TW200410387A - Routing layout of multi-layer metal lines - Google Patents

Routing layout of multi-layer metal lines Download PDF

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Publication number
TW200410387A
TW200410387A TW91135884A TW91135884A TW200410387A TW 200410387 A TW200410387 A TW 200410387A TW 91135884 A TW91135884 A TW 91135884A TW 91135884 A TW91135884 A TW 91135884A TW 200410387 A TW200410387 A TW 200410387A
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metal
metal wire
stacked
multilayer
layer
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TW91135884A
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Chinese (zh)
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TW569415B (en
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Zong-Xi Zhan
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Taiwan Semiconductor Mfg
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Publication of TW200410387A publication Critical patent/TW200410387A/en

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Abstract

A routing layout of multi-layer metal lines is disclosed. In the routing layout, one layer of metal lines is set vertically, and the other layers of metal lines are stacked and set horizontally, and between every two stacked metal lines there is a channel reserved. Then, vias or contact holes are put on the channel between every two stacked metal lines, thereby reducing the area of the routing layout.

Description

200410387 五、發明說明(1) 發明所屬之技術領域: 本發明係有關於一種多層金屬線之繞線佈局(Rout ing Layout),特別是有關於一種具有可降低繞線佈局面積並提 升元件操作速度之多層金屬線的繞線佈局。 先前技術: 請同時參照第1圖至第3圖,其中第1圖係繪示習知多層金屬 之繞線佈局的上視圖,第2圖係繪示沿第1圖之剖面線I -1 所獲得之剖面圖,而第3圖則係繪示沿第1圖之剖面線Π -Π 所獲得之剖面圖。在此多層金屬之繞線佈局1 0 0中,共有六 層金屬,第一層之第一金屬線10 2與第二層之第二金屬線 1 0 4之間由絕緣層11 4隔開,第二層之第二金屬線1 0 4與第三 層之第三金屬線1 0 6之間由絕緣層11 6隔開,第三層之第三 金屬線1 0 6與第四層之第四金屬線1 0 8之間由絕緣層11 8隔 開,第四層之第四金屬線1 0 8與第五層之第五金屬線11 0之 間由絕緣層1 2 0隔開,而第五層之第五金屬線11 0與第六層 之第六金屬線11 2之間則由絕緣層1 2 2所隔開。另外,每二 條第一金屬線1 0 2之間由絕緣材料1 0 3所隔開,每二條第二 金屬線1 0 4之間由絕緣材料1 0 5隔開,每二條第三金屬線1 0 6 之間由絕緣材料1 0 7隔開,每二條第四金屬線1 0 8之間由絕 緣材料1 0 9所隔開,每二條第五金屬線11 0之間由絕緣材料 111隔開,且每二條第六金屬線11 2之間由絕緣材料11 3所隔 開。其中,所有之第一金屬線1 〇 2互相平行,所有之第二金 屬線1 0 4互相平行,所有之第三金屬線1 0 6互相平行,所有 之第四金屬線1 0 8互相平行,所有之第五金屬線11 0互相平200410387 V. Description of the invention (1) The technical field to which the invention belongs: The present invention relates to a routing layout of a multilayer metal wire, and more particularly to a device having a winding layout area that can reduce the winding layout area and improve the speed of component operation. The winding layout of multilayer metal wires. Prior art: Please refer to Figs. 1 to 3 at the same time, wherein Fig. 1 is a top view showing a winding layout of a conventional multilayer metal, and Fig. 2 is a drawing along a section line I -1 of Fig. 1 The obtained cross-sectional view, and FIG. 3 is a cross-sectional view obtained along the cross-sectional line Π-Π of FIG. 1. In this multilayer metal winding layout 100, there are a total of six layers of metal. The first metal wire 102 of the first layer and the second metal wire 104 of the second layer are separated by an insulating layer 11 4. The second metal wire 104 of the second layer and the third metal wire 106 of the third layer are separated by the insulating layer 116, and the third metal wire 106 of the third layer and the fourth metal wire of the fourth layer The four metal wires 108 are separated by an insulating layer 118, the fourth metal wire 108 of the fourth layer and the fifth metal wires 110 of the fifth layer are separated by an insulating layer 120, and The fifth metal wire 110 of the fifth layer and the sixth metal wire 112 of the sixth layer are separated by an insulating layer 1 2 2. In addition, every two first metal wires 102 are separated by an insulating material 103, every two second metal wires 104 are separated by an insulating material 105, and every two third metal wires 1 0 6 are separated by an insulating material 1 0 7, every two fourth metal wires 1 0 8 are separated by an insulating material 1 0 9, and every two fifth metal wires 11 0 are separated by an insulating material 111. Each of the two sixth metal wires 11 2 is separated by an insulating material 11 3. Among them, all the first metal wires 102 are parallel to each other, all the second metal wires 104 are parallel to each other, all the third metal wires 106 are parallel to each other, and all the fourth metal wires 108 are parallel to each other, All fifth metal wires 11 0 are level with each other

