TW200422418A - Method of bonding sputtering target materials - Google Patents

Abstract

A method of forming a sputtering target is described that involves bonding a backing plate onto a casement having one or more recesses that contain target material to form a bonded target. During the bonding process, the bonded target is optionally vacuum sealed within the recess. The bonded target is then optionally annealed while under vacuum to form an annealed sputtering target. The sputtering target can then be retrieved by removing at least a portion of the casement from the sputtering target in one or several steps. Also described is a casement having one or more recesses containing bonded target material that is optionally vacuum sealed in the casement. The casement, as well as the backing plate that is optionally bonded onto the casement, are further described as well as other options and methods.

Description

200422418 发明, Description of the invention: [Technical field to which the invention belongs] The scope of patent application for this application was previously on October 2002, i.e. the national temporary special brake & &#,. U.S. Patent Application No. 60 / 415,272, 35 U.S.C. §119 (e) and US Provisional Patent Application No. 60 / 449,783 filed on February 25, 2003, all of which are incorporated herein by reference.先前 [Prior art] The present invention relates to sputtering targets and other metal objects. More specifically, it explains how to bond different metals together to form bonded targets and other bonded metal objects. 1 There are many techniques used to bond two metals together, such as diffusion bonding, explosion to the knot and its core 4 m > These processes include-extinguishing plating or raw target bonding on a support plate and at a time Make a target assembly. Needless to say, bonding at a time—supporting the floor slabs—may be costly and costly and further progress may lead to non-compliance with quality control. Further, bonded targets are often annealed for a variety of reasons, such as to remove mechanical stresses generated in the bonding material during bonding, to crystallize the microstructure of the material, and generally to achieve the metallurgical properties required for sputtered hafnium components. Annealing is typically performed under vacuum, in an inert atmosphere, or both to avoid introducing impurities into the bonded material during the annealing process (for example, from oxidation). Vacuum annealing is quite energy efficient. Accordingly, in order to save time and the cost of manufacturing a sputter target, it is necessary to improve the bonding process method and other metal objects. [Summary of the Invention]

O: \ 88 \ 88457.DOC 200422418 One feature of the present invention is to provide an improved method for bonding a support plate to a sputtering target, and vice versa. An advance feature of this month is to provide a method for forming a plurality of sputtering targets on a support plate. The advance feature of this month is to provide a method for forming many sputter targets and other metal objects with uniform physical properties and bonding strength. A further feature of the present invention is to provide a method for bonding a support plate to a target material in a cover frame so that the target material is hermetically sealed in the cover frame during bonding and knotting. ~ Additional features and benefits of the present invention will be partially stated in the following description, and some will appear in the explanation towel, or can be learned by using the exercises of the present invention. The objects and other benefits of the present invention will be achieved and achieved using a combination of elements and the patentable scope specifically pointed out and appended in the description. In order to achieve these and other benefits, and in accordance with the purpose of the present invention, such as specific embodiments and widely described in the text, the present invention relates to the method of forming-cheap money = or: other metal objects include bonding a support plate to a target-containing material Recessed-mask box. Bonding the support plate to the mask frame to form a plurality of bonded target materials I may include removing any remaining mask frame portion from the bonded dry material. The present invention also relates to forming a sputtering target, including arranging a target in a recess of a mask frame so as to expose a sticky, nominal surface of the target material and a surface parallel to the upper surface of the mask frame. The method further includes the bonding-supporting plate to the bonding surface of the bonding material and to at least a portion of the mask frame to form a bonded target which is vacuum-sealed in the cavity.该 方 ^

O: \ 88 \ 88457 DOC 200422418-The step includes annealing the vacuum-sealed bonded dry material to the base material. This method is followed by #y annealed full: The plater uses the sputtered leather # frame to remove the sputter target. Only private parts are removed, part of the cover is bonded to the supporting material to contain dry materials, and it can be made of explosive materials, fμ, any bonding technology, and it can be sealed directly. The bonding step is preferred. The target material of ..〇 is in the recess of the mask frame. The invention further advances-the mask frame tF U rU ^ ^ ^ US ^ field or cavity contains a target, which separates the gap between the top or exposed target material from the support plate material, and utilizes-controls m ± a and. The helium press board is in contact with the surface of the mask frame on the U surface. The present invention further relates to the crying priests. 7 The mask frame has a recessed area or the recess B has many target materials, as described above. One of the supports The board is bonded to at least the top of the ancient target material or the exposed bonding surface. ~ As an option, you can place an intermediate layer between the support plate and the surface of the cover frame on the sticky branch — + _ fork protector. It should be understood that the foregoing general description and the following are both examples and only examples, and it is expected that the scope of this patent will be provided. "Progress ^ Brother, if you apply for drawings, the combination and the composition of this application show that some /, the embodiment of the present invention and the description together with this description are used to explain the principles of the present invention. [Implementation mode] the present invention Regarding the base wire and other metal objects. More particularly, the present invention provides a method of simultaneously " many base materials while bonding the support plate to many sputtering targets. The process can also be applied to other metal objects: In the present invention, one or more dry materials are bonded to one

