TW200426253A - Electrochemically fabricated structures having dielectric or active bases and methods of and apparatus for producing such structures - Google Patents

Abstract

Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are formed from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurring during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.

Description

200426253 Description of invention: [Technical field to which the invention belongs] Related Application This application is to claim the benefit of US Patent Application No. 10/434493, filed on May 7, 2003. The contents of this application are hereby attached. FIELD OF THE INVENTION Different embodiments of certain aspects of the present invention are related to the field of electrochemical manufacturing 'and the technology of manufacturing three-dimensional structures (eg, parts, objects, components, devices) by constructing deposited materials layer by layer, and related to the completion of A method of processing the structures after a layer is manufactured 10 to transfer them from a construction substrate (ie, a temporary substrate) to a structural substrate. I: Prior Art 3 Background of the Invention A technique for making three-dimensional structures (such as parts, components, 15 devices, etc.) from most adhesive layers was invented by Adam L. Cohen and is called electro-chemical manufacturing. It is being implemented commercially under the name EFABR by MicrofabricaTM (formerly MEMGenR) of Burbank, California. This technique was disclosed in US Patent No. 6027630, issued on February 22, 2000. The electrochemical deposition technology can selectively deposit materials using a unique cover technology, which includes the use of a cover that contains a flexible and deformable material and is provided on a support structure, which is independent of the support structure. For the substrate to be plated. When the cover is to be used for electrodeposition, the smooth part of the cover will be in contact with a substrate in the presence of a plating solution, and the contact will inhibit the deposition of a selected part. For convenience, these hoods are generally referred to as 200426253 conformable contact hoods, and the hood mining technology is referred to as conformable contact hood forging. In particular, based on the name of MicrofabricaTM (formerly MEMGenR) of Burbank, California, the cover has been customarily called instant MASKS TM and the manufacturing method is customarily called INSTANT MASKING or 5 INSTANT MASKtm. Selective deposition using conformable contact mask plating can be used to make single material layers or multilayer structures. The contents of the US Patent No. 6027630 are incorporated herein by reference. Since this application is related to the above-mentioned patents, the published data on the conformable contact cover plating method (ie, INSTANT MASKING) and electrochemical manufacturing are listed as follows: (1) A. Cohen, G Zhang, F. Tseng, F. Mansfeld, U. Frodis, and P. Will, etc., "EFAB: Batch production of functional, fully-dense metal parts with micro-scale features", Proc. 9th

Solid Freeform Fabrication, The University of Texas at 15 Austin, pl61, Aug. 1998. (2) "EFAB: Rapid, Low-Cost Desktop Micromachining of High Aspect Ratio True 3-D MEMs" by A. Cohen, G. Zhang, F. Tseng, F. Mansfeld, U. Frodis, and P. Will et al. , Proc. 12th IEEE Micro Electro Mechanical Systems 20 Workshop, IEEE, p244, Jan. 1999. (3) A. Cohen's "3-D Micromachining by Electrochemical Fabrication", Micromachine Devices, March 1999. (4) G. Zhang, A. Cohen, U. Frodis, F. Tseng, F. Mansfeld, and P. Will, et al. "EFAB: Rapid Desktop Manufacturing of 6 200426253"

True 3-D Microstructures ", Proc. 2nd International Conference on Integrated MicroNanotechnology for Space Applications, The Aerospace Co., Apr. 1999 o

(5) F. Tseng, U. Frodis, G. Zhang, A. Cohen, F. Mansfeld, 5 and P. Will, etc., "EFAB ·· High Aspect Ratio, Arbitrary 3-D

Metal Microstructures using a Low-Cost Automated Batch Process '', 3rd International Workshop on High Aspect Ratio MicroStructure Technology (HARMST'99), June 1999 o (6) A. Cohen, U. Frodis, F. Tseng, G. Zhang, "EFAB: Low-Cost, Automated" by F. Mansfeld, 10 and P. Will, et al.

Electrochemical Batch Fabrication of Arbitrary 3-D Microstructures55, Micromaching and Microfabrication Process Technology, SPIE 1999 Symposium on Micromaching and Microfabrication, September 1999 o 15 (7) F.  Tseng, G.  Zhang, U.  Frodis, A.  Cohen, F.  "EFAB: High Aspect Ratio, Arbitrary 3-D Metal Microstructures using a Low-Cost Automated Batch Process" by Mansfeld, P. Will et al., MEMS Symposium, ASME 1999 International Mechanical Engineering Congress and Exposition, November, 1999. (8) A.  Cohen, "Electrochemical Fabrication (EFABTM)", Chapter 19 of The MEMS Handbook, edited by Mohamed Gad-EL-Hak5 CRC Press, 2002. (9) "MiciOfabi. ication-Rapid Prototyping's Killer Application ”, 7 200426253 page 1 ~ 5 of the Rapid Prototyping Rep. CAD / CAM Publishing, Inc., JUne] 999. The contents of the above nine kinds of public information are attached here for reference. The electrochemical The deposition method can be implemented in many ways as described in the above patents and publications. In one way, 'the manufacturing method will perform three separate operations when forming each layer of the structure to be manufactured ... Deposition to selectively deposit at least "material on" one or more desired areas of the substrate. "2. Then, the electrodeposition is used to deposit at least-additive material, so that the additive material covers the area that has been selectively deposited and the area that is not selectively deposited on the substrate. 15 • Take Jun, flatten the material deposited in Brothers 1 and 2 to form a first layer of smooth surface of appropriate thickness, which has at least-area with less material and material, and at least-area Contains at least the at least-additive material after the first-layer is made- 'or most of the additional layers can be adjacent to the previous sub-layer, "smooth to the previous layer ^ # $ Some additional layers are repeated by repeating the first 1 The younger brother 3 knows that the production of the subsequent layers made one or more times, and the manufacturing of the subsequent layers will consider the two bases and the original substrate as the new thickened substrate. After the manufacture of all the layers is completed, less one # (1) To a 3D structure that is to be exposed or released by the deposited material, the preferred method is to remove the 3D structure by an insect engraving process. One or more of the conformable shapes can be connected to the first. 1Selective deposition of contact cover plating method during operation. In this type of plating method, 20 200426253 contact (CC) cover will be made first. The CC cover includes a supporting structure on which a pattern is adhered or provided. Compliant conformable dielectric material. The conformable material of each cover will be based on the specific cut of the material to be plated. At least one CC cover is required for each specific cross-section pattern to be plated. 5 The support of a CC cover is typically a plate-like structure made of metal, which is selectively electroplated and is to be plated. The material of the plated cloth will be dissolved by it. In this typical method, the support will be shaped like an anode in an electroplating process. In another variation, the support may be a porous or perforated material. In a plating operation, the material to be deposited will be moved from the anode at a distance of 10 to a deposition surface through the perforations. In any of the above examples, the CC cover can share a common support, which is used to plate multiple layers. The pattern of the conformable dielectric material can be placed in different areas of a single support structure. When a single support structure contains multiple plating patterns, the entire structure will be considered as a CC cover, and individual plating The cloth cover can be regarded as a “secondary cover.” In this application, 15 this difference is only when a specific point is to be made. In preparation for the selective deposition of the first operation, the The conformable part of the CC cover will be aligned and pressed Against the selected portion to be deposited on the substrate (or a previously formed layer or a previously deposited portion of a layer). The CC cover and the substrate are pressed together in a way to make the CC cover The electroplating solution will be contained in all the openings in the compliant portion of the 20. The compliant material of the CC cover contacting the substrate will form an electrodeposition barrier, and the openings in the CC cover will Fill the plating solution, so when an appropriate voltage and / or current is supplied, it will form a contact part (which can be transferred from an anode (such as the CC cover support) to the substrate) A cathode path is formed during operation. 9 200426253 An example of a CC cover and a CC cover plating method is shown in Figures 1 (a) to 1 (c). Figure 1 (a) shows a CC cover 8 Is a side view of a compliant or flexible (eg, elastic) insulator 10 patterned on the anode 12. The anode has two functions. Figure 1 (a) also shows that a substrate 6 is separated from the cover 8. One of the positive poles functions as a support material for the patterned insulator 10 to maintain its integrity and alignment, as the profile of the pattern can be very complex (such as an isolated "island" containing many insulating materials). Its other function is to serve as the anode for this plating operation. The CC cover plating method will selectively deposit material 22 on a substrate 6, which simply presses the insulator against the substrate, and then deposits the material through the pores 26a, 26b and the like in the insulation 10 , As shown in Figure 1 (b). After deposition, the CC cover is separated from the substrate 6 (preferably non-disintegratingly), as shown in Figure 1 (c). The difference between the CC cover plating method and a "perforated cover" plating method is that the cover material of the perforated cover plating method is disintegrated from the substrate. Like the perforated cover plating method, the CC cover plating method also selectively deposits the material on the entire material layer at the same time. The plated area may consist of one or more isolated plated areas, which may belong to a single structure to be manufactured, or to multiple structures to be made simultaneously. In the CC coating method, since individual covers are not intentionally damaged, they can be repeatedly used in multiple coating operations. 20 Another example of the CC cover and the CC cover plating method is shown in Figures 1 (d) to 1 (f). Figure (d) shows that an anode 12 'is separated from a cover 8' which contains a patterned conformable material 10 'and a support structure 20. Figure (d) also shows that the substrate 6 is separated from the cover 8 '. Fig. 1 (e) shows that the cover 8 'is provided in contact with the base material 6. Figure 1 (f) shows the deposit 22 ', which is caused by directing an electric current 10 200426253 from the anode ir to the substrate 6. Figure 1 (g) shows that the deposit 22 remains on the substrate 6 after being separated from the cover 8 '. In this example, an appropriate% solution is placed between the substrate 6 and the anode 12 ′, and an ion current from the solution and / or the anode is guided to the opening through the cover. Where the material is to be deposited on the substrate. This type of enclosure can be referred to as an anodeless INSTANT MASK (AIM) or anodeless conformable contact (ACC) enclosure. ίο Different from the perforated cover plating method, the cc cover bell cloth method can allow the cc cover to be manufactured completely separately from the base material of the desired mineral cloth (for example, the Qin structure to be formed by Xiao Yi can be made in many ways.) It can be made, for example, by photolithography. All covers can be made simultaneously and simultaneously before the structure is manufactured, rather than during and during manufacture. This separate manufacturing can form a simple, low-cost, automated door. P Yttrium's "desktop factory" has a good structure and leaves only any processes that need to be dusty, such as photolithography, which is also done by specific departments. 