200410387 五、發明說明(2) 行以及所有之第六金屬線1 1 2互相平行。 此外,第三金屬線1 0 6堆疊於第一金屬線1 0 2上方,第五金 屬線1 1 0堆疊於第三金屬線1 0 6以及第一金屬線1 0 2上方,而 第四金屬線1 0 8堆疊於第二金屬線1 0 4上方,第六金屬線1 1 2 則堆疊於第四金屬線1 0 8以及第二金屬線1 0 4之上方。也就 是說,第一金屬線102、第三金屬線106、以及第五金屬線 I 1 0彼此平行,而第二金屬線1 0 4、第四金屬線1 0 8、以及第 六金屬線11 2彼此平行。另一方面,第一金屬線102、第三 金屬線1 0 6、以及第五金屬線11 0與第二金屬線1 0 4、第四金 屬線1 0 8、以及第六金屬線1 1 2互相垂直。 當要在兩元件間進行第一訊號的傳遞時,若其中一元件之 第一訊號係由第一層之第一金屬線10 2的其中一條所傳遞, 而另一元件之第一訊號係由第四層之第四金屬線10 8的其中 一條所傳遞,則先需在此條第四金屬線1 0 8下方之絕緣層 II 8中設置導電插塞124,以電性連接第四金屬線108與第三 金屬線1 0 6。接著,於第三金屬線1 0 6下方與第二金屬線1 0 4 上方之絕緣層11 6中設置導電插塞1 2 6,以電性連接第三金 屬線1 0 6與第二金屬線1 0 4。然後,於此第二金屬線1 0 4下方 之絕緣層11 4中設置導電插塞1 2 8,來電性連接第二金屬線 1 0 4與第一金屬線102,而形成如第4圖所示之結構。如此一 來,這兩個元件間之第一訊號的傳遞即可透過上述電性連 接之第四金屬線108、導電插塞124、第三金屬線106、導電 插塞126、第二金屬線104、導電插塞128、以及第一金屬線 10 2來達成。200410387 V. Description of the invention (2) Row and all sixth metal wires 1 1 2 are parallel to each other. In addition, the third metal line 106 is stacked above the first metal line 102, the fifth metal line 110 is stacked above the third metal line 106 and the first metal line 102, and the fourth metal The lines 108 are stacked on the second metal line 104, and the sixth metal lines 1 12 are stacked on the fourth metal line 108 and the second metal line 104. That is, the first metal line 102, the third metal line 106, and the fifth metal line I 1 0 are parallel to each other, and the second metal line 104, the fourth metal line 108, and the sixth metal line 11 2 are parallel to each other. On the other hand, the first metal line 102, the third metal line 106, and the fifth metal line 110 and the second metal line 104, the fourth metal line 108, and the sixth metal line 1 1 2 Perpendicular to each other. When the first signal is to be transmitted between two elements, if the first signal of one element is transmitted by one of the first metal wires 102 of the first layer, and the first signal of the other element is transmitted by If one of the fourth metal wires 10 8 of the fourth layer is transmitted, a conductive plug 124 needs to be provided in the insulating layer II 8 below the fourth metal wire 108 to electrically connect the fourth metal wire. 108 与 third metal wire 106. Next, a conductive plug 1 2 6 is disposed in the insulating layer 11 6 below the third metal line 106 and above the second metal line 104, so as to electrically connect the third metal line 106 and the second metal line. 1 0 4. Then, a conductive plug 1 2 8 is disposed in the insulating layer 11 4 below the second metal wire 104, and the second metal wire 104 and the first metal wire 102 are electrically connected to each other, so as to form as shown in FIG. 4.示 的 结构。 Show structure. In this way, the transmission of the first signal between the two components can pass through the fourth metal wire 108, the conductive plug 124, the third metal wire 106, the conductive plug 126, and the second metal wire 104 electrically connected as described above. , A conductive plug 128, and a first metal wire 102.

200410387 五、發明說明(3) 然而,若 中一元件 產生短路 遞。當碰 金屬線上 除,並從 成短路的 會造成短 是,這樣 失,增加 操作速度 發明内容 第4圖所緣示的這條第三金屬線丨〇 6係用以傳遞1 之第二訊唬時,就會導致第一訊號與第二气铲^ ’而無法成^地進行第一訊號與第二訊號的傳^曰 到此種狀況時,由於電性連接用的插塞係製= ,因此就必須先將導電插塞124與導電插塞丄 第三層的眾多第三金屬線1〇6中選出另一 ^不會造 第三金屬線1 06,再將整個的訊號繞線跳至這^不 路的第三金屬線1 〇 6上,才得以有效傳遞訊號。但 的跳線方式不僅會造成整個繞線佈局面積的損 繞線佈局面積,更因繞線距離變長而導致元件之 下降,嚴重影響元件性能。 蓉於上述習知將介層窗或接觸窗設置在金屬線上之多層金 屬線繞線佈局,會造成佈局面積的損失,而導致繞線面積 增加,進而影響元件之操作速度。 因此,本發明的主要目的之一就是在提供一種多層金屬線 之繞線佈局,係將其中一層金屬線與其他各層之堆疊金屬 線呈垂ΐ擺設,再於每兩條堆疊金屬線之間設置一條通 道,而將介層窗或接觸窗設置於這些通道上。由於介層窗 或接觸窗並不位於金屬線上,因此可避免佈局面積的損 失’縮減繞線面積。 本發明之再一目的就是因為本發明之多層金屬線的繞線佈 局係將介層窗或接觸窗設置於每兩條堆疊金屬線之間的通 道上,因此可有效縮減繞線面積,進而提升元件之操作速200410387 V. Description of the invention (3) However, if there is a short circuit in the middle element. When it touches a metal wire, it will cause a short circuit if it is short-circuited. This will increase the operating speed. This third metal wire shown in Figure 4 is used to pass the second signal of 1. Time, it will cause the first signal and the second air shovel to be unable to carry out the transmission of the first signal and the second signal. In this situation, because of the plug system for electrical connection =, Therefore, the conductive plug 124 and the conductive plug 丄 must be selected from the third layer of the third metal wires 106 of the third layer ^ will not make the third metal wire 1 06, and then the entire signal is wound to jump to Only on the third metal wire 106, which can not pass, can the signal be effectively transmitted. However, the jumper wiring method not only causes damage to the entire winding layout area, but also reduces the component due to the longer winding distance, which seriously affects the performance of the component. In the above-mentioned practice, a multilayer metal wire winding layout in which a via or a contact window is arranged on a metal wire will cause a loss of layout area, which will increase the winding area, and then affect the operation speed of the component. Therefore, one of the main objectives of the present invention is to provide a winding layout of multilayer metal wires. One layer of metal wires and the stacked metal wires of the other layers are arranged vertically, and then disposed between each two stacked metal wires. One channel, and vias or contact windows are placed on these channels. Since the vias or contact windows are not located on the metal lines, the loss of the layout area can be avoided 'and the winding area can be reduced. Another object of the present invention is that the winding layout of the multilayer metal wire of the present invention is to place a via window or a contact window on the channel between each two stacked metal wires, so that the winding area can be effectively reduced, thereby improving Operating speed of components