O: \ 88 \ 88457.DOC 200422418 is placed or located in the -recess area or formed in a recess. Located in the alcove is a no-knot surface that is free of materials or not just now. The material has a dry material that is difficult to parallel to the upper surface of the cover frame, and the surface of the knot is actually between the upper surface. A sun :: in order to form the support plate and the alcove of the cover frame) can be practically flat ::: the top of the contact surface or the dry material 之上 above the upper surface of the cover frame, the upper surface of 匚 is the same-plane, Or at _. When the support plate is bonded to the target material that is recessed in the cover frame, the material] position ... The bonded target material where the support plate 1: 1 is a dry material in the cover frame cavity. The exposed upper or bonded surface. Moreover, depending on the bonding technology, the exposed upper surface of the mask frame can be bonded to the giftboard. Preferably, the bonding process produces 2 empty conditions in the cavity, and the Hunan bonded cutting board Both of the materials are displayed on the mask frame: The formed bonding target is vacuum-sealed in the recess of the mask frame.-When the support plate is bonded to the dry material and the exposed area of the mask frame surface, at least a part of the mask frame It can be removed from the bonded concrete. Usually, the removal material is above the surface area of the support plate. Part of it is used as the method of supporting the target plate. Then 'the rest of any mask frame is still on or around the bonded target material and can then be removed from the bonded target material. If the support plate Bonding to dry material rather than to the exposed area of the mask frame surface 'then basically the entire mask frame can be easily removed from the bonded target material. These two parts will be explained in more detail below. For the sake of the present invention in more detail For the purpose, the metal object is preferably a sputtering target but can be any shape of the object. Two pieces of metal, such as metal plate 7, are bonded together. In a preferred embodiment, it usually includes a support plate

O: \ 88 \ 88457.DOC 200422418 to a dry material. The support board can be any suitable metal material used for money plating and one of the other support board applications. The target material may be any material capable of being sputtered. Examples of support plates include, but are not limited to, copper or copper alloys, copper, copper, sharp, titanium, chains, and alloys thereof, such as Taw, ν_, Sin, NbZr, TaNb, Suspension, TaTi, Yang, Tau, Ca 〇 and similar. Regarding the target material to be bonded using the method of the present invention, examples include, but are not limited to, 'µ, niobium, cobalt, titanium, copper, aluminum, and alloys thereof, such as the alloys described above. In the present invention, the target-grade material to be bonded to the supporting plate object may be, for example, Wu Guo Patent No. 6,348,113 (Michaluk et al.), Which describes a target-grade material, all of which is incorporated herein by reference. The patent states that examples of support plates can be prepared from starting ingots, plates or round billets. Purity, structure, and / or grain size and other properties, including size and similarity, are not critical to the invention. It is used to make the dry material grade support # 板 ㈣ 底 ㈣ and ㈣ itself can have any purity with respect to the metal. For example, the purity may be 99% or higher, such as from about redundant or higher and more 99.95% or higher and even more 9999% or higher, or 99.995% or higher, 99.999% or higher. The target can have any grain size (for example, an average grain size of less than 300 microns, less than 1000 microns, less than 50 microns, less than 20 microns) and / or structure. For example, the tissue can be random,-basic (111) tissue, or-basic (100) tissue which can be on the surface of the target or through the entire thickness. Preferably, the tissue is homogeneous. Moreover, the target can have a mixed (111) :( 110) tissue spread over the surface of the target or over the entire thickness. In addition, the target material can actually be a hollow of the group 0 \ 88 \ 88457.DOC -9- 200422418 weaving stripes, such as (100) tissue stripes actually ". The thickness μ is used to shape the material to an appropriate thickness. Or ’slabs and dry materials or other important metal plates may be of any thickness suitable for the desired application. Support plate: ==: Γ Examples include, but are not limited to, plates with: (degrees taught 25 or less to about 2 inches ^ larger thickness from about ° · 060 inches to about cut or larger Hou Lu. In the Tai: there is a knot to the support plate ... The material can be a two-handed, transparent, dry material-grade material such as sticky Λ.