15 An example of the aforementioned electrochemical manufacturing method is shown in section At 2⑷ ~ 2⑴, the drawings show that the manufacturing method includes the deposition of the first material 2 (sacrificial material) and the first material 4 (structural material). In this example, the frame contains a graph = Material 1G (for example-an elastic dielectric material) and-a support 12 made of a sunken material. The compliant portion of the CC cover is pressed against the substrate 'and there is-the electric fluid 14 Conformable material_Opening__The flow from the power source 18 will pass through the double as the yang And 〇 are also used as the anion_base material solution. The 2nd means that the current self-pass will cause the material 2 in the plating solution, and the material 2 will be selectively transferred from the anode to the cathode. 6. After CC # is used to deposit the first-deposited j 20 200426253 material 2 on the substrate 6, the CC cover 8 is removed, as shown in Figure 2 (b). Figure 2 (c) The second deposition material 4 has been surface-deposited (ie, non-selectively deposited) on the previously deposited first deposition material 2 and the rest of the current US material 6. The anode (not shown) composed of the second material (Out) The overlying deposits produced by the electrical penetration 5 will be transferred to the cathode / substrate 6 by a suitable plating solution (not shown). The bi-material layer 嗣 will be flattened as a whole. Achieve precise thickness and flatness, as shown in Figure 2 (d). After completing this procedure for all margins, the multi-thickness structure 20 formed by the second material 4 (ie, the structural material) will be buried in the first In a material 2 (that is, a sacrificial material), as shown in Section 2 (union 10), the buried structure will be etched away to form the required device, that is, the structure 20, such as 2 (f) shown in Fig. 15 20. Various components of the example artificial electrochemical manufacturing system 32 are shown in Figs. 3 (a) to 3 (c). The system 32 is composed of several sub-systems 34,%, 40, etc. The substrate holding sub-system 34 is shown in the upper part of the 3rd (magic to 3 (magic) figure, and contains several components: ⑴-carrier 48, (2) a metal substrate 6 on which a layer of material will be deposited. And (3)-the linear slider 42 can move the substrate 6 up and down relative to the carrier 48 in response to the driving force from the actuator 44. The secondary system: 34 also includes-the indicator 46 can measure the substrate The vertical position variation ^ can be used to set the material layer thickness and / or deposition thickness. The n system also includes the feet 68 of the carrier 48, which can be fixed intactly on the secondary system%. Μ The CC cover secondary system 36 It is shown in the lower part of Figure 3, and it contains several components: ⑴-CC cover 8 is actually composed of a plurality of CC covers (that is, the secondary cover) which share a common Cem pole i2. 54, the precision precision platform 56 ', the frame 72 on which the feet 68 of the secondary system 34 can be fixed, and (;) II 12 200426253 the tank 58 can hold the electrolyte 16. The secondary systems 34 and 36 also contain appropriate An electrical contact (not shown) can be connected to an appropriate power source to drive the CC cover plating process. The overlay deposition system 38 is shown in the lower part of Figure 3 (b) and contains several components: 1) An anode 62, (2)-the electrolytic cell 64 can be used for containing the plating solution 5 66, and the frame 74 can be provided with legs 68 of the secondary system 34. The secondary system 38 also contains appropriate electrical contacts (Not shown) The anode can be connected to an appropriate power source for driving the overlay deposition process. The planarization sub-system 40 is shown in the lower part of FIG. 3 (c), and includes a polishing plate 52 and an attached operation. And control system (not shown) for planarizing the deposit 10. In addition to the above, the No. US patent 6027630 shows that this plating method can also be used in combination with insulating materials. In particular, it shows that although the disclosed plating examples use two metals, there are many materials such as polymers, ceramics, and semiconductor materials, and any number of metals. Individual processes that occur during the manufacturing process are deposited. It shows that a thin plating base can be deposited, for example, by sputtering on an insufficiently conductive deposit (such as an insulating layer) for subsequent plating. It also shows that a variety of support materials (i.e. sacrificial materials) can also be included in the plating elements, with the support materials being optionally removed. 20 Another method of making microstructures from electroplated metal (that is, using electrochemical manufacturing techniques) was disclosed in Henry Guckel's No. In U.S. Patent No. 5,190,637, it is entitled "Method for Manufacturing Microstructures by Multilevel Deep X-Ray Lithoscopy and Sacrificial Metal Layer". This patent discloses a method for fabricating a metal structure using mask exposure. A first layer of main metal will be plated on an exposed plating base. 13 200426253 Fills the gap in a photoresist, the photoresist will be removed, and a second metal will be plated on the first layer and plated. Seat. The exposed surface of the second metal is milled down to a height while exposing the first metal to form a flat and uniform surface extending through the first and second metals. The formation of a second layer of 5 can be accomplished by arranging a photoresist layer on the first layer and repeating the process used to make the first layer. This process is repeated until the entire structure is formed and the second metal is etched away. The photoresist can be formed on the plating base or the previous layer by casting, and the gap in the photoresist can be formed by exposing the photoresist through X-ray or UV radiation through a patterned mask. 10 In this field, the combination of conductive materials, dielectric materials, semi-conductive materials, other materials, treated materials, and / or structural materials in the EFAB process still needs to be strengthened. Also, there is a need in this field to combine electrochemically manufactured structures with dielectric substrates or substrates, active substrates or substrates (substrates or substrates with elements capable of interacting with the structure), or As the purpose other than the base of the 15 structure), and / or the base or base material containing the modeling structure. There is also a need in this field to improve the adhesion between such substrates or substrates and electrochemical manufacturing structures. There is also a need in this field to expand the range of capabilities to expand the range of materials and processes that can be used to make the desired structures, including their substrates or substrates. [Summary of the Invention] Summary of the Invention One of the various aspects of the present invention is to expand the capability of electrochemical manufacturing methods to enhance the electrochemical manufacturing technology, to meet the structural and functional requirements of different uses, and to expand the technology. Potential uses. 14 200426253 The other objects and advantages of the various aspects of the present invention will become clearer after the professionals refer to the contents. Aspects of the present invention, whether described herein or inferred from the content, can be used alone or in combination to achieve any of the foregoing objectives; or they may not be able to achieve any of the foregoing objectives 5, but However, it can achieve some other purpose inferred from the content. Not all of these objectives can be achieved by any single aspect of the invention, although a single purpose may be related to some aspects. A first aspect of the present invention provides an electrochemical manufacturing method for manufacturing a 3D structure from a plurality of adhesive layers, including (A) selectively depositing at least 10 parts of a material layer on a temporary substrate. The temporary substrate may include previously deposited materials; (B) manufacturing a plurality of layers and making subsequent layers immediately adjacent to and adhering to the previously deposited layers, and the manufacturing includes repeating operations (A) multiple times; (C) during fabrication After the plurality of layers, a structural substrate containing a dielectric material is fixed to at least a portion of a layer of the structure, and at least a portion of the temporary substrate is removed from the structure. 15 The second aspect of the present invention provides an electrochemical manufacturing device with a 3D structure made of a plurality of adhesive layers, including: (A) —the device can selectively deposit at least a part of at least one layer on On a temporary substrate, the temporary substrate may include previously deposited materials; and (B) —the device may manufacture a plurality of layers such that subsequent layers are immediately adjacent and adhered to the previously deposited layers, where the manufacturing includes repeating 20 operations ( A) multiple times; (C) a device can fix a structural substrate containing a dielectric material to at least a portion of a layer of the structure, and remove at least a portion of the temporary substrate from the structure; And (D) —The computer can be programmed to control the contact device, conductive device, separation device, fixed device, etc., so that the fixed device can be operated after most layers of the structure are formed. 15 200426253 A third aspect of the present invention provides an electrochemical manufacturing method for making a 3D structure from a plurality of adhesive layers, including: (A) selectively depositing at least a portion of a material layer in a first temporary On the substrate, the first temporary substrate may include a previously deposited material; and (B) manufacturing a plurality of layers such that subsequent layers are immediately adjacent and adhered to the 5 previously deposited layers; and (C) fixing a A second temporary substrate (which includes a dielectric material) is on at least a portion of a layer of the structure, and at least a portion of the first temporary substrate is removed from the structure, and then a structural substrate is fixed to the structure At least a part of a layer will at least partially overlap the position where the first temporary substrate was once fixed. 