TW200416463A - Connection electrode and image display device - Google Patents

Abstract

The object of the present invention is to provide a connection electrode which is not broken due to proceeding a corrosion reaction. The solution of the present invention includes: a conductive layer 7 disposed on a substrate 1 and having a planar and rectangular shape; and an insulating layer 4 stacked on the substrate 1 and above the local area of a protecting conductive layer 3. The insulating layer 4 covers a terminal part in a short edge direction of the conductive layer 7. The area on the protecting conductive layer 3 that is not covered by the insulating layer 4 forms an opening part 5 which is provided as a connection part corresponding to a connected object. In addition, a surface conductive layer 6 is formed on the opening part 5 and the insulating layer 4. The widths W1 and W2 of the areas of the insulating layers stacked on the conductive layer 7 are different from each other. With such a structure, it is able to suppress the proceeding of corrosion reaction, and suppress the breaking of the connection electrode.

Description

200416463 发明 、 Explanation of the Invention ·· Technical Field Extremely, there is a display device. . The invention relates to a connection electrode used in the connection circuit structure, which can prevent an increase in occupied area on the substrate and a reduction in contact resistance, and a connection electrode of the middle system which is broken due to corrosion. First, for example, in order to connect a circuit structure provided on a substrate and a circuit structure provided on another substrate, a connection electrode is used, which is formed by exposing a conductive layer on the surface of the substrate. & Fig. 7 is a schematic diagram of a connection electrode structure previously used. As shown in FIG. 7, the connection electrode of the front structure has a structure in which a low-resistance conductive layer 102 and a protective conductive layer 103 are sequentially stacked on the substrate. The two ends in the short-side direction of the upper surface of the protective conductive layer 103 are covered with an insulating 11G4, and are not covered with an insulating layer 区域, and the opening portion 1G5 is formed. The surfaces of the openings 1G5 and the insulating layer 1G4 are covered with a surface conductive layer 106 formed of an indium tin oxide layer IT0 (Indium Tin Oxide) or the like. Also, as shown in FIG. 7, the previously structured connection electrode has a left-right symmetric < structure, and the area covered by the insulating layer 104 among the conductive conductive layer 103 has an equal width (for example, refer to Patent Document 1). The low-% resistance conductive layer 1 〇2 is electrically connected to other areas formed on the substrate 1 〇1, and the opening 105 is connected to the connection terminal of the external circuit with a tight device of TAB, and the circuit on the substrate 101 is electrically connected. With external circuit.