Instructions by Mwhaluk et al. A duel-the mask frame has one or more "『 shape, can be prepared "and more recessed into the area or cavity so that the target material sets: or more recesses. Basically, the mask frame can With-one or less alcoves cut or formed in the mask frame, uterine ulcers, or uterine ulcers, which match the shape of the target material about the straight two,-, length, and locality. Generally, in-Π, : The chamber has the appropriate W material to control the ruler; two two = ... separation. The gap can be any distance, such as .25 small or as large as 1 or 2 inches or larger. In other words, in-specific Zhongshi Example 'The top of the target material or the bonding surface material may be slightly lower or higher than the surface and surface of the mask frame. The level of the dry material is not critical.' The surface and the upper surface of the mask frame are related to the mask frame ' The cover frame is preferably a metal grade, such as steel or litam. The preferred steel is due to its strength and availability, and the price of the metal plate. If it can be used, the thickness is greater than the dry material. Steel and through traditional cutting and processing techniques can be cut or formed into leather frames with one or more recesses. Traditional Cutting and processing technology

O: \ 88 \ 88457.DOC 'Examples of 10-200422418 include, but are not limited to, drilling, grinding, milling, electrode discharge machining, or other suitable methods. The size of the cavity is larger than the size of the target material. For example, the diameter or size of the leather material may differ from the diameter or size of the cavity by about 1 mm to about 10 mm, and more preferably from about 1 mm to about 5 mm. In other words, the edge / margin of the alcove and the edge of the target are the ranges of this size. Alternatively, when the target material is placed in the cavity area to ensure that the target material is nested in the cavity, in order to produce a suitable or tight fit in the cavity area, the size of the cavity area is substantially similar to the size of the target material. Even when the recessed area is formed, the mask frame should have a specific thickness, especially in the area below the recessed area, the mask frame is still strong enough to withstand a bonding step, such as explosive bonding. As for arranging one or more targets in a mask frame cavity, the target material is positioned or placed with the adhesive edge upward and the opposite sputtered edge down into the corresponding mask frame cavity. Note that not every cavity needs to contain a target. Furthermore, a raw target or other metal layer can be arranged in the recess. The configuration may include pressure-sleeving the target material into the cavity such that the target material is guaranteed to enter the cavity. According to a specific embodiment of the present invention, the method further includes arranging a lining or a protective layer in at least one cavity before the dry material is disposed in the same cavity. This protective layer prevents the sputtered edges of the target from sticking to the bottom surface in the cavity of the mask frame. The protective layer can cover all or any part of the bottom surface of the cavity. The protective layer may cover all or any part of the side surface of the recess. For example, "the protective layer may be of any thickness or made from any material. The protective layer is preferably made of paper, and more preferably a cardboard. Before the target material is disposed or placed in the area of the housing cavity, the cover Box can throw

O: \ 88 \ 884S7 DOC 200422418 Light or clean, and if an explosive bonding mechanism is used, a glue polymer or other bonding material (such as a 'protective material') can selectively enable ^ to ensure that the leather material enters the frame and prevents Or make it easy to bond the target and the mask frame. Preferably, if the bonding material is used, the gap existing between the mask frame and the support plate is filled. Regarding the mask frame size or mask frame size, as long as a metal mask frame or other suitable material can be formed or obtained, any size can be used. In a specific embodiment of the present invention, the mask frame has a sufficient size so that the number and size of root filament materials: to prepare-enough number of recessed area. In the -preferred embodiment ', the cover frame has a length dimension from about a ruler or shorter to about 5 feet or longer and a width from about 1 foot or shorter to about 5 feet or longer some. Furthermore, the size of the mask frame is about 42 inches by about 42 inches. The thickness or high yield of the mask frame ranges from about w or shorter to about 10 feet < longer. Preferably, at least 2 recesses = areas or chambers are present in the enclosure and for adjustment-an equal number of dry materials have dimensions that will fit into these recessed regions, and there may be at least 3, at least 4, at least 5, at least 6, At least 7, at least δ, at least%, at least 10 or more alcove regions, which may be the same or different sizes. As shown in FIG. 1, for example, a mask frame can be prepared which basically adjusts 4 target materials, of which 2 target materials have the same size and the other 2 dry materials have the same size. Moreover, as an option, a small-shaped recessed area can be used to receive a bond quality test sample of the target material. In order to test the bonding quality and strength between the target material and the support plate, these 1 to regions can have a diameter size from about 1 inch or shorter by about i inches or shorter by about 6 pairs or longer by about 6 Or longer is important. This '. 〇 贝 ’, the alcove region of the test sample can be located in the entire mask frame, as shown in Figure 1. And as shown in Figure 1, it can be a little round line surrounding the dry material or

