TW200418358A - Method and device applying solid and liquid phase change in a heating electronic device to store heat and dissipate heat - Google Patents

Abstract

The present invention provides a method and device applying solid and liquid phase change in a heating electronic device to store heat and dissipate heat, in which an interaction between heat storage and heat dissipating for solid and liquid phase change material generated in the phase change period is employed to improve the heat dissipation for the CPU of a computer and the electronic device of other larger heat dissipating unit. The solid and liquid phase change material is added into aluminum squeezing fin type or other fin type heat sink that is typically cheap. The solid and liquid phase change material includes special material such as paraffin, and the phase change temperature thereof must be smaller than the highest CPU operating temperature. Aluminum powder and copper powder of different ratios are added into the material in a high-temperature liquid phase to enhance the heat storage and heat dissipating effect of the phase change material. The phase change material requires absorbing a large amount of dissolution heat in changing phase at a specific temperature, and thus the high temperature of CPU can be carried away.

Description

The heat dissipation of this chip takes away the CP at a fixed temperature. Because of the solid-liquid at high temperature, its phase and the temperature of the liquid phase increase the proportion of the phase change material. There is a phase change in the South Temperature Heater. 200418358 V. Description of the invention (l) [Technical field to which the invention belongs] The technology to which the invention belongs is to provide a method and device for heat storage and heat dissipation of solid electronic components. u and other larger heating units are equipped with phase-change materials in generally low-cost aluminum vessels. The phase change between the solid phase and the liquid phase absorbs the high u generated during high-speed operation and reduces the function. And even burned. Material selection for door phase change. Normally on the market, the temperature needs to be added. When the cp U is highest, different proportions of aluminum powder and copper material are stored. The heat storage and heat dissipation effect depends on the phase change of the heating electronic components. The material is liquid. ， 可 = in the space'is a finned heat sink that will be filled with solder. The invention of f will use different sizes of heat sinks: set solid-liquid with different dissolving points: fruit can achieve a better geometric appearance. Liquid phase change applied to heating system uses the thermal interaction of solid-liquid phase changes to improve heat dissipation on electronic components The problem is that the type 4 fin type or other phase change materials have a large amount of heat of dissolution in a certain special collection, and the instant heat 'so that the cpu will not be damaged by the stone or other materials below the temperature, and can be used in Lidao or other powder , To 'metal powder and phase change material set. It is easier to pour into the fin-type fan. The inlet is closed to form an internal H. Lu extruded fin-type heat sink. Phase-change materials and different ratios, lower thermal resistance values, and low temperature

$ 5 页 200418358 V. Description of the invention (2) [Previous technology] National 2 = :: Subcooling technology is roughly divided into three on the patent application = once the heat dissipation system is turned on *, which is the development of the heat pipe cooling system Most of them use the type of fins or salmon / month ... New patents, the best method for the production of fins apply for the manufacturing method and the furnace misweld method, and the higher cost ^ the lower one is the extrusion type and forging method Wait. "Cost manufacturing development is as important as c =! The research aspect of the industry is still focused on the configuration of i and related applications. In the development of official heat dissipation systems, in recent years, it has been mainly combined with chips and heat pipes. Increase the heat dissipation effect, + same as in the earlier period when the power is low, the heat pipe can be placed on the heat sink alone. The simplest way is to directly combine the heat conduction germanium patent No. 881 1 4649 -As shown in the figure), and the combination method is a spiral "Yi-Pian". == 良】 " See the second picture), it is connected to 1ΐ 二 # 二 特 说 It is to put a plurality of c-shaped heat pipes in a plurality of strings plus ·% Ξ and 1 ,,, the combination of The high thermal conductivity of heat pipes and the increase of fins increase the heat dissipation effect. Republic of China Patent No. 88 1 0 5 9 1 5 and hibiscus: see the second figure) proposed a plate type heat pipe radiator,, = 1 is characterized by a plate-like heat dissipation in a closed container i The fins are soldered to the top of the main j heat officer in a soldering manner, and the plate is used to dissipate heat, which is used to evenly distribute the heat source generated by c Ρ 于 on the fins.