O: \ 85 \ 856lODOC 200416463 Patent Document l US Patent No. 5,483,082 (page 36_37, 2D drawing) Summary of the Invention Problems to be Solved by the Invention However, the connection electrode shown in FIG. 7 has an opening portion ι05 exposed on the substrate surface. Due to its structure, there is a problem of durability. Specifically, a part of the conductive layer is corroded due to the reaction between the low-resistance conductive layer 10 below the opening 105 and the outside air, and this corrosion spreads to the entire low-resistance conductive layer 102 and there is a problem of disconnection. . As described above, it is known that the connection electrode has a structure that protects the low-resistance conductive layer 102 with a reactive inactive protective conductive layer 103, but actually, many voids due to thermal migration and the like are formed in the low-resistance conductive layer 102 inside. One of the low-resistance conductive layers 102 is exposed on the surface. The low-resistance conductive layer 102 on the exposed surface usually forms an oxide, but sometimes the oxide formed by body fluids such as acid, alkali, or sweat during operation may be removed. In the state where the oxide is removed, a rotten reaction occurs between the metal material constituting the low-resistance conductive layer 102 and the acid near the area where the oxide exists, and the corrosion reaction extends to the entire low-resistance conductive layer 102. Even disconnected. In particular, in the case where the low-resistance conductive layer 102 is formed by an intaglio and the surface conductive layer 10 is formed by ITO, an explosive reaction occurs through the cell effect. The area covered by the insulating layer 10 4 in the low-air-resistance conductive layer 102 will not be exposed 0 \ 85 \ 856lO.DOC -6-on the surface, the starting point of the above-mentioned corrosion reaction will not be formed. However, as the reaction generated in the opening 105 progressed gradually, the reaction also expanded to the area covered by the insulating layer 104, and finally a disconnection occurred. Even before the reaction spreads to the whole, the internal structure is sometimes destroyed by the pressure of the gas generated by the reaction, and disconnection may occur. Therefore, from the viewpoint of preventing disconnection, it is effective to widen the area of the low-resistance conductive layer 102 covered by the insulation | 1G4. This structure can be realized by, for example, increasing the width of the low-resistance conductive layer 102 in the short-side direction. However, in view of the integration and miniaturization of electronic circuits in recent years, it is not practical to increase the area for connecting electrodes on the surface of the substrate, and it is difficult to achieve a wide structure of the low-resistance conductive layer 102 < Especially for image display devices using liquid crystals, etc., as the display image becomes finer, the number of scanning lines and signal lines increases, and the number of connection electrodes required for connection with external circuits also increases. Therefore, from the viewpoint of achieving high definition, it is extremely difficult to secure a large area for each connection electrode, and it is not practical to increase the width of the low-resistance conductive layer 102. In order to prevent the occurrence of disconnection, the structure of reducing the area of the opening i 05 to widen the width of the area covered by the insulating layer 104 is also considered. Since the structure k is adopted, the occurrence of the corrosion reaction can be reduced, and the corrosion reaction can be delayed to extend to the end of the low-poly PiL conductive layer 102. However, the increase in the contact resistance due to the reduction in the width of the opening portion i 05 (another problem). Especially because of the use of liquid crystal image display devices, etc., it is necessary to correctly control the supply of pixel electrodes by scanning lines and signal lines.

O: \ 85 \ 856IODOC 200416463 potential, so it is necessary to suppress the change in call position due to the increase in contact resistance. On the one hand, the reduction of the contact resistance is suppressed to a permissible range, and on the other hand, when the width of the opening 105 is reduced, the proportion of disconnection can be reduced to a certain degree, but it is difficult to solve the problem. The present invention has been made in view of the above-mentioned problems of the prior art, and an object thereof is to provide a connection electrode capable of preventing an increase in the occupied area on a substrate and effectively suppressing disconnection due to corrosion, and an image display device using the connection electrode.

To solve the above problem, in order to achieve the above-mentioned object, the connection electrode of the first patent application range has an opening portion separated by an insulating layer covering a part of the conductive layer. The connection electrode is used to connect the outside The circuit connecting member is characterized in that the distance between one end of the upper surface of the conductive layer and the end of the opening portion corresponding to the end is longer than the other of the upper surface of the conductive layer.