10 A fourth aspect of the present invention provides an electrochemical manufacturing method for manufacturing a 3D structure from a plurality of adhesive layers, including: (A) selectively depositing at least a portion of a material layer on a sacrificial substrate The temporary substrate may include previously deposited materials; (B) manufacturing a plurality of layers such that each subsequent layer is immediately adjacent to and adhered to the previously deposited layer; wherein the manufacturing includes repeating operations (A) a plurality of times; After 15 layers, a structural substrate (including most materials and / or a patterned structure) is fixed to at least a part of a layer of the structure, and at least a part of the temporary substrate is removed from the structure. A fifth aspect of the present invention provides an electrochemical manufacturing method for manufacturing a 3D structure from a plurality of adhesive layers, including: (A) selectively depositing at least a portion of 20 of a layer on a first temporary substrate On the material, the first temporary substrate may include previously deposited materials; (B) manufacturing a plurality of layers such that subsequent layers are immediately adjacent and adhered to the previously deposited layers; and (C) after forming a plurality of layers, a second A temporary substrate (which includes most materials and / or a patterned structure) is secured to at least a portion of a layer of the structure, and at least a portion of the first temporary substrate is removed from the structure. Structure base # At least one Qiu injury fixed to the structure, which at least partially overlaps the first temporary base material once fixed. "The sixth aspect of the present invention provides a method for making batches. 々, _ xi section 3 Π Electrochemical manufacturing method of at least one section, at least one section of which is made of%, / Λ ', made of most adhesive layers, the method includes: (Α) The multi-segment junction, at least one adjacent scale, includes: (1) selectively depositing a layer At least-part of the substrate may include previously deposited materials; (2) manufacturing a plurality of seals on the a substrate, where a layer is required to make a sound; immediately adjacent to and adhered to the previously deposited layer, wherein the manufacturing package, '贝耶 ^ Repeat the operation (1) a plurality of times, (B) Provide at least one additional part of the multi-segment structure # · ίο 15 / Κ 又' (C) Fix this to ν — the segment is fixed to the at least As soon as a section is added to form the multiple units, more aspects of the present invention will become clearer after the professionals refer to the contents. Other aspects of the invention may include the second combination of the invention described above, and / or various features of one or more embodiments. Other aspects of the invention may include the means for implementing one or more of the above described inventions. These other aspects of the present invention can provide the above-mentioned various aspects, different combinations of heart and water, and other structures, structures, functions, relationships, and manufacturing methods that are not specifically described above. BRIEF DESCRIPTION OF THE DRAWINGS Figures 1 (a) to 1 (c) schematically show side views of different stages 20 of a CC cover plating method; and Figures 1 (d) to US) schematically show a use Side view of the different stages of the plating method of CC covers of different collar types. Figures 2 (a) to 2 (f) schematically show side views of different stages of an electrochemical manufacturing method for forming a specific structure, in which a sacrificial material is selectively deposited and a structural material is covered Surface deposition. 17 Figures 3 (a) to 3 (c) are schematic side views of various sub-combination examples that can be used to manually perform the electrochemical production methods of 2 (a) to 2 (0). Figures 4 (a) to 4 (i) The figure schematically shows that the first layer of a structure is made by using an adhesive cover plating method, in which an overlay deposition of a second material covers the openings of the first material 5 between the deposition positions and the first material. Itself. Fig. 5 shows a flowchart of the basic operation of a preferred embodiment of the present invention. Figs. 6 (a) to 6 (c) show an example of a structure created according to the preferred embodiment of the present invention, where Figures 6 (a) & 6 (b) show two different perspective views of the structure, and Figure 6 (c) shows a side view of the structure. 10 Figures 7 (a) to 7 (〇) It shows the procedures of making the structures of Figs. 6 (a) to 6 (c) from a plurality of adhesive layers according to a preferred embodiment of the present invention. Figs. 8 (a) to 8 (d) tf One of the variations of the last layer of the structure shown in Figures 6 to 6 and how the permanent substrate is mated to the material layer. Figures 9 (a) to 9 (e) show one embodiment when the present invention is implemented 15 steps of the time. Figure 10 provides the basic operation of the embodiment of Figures 9 ~ 9 The flowcharts of the present invention are shown in Figures 11 (a) to 11 (a) to 11 (a) to 11 (a), which show the operation steps when implementing one embodiment of the present invention. 20 202® provides a flowchart of the basic operation of another embodiment of the present invention. (a) to 13 (c) schematically show the process of transferring a structure 702 from a first substrate 704 to a second substrate 70. Figures 13 (d) to 13 (e) 18 200426253 Figures M (a) to M (c) schematically show the structure of a fixing layer that can modify one structure of a structure. It contains the groove shown in Figure 13 (d). Figures 15 (a) to 15 (f) schematically show that a manufacturing method can modify the structure of a fixed layer of a structure to include a buckling groove to strengthen it. The structure and the substrate are connected to each other. I: Detailed description of the preferred embodiment of Embodiment 3 1 (a) ~ 1 (g) '2⑻ ~ 2 (f)' 3⑷ ~ 3 (c) Different characteristics of a conventional electrochemical manufacturing method. Other electrochemical manufacturing techniques were disclosed in the above-mentioned US Patent No. 6,602,763, each previously published material, and other attached patents and patent applications. In the case, there are other methods that can be shot by various methods described in such public information, patents, and patent applications, or professionals can be inferred by the contents disclosed in this case. All: and other technologies can be used here The various embodiments of the disclosed various aspects of the invention are combined to produce a better embodiment. There are also other embodiments that can be derived from the combination of the various embodiments disclosed herein. ^ Brother 4⑷ ~ 4⑴ Stages of making single-layers in a multi-layer process' where a second metal is deposited on a first metal and in the first metal's openings, and its deposits form part of the layer Serving. In Fig. 20 ', it is a side view showing a substrate 82 on which a patternable photoresist 84 is formed as shown in Fig. 4 (b). In Fig. 4 (c), a photoresist pattern is formed by curing, exposing, and developing the photoresist. The combination of the light and the pattern results in openings or divisions 2 (a) to 92 (e) f extending from the surface thickness of the photoresist to the surface 88 of the substrate 82. In the fourth figure, —metal (19 200426253 nickel) has been plated in these openings 92 (a) ~ 92 (c). In FIG. 4 (e), the photoresist has been removed from the substrate (for example, chemical peeling), and the area on the substrate 82 that is not covered by the first metal 94 is exposed. In Figure 4 (f), a second metal 96 (such as silver) has been plated to cover the entire five exposed portions of the substrate 82 (which is conductive) and the first metal 94 (also conductive). )on. Figure 4 (g) shows that the first layer of the structure has been completed. It is made by flattening the first and second metals to a height to expose the first metal and set the thickness of the first layer. . In Figure 4 (h), the steps in Figures 4 (b) to 4 (g) are repeated a number of times to make a multilayer structure as shown in Fig. 4, where each layer contains two materials. For most purposes, one of these two materials will be removed as shown in Figure 4 (i) to form a desired 3D structure 98 (such as a component or device). Although the embodiments disclosed are mainly focused on the conformable contact cover and the cover plating operation, the various embodiments, variations, and techniques disclosed can also be applied to the near-body and cover plating operations (ie, using the Waiting for the operation of the cover body, the cover body 15 will selectively cover the substrate at least partially because it is close to the substrate, even if it does not touch the substrate. Non-conformable cover and cover plating operations (that is, the contact surface is not sufficient) Flexible and compliant covers and operations based on such covers), and bonding covers and covers plating operations (ie, covers bonded to a substrate and operations using such covers, on which Selective deposition or etching will occur in the untouched areas). Fig. 5 is a flowchart showing the basic operation of a preferred embodiment of the present invention. The process begins at operation 102, which provides a substrate to which a subsequent layer of deposited material is added. This substrate is typically made of a conductive material and can be electrodeposited thereon, but it can also be a seed layer of a dielectric material on which a conductive material has been deposited. 20 200426253 The process continues to operation 104, where a layer is deposited on the substrate or a previously formed layer that has been placed on the substrate. According to some embodiments of the present invention, the deposited layer will contain two or more materials, one or more of which will be patterned to give a desired shape to the structure to be made, and others One or more materials will be shaped like sacrificial materials which will be removed from the structure after the layer has been manufactured. A preferred embodiment of the present invention is used to separate the structure from the substrate (that is, the temporary substrate) made by the structure, and it is preferable to make the substrate have a different structure from the sacrificial material. Materials, so in some embodiments, the first or more 10 layers deposited on the substrate may be composed of only the sacrificial material. Also, in the preferred embodiment of the present invention, since the substrate on which the structure is to be fabricated is not a permanent substrate to which the structure is to be fixed, it is preferred that in some embodiments, the (the structure is The first layer is the last layer of the structure with respect to the permanent substrate system, and the last layer deposited is the first layer with respect to the permanent substrate system 15. In other words, in some embodiments, the layers of the structure are preferably deposited in the reverse order. The electrochemical manufacturing method used may be similar to those shown in Figures 1 (a) to 1 (c) and 2 (a) to 2 (f), or in No. 6027630 Another method disclosed in the U.S. patent, or one method described in each of the aforementioned publications, or one method described in one of the patents or applications in the attached 20 patent and application form, or A method of combining the various methods described in these published materials, patents, and applications, or a method known or inferred by professionals. Of course, these structural parts can also be made by other 3D molding or manufacturing methods. After depositing a layer, the process proceeds to block 106, which checks 21 200426253 to see if the last layer of the structure has been made (ie, the layer that will contact the permanent substrate in some embodiments of the invention) . If the answer is "No", the process will loop back to operation 104 and proceed with the deposition. If the answer is yes, the process moves to operation 108. 