第7頁 200410387 五、發明說明(4) 度。 根據以上所述之目的,本發明更提供了一種多層金屬線之 繞線佈局,用以連接複數個元件之複數個訊號線,且此多 層金屬線之繞線佈局至少包括:複數個第一金屬線層,其 中每一個第一金屬線層至少包括互相平行之複數個第一金 屬線,且每一個第一金屬線層之第一金屬線與其餘之第一 金屬線層中之第一金屬線相互堆疊;一第二金屬線層,其 中此第二金屬線層至少包括互相平行之複數個第二金屬 線,而這些第二金屬線與上述之第一金屬線垂直,且此第 二金屬線層與上述之第一金屬線層堆疊;複數個通道分別 位於這些第一金屬線層之每二條第一金屬線旁;以及複數 個介層窗位於這些通道上,其中這些介層窗可例如為多層 堆疊介層窗而暴露出部分之第二金屬線。 其中,上述之第二金屬線層可堆疊於上述之第一金屬線層 上方、下方、或中間。而且,上述之介層窗中更具有導電 插塞,可電性連接上述之第二金屬線。另外,在此多層金 屬線之繞線佈局中更包括有複數個連接線位於上述之第一 金屬線層中,藉以分別電性連接第一金屬線以及位於介層 窗中之導電插塞,並可分別透過上述之導電插塞電性連接 第一金屬線與第二金屬線,而將上述之元件之訊號線連接 起來。 連接元件之訊號線時,可根據訊號線之佈局,在一元件訊 號線所處之第一金屬線層的第一金屬線與此第一金屬線旁 之介層窗中的導電插塞之間,設置連接線,即可將此訊號Page 7 200410387 V. Description of Invention (4) Degree. According to the above purpose, the present invention further provides a winding layout of a multilayer metal wire for connecting a plurality of signal lines of a plurality of components, and the winding layout of the multilayer metal wire includes at least: a plurality of first metals A wire layer, wherein each first metal wire layer includes at least a plurality of first metal wires parallel to each other, and the first metal wire of each first metal wire layer and the first metal wires in the remaining first metal wire layers Stacked on each other; a second metal line layer, wherein the second metal line layer includes at least a plurality of second metal lines parallel to each other, and the second metal lines are perpendicular to the first metal line, and the second metal line Layers are stacked with the first metal line layer described above; a plurality of channels are located beside each of the two first metal lines of the first metal line layers; and a plurality of via windows are located on the channels, where the via windows may be, for example, The vias are stacked in multiple layers to expose portions of the second metal lines. The second metal line layer may be stacked above, below, or in the middle of the first metal line layer. Moreover, the above-mentioned interlayer window further has a conductive plug, which can be electrically connected to the above-mentioned second metal line. In addition, the winding layout of the multi-layer metal wire further includes a plurality of connecting wires located in the first metal wire layer, so as to electrically connect the first metal wires and the conductive plugs in the interlayer window respectively, and The first metal line and the second metal line can be electrically connected through the above-mentioned conductive plugs, respectively, and the signal lines of the above components can be connected together. When connecting the signal lines of the component, according to the layout of the signal line, between the first metal line of the first metal line layer where a component signal line is located and the conductive plug in the interlayer window next to the first metal line , Set the cable, you can get this signal

200410387 五、發明說明(5) 線所處之第一金屬線與另一元件訊號線所處之第二金屬線 層上的第二金屬線與以電性連接。 ' 由於本發明之多層 屬線上,因此不需 繞線距離,進而縮 升元件操作速度的 金屬線之繞線佈局的 為防止短路而進行跳 小繞線面積,達到、縮 目的0 介層窗並不位於金 線處理,而可縮短 減佈局面積以及提 實施方式: 本發明揭露一種多層金屬、線之、繞線佈局,具有缩減繞線佈 局面積以及縮短繞線距離等優勢,並可提升元件之操作性 能。為了使本發明之敘述更加祥盡與完備,可參照下列描 述並配合第5圖至第8圖之圖示。 請一併參照第5圖至第7圖,其中第5圖係繪示本發明之一較 佳實施例之多層金屬的繞線佈局上視圖,第6圖係繪示沿第 5圖之剖面線瓜_瓜所獲得之剖面圖,而第7圖則係繪示沿第 5圖之剖面線w -IV所獲得之剖面圖。在本發明之多層金屬 的繞線佈局200中,共有六層金屬,第一層之第一金屬線 202與第二層之第二金屬線204之間由絕緣層214隔開,第二 層之第二金屬線204與第三層之第三金屬線2〇6之間由絕緣 層216隔開,第三層之第三金屬線2〇6與第四層之第四金屬 線208之間由絕緣層218隔開,第四層之第四金屬線2〇8與第 五層之第五金屬線2 1 0之間由絕緣層2 2 〇隔開,而第五層之 第五金屬線210與第六層之第六金屬線212之間則由絕緣層 222所隔開。另外,每二條第一金屬線2〇2之間由絕緣材料 203所隔開,每二條第二金屬線2〇4之間由絕緣材料2〇5隔200410387 V. Description of the invention (5) The first metal line where the line is located and the second metal line where the signal line of another component is located are electrically connected to the second metal line on the layer. '' Because the multi-layered wire of the present invention belongs to the wire, there is no need for a winding distance, and the winding layout of the metal wire which shortens the operating speed of the component is reduced to prevent short-circuits, and the winding area is small to achieve and shrink the 0-layer window It is not located on the gold wire, but can shorten the layout area and improve the implementation: The present invention discloses a multilayer metal, wire, and winding layout, which has the advantages of reducing the layout area and the winding distance, and can improve components. Operating performance. In order to make the description of the present invention more complete and complete, reference may be made to the following descriptions in conjunction with the diagrams in FIGS. 5 to 8. Please refer to FIG. 5 to FIG. 7 together, where FIG. 5 is a top view of a winding layout of a multilayer metal according to a preferred embodiment of the present invention, and FIG. 6 is a cross-section line along FIG. 5 The cross-sectional view obtained by melon_melon, and FIG. 7 is a cross-sectional view obtained along the section line w-IV of FIG. 5. In the multilayer metal winding layout 200 of the present invention, there are a total of six layers of metal. The first metal line 202 of the first layer and the second metal line 204 of the second layer are separated by an insulating layer 214. The second metal line 204 is separated from the third layer third metal line 206 by an insulating layer 216, and the third layer third metal line 206 and the fourth layer fourth metal line 208 are separated by The insulating layer 218 is separated, the fourth metal line 208 in the fourth layer and the fifth metal line 2 10 in the fifth layer are separated by the insulating layer 2 2 0, and the fifth metal line 210 in the fifth layer It is separated from the sixth metal line 212 of the sixth layer by the insulating layer 222. In addition, every two first metal wires 200 are separated by an insulating material 203, and every two second metal wires 200 are separated by an insulating material 205.