The distance between the square end and the end of the opening corresponding to the other end has a larger value. According to the invention of item 1 of the patent scope of the present application, since the two ends of the width of the conductive layer covering the insulating layer cover are different from each other, the distance from the opening to the end of the conductive screen is different, even if part of the opening At the beginning of rotten anti-deer, the speed of the decay reaction in the vicinity of the two ends is different, and the conductive layer can be disconnected. It also claims that the connection electrode related to the second item of the patent scope is the above-mentioned invention 0 \ 85 \ 856IO.DOC -8-200416463, wherein the center axis of the short side direction of the conductive layer and the center of the opening portion are separated by the horizontal direction. Drive a certain distance. According to the invention in item 2 of the patent scope of this application, since the central axis of the short side of the conductive layer foot and the central axis of the opening portion are formed only by a certain distance, the widths of the conductive layer portions covered by the insulating layer are different from each other. Prevents disconnection due to corrosion reactions. The connection electrode related to item 3 of the patent application is as described above, wherein the distance between one end of the surface of the conductive layer and the end of the opening and the end corresponding to the end is 10 # m or more. The connection electrode related to the fourth item of the patent application is the above-mentioned invention, wherein the conductive layer is formed by a multilayer structure in which a low-resistance layer is sequentially stacked and a protective conductive layer that protects the low-resistance layer. The connection electrode related to the fifth item of the patent application is the above-mentioned invention, and a surface conductive layer is further disposed on the conductive layer and the insulating layer. The connection electrode related to the sixth item of the patent application is the same as the above-mentioned invention, wherein the openings are formed on the conductive layer by a plurality of openings. An image display device related to item 7 of the patent application, which is characterized by having an array substrate, which includes: a pixel electrode corresponding to a display pixel arrangement; a switching element corresponding to a pixel electrode arrangement; a signal The scanning element is used to supply the display signal to the pixel electrode; the scanning line is used to supply the scanning signal that controls the driving state of the switching element; and the connection is O: \ 85 \ 85610.DOC -9- 416463 " / 2. It is connected to the above signal line and / or the above scan line and the external driving circuit, as described in the items 1 to 6 of the patent application scope. The image display device related to the eighth aspect of the patent application is the above-mentioned invention, which further includes: an external driving circuit, which is connected by the connection electrode, and is opposed to the substrate, which is disposed relative to the array substrate; and The layer is a layer enclosed between the array substrate and the opposite substrate. The image display device related to the 9th aspect of the patent application is the above-mentioned invention, which further has a backlight light source, which supplies light transmitted through the liquid crystal layer. Embodiments Embodiments Hereinafter, a connection electrode and an image display using the connection electrode according to an embodiment of the present invention will be described with reference to the drawings. ② The diagrams that are properly referenced in the future are model diagrams, and it should be noted that there are differences from the actual structure. In addition, even if they are shown in the drawings, they also include mutually different dimensional relationships and proportions. First Embodiment First, the connection electrodes according to the first embodiment will be described. The connection electrode of the first embodiment has a structure in which both ends of the short-side direction of the conductive layer are covered with an insulating layer. The width of the area under the insulating layer in the conductive layer is different from each other to suppress the disconnection of the connecting electrode. Fig. 1 (a) is a plan view of a connection electrode according to the first embodiment. OA85 \ 856lO.DOC -10- 200416463 'Please refer to FIG. 1 (a), FIG. 1 (b), etc. to explain the first embodiment. As shown in FIG. 丨 (a), the connection electrode of the first embodiment has a conductive layer 7 which is arranged on a substrate and has a rectangular planar shape; and an insulating layer 4 which is stacked on the substrate丨 the upper part of the protective conductive layer 3-part of the area. The area on the protective conductive layer 3 that is not covered by the insulating layer 4 forms an opening portion 5 which is a connection portion with a connection target. In addition, a surface conductive layer 6 made of ITO or the like is formed on the opening portion and the insulating layer 4. The conductive layer 7 has a structure in which a low-resistance conductive layer 2 and a protective conductive layer 3 are sequentially stacked. The low-resistance conductive layer 2 has a structure electrically connected to an internal circuit (not shown) provided in another region of the substrate. The low-resistance conductive layer 2 is preferably made of a low-resistance conductive material such as copper (Cu) in order to reduce the potential difference between the internal circuit and the external circuit to which it is connected. The part of the protective conductive layer 3 suppresses the oxidation of the entire surface of the opening caused by the contact of the low-resistance conductive layer 2 with the outside air and the increase in the contact resistance or insulation. Specifically, the 'protective conductive layer 3 is made of molybdenum (M0) and the like, and the ancient system is made of molybdenum (M0), which has an inert gas-reactive property, and has a film thickness of about 50 nm, for example. The insulating layer 4 covers the ends of the low-resistance conductive layer 2 and the protective conductive layer 3, and the vicinity: to protect the ends of the low-resistance conductive layer 2 and the conductive layer 3 4 and 4 have the function of insulation between the electrodes connected to each other. Shaped "edge layer 4 ㈣;