O: \ 88 \ 88457.DOC -12- 200422418 The back edge of the stay. These dots and circles represent flanges that will be cut to form a leather material when adhesion occurs. These dotted lines or other similar marks can be placed on the back of the mask frame so as to be bonded. In order to remove the stuck puzzle material, you can immediately decide where the mask frame cutting will occur. These marks can be the type of the last name engraved line, coated marks and the like. Alternatively, or in combination, the mark may be on the back of the branch floor to indicate the position of the flange portion. -When the dry material is arranged or located in the alcove region of the hood frame, the hood frame containing the dry material in the alcove region can be paired with a support slab such that the support plate 4 is near the upper surface of the hood frame and has exposed materials. The bonding surface is in the area of the alcove. The mask frame with the dry material facing the support floor can then use any conventional technique such as retaining clips, today's chrome book sweetheart bar T, vise and other locking devices. In order to achieve explosive adhesion, if this point-knot technology is used, the load behind the support plate can be-explosives. Generally, the explosive load is a load sufficient to cause a bond between the filament material and the support plate. The load of the explosive is preferably also sufficient to provide a bond between the support plate and the exposed surface area of the mask frame. Generally, using explosives stacked to a density of ig / cc, the explosive load on a w-thick support plate with a gap of about .25 is from about 0.018 pieces / square 忖 to about 8200 pieces of ⑽copper support plate. The copper alloy support plate is about 0.02 Ho / square. Other explosives such as Bulletin H, Café, Huatze _ No. 1, C4, or other appropriate explosives can be used, but the explosive load should be adjusted to the energy of the explosion. For the calculation of explosive load, see more information]. Carlson, V.D_ Linse & RH evaluation ~

Materials Engineering 68, 70 (1968), all of which are incorporated herein by reference.

O: \ 88 \ 88457.DOC -13-200422418 As mentioned above, there can be a gap between the support plate and the cover frame by using the target bonding surface above or below the upper surface of the military frame. If explosive bonding is used, it is preferred that the gap is filled so that it is at least flush with the dry material bonding surface and is preferably filled above the height of the target material bonding surface. When using explosive bonding 'it is preferred that there is a gap between the branch and the Tibetan mastiff material before the explosion occurs. If there is no gap and an explosive bond f is formed, an inappropriate bond may not be formed. According to this, with this option, in a specific embodiment, there may be a gap between the support plate and the dry material bonding surface and preferably no gap exists between the surface of the cover frame and the support plate. A better position of the gap can be created using a sufficient depth in the recessed area to have a dry material bonding surface under the upper surface of the cover frame so that the support plate contacts the cover frame without touching the remaining material. Moreover, the gap can be created using a bonding surface having a dry material substantially flush with the surface of the mask frame. Then 'apply the adhesive or protective material to surround the exposed surface area of the mask frame and / or the opposite surface of the support plate, and the supporting floor will adhere to the dry material bonding surface but not to any mask frame surface' because the bonding material is not on On any dry wood surface. Therefore, 'any method of generating-gap between the support plate and the dry material, rather than creating a gap between the support plate and the cover frame, and how the above method can achieve the preferred embodiment can be used. n early, preferably, 'the bonded preform has the metallurgical properties of a tree material having Aizaki grade flat plates. For example, according to the present invention, explosive adhesion—having—an average grain size of less than about 100 microns and—at the organization level, a target-grade flat plate with holes in the (10.) tissue is preferably formed with one; there is—

O: \ 88 \ 88457.DOC -14- 200422418 The preform with an average grain size of less than about 100 microns and a structure that is actually bonded to one of the (100) structure π void sputtering targets. Also, the explosively bonded knots, 'the bonded preforms, preferably have more support plates than the support plate parts prior to bonding' as measured quantitatively, for example, Rockwell B scale. For example, 'the hardness increases by 5% or more, such as% or more, and 30% -60% or more. In a particular embodiment, a support plate, such as C464 00, has a Rockwell B scale hardness of 63 before being bonded to a block hardness of 85 and an interface hardness of 100 after bonding. The bonding preform preferably has a bonding interface between the target and the support plate part, and the bonding interface has a higher strength. For example, the bond strength can be from 10,000 Psi to about 75,000 psi or higher, which is approximately, for example, twice the typical bond strength obtained by diffusion bonding. Other ranges include from about 25,000 psi to about 55,000 psi and from about 40,000 pSi to about 5,600,000 pSi and the like. The bonding strength is preferably uniform over the entire bonding surface. As stated above, it is particularly important to increase the bonding strength as the diameter of the sputtering target increases. Furthermore, the bonding interface formed by the present invention preferably includes a target-grade flat plate and a support plate that do not interact with each other. Therefore, the sputtering target and the support plate part can be separated more easily after recycling, for example, reducing the amount of contamination of the reprocessed metal with each other. The domains will be stuck and areas with gaps or adhesion problems can still be left. In the case of diffusion bonding, the mask frame is designed so that raw dry materials and instead of explosive bonding can be spread to the mask frame using traditional expansion materials. In the area of diffusion bonding, the bonding and bonding techniques are adopted, in which the supporting plate is applied to the supporting plate horizontally, such as the example of heat equalizing pressure and the like.