200410387 五、發明說明(6) ' 開,每一條第二金屬線2 0 6之間由絕緣材料2 〇 7隔開,每二 條第四金屬線2 0 8之間由絕緣材料2 〇 9所隔開,每二條第五 金屬線2 1 0之間由絕緣材料2 11隔開,每二條第六金屬線2丄2 之間由絕緣材料213所隔開。其中,所有之第一金屬線2〇2 互相平行,所有之第二金屬線20 4互相平行,所有之第三金 屬線2 0 6互相平行’所有之第四金屬線2 〇 8互相平行,所有 之第五金屬線2 1 0互相平行,且所有之第六金屬線2丨2互相 平行。200410387 V. Description of the invention (6) 'On, each second metal wire 206 is separated by an insulating material 207, and every two fourth metal wire 208 is separated by an insulating material 2 009 On, every two fifth metal wires 2 1 0 are separated by an insulating material 2 11, and every two sixth metal wires 2 2 are separated by an insulating material 213. Among them, all the first metal wires 202 are parallel to each other, all the second metal wires 20 4 are parallel to each other, all the third metal wires 2 06 are parallel to each other'all the fourth metal wires 2 08 are parallel to each other, all The fifth metal lines 2 1 0 are parallel to each other, and all the sixth metal lines 2 2 are parallel to each other.

此外,第三金屬線2 0 6堆疊於第二金屬線2〇4上方,第四金 屬線2 0 8堆疊於第三金屬線2 0 6上方,第五金屬線2 1 〇堆疊於 第四金屬線2 0 8上方,而第六金屬線2 1 2則堆疊於第五金屬 線210上方。亦即,第二金屬線204、第三金屬線2〇6、第四 金屬線208、第五金屬線210、以及第六金屬線21 2呈堆疊狀 且互相平行。另一方面,第一金屬線2〇2與第二金屬線 204、第二金屬線206、第四金屬線208、第五金屬線210、 以及第六金屬線21 2互相垂直。In addition, the third metal line 206 is stacked on the second metal line 208, the fourth metal line 208 is stacked on the third metal line 206, and the fifth metal line 2 10 is stacked on the fourth metal The line 2 0 8 is above, and the sixth metal line 2 1 2 is stacked above the fifth metal line 210. That is, the second metal line 204, the third metal line 206, the fourth metal line 208, the fifth metal line 210, and the sixth metal line 21 2 are stacked and parallel to each other. On the other hand, the first metal line 202 and the second metal line 204, the second metal line 206, the fourth metal line 208, the fifth metal line 210, and the sixth metal line 21 2 are perpendicular to each other.

另外,在金屬線堆疊之第二層、第三層、第四層、第五 層、以及第六層的金屬線中,每兩條金屬線旁更具有通道 224。也就是說’每兩條第六金屬線21 2旁就設置一個通道 2 24,如第5圖所示。由於每一條第六金屬線212皆堆疊在第 五金屬線2 1 0上,每一條第五金屬線2丨〇皆堆疊在第四金屬 線208上,每一條第四金屬線2〇8皆堆疊在第三金屬線2〇6 上’且每一條第三金屬線2〇 6皆堆疊在第二金屬線2〇4上, 因此通道22 4亦位於每兩條第五金屬線21〇、每兩條第四金In addition, in the second, third, fourth, fifth, and sixth metal lines of the metal line stack, there are channels 224 beside each two metal lines. In other words, a channel 2 24 is provided beside every two sixth metal wires 21 2, as shown in FIG. 5. Since each sixth metal line 212 is stacked on the fifth metal line 2 10, each fifth metal line 2 is stacked on the fourth metal line 208, and each fourth metal line 208 is stacked On the third metal line 206 'and each third metal line 206 is stacked on the second metal line 204, so the channel 22 4 is also located at every two fifth metal lines 210, every two Fourth gold