O: \ 85 \ 856lODOC 200416463 For those with insulation, any material can be used, but Si02, siNx, etc. are generally used. In FIG. 1 (a), the insulating layer 4 is a single-layer structure, but it is not necessarily limited to this structure, and it may be a multilayer structure using a plurality of insulating materials. Also, the connection electrode of the first embodiment constitutes a distance Wi between one end of the conductive layer 7 and the end of the opening 5 corresponding to the end, which is greater than the other end of the conductive layer 7 and corresponds to the other end. The value of the distance W2 between the ends of the opening 5. Specifically, the planar shape of the conductive layer 7 and the opening 5 are rectangular, and the short-side direction is separated by a certain distance from the central axis toward the horizontal direction, and the distances Wi and W2 between the ends are mutually interactive values. . The width in the short-side direction of the conductive layer 7 and the width of the opening 5 are not particularly limited, and may be the same value as before. The connection electrode of the first embodiment has a structure in which the distances W1 and W2 * between the ends are different from each other, so that the possibility of disconnection due to the corrosion reaction can be reduced. The situation will be described below. As described above, the disconnection of the connection electrode starts from a part of the opening 5 as the corrosion reaction 'gradually spreads to the surrounding area, and finally the corrosion occurs at both ends of the low-resistance conductive layer 2 in the short-side direction. Therefore, the time required for the corrosion reaction to break from the 4th point of the opening $ corresponds to the distance from the starting point of the corrosion reaction to the short-side direction end of the low-resistance conductive layer 2. By lengthening this distance, the occurrence of the break can be suppressed. . However, the internal circuit connected to the external circuit is arranged on the substrate. Since the O: \ 85 \ 856I0 DOC -12-200416463 requires a large area for the internal circuit, it is difficult to build a large area of the connection electrode. On the one hand, in order to prevent the disconnection of the connection electrode, it is necessary to completely suppress the expansion of the corrosion resistance of the low resistance ㈣2, and as long as the expansion of the corrosion reaction to one end is suppressed, the conduction of the low resistance conductive layer 2 can be ensured. Therefore, the first In the embodiment, the central axis of the opening 5 is separated from the central axis of the conductive layer 7 by a certain distance, and the width of the short-side direction of the conductive layer 7 is not changed. The starting point of the corrosion reaction and the end of the short-side direction of the conductive layer 7 are not changed. The distance is maximized. By adopting this structure, the time required for the corrosion reaction generated in a part of the opening portion 5 of the connection electrode of the first embodiment to reach both ends of the low-resistance conductive layer 2 is lengthened, and the occurrence of disconnection can be suppressed. Fig. 2 is a schematic diagram of the reaction expansion pattern of the connection electrode of the first embodiment when the rot reaction occurs. As shown in FIG. 2 (a), a hole is formed in a part of the protective conductive layer 3 under the opening 5, and an acid, a test, etc. are formed on the local area of the low-resistance conductive layer 2 corresponding to the hole to form a rotten name. Reaction area. In addition, in the schematic diagram of FIG. 2 (a), for the sake of easy understanding, an example in which the rot name reaction starts on the central axis in the short side direction of the opening 5 is described. As shown in Fig. 2 (b), the corrosion reaction system expands to the surroundings from the local area of the low-resistance conductive layer 2 as a starting point to form an corrosion reaction area 8b. However, since the connection electrode of the first embodiment constitutes only the central axis in the short-side direction of the low-resistance conductive layer 2 and is separated from the central axis of the opening 5 by a certain distance, the corrosion reaction region 8b must reach the distance corresponding to the opening 5 The distant position of the central axis O: \ 8S \ 856IO.DOC -13- 463 Γ The short-side direction end of the low-resistance conductive layer 2 takes a long time and is low in the meantime. In addition, the conductive layer 2 can maintain conduction. Again in the figure% should occur, compared to the case of r, r / H M K watts, the current of the low-resistance conductive layer 2 is reduced by the cross-sectional area. As the cross-sectional area of the current decreases, the electricity: value < increasing 'In order to suppress the increase of the resistance value within the allowable range, the low-conductance conductive cladding 2 is also preferably as low as Ming, copper (Cu), etc. Resistive metal material is formed. Even if the low-resistance conductive layer 2 formed of the metal material containing this temple is used, the resistance value can be maintained to a practically acceptable level even if the cross-sectional area of the current is reduced due to the reaction of the surname. The inventors of the present invention actually made the connection electrode 'having the structure shown in Figs. 1 (a) and 1 (b), and determined its durability. Therefore, regarding the ratio of the distance between the ends of the openings 5 corresponding to the ends of the openings 5 in the short-side direction of the conductive layer 7 in the middle to the axis of the 10,000-point position, and the broken lines, the curve of FIG. 3 can be generated. The relevant _ is shown. Also, Figure 3 is a predictor of the proportion of disconnection occurrence under the condition that a disconnection is liable to occur. F Note that the specific proportion of the occurrence of disconnection may not be consistent with the situation under normal conditions. In other words, when the distance between the end of the conductive layer 7 and the end of the opening 5 is 5 Am (corresponding to the previous structure), the proportion of the disconnected connection electrode is about 1.7% ', and the distance of the disconnection is 10 / zm. The proportion is expected to be reduced to about ο;%. In addition, when the distance between the end of the conductive layer 7 and the end of the opening 5 is 16 ^ m, the proportion of the connection electrode that is disconnected after a certain period of time is expected to decrease