5 This operation 108 involves attaching a permanent substrate (such as a dielectric material) to the last deposited layer of the structure. The fixing can be achieved by an adhesive, such as a pressure-sensitive adhesive, a heat-sensitive adhesive, or a radiation-curable adhesive (provided that the substrate can transmit appropriate radiation). The adhesive can be applied in a variety of ways known to professionals (e.g., coating, spin coating, spraying, etc.). The fixation can also be accomplished by non-adhesive bonding technologies, such as surface welding, sintering, welding, ultrasonic fusion, and vibratory joints. After the permanent substrate and the deposition material layer are fixed together, the process proceeds to operation 110, in which a permanent substrate and a layer are separated from the temporary substrate, and all the sacrificial materials are removed. If one or more layers of sacrificial material are interposed between the temporary substrate and the structural material, or if the temporary substrate is attacked by the sacrificial material or by an etchant that is used to selectively separate the sacrificial material and the structural material When other materials are used, the separation process can occur as a natural part of the removal process of the sacrificial material. In a variant embodiment, the three tasks in operations 108 and 110 can be performed in 20 different orders, for example: (1) first connect and then separate and remove the sacrificial material; (2) first connect, then separate, and then Removal; (3) Simultaneous separation, removal and reconnection; (4) Removal, reconnection, and separation. Figures 6 (a) to 6 (c) show a structural example (such as a switch) made according to a preferred embodiment of the present invention. The two different perspective views of this structure are shown in Fig. 6 (a) and 6 (b), and a side view is shown in Fig. 6 (c). The overall structure 122 can be seen in FIG. 6 (a), and the structure is fixed to the permanent substrate 124. Figure 6 (b) shows a bucket wound when the structure 122 has been fixed to the permanent substrate 124, but it can be seen that when the structure is manufactured and fixed to a temporary substrate such as 7 (hook 5 to 7 ( n) The material layer process not shown in the figure. As shown in Figure 6 (c), the structure is composed of ten layers 201 ~ 210. 10 15 20 Figures 7 (a) ~ 7 (0) show manufacturing The process states of the structures shown in Figures 6 (a) to 6 (c). In this embodiment, the subsequent layers will be fabricated and glued to the bottom of the previous ^ build-up layer. Except as shown in Figure 7 (b) In addition to the sacrificial material, when the structural material and the sacrificial material on the target deposited layer are shown, the structural material will be fully shown 'and the sacrificial material is only shown on the outer wheel. On a currently deposited layer, any The order of the deposition structure # material and the sacrificial material is acceptable. In a variant embodiment, 'the layers can be deposited on top of each other or side by side. In this application' unless the content requires—different layers, when-deposition is shaken When the description takes place in the pre-sediment, it is not necessary to make an absolute conclusion about the direction of the material layer, but only the relative relationship of the deposition sequence should be noted. Figure 7 shows the process. A temporary substrate 212 is started. Section 7_ shows that the temporary substrate will be laid out—a coating of a sacrificial material or a first deposition layer 2U. The sacrificial material layer 2U may allow this at a later step in the process The structural material is separated from the temporary substrate. Of course, in actual falling, the 'y number of layers 211 with t can also be made, or its thickness can be adjusted so that it can be easily separated in the subsequent steps. Figure 2 of Figure 7 ―The structural oil of the layer 210 is patterned by a dashed line, which represents the boundary of the sacrificial material that also existed. 23 200426253 ^ 7 (d) J 7 (1) The principals of each successive deposition layer to 201, and the pattern of the structural material 209 to 201, especially the deposition layer are also shown along with the outline of the material. The previous deposition layer is shown as a material shell. ^ And there is no patterning difference between the structural material and the sacrificial material. (1) The figure does not show that the permanent substrate 200 is fixed to each of the materials 2001 ~ _, the release layer 2m, and (Figure 3) The components of the partially shaped coin structure are shown as solid squares in the second figure, but the figure 7 does not show the sacrificial material and permanent The base material is transparent, so you can see the shape of each layer and the structural material 2 () 1 • ~ 21 (). Ίο 15… Figure 7 (G) shows the released structural materials 201, ~ 210, It is adhered to the water-based substrate 200. The prefecture is described as transparent, but it can be transparent (such as glass) or opaque, and some applications may require transparent materials (such as when the structure contains -scan The mirror can accept the radiation source that passes through the substrate. When the black substrate is transported back, the temporary substrate can be removed with the sacrificial material. (M) Selective engraving, which is invasive to animal materials (such as copper), but will not disintegrate structural materials (such as supplementary animal materials. Tinctures can include-anti-point tincture or similar to ensure that they are not Attacks the structural material. 20 Figs. 8 (a) to 8 (d) show examples of the modification of the last layer of the structure of Figs. 6 (a) to 6 (c) 'and how the permanent substrate is compounded with the modifier of the material layer. Figure 8 (a) does not show that the last layer contains only the structural material 201. Figure 8 (b) shows that the permanent substrate is not only made or bonded to the bottom of the last layer, but also on the side of the last layer, so the structural material of the last layer will become at least part Buried in 4 substrates. Figures 8 (c) and 8 (d) show a two-dimensional view of the formed structure. 24 200426253 ίο. As shown, the structural material 201 is buried in the substrate, so only nine out of ten original structural material layers extend on the surface of the permanent substrate. The structural material 201 can be achieved in a variety of ways by being surrounded by the substrate. For example, instead of the base material being in the form of a prefabricated sheet to be bonded to layers such as "Hai, it must also be in the form of a flowable material that can be molded to surround the structural material ' And has a surface that extends a desired thickness beyond the last layer of structural material. In another example, 'the substrate can still be sheet-shaped and adhere to the last layer of structural material 205', but the sacrificial material has not been deposited on the last layer or the portion of the sacrificial material has been removed, It can be filled-epoxy resin or other Π, 动 / curable materials. The permanent substrate will be positioned, and the hardening of the resin or other material will not only fill the area around the feet of the structural material, but also cause adhesion between the layers and the substrate. 15 The above embodiment also has various modifications. Even when the substrate on the side of the last layer is not formed, it can still be used-a moldable material, 20: unlike-a piece of material and the substrate is made of a temporarily flowable material. The contact pads and vias can be made of the structural material, and they can be extended to the desired position on the surface of the substrate, or they can be encapsulated by the material of the substrate except for the required contact points. The selective engraving of the sacrificial material may be performed before the water-based substrate is connected or fabricated. Each layer can be engraved to a depth less than one layer thickness or greater than a layer thickness. In some embodiments, the engraving depth may allow a portion of the structural material to extend completely through the substrate to be covered, thereby forming a protrusion from the bottom of the wire. In the embodiment where the substrate extends through the bottom of the substrate, and when the molding is not performed, the "the base" can be flattened until 25 200426253 when the structural material is exposed. The base The material does not have to be flat, and its lateral extension does not need to correspond to these layers. If the part is etched to a depth of more than one layer thickness, it is best that the pattern of the structural material can maintain a fixed pattern ^ but maybe The deepest layer will be exposed by the 5 part etch. This will help ensure a more uniform etch depth, as the sacrificial material will not be masked by the extended area of the structural material. However, at this etch depth In embodiments that are less important or that it is expected that a different structural pattern will result in a desired etch pattern, the patterning of the structural material will not necessarily have this limitation. 10 In some embodiments, unlike the temporary substrate Instead of the permanent substrate being disposed on the opposite side of the deposition layers, the permanent substrate may also be disposed in an orientation perpendicular to the temporary substrate. In other words, the permanent substrate may also be disposed in the majority Sedimentary In some embodiments, the permanent substrate is not fixed on the opposite side of the laminated phase 15 to the temporary substrate. 'The temporary substrate will be removed first and the permanent substrate will be adhered. In its position. This allows the temporary substrate or its topmost surface to be made of a material that can be selectively etched or removed from such layers, preferably without damaging the layers. Structural material or sacrificial material. After removing, the bottom layer of the structure will be exposed, and the 20 permanent substrate (such as dielectric substrate) will be fixed to it. When the permanent substrate is needed When the material is set in some positions occupied by the temporary substrate, in some embodiments, it may be necessary to first set a second temporary substrate on the opposite side of the stack relative to the first temporary substrate. Then the first temporary substrate can be removed, then the permanent substrate is fixed, and then the second temporary substrate is removed at the time of the second temporary 26200426253. In other embodiments, the permanent substrate can be disposed in the bump layer. Opposite the opposite side of the substrate (on which the layers are made), and the substrate can be protected In some embodiments of the present invention, the permanent substrate can be replaced by some other material instead of a dielectric 5 material. For example, the permanent substrate can be made of a conductive material and can be easily Although the term "permanent material" is used here, it should be understood that it does not mean that the permanent material must be able to exist over the entire life of the structure, but if it forms part of the structure, at least It should be able to be used for certain parts of the structure. In some embodiments of the present invention, sacrificial layers may also not be used when depositing the stacks. In some embodiments, the fabrication of the layers This can be accomplished by single or multiple selective depositions, and possibly one or more overlying depositions and one or more planarization operations. 15 Certain embodiments of the present invention can provide structures that are electrochemically fabricated ( For example, using conformable contact cover plating technology or adhesive cover plating technology), it is fixed on the substrate that may contain active components. This is shown in the embodiment of Figures 9 (a) to 9 (e), in which an electrochemically fabricated structure is fixed to a piezoelectric element, and the two are combined to form an operable pressure.