O: \ 88 \ 88457.DOC -15- 200422418 The branch floors are in close contact. Similarly, if the cover frame is in contact with, or a door is used, the board is cut with a clamp, and the fm is cut off to prevent the material from being separated from the support plate. Therefore, when the gold 77 frame ^, the Thai fried sticky gap is better. The percentage is better, using diffusion bonding, and the preferred strategy for placing the last name of / 5, which is the best position, is the opposite. Put another way 'When the top of the dry material or the bonding surface is in contact, the gap is better The presence of the second knowledge board can be accomplished using techniques similar to those described above, for example: == so that the top of the dry material or the bonding surface is located on the surface of the mask frame. And ^ use any mechanism to achieve the better gap position.: After the support plate is bonded to the upper surface of the dry material and the cover, the required size of the support plate can be shown from the earlier description. Possible flange. At this point use any transmission parts and thus get ... Remove any remaining points of the mask frame, you can use any of the following: dry material on it. In the = any Chuanzaki process, light and similar. The surface "formation is called, but at the same time as the part of ===, it is also straight — * sticky, .. ° support board to the explosive bonding exposed by the cover frame, the unoccupied space of the cavity is drawn =; two other -The way 'the cover frame and the supporting floor exploded and placed between the support plate and the sealing cover leaving the cover frame and the plate would be double ... with no dry material between the plates. As a result, the support, that is,

O: \ 88 \ 88457.DOC -16- 200422418 On the bonded surface, the vacuum conditions created in the cavity during the explosion are maintained after bonding. After the support plate is bonded to the bonding surface of the target material and the exposed upper surface of the cover frame to form a bonded target which is vacuum sealed in the recess, the method according to the present invention preferably includes annealing the bonded target material / cover frame. / Support the plate to form an annealed target. The bonding method described above can generate mechanical stress in the support plate during bonding. The stress in the support plate can be reduced or eliminated by annealing the bonded target. Preferably, the bonded target material is annealed under vacuum in other objects to avoid oxidation of the target material. However, because the bonding according to the method of the present invention produces a vacuum-tight bonded target in the recess, because no air will react with the target, the bonded target can be annealed in an air furnace. This allows a very simple and economical annealing. The annealing may be at any temperature, and preferably at a temperature below about 80 ° C. For example, the annealing may be at about 200 to about 80 ° C., and preferably from about 3 ° C. to about 500 ° C., and More preferably, at a temperature lower than about 45 × χ. Preferably, the bonded target is annealed at a sufficient temperature and a sufficient time to reduce or eliminate the stress in the support plate, and the annealing time may be from about 丨Minutes to about 4 hours or more 'and preferably from about 1 hour to about 2.5 hours. According to a specific embodiment of the present invention, the method may include the step of annealing, selectively from other bonded targets Splitting one or more of the bonded targets is poorly divided, so that the bonded targets are still vacuum-sealed in the cavity. The split bonded targets may then be individually annealed. The split may include from Any other suitable method of separating and sticking the target in the mask frame. For example, the segmentation can be processed,

O: \ 88 \ 884S7.DOC -17- 200422418 Waterjet cutting, punching pressure, electric ^ water cutting brake, flame cutting, grinding, grinding, mining, laser cutting, drilling, + ru hole electrode EDM or any combination thereof. The size of the support plate required to remove the sputtering target can be removed by using the / removed mask frame from the sputtering target, as shown in the earlier description of the 'Ge' sputtered sheet. Tian Kren ’s point-knot target material / support plate was cut and separated from the hood frame, and there was still a mouthful of ^ The injury hood frame was stuck to the support plate area or it would be used as a sputtering target. Of the law. At this point, the remaining mask frame and the part bonded to the Geba Hao, '土 # material method area can then be processed using any processing technology, and any remaining mask frame is removed. Partially and consequently to a target material with a support plate adhesive ... At this point, traditional processes using any target, such as polishing and the like. This: The specific embodiment allows a large number of targets to be bonded to the support floor in a bonding process and therefore the output of the target material is bonded to the support plate for a larger output and to further reach many targets. Sticky, 黏. In addition, the small cavity is solid: two are one choice, and the bonding quality test material can be dispersed throughout the frame to ensure the size and consistency of the entire frame. As mentioned above, if the mask frame toilet support plate > adhesion occurs again, then the mask frame can basically be removed in one step and the mask frame will be intact and therefore reusable. # 仏 is optional. When the dry material is placed in the alcove area of the mask frame, a middle layer or protective layer can be positioned on the top of the mask frame. The intermediate layer or protective layer can be bonded to the target material and the support plate

The A and T interlayers or retaining layers can be any traditional interlayer material, ‘7 L, but not limited, an example of tantalum bonded to a copper alloy branch floor, the middle; 4, b ,. , Titanium or Vanadium can strengthen the cement