O \ 85 \ 85610.DOC -14- 200416463 as low as 0.5%. Therefore, when the distance between the end of the conductive layer 7 and the opening 5 is 16 // m, compared with the previous structure, the proportion of the disconnected connection electrode can be reduced to less than 1/3. For example, when the structure in which the central axis of the conductive layer 7 coincides with the central axis of the opening 5 'in order to ensure a distance of 10 / ^ m, 16 // ΓΠ', it is necessary to enlarge the short side direction visibility of the conductive reed 7 'or sacrifice contact The resistance reduces the wide production of the opening 5. However, the connection electrodes of the first embodiment can be offset from each other's central axis without changing the width of the short-side direction of the conductive layer 7, thereby reducing the proportion of occurrence of disconnections due to the corrosion reaction. That is, the connection electrode of the first embodiment does not increase the exclusive area on the substrate i without sacrificing the contact resistance of the opening 5. Therefore, the connection electrode 'of the first embodiment does not adversely affect the function of the connection electrode and the internal circuit provided on the substrate i, and it can suppress the disconnection due to the corrosion reaction. It is only a clever invasion, a narrow diameter, and only a fixed distance to isolate the central axis of the short side of the guide 7 from the central axis of the opening 5-the point and the structure of ^ are different. Therefore, when manufacturing the connection electrode of the first embodiment For example, ## 日 目 如 r 、 / 成 开 1 口 邛 5 <You can use a different mask pattern from the previous step, and other devices can use the former. Especially the connection electrode of the first embodiment, 圊, 、 、 Electric θ 〈structure and the like can increase the burden on the design of the same structure ^ ^. The variable conductive layer 7 ㈣… needs to be modified by etching, etc. Even if the width of the conductive layer 7 in the short side direction is narrower