电 装置。 Electric device. 20 In Figure 9 (a), a structure 302 includes a structural material 304 and is surrounded by a sacrificial material 306. The structure 302 is preferably made of a plurality of adhesive layers by an electrochemical method. The structure 302 is fabricated on a release material 308 and is fixed to a substrate 312. The release material 308 may be the same as the sacrificial material 306 ', or it may be another material that can be separated by etching or melting (for example, a 27 200426253 agent) or removal. The release material 3008 can be placed on the substrate 312 before the structure 302 can be electrochemically manufactured, or it can also be made from one or more of the first deposits of the electrochemical process. . The substrate is typically a conductive material, but in some embodiments it can also be a dielectric material and can be covered with a seed layer of a conductive material. In Figure 9 (b), the '-prefabricated element or component cut system is shown above the structure. The prefabricated member 322 is ready to be used in the electrochemical fabrication structure 302. The component 322 is fixedly mounted to the device substrate 32. The device substrate 324 usually forms the final substrate of the device. The device is a composite device of the structure: 322 and the structure 302 of the structure. Most of the time, the device substrate 324 can adopt any desired properties (for example, it can be H-dielectric, -transparent material, or -flexible material, etc.). In this example, the device substrate 324 is a dielectric, so its power supply is isolated. At the Fμ ^ 15, the M is positioned on the substrate 324, and the -metal element 326 will be patterned. "The area with the piezoelectric material 328 on it will be patterned, and the piezoelectric material will have -adhesive 33〇 (if If necessary, it can be conductive.) It will be converted into a case. A suitable "spoon adhesive should have good adhesion to the structural materials of the structure. The raw metal 7G element 326 will be provided and used as an electrode to Actuate 20 / [package material 'sub-as-circuit to connect the electrode to a power source. 'In Fig. 9 (c), the prefabricated member 322 is adhered to the structure by the adhesive 33. In Fig. 9 (d), the release material has been removed. In the 9th (e) round, the 4 sacrificial material 3G6 has been removed by the structural material 3Q4, and then the component 33 is starved. The structure is released to form the completed device. It is said that the component 3 ° 4,322 and the device base Material 324 and the like. 28 200426253 Fig. 10 is a flowchart showing the process steps of the embodiment of Figs. 9 (a) to 9 (e). In Figure 10, the process starts at two points shown in blocks 402 and 406. Block 402 provides a substrate that is separable from a component formed thereon. The substrate and the member can be separated because the substrate has a release layer, or because a release layer will be provided on the substrate. Block 406 provides a second component that will have a desired shape or be made from a variety of desired materials. The second member will have a surface energy that can be fixed to the surface of the first member provided by block 402. Block 404 is a layer or a layer formed on the substrate to form the first component (ie, a part) of one of the devices to be manufactured. In making the first component, the component may be partially surrounded by a sacrificial material, and the final sound of the sacrificial material is removed by the component portion of the layer. The first member will have a surface that can be bonded or fixed to the second member. The two blocks 404 and 406 are the starting points for the operation of block 208. 15 In block 408, one or both of the first and second members will be prepared to be bonded to each other by attaching an adhesive to at least one of its joining surfaces. Of course, in the changing embodiment, the block is also a part of the process. For example, in some embodiments, an adhesive may be part of the second component provided. 20 The process will move from block 408 to block 4 丨 0, where the two components will be glued to each other. This bonding can be achieved using pressure-sensitive adhesives, hot-melt adhesives, or other means known to professionals. The process flow moves to block 412, where the first component is separated from the substrate to which it is attached. 29 200426253 The process moves to block 414, where the first component is separated from any sacrificial material of the non-retained portion of the final device to be made. The process then moves to block 416 where additional manufacturing operations may be performed or the device released during the operation of block 414 may be used. 5 In a variant embodiment, the order of operations of blocks 414 and 412 may be reversed. In still other embodiments, the operations of the two blocks 414 and 412 may be performed at the same time. In still other embodiments, the operations of blocks 412 and / or 414 may be performed between the operations of blocks 408 and 410. After reading this article, professionals will be able to easily infer various other variations. 10 In some embodiments of the present invention, the substrate to be fixed may be a passive component, but the structure to which it is fixed may have an electrochemical manufacturing portion and a portion made by other deposition or patterning techniques. Serving. One or both of these parts may include active components. This system is shown in the embodiment of FIGS. 11 (a) to 11 (j). Figures 11 (a) to 11 (j) show another modified embodiment of the present invention. The system 15 uses the same operation to make a plurality of layers, and then uses different operations to make an added part of a structure. . Figure 11 (a) shows a side view of the first structure 502 for illustration, which is similar to Figure 9 (a). In FIG. 11 (b), a piezoelectric material 528 has been deposited on the top surface (ie, the last layer) of the structure 502, and a photoresist 520 has been deposited on the piezoelectric material 20 528. In Fig. 11 (c), a desired pattern of one of the piezoelectric materials 528 is shown. The patterning of the piezoelectric material can be accomplished as follows: first pattern the photoresist 520, and then use it as a pattern to selectively etch the piezoelectric material. In a variation, for example, the piezoelectric material may be patterned by a lift-off 30 200426253 method. Figure 11 (d) shows an optional step for forming the surface of the part forming device horizontally. A dielectric material 5 3 2 is used to fill the gap caused by the etched M electrical material. An even height. In some variations, it may be desirable, or at least better, to planarize the combined dielectric and piezoelectric material layers. Figure 11 (e) shows the deposited structure of the next layer, which will provide a metal 534 on top of the piezoelectric and dielectric materials. Figure 11 (f) shows the result of patterning the deposited metal. The pattern of the metal 10 is selected to form the electrodes of the piezoelectric element and an interconnecting track. The patterning of the metal can be performed in various ways, for example, it can be performed in the manner described above for patterning the piezoelectric material. Figure 11 (g) shows the result of filling the voids in the metal layer with a dielectric material 536 (which may be the same as the dielectric material 532). The filling of the voids can also be performed using the same method as filling the voids of the 15 piezoelectric material layer. For example, a material can be deposited in large quantities, laid out, cured, and then planarized to produce a desired thickness and uniform layer. In Fig. 11 (h), a device substrate 538 is coated on the metal and the dielectric layer. The substrate can have any. The required characteristics are in this case a dielectric. In Figure 11 (i), a release material 508 has been removed. 20 Finally, in Figure 11 (j), a sacrificial material 508 has been removed to form a release device that can be subjected to additional processing operations or used. In a final functional device, a connector passing through the structural material 304 in FIG. 9 (e) or 504 in FIG. 11G) can be used to form the second electrode of the piezoelectric element so that Make a final device. 31 200426253 Fig. 12 is a flowchart showing the process of the embodiment of Figs. 11 (a) to 11 (j). The process begins at block 602 where a substrate is provided and a device is fabricated thereon. The device will eventually be transferred to a different substrate, which may already have a release layer, or an appropriate release material may be added when the first or more layers are electrochemically fabricated (5 Such as sacrificial material). Block 604 uses a first method to make one or more layers (e.g., made by electrochemistry) that will form part of the device and can be surrounded by a sacrificial material. Block 606 further uses at least one different deposition method to further construct and pattern the structure. In some embodiments, additional electrochemical manufacturing operations will be used to complete the structure, which will include the unreleased device. Block 608 places an adhesive on the last layer of the formed structure and / or a substrate to be bonded to the structure. The use of the adhesive may or may not be necessary depending on the constituent materials of the substrate and the method used to join. 15 Block 610 is to make a substrate on the last forming layer of the structure, or to adhere the substrate to the last forming layer. Block 612 separates the structure from the original substrate from which it is made. Block 614 separates the structure from any sacrificial material that is not a reserved part of the final device. 20 Block 616 performs any additional manufacturing operations or uses the device. Using the flowchart of FIG. 10, various changing operations can be implemented, and the order of the operation blocks can be changed. Two additional embodiments are shown in Figures 13 (a) to 13 (e), 14 (a) to 14 (c), and 15 (a) to 15 (f). The two additional embodiments show a substrate conversion technology, which includes increasing the surface area (junction) between the structure and the bonded substrate 'or making a fine structure in the structure that can be fastened to the exchange substrate. . Figures 13 (a) to 13 (c) illustrate a method for converting a structure 702 from a first substrate 704 to a first substrate 706, wherein the structure is between the structure and the second substrate The contact area is flat, so there is no increased surface area or fastening parts to help improve its adhesion. Figure 13 (d) shows a modified structure 702 and a modified substrate 706, in which a notch is formed on a flat surface of the structure, and in the replacement substrate or an adhesive layer The convex part can be embedded in the grooves to strengthen the adhesion between the structure and the substrate. Fig. 13 (e) shows a modified structure 702, bonded to a modified replacement substrate 706 ", wherein the structure includes a groove with an undercut, and the replacement substrate or an adhesive The material will be placed in the structure so that the structure and the substrate can be strengthened by mechanical fastening between them. The modified structure of Figure 13 (d) can be implemented in many different ways. One of them The manufacturing method is shown in Figures 4 (a) to 14 (b). Figure 14 (a) shows that the last two layers of the edge structure 714 and 714 have been covered, and the material layer 714 has not been fastened to a substrate. Brother M