O: \ 88 \ 88457.DOC -18- 200422418 shell material. The technical papers of 0berg et al., Metallurgical Transactions A, 16, 841 (1 985) are all incorporated herein by reference, providing a description of the principles of thermodynamics used to select the appropriate bonding intermediate layer. Next, as explained above, the intermediate layer can be processed and separated in the Geba material flange area or left on the Geba material flange area, depending on the design of the target material. For another option, an intermediate layer or protective layer may be first placed on the cover frame and the connector material is inserted into the recessed area so that the intermediate layer or protective layer is pressed into the recessed area and the material is in the intermediate layer or protected Layer above. When using this option = ’she *, the support plate can be bonded to the target material and the middle layer or edge retaining layer. If the protective layer has a thickness of 3 mm and is solid, the supporting plate is connected to the protective layer and the cover frame. With this option, the integration of the hood frame can be damaged. Alternatively, in order to cut through the material, the mask frame need not be just a sacrificial layer. As another example, the intermediate layer or the intermediate layer / protective layer is basically opened / opened 乂 /, and has a branch plate design so as not to be the top area of the cavity. Use the point m, the surface only covers the material of the mask frame, not on the mask frame. This adhesion occurs in the protective layer as another-select "same target. The force is selected, the target's speech is used. 哕Le Er can be larger than the required final diameter. Use. Hey point, which ensures that the support plate and the straight position are-oversized diameter, p, between the bonding is of high quality and in other words, too much dry material can The outer boundary can be cut with force. Change the dry material with the required size and make sure that the amount of other methods to remove the target material is left. The final raking material is bonded. Too large τξ: Any love Li 'as the final desired diameter

O: \ 88 \ 88457.DOC -19- 200422418 5%, 10% to 25% or more. A protective material may be placed on the mask frame during the bump. The partner ^ is not located on the top surface of the dry material in the area of the cover frame cavity. The material preferably prevents the support plate from sticking to the top surface of the cover frame. Examples of this protective material are the same as knives such as high polymer adhesive, metal and the like. Another example could be-ceramic materials such as oxidized m-sections. Shell & = Explosive Bonding 'preferably has a gap between the support plate and the wire surface of the dry material to be bonded to the substrate. It allows the use of explosively bonded Γ to reach its optimal speed before hitting the top of the cymbal or the bonded surface. Place the top surface of the mask frame at -less than the optimal distance _ speed of the door. Put it in another way, if the surface of the top of the mask frame is close to or in contact with the support board during the explosion and adhesion, the support board will have a chance to impact the top of the mask frame before it hits the top of the mask frame. ^ ^ ^ Φ ^ The speed and therefore will prevent, or importantly, prevent actual adhesion to the top surface of the mask frame. In another Lugu Γ mask frame is further away from the optimal gap to achieve the maximum speed, then the support plate will contact the target material at the maximum speed to reach the top surface of the mask frame, the maximum speed is not sticky surface but at the same time actually minimize the point knot There will be no need to cover the frame and therefore the specific embodiments of the present invention described above will prevent or need to anneal the bonded target under vacuum [even, including elimination, if it is energy efficient. " Yue /, his specific embodiment will be disclosed to those skilled in the art from the book and the practical application of the present invention. ^ Mind The book and examples are considered as examples; It is expected that

O: \ 88 \ 88457.DOC -20- 200422418 The true range shown by the equivalent and the spirit of the present invention [Simplified illustration of the drawing]

The present invention is illustrated and not limited by the examples in the accompanying drawings. FIG. 1 is a diagram containing a plurality of target materials in the alcove region. FIG. An explosive load Q diagram after the brace. -Hood frame top view. Side view of a frame of a field

O: \ 88 \ 88457.DOC

Claims (1)