O: \ 85 \ 856IO.DOC -15-200416463 It is also easy to manufacture when the foot structure is available, but there are-> surface area to protect the area of the opening 5 and the other surface effectively suppresses the disconnection. Also in the first embodiment, the insulating layer 4 $ ..., μ is a structure of the short-side direction of the wind conductive layer 7, but it can also be a structure that only covers w-A and λ Manzaki 4 Ai, which constitutes W body 0. In the first embodiment, 叩 ## is used to avoid the low resistance due to the shift in the position due to the offset in the manufacturing process. The layer 2 is exposed at the side, which requires ample space on the device. Therefore, if the moon dipper / 夭 Θ asks, it is not possible to construct a structure that does not cover the other end portion with the insulating layer 4. Also in the first embodiment, the opening formed in the conductive layer 7 is rectangular and only one ', but it is not limited by the structure. For example, as shown in FIG. 4 (a), a plurality of openings 9a to 9d may be provided in the single-low-resistance conductive layer 2 so that the shape of the openings 9a to 9d is a square, and the structures are arranged in series. Even with this configuration, since the central axis of each of the openings 9a to 9d and the central axis of the short-side direction of the low-resistance conductive layer 2 are different from each other, and the openings 9a to 9d are formed, it is possible to suppress the occurrence of disconnection due to corrosion reaction. Alternatively, as shown in Fig. 4 (b), a structure in which openings 10a to 10d are randomly arranged. In this case, since each of the openings 10a to 10cl has a central axis that is different from the central axis in the short-side direction of the low-resistance conductive layer 2, it can be obtained from FIG. 1 (a) and FIG. 1 (b). The construction shown has the same effect. The planar shape of the conductive layer 7 may be a shape other than a rectangle. In addition, as shown in FIG. 4 (c), even when the central axis of the entire opening portion 10e coincides with the central axis of the short-side direction of the low-resistance conductive layer 2, such as the area 10f, O: \ 85 \ 856lO.DOC -16- 200416463 § The central axis of the main part of the opening 邛 1 〇e and the low-resistance conductive layer 2 (the central axis are different from each other). Also open π # 1Qe-the distance between the square end and the low-resistance conductive layer 2 corresponding to the end, and the distance between the other end and the low-resistance conductive ^ 2 corresponding to the end Different from each other. Therefore, the same effect as that in the case of Fig. 1 (a) and Fig. 1 (b) can be obtained. Second Embodiment Next, an image display device of a second embodiment will be described. The image-π device of the second embodiment has the structure of using the connection electrode of the first embodiment for inter-circuit connection. Fig. 5 is a schematic diagram of the overall structure of an image display device according to the second embodiment; Fig. 6 is a wiring structure provided on an array substrate constituting the image display device, and an equivalent circuit diagram for explaining a drive circuit connected to the wiring structure. Therefore, please refer to FIG. 5 and FIG. 6 to explain the image of the second embodiment ^ The device X and s and <thin film transistor, due to lack of distinction between the source electrode and the electrode &lt; necessity, so except the gate The electrodes are called source / drain. The image display device of the second embodiment, as shown in FIG. 5, includes: an array substrate 11 configured to correspond to display pixel arrangement circuit elements; and an opposite substrate 12 configured to be disposed opposite to the array substrate n; Between the substrates 12, a structure of a liquid crystal layer 13 containing liquid crystal molecules having a predetermined orientation is sealed. A backlight unit 14 is arranged below the array substrate u. The backlight 7C 14 has the power to input white light to the back of the array substrate n, the I1 train substrate i !, and the opposite substrate 12, and the liquid crystal layer η. Of contact