shows another layer of the two layers 712 and 714, in which the layer 714 'has been modified and contains holes, grooves, gaps, etc. provided in the structural material 718. These holes and grooves can be filled. A sacrifice material is talked about as part of the system. Figure 14 shows the process after the sacrifice material of buckle 4, shown in Figure 14 (b), is removed. In some cases In the embodiment, the openings in the material layer 714, may be formed by modifying the material instruction of the layer during the material layer system 200426253. Or, in the other embodiment of Example 7 The opening of the material layer 714, can be borrowed by the user after the manufacture of the layer is completed; the position 1 needs to be engraved with holes in the material layer 714. Engraving = ❹contact cover or adhesive cover. If there is no concern that the sacrificial material will be removed by the structural structure, the secret removal of the sacrificial material can be performed by a large amount. Or 'the silver carving can also use one or to complete = at least one mask can cover The area that shields the sacrificial material from being removed will cover the structural material. After the openings are named in the material used for bonding'—adhesive or flowable base material, it can be laid, ίο 15 20 Therefore, the substrate is connected to the structure or the solid ground structure (this will adhere) ° == In the embodiment 'It is best to set the sacrificial material before the bonding operation = the material layer 714 will not be described The outer side area of the structural material part 2 = the order of these adhesion and removal of materials will improve the substrate material: positioning 'and / or may help limit the movement of the adhesive or flowable substrate material into the In the area around the structure =: ling ga, __ outer 嶋 heart Γ: the mouth is made of money, the material may be more tolerant before bonding than after bonding From other embodiments, the rest of the outer area will be ordered before bonding. 'Just because of the heterogeneous structure. Determine.' Heterogeneity-breakage of the flowable base material or the agent. Partially or completely: 2: Large inclusiveness. Correcting the last layer (or the last few layers) of the structure and only the poor material can be based on the cad broadcast instruction of the designer to modify the required structure, or Borrowing-data processing program will perform various b ... ^ operations ⑼ 34 200426253 such as etching or expansion operations, and can be superimposed according to fixed or user-settable parameters (such as fixed grids of fixed positions and sizes). Overlay the structural materials in the correct position of the material layer). The data processing operation can be based on the structural data that has been transferred into the material layer data, or based on the structural material retained in a 3D format 5. Come on. The holding function of the transition zone between the structure of Fig. 13 (e) and the substrate can be obtained in various ways. For example, an etch operation can be used, which has a tendency to reverse the etched material. The reverse cutting can also be the result of pressing a conformable contact cover into the hole being formed. The cover can protect the upper part of the side wall of the 10 holes to a certain depth, and the horizontal An undercut can be formed by etching. These holding functions can also be obtained by modifying the pattern of the structural material on the last two or more layers of the structure, where the contact layer (and possibly one or more additional layers) will have a greater Small openings, but will have larger openings in one or more previously formed layers. The smaller and larger openings of the 15th grade in different layers will be filled with sacrificial material during the layer process. The sacrificial material can be removed after the layer is formed, as described previously in Figures 14 (b) and 14 (c). An example of a method of manufacturing such a retaining portion, an undercut portion, or an interlocking structure is shown in Figures 15 (a) to 15⑴. 20 Figure 15 (a) shows the last five layers of an example of a structure made by an electrochemical manufacturing method, all of which have the same structure. As shown, the structure includes a structural material region 752 and a sacrificial material region 754 on the periphery of the structure itself. Figure 15 (b) shows the last few layers of the electrochemically fabricated structure. The structure of the last two layers has been modified to include openings in its structural material, with 35 200426253 with an undercut or retaining structure. . As shown in FIG. 15 (b), the retaining structures 762 and 764 and the channels 772 and 774 leading to them are temporarily filled with a second sacrificial material, which may be the same as or different from the first sacrificial material 754. . Figure 15 (c) Figure 7F shows that the second sacrificial material in the grooves or retaining structures 762 and 764 and their channels 5 772 and 774 has been removed. Figure i5 (d) does not show that the structure has been covered with an adhesive 774, and a conversion substrate 776 is located above the bonding position. Figure 15 (e) does not show that the conversion substrate w has been lowered to the position and stuck & Not only will the connection between the substrate and the structure occur, but also interlocking will occur between the agent and the structure, and if the adhesive has a better adhesion to the substrate than the structure Characteristics, the overall robustness of the composite shouting material / structure system can be improved. After the 15 (_ * out of the external sacrificial material μ has been removed—the lock method and the method of increasing the surface area can have many variations. I. In these two methods, the height of the transfer or interlocking elements can be changed by one Part of Z extends to the thickness of multiple layers. If you do n’t have money, you can adhere the substrate to the structure—know the openings, and then make it Ruhua. The flowable substrate material can also fill these. 20 In other embodiments, the substrate itself may also include openings or retaining clips to facilitate the grasping of an adhesive or a filler material. In other embodiments, == the retaining structure is not a single element. The buckle between the handle substrate and the structure (=: fine structure, but two or more structural combinations that can produce a buckle shape _ straight holes protruding into the structure at different angles, etc.) 36 200426253 Also implemented in other For example, the two to be fixed may not be a multi-layer structure and a substrate, but include a combination of one or more multi-layer structures—or multiple: or members, which may or may not be multi-layer structures, and Embodiments that may or may not form an interlocking reinforced adhesive structure can be summarized as follows.  ⑴Obtain—the groove of the desired structure; (2) 敎 It contains one or more branches or channels in the last one or more layers, and it can contain grooves or buckles in the tight =: coffee: each layer-or multiple layers. Hold the knot οο ο ⑽ ⑽ made of butterflies on the material; the scales of these channels or retaining holes are said to be '(5) layout-flowable material on the surface with these channels, if a separate substrate to The flowable material is used for bonding, an adhesive, or it can be formed as a curable material and can be formed into a desired beauty material = 15 =: = The _ or curing the substrate material to adhere the correction and the two Structure wheat, a substrate adhered to the structure; and if it needs to be removed, it is difficult to release the structure. The portable substrate is made up of many possible variations. The embodiment additionally contains: ⑴ 20 material to fill the openings, and the outer area of the structure, the heart = only = = material for it; _ knot_ and make-sacrifice material π temporarily fills these openings; and uses a variety of structural materials. These grooves or channels can be of any desired length and they can have different cross sections: two identical = degrees. The grooves or retaining structures do not have to be the same size as the channels, because they can simply be read from the position of the channel 37 200426253, in fact, they can have a smaller wear. Area; (5) there is no need for one-to-one correspondence between each groove and channel; (6) the dimples themselves may have different heights, or be provided at different depths in the structure, or have different Cross-sectional dimensions. 5 In other variant embodiments, instead of the chamfered portion or the holding structure that penetrates into a structural element, it can also form a chamfered buckle groove on the side wall area of the structural material, and these buckle grooves can be filled with a Adhesive or substrate material, and forms an interlocking element when mated with reverse buckle grooves on other parts of the structural material. 10 In some embodiments, a multilayer structure can be manufactured from a "top" layer (the expected last layer), which is adjacent to a temporary substrate, or it may be made with one or more sacrificial materials. The substrate is temporarily separated and then attached to subsequent layers until the first layer is reached. In this case, the conversion of the substrate can be completed by directly fixing the structure (such as a permanent substrate) to the final formation layer (such as the expected 15 first layer), and then, if not yet, the temporary substrate Can be removed. In some other embodiments, the multilayer structure can be manufactured from a predetermined first layer, which can be formed directly on a temporary substrate or separated from the temporary substrate by a sacrificial material, the sacrificial material The sacrificial material may be the same or different from forming a part of the layer containing the structural material. This construction process will progress from the first layer to the last layer, and if needed, one or more layers of sacrificial material can be placed on the last layer. The sacrificial material provided on the last layer may be the same as or different from the sacrificial material used to form each layer including the structural material and the sacrificial material. If necessary, a second temporary substrate can also be fixed to the last layer or the material layer on it. This first temporary substrate (ie, the original substrate) can be removed by 38 200426253. If there is material sacrifice_stored underneath the layer, they can also be removed 'and then fixed to the first layer with a permanent (or structural) substrate', the second substrate can be removed with any The removed sacrificial material is removed together. In some embodiments, the structural material may be rigid, while in other embodiments, it is mutable. In still other embodiments, the permanent substrate may be an integrated circuit or other electrical component, and the dielectric _, wire junction, reflow soldering contact, and / or other conductive or dielectric components-or more To complete the connection. 10 # #People will be able to infer many other variations after reading this article. More embodiments can also be formed by the combination of various technologies disclosed in this case. ° More more can be formed by combining the technology disclosed in this case with the content described in the patents and applications in the following table. The contents are attached for reference. • U.S. Patent Application, Proclaiming Green Sun U.S. Patent Application Publication No., Publication Date Γ \ Γ \ / Λ Α Γ \ ^ Inventor, name ~~ -------- • 09 / 493,496 2001. 01. 28 Cohen, Adam L., "Methods of Electrochemical Manufacturing"-• 10/677556 2003. 