第10頁 200410387 五、發明說明(7) ^ 屬線2 0 8、每兩條第三金屬線2 0 6、以及每兩條第二金屬線 2 0 4旁。亦即,通道2 2 4係從第六層之第六金屬線2 1 2往第一 層之第二金屬線204的方向一直延伸,直至第二層之第二金 屬線2 0 4為止,如第7圖所示。 請再次參照第5圖與第7圖,通道2 2 4上設置有多個介層窗 226,其中這些介層窗22 6為多層堆曼介層窗,也就是說, 這些介層窗22 6從通道22 4上方的第六金屬線21 2所處之層朝 第一金屬線202所處之層的方向貫穿而過,直至暴露出部分 之第一金屬線20 2為止。在這些介層窗22 6中填入導電材料 而形成導電插塞228,其中這些導電插塞228與介層窗22 6所 暴露出之第一金屬線2 0 2電性連接。 在兩元件之間’假設其中一元件之第一訊號係由第一層之 第一金屬線20 2的其中一條所傳遞,而另一元件之第一訊號 係由第五層之第五金屬線2 1 〇的其中一條所傳遞。因此當要 在兩元件間進行第一訊號的傳遞時,僅需將介於此條第五 金屬線210以及介層窗226之間的通道224區域變更為連接線 2 3 0即可,如第8圖所不之結構,其中連接線2 3 〇分別與第五 金屬線2 1 0以及導電插塞2 2 8電性連接。於是,這兩個元件 間之第一訊號即可透過此條第五金屬線2 1 〇、連接線2 3 0、 以及導電插塞2 2 8而達到有效的傳遞。 由於,導電插塞228係獨立於金屬線以外的區域,因此可依 訊號傳遞的需求,將所需之金屬線電性連接至導電插塞228 上,相當方便且輕易’完全沒有跳線的困擾。因此,不僅 具有相當南的應用性,更可省下跳線所增加之繞線面積,Page 10 200410387 V. Description of the invention (7) ^ Belonging to line 2 0 8, every two third metal lines 2 06, and every two second metal lines 2 0 4. That is, the channel 2 2 4 extends from the sixth metal line 2 1 2 of the sixth layer to the second metal line 204 of the first layer until the second metal line 2 0 4 of the second layer, such as Figure 7 shows. Please refer to FIG. 5 and FIG. 7 again, a plurality of interlayer windows 226 are provided on the channel 2 2 4, wherein these interlayer windows 22 6 are multilayer stacking interlayer windows, that is, these interlayer windows 22 6 The layer from the sixth metal line 21 2 above the channel 22 4 passes through in the direction of the layer from the first metal line 202 until a portion of the first metal line 202 is exposed. A conductive material is filled in the interlayer windows 22 6 to form conductive plugs 228, and the conductive plugs 228 are electrically connected to the first metal lines 202 exposed by the interlayer windows 22 6. 'Between two elements' assuming that the first signal of one of the elements is transmitted by one of the first metal wires 202 of the first layer, and the first signal of the other element is by the fifth metal wire of the fifth layer One of 2 1 0 was passed. Therefore, when the first signal is to be transmitted between the two components, it is only necessary to change the area of the channel 224 between the fifth metal line 210 and the interlayer window 226 to a connection line 2 3 0, as shown in FIG. The structure shown in FIG. 8, wherein the connection line 2 3 0 is electrically connected to the fifth metal line 2 10 and the conductive plug 2 2 8 respectively. Therefore, the first signal between the two components can be effectively transmitted through the fifth metal wire 2 1 0, the connecting wire 2 3 0, and the conductive plug 2 2 8. Since the conductive plug 228 is independent of the area other than the metal wire, the required metal wire can be electrically connected to the conductive plug 228 according to the needs of signal transmission, which is quite convenient and easy. . Therefore, it not only has a quite southern application, but also saves the winding area increased by the jumper.