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The base, the patent No. of this system, is connected to the groove, because the vertical and horizontal flow fields are less, this size or the falling space; and the high-density resistance of the material forming the multi-fiber bundle membrane from the top is proposed instead of increasing the dispersion. The heat-dissipation of the heat pipe fin of the test can be lowered by a soft convex membrane or a granular layer on its surface, and the degree of fin dispersion increases, which is conducive to the CPU heater volume, quality inspection, and dispersion. Radiating effect: Luo Luoteng extended edge sealer. Thin person. Its thermal conductivity heater does not dissipate the heat of the fan. This makes the heater better, but the film is connected to the film. The function of the film type heat pipe is suitable for the failure and only reduces the efficiency. Therefore, the weight of Wei increases. Computer, but the patented type of heat pipe is made, the upper and inner angles are good. Difficult to do, leading to the need to add unfavorable internal costs 1¾ 88220012, the film under the heat pipe is often covered with small changes, but the degree, and the amount of air flow is reduced, and the fan is mostly empty on the motherboard. [Abstract] The present invention provides A method and device for solid-liquid heat and heat dissipation, such as adding fin material 7 or other finned radiators 7 to receive a large amount of dissolution heat at a specific temperature, and instantly remove C heat, so that c ρ ϋ will not be caused by high temperature solidification. The liquid phase change material 5 is selected. 'The phase change temperature needs to add different proportions of aluminum powder k material when C p U = phase. The heat storage and heat dissipation effect of phase change are applied to the heating electronic component storage. Aluminum extruded fin-type solid-liquid phase change materials 5 reduce the function and even burn down by absorbing the height generated by the PU during high-speed operation through the phase change between the solid and liquid phases. The paraffin or other materials commonly used in the market are below the maximum operating temperature, and the metal powder 6 such as high temperature and copper powder is used to increase the effect. The metal powder 6 and the solid-liquid phase change material

200418358 V. Description of the invention (4) The proportion of material 5 is determined by the calorific value of the heating electronic components. The phase change material at a high temperature is in a liquid state, and can be easily poured into a closed space inside the radiator 7, and the entrance is closed by brazing to form a fin-type radiator 7 with a phase change material 5 inside. Therefore, the present invention will add phase change materials 5 with different melting points and different proportions of all powders 6 in aluminum extruded fin-type radiators with different sizes of the radiators 7 to achieve a better geometric shape and more Low thermal resistance and low cost heat dissipation effect.

As shown in the fifth figure, the relationship between the heat absorption F and the temperature E of a copper finned radiator B and an aluminum finned radiator C is a linear ratio, and the solid-liquid-phase changing material fins are added. For a chip radiator A, when the temperature E does not reach the phase change temperature point G, its heat absorption is slightly smaller than that of a copper fin radiator B and an aluminum fin radiator C. When the temperature E is equal to the phase change temperature point At G, the phase change material changes from a solid to a liquid, and since the latent heat of phase change D is the heat required for the phase change, at this time, the heat absorption F of the fin heat sink A with the solid-liquid phase change material increases greatly, Exceeded the heat absorbed by copper finned radiator B and aluminum finned radiator C, that is, at the same temperature difference, the heat absorption of finned radiator A with solid-liquid phase change material will be greater than that of copper The finned radiator B made of aluminum and the finned radiator C made of aluminum are larger. [Embodiment] An embodiment of the present invention provides a method and device for applying solid-liquid phase change to heat generation and heat dissipation of electronic components.