10. 01 ’Single with alignment and / or holding fixtures that can accept components • 10/8 j0262 2004. 04. 21 people, "The Way to Reduce Interlayer Discontinuities in 3D Structures Produced Electrochemically (Docket P-US099 -A-MF) 2004. 05. 07 I ^ ockaid et al ’“ Electrochemical fabrication of structures that can be partially removed by planarization using an adhesive cover, combined with a dielectric sheet and / or a seed layer ,, 10/271574 2002. 10. 15 • 20030127336A1 2003. 07. 10 ^ ien et al., "Methods and devices for making micro-electromechanical structures with high aspect ratios-10/697597 2002. 12. 20 Lockaid Temple ’fafa method and device including spray metal or powder coating process” • 10/677498 2003. 10. 01 Cohen et al., "Porous hoods and methods and devices using the hoods to create 30 structures, • 10/724513 2003. 11. 26 Cohen et al., "Non-conformal hoods and methods and devices for making 3D structures," 10/607931 2003. 06. 27 Brown et al., "Miniature Rp and microwave components and the methods used to make them ^ __ 39 200426253 • (Docket P-US093 -A-MF) 2004. 05. 07-layer 3D structure to flatten plating and / or to form multiple layers • 10/387958 2003. 03. 13 • 2003-022168-A1 2003. 12. 04 Cohen is awe-inspiring, "Tian iu system, Tie —-__ Education system and the 3D blessing of ^^ 10/434494 2003. 05. 07 • 2004-0000489-A1 2004. 01. 01 quality 3 service and loading silver cloth operation to monitor sediments • 10/434289 2003. 05. 07 • 20040065555 2004. 04. 08 Straightforward positioning of cathodic activation of cis-contact contact stupidity • 10/434294 2003. 05. 07 • 20040065550 2004. 04. 08 Uang Zhang has an enhanced electrochemical method for post-sinking, • 10/434295 2003. 05. 07 • 2004-0004001 2004. 01. 08 3D Structure Pole Integration of Fashion and Semiconductor Circuits • 10/434315 2003. 05. 07 • 2003-0234179 2003. 12. 25 A. Slim 8, using sacrificial metal patterns to shape the structure • 10/434103 2004. 05. 07 • 2004-0020782 2004. 02. 05 Manufacture of Cypress Seal Microstructures and Wire Manufacturing This Step • (Docket P-US105 -A-MF) 2004. 05. 07 Cohen et al., User side; Multi-step release method for electrochemical fabrication of structures,-• 10/434519 2003. 05. 07 • 2004-0007470 2004. 01. 15 genms R.  Smalley ’A method and device for electrochemically fabricating structures by mutual enrichment layers or selective etching and voids” #_ j ”Supplement • 60/533947 2003. 12. 31 Kumar et al., "Probe arrays and methods for labeling," _ • a • 10/724515 2003. 11. The rain of the non-parallel mating of the axe contact cover and the substrate ^ Various other embodiments of the present invention exist. Some of these embodiments are based on a combination of the techniques herein and the various techniques of the accessory. Some embodiments may not use any overlying deposition process and / or planarization process. Certain embodiments may include selective deposition of multiple different materials on one or more layers. There are 5 embodiments that may use a non-electrodeposition overlying deposition method. Some embodiments 40 200426253 use nickel as a structural material, while other embodiments may use different materials, such as gold, silver, or any other electrodepositable material, which can be separated from copper and / or some other sacrificial material . Some embodiments may use copper as a structural material with or without sacrificial material. Some embodiments remove the sacrificial material, while others do not. In some embodiments, if the deposition occurs in a manner such that the seal between the compliant portion of the CC cover and the substrate is transferred from the surface of the compliant material to its inner edge, The deposition depth can then be increased by pulling the conformable contact mask away from the substrate. After reading this article, the skilled person will easily know about many other embodiments of the present invention, design changes and usage. Therefore, the present invention is not limited to the foregoing specific embodiments, variations, and uses, but is limited only by the scope of the following patent applications. I: Brief description of drawings 2 Figures 1 (a) to 1 (c) schematically show side views of different stages 15 of a CC cover plating method; and Figures 1 (d) to 1 (g) are schematic A side view of different stages of a plating method using different types of CC covers is shown. Figures 2 (a) to 2 (f) schematically show side views of different stages of an electrochemical manufacturing method for forming a specific structure, in which a sacrificial material is selectively deposited and a structural material is covered Surface deposition. 20 Figures 3 (a) to 3 (c) are schematic side views of various sub-combination examples that can be used to manually perform the electrochemical production method shown in Figures 2 (a) to 2 (f). Figures 4 (a) to 4 (i) schematically show that the first layer of a structure is made using the adhesive cover plating method, in which the overlay deposition of a second material will cover the first material between the deposition locations The openings as well as the first material itself. 41 200426253 Figure 5 shows a flowchart of the basic operation of a preferred embodiment of the present invention. Figures 6 (a) to 6 (c) show a structure example made according to a preferred embodiment of the present invention, wherein Figures 6 (a) and 6 (b) show two different perspective views of the structure, Fig. 6 (c) shows a side view of the structure. 5 Figures 7 (a) to 7 (0) show the procedures for making the structures of Figures 6 (a) to 6 (c) from a plurality of adhesive layers according to a preferred embodiment of the present invention. Figures 8 (a) to 8 (d) show one variation of one of the last layers of the structure made in Figures 6 (a) to 6 (c), and how the permanent substrate is mated to the material layer. Figures 9 (a) to 9 (e) show the ten steps when implementing one embodiment of the present invention. Fig. 10 provides a flowchart of the basic operation of the embodiment of Figs. 9 (a) to 9 (e). Figures 11 (a) to 11 (j) illustrate various operation steps performed when implementing an embodiment of the present invention. 15 Figure 12 provides a flowchart of the basic operation of another embodiment of the present invention. Figures 13 (a) to 13 (c) schematically illustrate the process of transferring a structure 702 from a first substrate 704 to a second substrate 706. Figures 13 (d) to 13 (e) are schematic side views of a structure and a substrate having a correction structure capable of strengthening the fixing. 20 Figures 14 (a) to 14 (c) schematically show that a manufacturing method can modify one of the structures. The structure of the bonding layer includes the groove shown in Figure 13 (d). Figures 15 (a) to 15 (f) schematically show that a manufacturing method can modify the structure of a fixing layer of a structure to include a fastening groove to strengthen the structure and the substrate. 42 25 200426253 [Representative symbols for main elements of the drawing] 2 ··· First material 56 ·· Υ 台 4 ··· Second material 58,64 ... Slot 6,82 ... Substrate 62 ... Anode 8 ". CC cover 66 ... plating solution 10 ... insulator 68 ... feet 12 ... anode 72, 74 ... frame 14 ... plating solution 84 ... photoresist 16 ... electrolyte 86, 88 ... surface 18 ··· Power source 94,96 ... Metal 20 ... Support structure 98 — 3D structure 22 ·· Deposition material 102-110 ··· Operation steps of the process 26,92 ·· Opening L 122,302 ·· Structure 32 ··· Electrochemical Manufacturing System 124,200 ... Permanent Substrate 34 ... Substrate Retention System 201-210 ... · Each Layer 36 ... CC Cover Subsystem 211 ... Sacrificial Material Layer 38 ... Overlay Subsystem 212 ... Temporary Substrate 40 ... Flattening secondary systems 304, 504 ... Structural materials 42 ... Sliders 306, 506 ... Sacrificial materials 44 ... Actuators 308, 508 ... Release materials 46 ... Indicators 312 ... Substrates 48 ... Carriers 322 ... prefabricated component 52 ... polishing plate 324 ... device base 54 ... force plate 326 ... metal 43 200426253 328 ... piezoelectric material 602-614 ... each process step 330 ... adhesive 702 ... structure 334 ... member 704 ... first substrate 336 ... device 706 ... second substrate 402-416 ... each process step 712, 714 ... layer 502 ... First structure 718, 752 ... Structural material 520 ... Photoresist 720/754 ... Sacrifice material 528 ... ¾ Electrical material 722 ... Opening 532, 536 ... Dielectric material 762, 764 ... Holding structure 534 ... Metal 772/774 ... Channel 538 ... Device base 776 ... Conversion base

44

Claims (1)

200426253 Scope of patent application: 1. An electrochemical manufacturing method for making a 3D structure from a plurality of adhesive layers, comprising: (A) selectively depositing at least a part of a material layer on a temporary base material 'The temporary substrate may include previously deposited material, (B) manufacturing a plurality of layers such that subsequent layers are immediately adjacent and adhered to the previously deposited layer, and the manufacturing includes repeating operations (A) a plurality of times; (C) After a plurality of layers, a structural substrate containing a dielectric material is fixed to at least a portion of a layer of the structure, and at least a portion of the temporary substrate is removed from the structure. 2. The method of claim 1 in the patent application scope further includes: (D) providing a plurality of prefabricated shells, each of which contains a patterned dielectric material containing at least one opening, and when manufacturing a material At least a portion of the layer can be deposited through the openings, and each cover package 15 contains a support structure that supports the patterned dielectric material. At least some selective deposition operations include: (1 ) Contacting the temporary substrate with the dielectric material of a selected pre-made cover; (2) conducting a current through at least one opening in 20 of the selected cover in the presence of a plating solution; Between an anode and the temporary substrate, the anode contains a selected deposition material, and the temporary substrate will be shaped as a cathode, so the selected deposition material will be deposited on the temporary substrate to form at least one layer. Part; and (3) the selected prefabricated shell is separated by the temporary substrate. 45 5 3. As stated in the method of item I} of the patent, some of the optional * operations include: "Bei provides an adhesive cover on the surface of the substrate-the figure, the cover contains at least one opening ⑺ In the case of the existence of the electric liquid surface, the current is passed through the holes in the _ grass to the anode between the anode and the substrate, the anode contains-the selected deposit, the domain button will be shaped as- The selected deposition material on the side of the cathode 1 will be deposited on the temporary substrate to form-at least a part of the residence, and 10 (3) the cover is removed by the substrate. 4. If I Method, wherein the bonding operation is arranged on the structural substrate and / or the layer to be fixed in contact. Courtesy 'then make the structural substrate and at least-part of the layer 15 5 · == 利The method of the first item, wherein the structural base material is ― pre-coating limbs and is adhered to at least a part of the layer. The substrate contains a 7-response material, which is cured. 