TW200420760A - A new method of treatment for a wrought copper foil - Google Patents
A new method of treatment for a wrought copper foilInfo
- Publication number
- TW200420760A TW200420760A TW92107962A TW92107962A TW200420760A TW 200420760 A TW200420760 A TW 200420760A TW 92107962 A TW92107962 A TW 92107962A TW 92107962 A TW92107962 A TW 92107962A TW 200420760 A TW200420760 A TW 200420760A
- Authority
- TW
- Taiwan
- Prior art keywords
- copper foil
- layer
- foil
- treatment
- nodularization
- Prior art date
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
This invention relatives to a surface treatment method for a wrought cooper foil for use on a flexible PCB. The surface treatment method comprises the steps of chemical degreasing, acid etching and nodularization, electroplating a barrier layer and an anti-tarnish layer and coating an silane coupling agent layer to a copper foil. One side of the copper foil is nodularization, and a Zn-Ni-Co barrier layer and a Cr-Zn anti-tarnish layer are electroplated on the copper foil. Finally, an silane coupling agent is coated to the roughened surface of the copper foil to modify the surface characters to impart the peel strength. Whereby, the cooper foil has very low profile, high peel strength, finer-pattern property, low HC1 undercut and high thermal oxidation property.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW92107962A TW200420760A (en) | 2003-04-03 | 2003-04-03 | A new method of treatment for a wrought copper foil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW92107962A TW200420760A (en) | 2003-04-03 | 2003-04-03 | A new method of treatment for a wrought copper foil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200420760A true TW200420760A (en) | 2004-10-16 |
Family
ID=52340992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW92107962A TW200420760A (en) | 2003-04-03 | 2003-04-03 | A new method of treatment for a wrought copper foil |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200420760A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105603480A (en) * | 2016-03-02 | 2016-05-25 | 山东天和压延铜箔有限公司 | Black surface treatment method for rolled copper foil |
| CN112600050A (en) * | 2020-10-20 | 2021-04-02 | 陕西斯瑞新材料股份有限公司 | Auxiliary processing technology for copper foil flexible connection metal with high tear resistance |
| CN114086227A (en) * | 2021-12-10 | 2022-02-25 | 铜陵市华创新材料有限公司 | Surface treatment process for improving peel strength resistance of low-profile electrolytic copper foil |
-
2003
- 2003-04-03 TW TW92107962A patent/TW200420760A/en unknown
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105603480A (en) * | 2016-03-02 | 2016-05-25 | 山东天和压延铜箔有限公司 | Black surface treatment method for rolled copper foil |
| CN105603480B (en) * | 2016-03-02 | 2019-01-01 | 山东天和压延铜箔有限公司 | The black surface processing method of rolled copper foil |
| CN112600050A (en) * | 2020-10-20 | 2021-04-02 | 陕西斯瑞新材料股份有限公司 | Auxiliary processing technology for copper foil flexible connection metal with high tear resistance |
| CN114086227A (en) * | 2021-12-10 | 2022-02-25 | 铜陵市华创新材料有限公司 | Surface treatment process for improving peel strength resistance of low-profile electrolytic copper foil |
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