第11頁 200410387 五、發明說明 達到縮減 在本發明 介層窗, 其連通的 元件之第 另一元件 時,僅需 可° 在此實施 層係位於 以舉例說 數層金屬 方,亦可 綜合以上 線之繞線 相當高, 高,更可 佈局面積 如熟悉此 佳實施例 其它未脫 飾,均應 (8) 繞線面積的目的。 之較佳實施例中,雖然 然本發明之介層窗亦可 區域。舉例而言,若在 二訊號係由第一層金屬 之第二訊號係由第三層 使介層窗貫穿第三層至 例中,雖然與堆疊之數 此堆疊之數層金屬線的 明,本發明並不在此限 線垂直的金屬線可位於 位於此堆疊之數層金屬 所述’本發明之優點就 佈局的介層窗並不位於 且沒有跳線的問題產生 有效縮短繞線距離以及 以及提升元件操作速度 技術之人員所瞭解的, 而已,並非用以限定本 離本發明所揭示之精神 包含在下述之申請專利 所有之介層窗為多層堆疊 依訊號傳遞的需求而變化 兩元件之間,假設其中一 線的其中一條所傳遞,而 金屬線的其中一條所傳遞 第一層之間的通道區域即 層金屬線垂直之一金屬線 下方,然,以上所述僅用 。在本發明中,與堆疊之 此堆疊之數層金屬線的上 線之間。 是因為本發明之多層金屬 金屬線上,因此佈局彈性 。因此,不僅可應用性極 繞線面積,進而達到縮減 的目的。 以上所述僅為本發明之較 發明之申請專利範圍;凡 下所完成之等效改變或修 範圍内。 200410387 圖式簡單說明 本發明的較佳實施例已於前述之說明文字中辅以下列圖形 做更詳細的闡述,其中: 第1圖係繪示習知多層金屬之繞線佈局的上視圖; 第2圖係繪示沿第1圖之剖面線I -1所獲得之剖面圖; 第3圖係繪示沿第1圖之剖面線Π -Π所獲得之剖面圖; 第4圖係繪示習知多層金屬於傳遞訊號時的繞線佈局剖面 121 · 園, 第5圖係繪示本發明之一較佳實施例之多層金屬的繞線佈局 上視圖; 第6圖係繪示沿第5圖之剖面線ΠΙ -ΠΙ所獲得之剖面圖; 第7圖係繪示沿第5圖之剖面線IV -IV所獲得之剖面圖;以及 第8圖係繪示本發明之一較佳實施例之多層金屬於傳遞訊號 時的繞線佈局剖面圖。 圖號對照說明: 100 繞 線 佈 局 102 第 金 屬 線 103 絕 緣 材 料 104 第 二 金 屬 線 105 絕 緣 材 料 106 第 三 金 屬 線 107 絕 緣 材 料 108 第 四 金 屬 線 109 絕 緣 材 料 110 第 五 金 屬 線 111 絕 緣 材 料 112 第 六 金 屬 線 113 絕 緣 材 料 114 絕 緣 層 116 絕 緣 層 118 絕 緣 層 120 絕 緣 層 122 絕 緣 層Page 11 200410387 V. Explanation of the invention In order to achieve the reduction in the interlayer window of the present invention, the other component of the connected component only needs to be °. Here the implementation layer is located to take several layers of metal as an example, and the above can be combined. The winding of the wire is quite high, high, and more layable area. If you are familiar with other unreleased parts of this preferred embodiment, you should (8) the purpose of the winding area. In the preferred embodiment, though, the interlayer window of the present invention may also be area. For example, if the second signal is from the first layer of metal, the second signal is from the third layer, and the interlayer window runs through the third layer to the example, although the number of stacked metal lines is clear, The present invention does not limit the vertical metal lines which can be located in several layers of the metal. The advantages of the present invention are that the layout of the interlayer window is not located and there is no jumper problem, which effectively reduces the winding distance and Those skilled in the art of speeding up the operation of components understand, but are not intended to limit the spirit disclosed in the present invention. The interlayer windows owned by the following patents are multi-layered and stacked in accordance with the needs of signal transmission. Suppose that one of the wires is passed and one of the wires is passed between the first layer, that is, the channel area between the first layers, that is, the layer of the wire is perpendicular to one of the wires. However, the above is only used. In the present invention, it is between the upper lines of several layers of metal wires stacked in this stack. It is because the multilayer metal wire of the present invention has a flexible layout. Therefore, not only the applicability of the winding area, but also the purpose of reduction. The above is only the scope of patent application for the comparative inventions of the present invention; all equivalent changes or repairs completed below. 200410387 Schematic illustration of the preferred embodiment of the present invention has been described in more detail in the preceding explanatory text with the following figures, where: Figure 1 is a top view showing the winding layout of a conventional multilayer metal; Fig. 2 is a sectional view obtained along the section line I -1 of Fig. 1; Fig. 3 is a sectional view obtained along the section line Π-Π of Fig. 1; Knowing the winding layout section 121 of the multilayer metal when transmitting a signal, FIG. 5 is a top view of the winding layout of the multilayer metal according to a preferred embodiment of the present invention; FIG. 6 is a drawing along FIG. 5 Figure 7 is a cross-sectional view obtained by section line II-II; Figure 7 is a cross-sectional view obtained along section line IV-IV of Figure 5; and Figure 8 is a view illustrating a preferred embodiment of the present invention A cross-sectional view of the winding layout of a multilayer metal when transmitting a signal. Comparative drawing description: 100 winding layout 102 first metal wire 103 insulating material 104 second metal wire 105 insulating material 106 third metal wire 107 insulating material 108 fourth metal wire 109 insulating material 110 fifth metal wire 111 insulating material 112 Six metal wires 113 Insulating material 114 Insulating layer 116 Insulating layer 118 Insulating layer 120 Insulating layer 122 Insulating layer

第13頁 200410387 圖式簡單說明 124 導電插塞 126 導電插塞 128 導電插塞 200 繞線佈局 202 第一金屬線 203 絕緣材料 204 第二金屬線 205 絕緣材料 206 第三金屬線 207 絕緣材料 208 第四金屬線 209 絕緣材料 210 第五金屬線 211 絕緣材料 212 第六金屬線 213 絕緣材料 214 絕緣層 216 絕緣層 218 絕緣層 220 絕緣層 222 絕緣層 224 通道 226 介層窗 228 導電插塞 230 連接線Page 13 200410387 Brief description of the diagram 124 conductive plug 126 conductive plug 128 conductive plug 200 winding layout 202 first metal wire 203 insulating material 204 second metal wire 205 insulating material 206 third metal wire 207 insulating material 208 Four metal wires 209 Insulating material 210 Fifth metal wire 211 Insulating material 212 Sixth metal wire 213 Insulating material 214 Insulating layer 216 Insulating layer 218 Insulating layer 220 Insulating layer 222 Insulating layer 224 Channel 226 Intermediate window 228 Conductive plug 230 Connecting line

第14頁Page 14

Claims (1)