20-prepolymer. The method, wherein the flowable material contains 8 · The component epoxy resin as claimed in item 7 of the scope of patent application. "Method" wherein the prepolymer contains-double 9 · The method as claimed in item 鄕, flexible material. "The structural substrate contains a 46 10. If the application of the first item of the patent scope, the fixed connection operation will make the ,, ... The substrate is at least partially covered by the deposition substrate. The method of item 1 of the patent application, wherein the manufacturing of the plurality of layers includes depositing at least a second material. The method of item 12 in the patent scope, wherein the fastening of the structural substrate to the structure includes mechanical fastening of a portion of the substrate and a portion of the structure. The selected deposition material or animal material in 10 ㈣m. -Structural Materials Section, and the other-includes a sacrifice 14. The method according to item 11 of the scope of patent application, wherein the second material is-a structural material and the selected deposition material is-a sacrificial material. 15 15 二: = Method 11 of the range item ′, wherein the selected deposition material is,-,. The second material is a sacrificial material. 16 · = = Reliance method of the 13th rhyme, in which at least a part of the sacrificial material will be removed, such as the month of the structural substrate. The method of item 16 of the i7.mr range 'its #The sacrificial material will be Divide or at least-part of it will be filled-dielectric material. 20 core = Li Qing method of item 17 'where the structural substrate contains this! 9.2 method of patent scope item, where the sacrificial material is removed' J, § The structural base material will be fixed to at least a part of the layer. For example, the method of item 3 in the scope of the patent application, when the structural material is made of the material '4, the structural material will also be made of The temporary substrate is released. 47 2I: The method of the patent 22 · == profit range item 1, wherein the structural base material contains -23 · If the patent application range item or more than one line knot operation, intermediate connection operation Contains-one or more " structural- or multiple-parts of the structural substrate are fixedly attached to 24. The method of item 1 of the patent application scope, wherein the fixed-tipped package is at 10 the structural-or- -Or multiple heavy-flow soldering contacts made between multiple parts of the structural substrate-or more. "25.-种 可An electrochemical manufacturing device made of a plurality of adhesive layers, including:, 装置-the device can be selectively deposited-at least _ part of the material layer-on a temporary substrate, the temporary substrate may include previously deposited materials ⑻-The device can manufacture most layers and make subsequent layers immediately adjacent and adhere to the first deposited layer, and the manufacturing involves repeating operations (A) multiple times; (C) A device can incorporate a dielectric material The structural substrate is fixed to at least a portion of a layer of the structure, and at least a portion of the temporary substrate is removed from the structure; and (D) — a computer-programmable control of contact devices, conductive devices, separation devices, A fixing device or the like is operated after the layers of the structure are formed. 26. If the device in the scope of application for patent No. 25, further includes: (D) most of the prefabricated shells, each of which contains a patterned dielectric 48 200426253 electrical material containing at least one opening, when manufacturing at least one layer of at least In some cases, deposition can be performed through the openings, and each cover body includes a supporting structure that can support the patterned dielectric material. The selective deposition device includes: 5 (1) a device can The temporary substrate is brought into contact with the dielectric material of a selected pre-made cover. (2) The device can conduct a current through at least one opening of the selected cover in the presence of a power mineral solution. Between an anode and the temporary substrate, the anode includes a selected deposition material, and the temporary 10 substrate will be shaped as a cathode, and the selected deposition material is deposited on the temporary substrate to form at least one layer. Parts; and (3)-the device can separate the selected prefabricated enclosure from the temporary substrate. 27. The device of claim 25, wherein the selective deposition device comprises: 15 (1) A device can provide a patterned adhesive cover on a surface of the substrate, and the cover contains at least An opening; (2) the device can conduct a current between an anode and the substrate through at least one opening of the bonding cover in the presence of a plating solution, the anode including an A selected deposition material, and the substrate is shaped like a cathode, so that the selected deposition material is deposited on the temporary substrate to form at least a portion of a layer; and (3) the cover can be removed by the substrate Device. 28. An electrochemical manufacturing method for making a 3D structure from a plurality of adhesive layers, comprising: 49 200426253 (A) selectively depositing at least a portion of a layer on a first temporary substrate, the first A temporary substrate may include previously deposited materials; (B) manufacture a plurality of layers so that subsequent layers are immediately adjacent and adhered to the previously deposited layers; and 5 (C) after forming a plurality of layers, a A second temporary substrate is fixed to at least a part of a layer of the structure, at least a part of the first temporary substrate is removed from the structure, and then a structural substrate is fixed to at least a layer of the structure In part, it will at least partially overlap the position where the first temporary substrate was fixed. 10 29. The method of claim 28, wherein the selective deposition operations include: (1) providing an adhered patterned cover on a surface of the substrate, and the cover includes at least one Openings; (2) in the presence of an electroplating solution, a current is conducted between an anode and the substrate through at least one opening of the bonding cover 15, the anode comprising a selected deposition material And the substrate is shaped like a cathode, the selected deposition material is deposited on the temporary substrate to form at least a portion of a layer; and (3) the cover is removed from the substrate. 20 30. An electrochemical manufacturing method for manufacturing a 3D structure from a plurality of adhesive layers, comprising: (A) selectively depositing at least a portion of a material layer on a first sacrificial substrate; and the temporary The substrate may include material deposited by the Prophet, (B) making a plurality of layers with each subsequent layer in close proximity and adhering to the previous Shen 50 200426253 layer; and the manufacturing includes repeating operations (A) a majority of times; (C) in the production After the plurality of layers, a substrate containing a structure containing a plurality of materials and / or a patterned structure is fixed to at least a portion of a layer of the structure, and at least a portion of the temporary substrate is removed from the structure. 5 31. The method according to item 30 of the scope of patent application, further comprising: (A) providing a plurality of prefabricated shells, each of which includes a patterned dielectric material containing at least one opening, and is manufacturing a layer At least a portion of the dielectric layer can be deposited through the openings, and each cover includes a supporting structure that can support the patterned dielectric material. 10 At least some of the selective deposition operations include: (1) using The temporary substrate is in contact with a dielectric material of a selected pre-made cover; (2) in the presence of a plating solution, a current is conducted through an anode and the at least one opening of the selected cover; Among the 15 sacrificial materials, the anode contains a selected deposition material, and the temporary substrate is shaped like a cathode, so the selected deposition material is deposited on the temporary substrate to form at least a portion of a layer; and (3) The selected prefabricated shell is separated by the sacrificial material. 32. The method of claim 30, wherein the selective deposition operations 20 include: (1) providing an adhered patterned cover on a surface of the substrate, and the cover includes at least An opening; (2) in the presence of a plating solution, a current is conducted between an anode and the substrate through at least one opening of the bonding cover, the anode 51 200426253 includes a choice And the substrate is shaped like a cathode, the selected deposition material is deposited on the temporary substrate to form at least a portion of a layer; and (3) the cover is removed from the substrate. 5 33. An electrochemical manufacturing method for making a 3D structure from a plurality of adhesive layers, comprising: (A) selectively depositing at least a portion of a layer on a first temporary substrate, the first A temporary substrate may include previously deposited materials; (B) manufacture a plurality of layers such that subsequent layers are immediately adjacent and adhered to the previously deposited 10 layers; and (C) after forming a plurality of layers, a material containing a majority of the material and / or A second temporary substrate of a patterned structure is fixed to at least a portion of a layer of the structure, and at least a portion of the first temporary substrate is removed from the structure, and then a structural substrate is fixed to the structure. At least 15 parts of one layer of the structure will at least partially overlap the position where the first temporary substrate was fixed. 34. The method of claim 33, wherein the selective deposition operations include: (1) providing an adhered patterned cover on a surface 20 of the substrate, and the cover includes at least one Openings; (2) in the presence of a plating solution, conducting an electric current between an anode and the substrate through at least one opening of the bonding cover, the anode comprising a selected deposition material, The substrate will be shaped like a cathode, so the selected deposition material will be deposited on the temporary substrate to form at least a portion of 52 200426253; and (3) the cover is removed from the substrate. 35. An electrochemical manufacturing method for manufacturing a multi-segment 3D structure, at least one of which is made of a plurality of adhesive layers, the method includes: 5 (A) manufacturing at least one of the multi-segment structure Sections, including: (1) selectively depositing at least a portion of a layer on a substrate, the substrate may include previously deposited materials; (2) fabricating a plurality of layers with subsequent layers in close proximity and bonding The layer is deposited before, and the manufacturing includes repeated operations (1) multiple times; 10 (B) providing at least one additional section of the multi-segment structure; (C) fixing the at least one section to the at least one additional section Sections to form the multi-segment structure. 36. The method of claim 35, wherein the selective deposition operations include: 15 (1) providing an adhered patterned cover on a surface of the substrate, and the cover includes at least one Openings; (2) in the presence of a plating solution, conducting an electric current between an anode and the substrate through at least one opening of the bonding cover, the anode comprising a selected deposition material, The substrate will be shaped like a cathode, so the selected deposition material will be deposited on the temporary substrate to form at least a portion of a layer; and (3) the cover is removed from the substrate. 37. The method of claim 35, further comprising separating at least one segment of the multi-segment structure by the substrate. 53