Scope of application for patents: A method of plating standard dry marks, including: gluing a support plate to the top surface of a number of targets i # in the alcove of the towel on the top surface of the target, where the target's One to the support plate to form a sticky dry material; and the surface sticking to the branch to remove the cover frame from the sticky dry material 2. Take out the 如> base ore leather and base material if you like. A. The method of item 1 of the monthly patent scope ends. / 、 Medium σ glutinous adhesive 疋 one explosion glutinous 3 · If applying for special ¥ 1 ㈣H knot. / 、 The adhesion is a diffusion adhesion. 4. As the method in the scope of patent application, item 苴, alloy. The target material includes tantalum or a method alloy such as the one in the scope of the patent application. The target in hafnium includes niobium or 6. Wherein the target material includes cobalt, titanium, wherein the support plate includes copper or the method according to item 1 of the scope of patent application, copper, aluminum, tantalum, niobium or an alloy thereof. Such as the method of applying for the scope of the patent No. 1 its alloy. Wherein the supporting plate comprises cobalt, wherein the cavity comprises at least 2 and wherein the cavity comprises at least 4 δ. The method according to item 1 of the scope of patent application 'titanium, copper, aluminum, niobium, tantalum or an alloy thereof. 9. Method as claimed in item i of the patent application, alcove. 10. Method according to the first scope of the patent application, the alcove. O: \ 88 \ 88457.DOC 200422418 If you apply for the square, and the alcove of the first scope of the patent application, these alcoves have the same or law 'where the alcove includes at least 2 and further includes at least one ^ 3 different sizes to accept the Targets, small recesses, and test samples. 4 Accept at least one bonding quality 12. If the item in the scope of the patent application is applied, remove the box. / 、 The cover frame is a steel cover 1 3 · As in the first item of the scope of patent application, one of the targets is exposed to the T where at least each surface before the bonding is actually 蛊 ^ " level.顶 The top surface of the mask frame is flush 14. As in the method of the first patent application, wait for at least one of the targets to be exposed, where the top surface is flush before the bonding. The surface is not tightly connected to at least one of the target materials of the cover frame, not at least one of the leather materials, such as the method of applying for the scope of the patent application, the cover is fixed to the cover in the cavity. frame. 16. The method according to item} of the scope of patent application is tightly fitted into the cavity. Among them, at least one set of tandem of the leather material enters the alcove so that there is a gap between the target and the .u. 18. · Method 10 in the n of the scope of patent application, where the gap is from about 丨 to about 10 mm. Method 1 in the scope of the patent application, whose former is occupied by σ, The support #plate and the target's exposure 如 17. The method as described in the scope of application for the patent! Item 19. ^ Tangiera has a gap between the support plate and the exposed surface of the correction material. The method of the patent scope item No. 'wherein, before the bonding, the section support plate is actually flush with the top surface of the cover frame, and among them, the support O: \ 88 \ 88457.DOC 200422418 There should be a gap between the exposed surface of the rake material. • For example, please apply the method of the first patent scope, in which before the bonding, a protective layer is arranged on the top surface of the cover frame to prevent the cover frame from sticking to the surface. Far support plate. 22. If the method of applying for the scope of patent No. 21, wherein the protective layer is a cardboard layer. 23. If the method of applying for the scope of patent No. 1, wherein before the bonding, the protective layer is arranged at least One of the recesses to prevent the mask frame from sticking into the at least one recess At least one of the targets. 24. The method according to the scope of application for patent #, wherein before the bonding ~ the middle f is arranged on the top surface of the cover frame and at least the exit surface of the dry material ~ 25. The method according to item 1 of the patent application scope, wherein removing the mask frame from the subtractive material includes cutting the surrounding mask frame. Q 5 Hai at least a portion of the bonded target 26 · ::: Γ method of item 25, wherein the removing step further includes; k-knot target processing 2 ... Please patent the item of item !: the remaining mask frame part. Cut open the Geba material = Where the removal of the mask frame includes a size of the mask frame that surrounds each knot and provides a sufficient support plate to form a flange. Only from the 28 that surrounds the sputtering target material. If the scope of the patent application item 丨 except the mask frame includes-彳, which is removed from the bonded target 29. If the scope of the patent application scope Hi step, remove part of the mask frame. The method of item 1, wherein At least ~ O: \ 88 \ 88457.DOC 200422418 of the target and pg S, 扃, 纟 σ of the target plate The degree is from about 10,000 to about 75,000 psi. 30. 31. 32. 33. 34. 35. 3 6. 37. 'Russian 4 patent scope No. 1, the method in which at least one of the target and the The strength of the door M3 of the support plate is from about 29,000 to about 55,000 psi. For example, the method in the patent range W, wherein at least one of the pure materials has an average grain size of less than about 100 microns. The scope of the application for patents is + the sound of the heart, the square &, /, in which the support plate has a hardness and adhesion to the knowledge 44 * >, ... comparison of the support plate of the dry village river, after bonding The support plate is increased by at least 10%. For example, in the method of applying for the first patent in the patent scope, the glued target is sealed in the alcove in real. If the __ mask frame of the patent application scope No. 3 3 is annealed before the bonding, 纟 :: material encapsulation. In the method of claiming the 34th patent range from the bonding 2, the annealing is performed in an air such as the 34th of the patent application, where the annealing is less than about 80 (TC. 1 person seven births) A method of forming a target by sputtering, including: bonding a support plate to a material 'JL in a cavity in the top surface of a cover frame, and forming a surface to the -pm, A support plate to form a sticky target which is vacuum-sealed in the recess; annealed a good material to form an annealed bonded target; and removing at least and y from the annealed bonded dry material Cover the frame to take out O: \ 88 \ 88457.DOC -4- 200422418 The Tibetan forging free material. Where the adhesion is explosive adhesion and the far adhesion is diffusion adhesion 3 8. The method of item ^ of the scope of patent application is knotted. 