Page 8 418358 V. Description of the invention (5) Other large heating bills produced during the transformation; its role is to improve the liquid phase change of the heat dissipation problem on the electronic components of the chain as shown in Figures 6 and 7. Material 5 uses phase change;: 2 or base 2 1 Θ, filled in the phase change between solid and liquid phase ', which is generated when the solid phase and speed calculation at a certain temperature ::: Big! The heat of dissolution, # takes away the CPU in high function, and even burns 1; night phase change material; == down and lower, as shown in the sixth figure *, then only: above the base 2 1 孓 ten horizontal radiators. In order to make the present invention more _ the list is as follows: #Its progress and practicability 'here will be practical work 1, has more heat absorption, effectively eliminates hair loss, and the device can achieve the function of large heat absorption There is no need to add extra clothes, which saves space. 4 3. Compatibility: Pan: Any radiator can be used, reducing production cost. Progressive and consistent. Improve industrial competitiveness. In summary, the present invention has already met the requirements for the application of an invention patent. The application has been duly submitted in accordance with the law, and we ask the examiner of the Bureau to make a clear reference and grant the patent right of the invention. x month

Page 9 200418358 Brief description of the drawings The first picture is one of the perspective views of a conventional radiator. The second picture is the second perspective view of the conventional radiator. The third picture is the third perspective view of the conventional radiator. The fourth figure is a device diagram of the present invention. The fifth diagram is a diagram of the relationship between temperature and heat when the heat is absorbed in the present invention. The sixth diagram is one of the embodiments of the present invention. The seventh diagram is the second diagram of the embodiment of the present invention. Drawing number description]

1 2 2 3 4 5 6 7 ABCDEFG heat pipe scale base plate type heat pipe capillary structure solid-liquid phase change material metal powder radiator fin-type radiator with solid-liquid phase change material copper fin-type radiator aluminum Phase change latent heat temperature of finned heat sink

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Claims (1)

6. The scope of the patent application method is to make 2 phase-change electronic elements 3 in the application of the sub-element 4 in the solid and phase change 5 plus a fixed step of 6 including the problem of modification 7 to make the 8-phase change electronic element, a solid 'system By raising the height, such as the application of the material to the heat dissipation, such as the application of the problem including the improvement, such as the application of liquid phase change materials, such as the application of different proportions of gold, such as the application of good computer, 0, a “Solid” refers to the fin-type heat sink of the patented range of solid-liquid-phase heat-generating electronic elements by changing the heat-dissipating liquid-phase when the application material is placed on the part. The patent scope is the best computer c. The patent scope is the addition of solid materials and the proportion depends on the heat. The patent scope is the metal powder whose powder is placed on the fin. Patent scope No. cpu and its liquid phase change should be solid-liquid phase change heating electronic element Patent scope No. fin heat dissipation effect Heat dissipation used for heat-generating materials placed in heat sink 1 Item 1 or No. PU and its 1 item or a predetermined proportion of electronic components, 4 pieces of chip heat dissipation, 4 items of heat dissipation materials for heat dissipation materials, 7 items of heat sinks, and internal devices of the bases. A method for heat storage and heat dissipation of electronic components on a fin-type radiator base, wherein the solid-liquid part enables the method described in item 2 to promote high heat generation, the method described in item 2 of other larger heating units, and the metal thereof Powder, and the calorific value of its metal powder is determined. The solid-liquid phase change material is added with $ ', and the method of applying the metal powder is applied to the electronic components of the thermal unit. Electronic components store and dissipate heat. The device is made by solid liquid # Page 11 200418358 VI. Scope of patent application 9. For the device described in item 7 or 8 of the scope of patent application, its application scope includes the problems of improving the C P U of computers and other electronic components of larger heating units. 10. The device as described in item 7 or 8 of the scope of patent application, wherein a fixed proportion of metal powder is added to the solid-liquid phase change material, and the ratio of the metal powder to the phase change material depends on the heat generation of the heating electronic component Decide. 1 1. Add a fixed ratio of metal powder to the solid-liquid phase change material as described in item 10 of the scope of patent application, and place it in a finned heat sink, where the metal powder is further metal powder of different particle sizes. 1 2. Add a fixed proportion of metal powder to the solid-liquid phase change material as described in item 10 of the patent application scope and place it in a finned heat sink. Its application scope includes improving the computer's CPU and other electronic components of larger heating units On the problem. Page 12