200410387 六、申請專利範圍 1· 一種多層金屬線之繞線佈局(Routing Layout),用以連 接複數個元件之複數個訊號線,且該多層金屬線之繞線佈 局至少包括: 複數個第一金屬線層,其中每一該些第一金屬線層至少包 括互相平行之複數個第一金屬線,且每一該些第一金屬線 層之該些第一金屬線與其餘之該些第一金屬線層之該些第 一金屬線相互堆疊;200410387 6. Scope of patent application 1. A routing layout of a multilayer metal wire for connecting a plurality of signal lines of a plurality of components, and the routing layout of the multilayer metal wire includes at least: a plurality of first metals A wire layer, wherein each of the first metal wire layers includes at least a plurality of first metal wires parallel to each other, and the first metal wires of each of the first metal wire layers and the remaining of the first metal wires The first metal lines of the line layer are stacked on each other; 一第二金屬線層,其中該第二金屬線層至少包括互相平行 之複數個第二金屬線,而該些第二金屬線與該些第一金屬 線垂直,且該第二金屬線層與該些第一金屬線層堆疊; 複數個通道分別位於該些第一金屬線層之每二個該些第一 金屬線旁;以及 複數個介層窗位於該些通道上。 2. 如申請專利範圍第1項所述之多層金屬線之繞線佈局,其 中該第二金屬線層係堆疊於該些第一金屬線層上。A second metal line layer, wherein the second metal line layer includes at least a plurality of second metal lines parallel to each other, and the second metal lines are perpendicular to the first metal lines, and the second metal line layer and The first metal line layers are stacked; a plurality of channels are located beside each of the two first metal lines of the first metal line layers; and a plurality of via windows are located on the channels. 2. The winding layout of the multilayer metal wire as described in item 1 of the scope of the patent application, wherein the second metal wire layer is stacked on the first metal wire layers. 3. 如申請專利範圍第1項所述之多層金屬線之繞線佈局,其 中該第二金屬線層係堆疊於該些第一金屬線層下。 4. 如申請專利範圍第1項所述之多層金屬線之繞線佈局,其 中該第二金屬線層係堆疊於該些第一金屬線層之間。3. The winding layout of the multilayer metal wire as described in item 1 of the scope of the patent application, wherein the second metal wire layer is stacked under the first metal wire layers. 4. The winding layout of the multilayer metal wire according to item 1 of the scope of the patent application, wherein the second metal wire layer is stacked between the first metal wire layers. 第15頁 200410387 六、申請專利範圍 5 ·如申請專利範圍第1項所述之多層金屬線之繞線佈局,其 中該些介層窗與該些第二金屬線堆疊。 6 ·如申請專利範圍第1項所述之多層金屬線之繞線佈局,其 中該些介層窗暴露出部分之該些第二金屬線。 7 ·如申請專利範圍第1項所述之多層金屬線之繞線佈局,其 中該些介層窗為複數個多層堆疊介層窗。 8.如申請專利範圍第1項所述之多層金屬線之繞線佈局,其 中每一該些介層窗中更至少包,括一導電插塞(Plug)。 9 ·如申請專利範圍第8項所述之多層金屬線之繞線佈局,其 中更至少包括複數個連接線位於該些第一金屬線層中,藉 以電性連接該些第一金屬線以及每一該些介層窗之該導電 插塞,並分別透過每一該些介層窗之該導電插塞電性連接 該些第一金屬線與該些第二金屬線。 10.—種多層金屬線之繞線佈局,用以連接複數個元件之複 數個訊號線,且該多層金屬線之繞線佈局至少包括: 複數個第一金屬線層,其中每一該些第一金屬線層至少包 括互相平行之複數個第一金屬線,且每一該些第一金屬線 層之該些第一金屬線與其餘之該些第一金屬線層之該些第Page 15 200410387 VI. Scope of patent application 5 • The winding layout of the multilayer metal wire as described in item 1 of the patent application scope, wherein the interlayer windows are stacked with the second metal wires. 6. The winding layout of the multilayer metal wires as described in item 1 of the scope of the patent application, wherein the interlayer windows expose portions of the second metal wires. 7 · The winding layout of the multilayer metal wires as described in item 1 of the scope of the patent application, wherein the interlayer windows are a plurality of multilayer stacked interlayer windows. 8. The winding layout of the multilayer metal wires as described in item 1 of the scope of the patent application, wherein each of the interlayer windows further includes at least a conductive plug (Plug). 9 · The winding layout of the multilayer metal wires as described in item 8 of the scope of the patent application, which further includes at least a plurality of connection wires located in the first metal wire layers, thereby electrically connecting the first metal wires and each The conductive plugs of the vias are electrically connected to the first metal lines and the second metal lines through the conductive plugs of each of the vias, respectively. 10. A winding layout of a multilayer metal wire for connecting a plurality of signal lines of a plurality of components, and the winding layout of the multilayer metal wire includes at least: a plurality of first metal wire layers, each of which A metal line layer includes at least a plurality of first metal lines that are parallel to each other, and the first metal lines of each of the first metal line layers and the plurality of first metal lines of the remaining first metal line layers. 第16頁 200410387 -- ---—— _^ — -----— 六、申請專利範圍 一金屬線相互堆疊; 一第二金屬線層,其中該第二金屬線層至少包括互相平行 之複數個第二金屬線,而該些第二金屬線與該些第一金屬 線垂直,且該第二金屬線層與該些第一金屬線層堆疊; 複數個通道分別位於該些第〆金屬線層之每二個該些第一 金屬線旁;以及 複數個多層堆疊介層窗位於該些通道上,且該些多層堆疊 介層窗暴露出部分之該些第二金屬線。 11 ·如申請專利範圍第1 〇項所述之多層金屬線之繞線佈局, 其中該第二金屬線層係堆疊於該些第一金屬線層上。 1 2 ·如申請專利範圍第1 0項所述之多層金屬線之繞線佈局, 其中該第二金屬線層係堆疊於該些第一金屬線層下。 1 3 ·如申請專利範圍第1 〇項所述之多層金屬線之繞線佈局, 其中該第二金屬線層係堆疊於該些第一金屬線層之間。 1 4·如申請專利範圍第丨〇項所述之多層金屬線之繞線佈局, 其中每一該些多層堆疊介層窗中更至少包括一導電插塞。 1 5 ·如申請專利範圍第1 4項所述之多層金屬線之繞線佈局, 其中更至少包括複數個連接線位於該些第一金屬線層中, 藉以電性連接該些第一金屬線以及每一該些多層堆疊介層Page 16 200410387-------- _ ^ — -----— 6. Scope of patent application-Metal wires are stacked on each other; a second metal wire layer, wherein the second metal wire layer includes at least parallel to each other. A plurality of second metal lines, and the second metal lines are perpendicular to the first metal lines, and the second metal line layer is stacked with the first metal line layers; a plurality of channels are respectively located on the third metal lines Next to each of the first metal lines of the line layer; and a plurality of multi-layer stacked vias are located on the channels, and the second metal lines are exposed from the multi-layer stacked vias. 11. The winding layout of the multilayer metal wire as described in item 10 of the scope of the patent application, wherein the second metal wire layer is stacked on the first metal wire layers. 