39 · For example, the method of applying for the 37th scope of the patent application is concluded. The publication · Ruyan alloy of the 37th scope of the patent. 41 · :: Please apply the first method of the patent scope, in which the sister material includes the state 42. For the method of the 37th scope of the patent application , Of which Ganqin, Copper, Shao, Noodle, Jiu or its alloys. Including drill 43. Rushen The scope of the patent is 37. 37. The support plate includes copper or titanium, copper, aluminum recognized as the scope of the patent application, and the m-bracket includes drill, sharp, button or its alloy. 4 5. Apply for a patented frame. 〇 j. Method, where the cover frame is a steel cover 46. If the method of the 37th scope of the patent application, the exposed surface of the material is μ * ,,,,,,,,,,,,,,,,,,,,,,, 47 This target 47 If the scope of the patent application is 37, the page sheet is unloaded flush. The exposed surface of the material is actual .. Others s-Hai target 4 8 Rushen · Main inspection, /, 5 The top surface of the cover frame Qiping. 48. As in the 37th application for the patent application, the cover frame in the alcove is used. Method 'where the dry material is not fixed to 49. As in the 37th application method of the patent application, it makes the The target is tightly nested in the O: \ 88 \ 88457.DOC ZUU4Z2418 50. 51. 52. 53. 54. 55. 56. 57. 58. Alcove. For example, the method of claim 37 of the patent scope, where: The target is nested in the cavity. There is a gap between the Haigeba material and this. For example, the method of applying for the scope of the patent No. 50,1,1 ,, wherein the gap is from about 1 to about 10 mm. For example, the method of claim 37 of the patent application scope, wherein before the bonding, there is a gap between the support plate and the protruding surface of the target. For example, the method in item 37 of the patent application scope, wherein before the bonding, the support board is horizontally back to the top surface of the cover frame, and among the support floor board and the dry material, There is a gap between the exposed K surfaces. For example, the method of claim 3, where before the bonding, ′, ° and θ are arranged on the top surface of the cover frame to prevent the cover frame from sticking to the support plate. ° As for layer 54 in the scope of patent application. The method, wherein the protective layer is a cardboard as described in item 37 of the patent scope. Before the bonding, the protective layer is arranged in the cavity to prevent the cover frame from being bonded to the cavity. Target. Wang Tau's ancient and earthen method, such as the 37th in the scope of patent application, in which the adhesive intermediate layer is arranged on the τ-4 topcoat of the cover frame and the exposed surface of the target material. Makes it easy to reach the stick. The way out is the Fangbangangan 0 method of the scope of patent application; item Π, wherein removing the mask frame from the sticking includes cutting and enclosing the moving frame. At least part of the solidified bonded target is covered by O: \ 88 \ S8457 DOC 59. If applying for the bonded leather processing method, the removal step further includes 60. Part of the mask frame. Shen-Patent Encirclement Item 37 Cut Package _ ^^ /. The removal of the material frame includes the size of the enclosure, and part of the cover frame and providing-sufficient support plate to form a flange. °, only to remove from the 61 · such as the scope of the patent application that surrounds the sputtering target The mask frame includes a method in which a portion of the mask frame is removed from the adhered dry material by 62.-4 steps. The method of patents in each month is 37 ° ± ^,, where at least the target 63. For example, the scope of the application for the patent 37 = Qing 0 to about 75 ~ a plate ": method, in which the sister material and the support 64". The strength of from about 29, _ to about 55, _psie • The method of item 37 of the patent application range, wherein at least the target material has a + average daily grain size of less than about 100 microns. 65 · If the application of item 37 of the patent application range and adhesion to the dry material> 、 / 、 Compared to the 4 support plate with hard jig, the support plate is increased by at least 10% on the bonded support plate. Μ 66. For example, the method of the 37th scope of the patent application, wherein the annealing is in an air furnace . 67. The method of the 4th patent model @item 37 in the application, its t should be lower than about 800 ° C. ~ ~ 68. — A method to use the money and other materials such as item i in the scope of the patent application to become 69. — A method to use the reduced material in the scope of patent application to item 37; 70. — a method of forming a _knot metal object , Including. Seven O: \ S8 \ 88457.DOC 200422418 The top of the early frame; +-metal object, in which the cavity plate in the 4 surface of the metal object to form a bonded metal object which: the surface is bonded to The annealed and bonded metal object is sealed in the cavity with a hollow core and is removed from the annealed and bonded object. The annealed and bonded object is the bonded metal object. Xi. Let's share this frame to take: 71. If you apply for the item 70 in the scope of the patent, go to the furnace. The annealing is performed in an air 72. The temperature of about 800 ° C, as in the square of the 70th scope of the patent application. Where the annealing occurs below O: \ 88 \ 88457.DOC