0 \ 85 \ 856IODOC -17- 200416463 1 Alignment films (not shown) are respectively arranged on the liquid crystal surface of the liquid crystal surface, and the alignment of molecules of the liquid crystal layer is regulated. In order to control the light transmittance of the liquid crystal layer 13 corresponding to the displayed image pattern, a pixel electrode is arranged on the array substrate U, and a common electrode is arranged on the opposite substrate 12. The intensity of the electric field generated between the pixel electrode and the common electrode is controlled to control the alignment state of the liquid crystal molecules contained in the liquid crystal layer Π, and the light transmittance of the liquid crystal layer 13 is adjusted. The light input from the backlight unit 14 passes through the liquid crystal layer 13 to display the intensity of the corresponding light transmittance on the outer surface of the opposite substrate 12. In the image display device of the second embodiment, since the color filter 15 is disposed on the inner surface of the opposite substrate 12, it is possible to display not only the display density, but also R, G, and B colors. Next, a circuit structure arranged on the array substrate U will be described. As shown in FIG. 6, the pixel electrodes 17 a to 17 d are arranged on the array substrate 11 corresponding to the display pixels, and the same circuit structure is formed around the pixel electrodes 17 a to 17 d. Therefore, the pixel electrodes 17 a to 17 d will be collectively referred to below. For the “pixel electrode 17”, other circuit elements arranged on the array substrate 11 are also collectively described. A thin film transistor 18 having a switching element function is arranged near the pixel electrode 17 and the pixel electrode 17 is connected to the square source / drain of the thin film transistor 18. The other source / electrode of the thin film transistor 18 is connected to the position near the pixel electrode 17, and the signal line 19 extends in the longitudinal direction. The gate is connected to an element like O: \ 85 \ 856IO.DOC -18- 200416463 Scanning lines extending in the horizontal direction near the% pole 17. At the ends of the signal line 19 and the scanning line 20, a connection electrode 21 and a connection electrode 22 are arranged. The connection electrode 21 and the connection electrode 22 have the connection electrode structure described in the first embodiment, and have a structure that suppresses the occurrence of a disconnection between the signal line 19, the scan, and the spring 20 due to corrosion. Since the specific structure of the connection electrode has been described in the first embodiment, it is omitted here. The connection electrode 21 is connected to the signal line drive circuit 23, and the connection electrode 22 is connected to the scan line drive circuit 24. For specific connection status, TAB (Tape Automated Bonding) ^ ACF (Anisotropic Conductive Film) & COF (Chip On Film) is generally used. Next, the functions of circuit elements arranged on the array substrate will be briefly described. The pixel electrode 17 is used for generating a required electric field between the pixel electrodes arranged on the opposite substrate 12. Specifically, the pixel electrode 17 supplies a potential corresponding to a displayed image through a thin film transistor 18, so that a potential difference is generated between the pixel electrode 17 and the common electrode, and an electric field is generated between the pixel electrode 17 and the common electrode according to the potential difference. The liquid crystal layer 13 is enclosed between the array substrate 11 on which the pixel electrode 17 is disposed and the opposite substrate 12 on which the common electrode is disposed. The liquid crystal layer 13 is formed in accordance with the electric field intensity and the liquid crystal molecules contained in the liquid crystal layer 13 can be used to display an image. The signal line 19 transmits a display signal and supplies a certain potential to the pixel electrode 17. As described above, the signal line 19 connects one end to the signal line driving circuit 23 through the connection electrode 21, and connects the other end to the pixel circuit through a thin film transistor O: \ 85 \ 856IODOC -19- 200416463 pole II7. So thin film transistors! When the driving state is 8, a display signal from the signal line driving circuit 23 is transmitted to the pixel electrode 17, and a certain potential is supplied to the pixel electrode ^. The line 20 transmits a scanning signal to control the driving of the thin film transistor a. As mentioned above, the 'scanning line 20' is connected by one end via the connection electrode 22: the Zhi line driving circuit 24 'and the other end is connected to the gate of the thin film transistor M = so the thin film transistor 18 can be transmitted from the scanning line driving circuit M Supply a scan signal, and change the gate potential according to the scan signal to control the driving state of the thin crystal 18. The earth is generally connected to an image display device's circuit structure provided on the array substrate, and a connection electrode for a driving circuit outside the array substrate has a structure exposed on the array substrate. Therefore, the connection electrode is easily affected by the outside air, and it is easy to be attached with dirt. Compared with other circuit structures on the array substrate, it is easy to break, and the spring exists. In the image display device of the second embodiment, the connection electrode is configured as in the first embodiment to prevent the disconnection due to the rotten button, and maintain a good conduction between the driving circuit and the circuit structure on the array substrate. status. This makes it possible to realize an image display device that has a longer product life than before and can suppress the occurrence of failures. The use state of the connection electrode of the first embodiment can be used not only for the image display device of the structure shown in the second embodiment, but also for an image display device of the IwSwitching type. 20 beers

0 \ 85 \ 856IODOC 200416463 It is used in the active matrix, but also the image display device of passive matrix structure. These image display devices use a signal line and a scanning line for image display. 'This is a common point.' In order to connect to a driving circuit, a connection electrode is required. Also, any image display device requires a large number of signal lines and trace lines due to high definition and the like, and the connection electrode is large. It is best to use the connection electrode of the first embodiment. Even if the image display device is not used, Those connecting multiple circuits such as tabs can use the connection electrodes of the first embodiment. The effect of the invention is as described above. According to the present invention, the width of the upper surface of the conductive layer covered with the insulating layer is different from the structure of the two ends, so the opening The distances to the ends of the conductive layer are different, even if 10,000-parts of the openings start to rot, the speed of the rot-response reaction is different in the areas near the two ends, which can suppress the fe / f line of the pen layer. According to the present invention, since the central axis related to the short-side direction of the conductive layer is separated from the central axis of the opening by a certain distance, the widths of the conductive layer portions covered by the insulating layer are different from each other, so that the cause can be suppressed. The effect of the disconnection of the corrosion reaction. 'Also according to the present invention, since the connection electrode with the above structure is adopted to connect the circuit structure on the array substrate with the external circuit, the image display device, Inhibit connection portion of the disconnected, having realized a long life of the article

Same effect as 1 picture 7JT device.