1 2 · The winding layout of the multilayer metal wire according to item 10 of the scope of the patent application, wherein the second metal wire layer is stacked under the first metal wire layers. 1 3. The winding layout of the multilayer metal wire as described in item 10 of the scope of the patent application, wherein the second metal wire layer is stacked between the first metal wire layers. 14. The winding layout of the multi-layer metal wires as described in item No. 0 of the patent application scope, wherein each of the multi-layer stacked interlayer windows further includes at least one conductive plug. 15 · The winding layout of the multilayer metal wire as described in item 14 of the scope of the patent application, which further includes at least a plurality of connection wires located in the first metal wire layers, thereby electrically connecting the first metal wires. And each of those multilayer stacked interposers 200410387 六、申請專利範圍 窗之該導電插塞,並分別透過每一該些多層堆疊介層窗之 該導電插塞電性連接該些第一金屬線與該些第二金屬線。 16·—種多層金屬線之繞線佈局,用以連接複數個元件之複 數個訊號線,且該多層金屬線之繞線佈局至少包括: 複數個第一金屬線層,其中每一該些第一金屬線層至少包 括互相平行之複數個第一金屬線,且每一該些第一金屬線 層之該些第一金屬線與其餘之該些第一金屬線層之該些第 一金屬線相互堆疊; 一第二金屬線層,其中該第二金屬線層至少包括互相平行 之複數個第二金屬線,而該些第二金屬線與該些第一金屬 線垂直,且該第二金屬線層與該些第一金屬線層堆疊; 複數個通道分別位於該些第一金屬線層之每二個該些第一 金屬線旁; 複數個多層堆疊介層窗位於該些通道上,且該些多層堆疊 介層窗暴露出部分之該些第二金屬線; 複數個導電插塞分別位於該些多層堆疊介層窗中,且該些 導電插塞分別與該些第二金屬線電性連接;以及 複數個連接線位於該些第一金屬線層中,藉以分別電性連 接該些第一金屬線以及該些多層堆疊介層窗之該導電插 塞,並分別透過該些導電插塞電性連接該些第一金屬線與 該些第二金屬線。 1 7.如申請專利範圍第1 6項所述之多層金屬線之繞線佈局,200410387 VI. Scope of patent application The conductive plugs of the windows are electrically connected to the first metal lines and the second metal lines through the conductive plugs of each of the multilayer stacked interlayer windows, respectively. 16. · A winding layout of a multilayer metal wire for connecting a plurality of signal lines of a plurality of components, and the winding layout of the multilayer metal wire includes at least: a plurality of first metal wire layers, each of which A metal wire layer includes at least a plurality of first metal wires parallel to each other, and the first metal wires of each of the first metal wire layers and the first metal wires of the remaining first metal wire layers Stacked on each other; a second metal line layer, wherein the second metal line layer includes at least a plurality of second metal lines parallel to each other, and the second metal lines are perpendicular to the first metal lines, and the second metal A line layer is stacked with the first metal line layers; a plurality of channels are located beside each of the first metal lines of the first metal line layers; a plurality of multilayer stacked vias are located on the channels, and The multilayer stacked interlayer windows expose a portion of the second metal lines; a plurality of conductive plugs are respectively located in the multilayer stacked interlayer windows, and the conductive plugs are electrically conductive with the second metal lines, respectively. Connection; and plural The connecting wires are located in the first metal wire layers, thereby electrically connecting the first metal wires and the conductive plugs of the multilayer stacked interlayer windows, and electrically connecting the conductive plugs through the conductive plugs, respectively. The first metal lines and the second metal lines. 1 7. The winding layout of the multilayer metal wire as described in item 16 of the scope of patent application, 第18頁 200410387 六、申請專利範圍 其中該第二金屬線層係堆疊於該些第一金屬線層上。 1 8 ·如申請專利範圍第1 6項所述之多層金屬線之繞線佈局, 其中該第二金屬線層係堆疊於該些第一金屬線層下。 1 9 ·如申請專利範圍第1 6項所述之多層金屬線之繞線佈局, 其中該第二金屬線層係堆疊於該些第一金屬線層之間。Page 18 200410387 6. Scope of patent application Wherein the second metal line layer is stacked on the first metal line layers. 18 · The winding layout of the multilayer metal wire according to item 16 of the scope of the patent application, wherein the second metal wire layer is stacked under the first metal wire layers. 19 · The winding layout of the multilayer metal wire according to item 16 of the scope of the patent application, wherein the second metal wire layer is stacked between the first metal wire layers. 第19頁Page 19
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Publication number Priority date Publication date Assignee Title
TWI745544B (en) * 2017-02-08 2021-11-11 南韓商三星電子股份有限公司 Integrated circuit having contact jumper and semiconductor device
US11626348B2 (en) 2017-02-08 2023-04-11 Samsung Electronics Co., Ltd. Integrated circuit having contact jumper

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI745544B (en) * 2017-02-08 2021-11-11 南韓商三星電子股份有限公司 Integrated circuit having contact jumper and semiconductor device
US11626348B2 (en) 2017-02-08 2023-04-11 Samsung Electronics Co., Ltd. Integrated circuit having contact jumper
US11887914B2 (en) 2017-02-08 2024-01-30 Samsung Electronics Co., Ltd. Integrated circuit having contact jumper

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