O: \ 85 \ 856lODOC -21-belongs to 416463. Brief description of the drawings, Fig. 1 (b) and 1 (a) are the cross-sectional structure of the connecting electrode of the first embodiment. Figures 2 (a) and 2 (b) are schematic diagrams showing the progress of the corrosion reaction of the connection electrode of the first embodiment. FIG. 3 is a proportion curve diagram of disconnection of a connection electrode in the first embodiment. 4 (a) to 4 (c) are plan views of different embodiments of the connection electrode of the first embodiment. FIG. 5 is a schematic diagram showing a structure of an image display device according to a second embodiment. Fig. 6 is an equivalent circuit diagram of a circuit structure on an array substrate constituted by an image display device of a second embodiment. FIG. 7 is a schematic diagram of a structure of a previous connection electrode. Explanation of component symbols 1 Substrate 2 Low-resistance conductive layer 3 Protective conductive layer 4 Insulating layer 5 Opening portion 6 Surface conductive layer 7a to 7d, 9a to 9d, 10a to 10e Opening portion 8a, 8b Corrosion reaction zone Q \ 85 \ 856lO.DOC -22- 200416463 lOf, lOg area 11 Array substrate 12 Opposite substrate 13 Liquid crystal layer 14 Backlight unit 15 Color filter 17a Pixel electrode 17 Pixel electrode 18 Thin film transistor 19 Signal line 20 Scan line 21, 22 Connection Electrode 23 Signal line drive circuit 24 Scan line drive circuit 101 Substrate 102 Low-resistance conductive layer 103 Protective conductive layer 104 Insulating layer 105 Opening 106 Surface conductive layer O: \ 85 \ 85610.DOC -23-

Claims (1)

200416463 Patent application park: 1 · A connection electrode having an opening portion separated by an insulating layer covering a part of the conductive layer. The connection electrode is used as a connection member for connecting an external circuit. The special purpose is that the distance between one of the upper end of the conductive layer and the end of the opening corresponding to the end is greater than the other ten thousand end of the conductive layer and the opening of the other end. The distance between the ends has a larger value. • The connection electrode of item 1 in the scope of patent application, wherein the central axis of the short side direction of the conductive layer and the central axis of the opening portion are spaced a certain distance in the horizontal direction. 3. The connection electrode according to item 1 or 2 of the patent application, wherein the distance between one end of the surface of the conductive layer and the end of the opening corresponding to the end is 10 # m or more. 4_ The connection electrode according to item 1 or 2 of the scope of patent application, wherein the conductive layer is formed by a multilayer structure in which a low-resistance layer is sequentially stacked and a protective conductive layer protecting the low-resistance layer. 5. The connection electrode according to item 1 or 2 of the scope of patent application, wherein a surface conductive layer is further arranged on the above pen layer and the above insulating layer. 6. The connection electrode according to item 1 or 2 of the patent application range, wherein the openings are formed on the conductive layer by a plurality of openings. 7. An image display device, characterized by having an array substrate, comprising: a pixel electrode corresponding to a display pixel arrangement; a switching element corresponding to a pixel electrode arrangement; O: \ 85 \ 856lODOC 200416463 signal line, borrowing this The switching element supplies a display signal to the above pixel electrode; a scanning line to supply a sweeper that controls the driving state of the above switching element; and a π connection electrode, such as, for example, the scope of a patent, page, connects the above signal line And / or the scan line and an external driving circuit. 8. The image display device according to item 7 of the patent application scope, further comprising: an external driving circuit connected by the above-mentioned connection electrode; 〃. An opposite substrate, which is arranged relative to the above-mentioned array substrate; and a liquid crystal layer , Which is enclosed between the array substrate and the opposite substrate. 9. If the image display device of the scope of application for item No. 7 &lt; 8 further includes a backlight light source, which supplies light transmitted through the liquid crystal layer. / O: \ 85 \ 856lODOC