TW200408333A - Surface insulation method for multi-layered chip-type ceramic over-voltage suppressor device - Google Patents

Abstract

The present invention is related to the surface insulation method of multi-layered chip-type ceramic over-voltage suppressor device. Before electroplating the terminal electrode of the device, highly insulating material is coated on the entire surface of the device and is undergone with a thermal processing, so as to make the coated material react with the ceramic main-body material and form a surface insulation layer. Therefore, the conventional electroplating process can be performed onto the terminal electrode of the device where one layer of soldering interface layer is plated on the terminal electrode so that the terminal electrode have excellent soldering characteristic. In addition, the main-body surface is prevented from being plated with metal to cause product malfunction due to short-circuit. Furthermore, when performing insulation coating onto the ceramic main-body before the manufacturing of terminal electrode, it is possible to have no electrical conduction between the terminal electrode manufactured in the following process, and the internal electrode for the terminal portion of the originally exposed internal electrode due to the block of the surface insulation layer. The present invention adopts dipping and etching method and thermal processing method to extend the internal electrode terminal portion outward, so as to assure the formation of excellent electric conduction between the internal electrode and the terminal electrode.

Description

200408333 V. Description of the invention (l) [Technical field to which the invention belongs] The present invention relates to a plurality of components, in particular, to the element table ^ The wafer-type ceramic overvoltage suppressor element electrodes can be applied to traditional wafer-type components', The method of edge and edge makes the end layer of the component a welding interface layer, so that the terminal electrode and the plating process, the terminal electrode is plated with a ceramic-free and free of the good welding characteristics of the metal on the surface of the body, and at the same time can avoid product short-circuit failure . [Previous technology] In recent years, with the miniaturization, multi-functionality and portable cloud of electronic products, the production density of electronic circuits is called Yin Yi ^ Α is not profitable to improve the unit volume Circuit function. In addition, with the rise of circuit power and private power, electronic components not only need to meet higher specifications in terms of performance, but also must be equipped with a single driver. ^ ^ High reliability with integrated circuit Sex is also a basic need. Therefore, the ceramic overvoltage suppressor, which is essentially a circuit protection function, has a larger unit volume surge absorption capacity and a wider range of applicable voltages, which is an inevitable result. In addition, electromagnetic interference ( Under the requirements of jMI) and electromagnetic compatibility (EMC), multi-layer ceramic overvoltage suppression is gradually being applied to the electronic circuits of computer information and communication products. In addition, the requirements for high transmission speed, high bandwidth, high assembly density, and compliance Under the control regulations, ceramic overvoltage suppressors not only take the material development to the next level, but also various technologies such as chip forming that can be used with surface-mounted (SMT) circuits have promoted the development of ceramic overvoltage suppressors. In particular, the design and fabrication of wafer-type ceramic overvoltage suppressors in multilayer ceramic manufacturing processes have developed extensively. For example, electrode co-firing in multilayer ceramic manufacturing processes involves researching the formulation of overvoltage suppressors to reduce the sintering temperature, Ceramic overvoltage suppression

200408333 V. Description of the invention (2) Some components of the device will react with the co-fired electrode, and the stability of the characteristics is an extremely important subject. 5. After the composition of i, the conventional multi-layered wafer-type ceramic pressure suppressor shown in Figures 2A, 1B, and 1C is made of ceramic green sheets, printed electricity Γ 丨 brush stacking, cut treasure J, 77〇 junction and After the terminal electrodes are manufactured, they are composed of a ceramic tile body 12, internal electrodes 22, and terminal electrodes 32, a multilayer ceramic overvoltage suppressor used in semiconductor or low-insulation materials, and other chip-type electronic components. The manufacturing method often uses Ag, Ag-Pd or Ag-Pd-Pt as the terminal silver electrode. In order to make the terminal electrode of the electronic component and the circuit board of the system easy to be soldered / connected to perform the function of the electronic component, most of them After the electronic components are fabricated, a soldering interface layer needs to be plated in an electroplating process so that the electrical components have good soldering characteristics. However, the multilayer ceramic overvoltage suppressor is a semiconductor material. During the electroplating process, Will plate metal ^, pb —Sn or

Sn is plated on the ceramic body, which makes the two ends of the element conductive, which causes the product to short-circuit failure. The traditional method to solve the above problem is to use a terminal electrode material containing precious metals, so that the terminal electrode has the characteristics of solderability without electroplating. However, the solderability and guilt of this type of terminal electrode is still difficult to achieve with the electrode. The interface layer metal has the same welding quality and level. In addition, there are the following three more important conventional insulation methods, which can achieve the terminal electrode can be electroplated, and the electroplated metal will not be plated on the ceramic body. The methods and problems are described below: 1. European Patent No. 0806780 The method is to immerse the multilayer ceramic electronic components in an aqueous phosphate solution, and the main component of the ceramic body, zinc oxide, is dissolved by acid.

Page 6 200408333 V. Description of the invention (3) After the liquid is dissolved, the concentration of the reactant formed also causes the manufacturing of the 2 · ROC terminal electrode to form an insulating coating, and reducing the use of electronic components will also limit the insulation below. 3. After the completion of the U.S. patent, the production of a terminal silver electrode that is then coated twice is not conducive to making a heterogeneous coating on the surface edge of the ceramic body based on the reaction with the solution to form a linthate deposited on the surface of the ceramic body. Care must be taken to control the conditions of the solution, temperature and pH, and the cost of disposal of the waste solution after use increases and environmental issues. The method of No. 447775 is that after the ceramic body is formed, 岫, the ceramic body is covered with an insulating layer. However, this method may cause the exposed internal electrode ends to be covered with an insulating layer to cover electronic components. Alas, the heart must add procedures for the insulating layer at both ends, and in addition, the material of the insulating layer is selected! It is chosen because the firing temperature of the terminal electrode must be the upper temperature limit that the material can withstand. 6-1 23; 8: The method of Thunder No. Λ is based on multilayer ceramics ... The first-second glass insulation layer is coated after the second-n n U, and the second layer is made of a different grade of glass-clad electrode. ^ Later, I enter the lamp brother and start to perform a total of four plutonium plating. This method controls the manufacturing cost from the end. The problems of restatement of materials and processes and the problems of conventional methods. The research is lost, the present invention [Content] [Technical Problem to be Solved] The present invention is mainly to solve the problem that after the completion of the process, the electroplating process needs to be plated with a layer of ceramic electronic components and a welding interface layer.

200408333 V. Description of the invention (4) It has good soldering characteristics. However, the multilayer ceramic electronic component is a semiconductor material. The electroplated metal will be plated in the plating process ..., Pb-Sn * Sn

On the ceramic body, the electrodes at both ends of the component are turned on, which causes the problem of short-lived products. A "Technical means to solve the problem" ^ The technical means of the present invention is mainly coated with glass, organic compounds, metal emulsions, metal salts or other highly insulating materials on the surface of the multilayer ceramic electric, and the body of the suppressor, after heat treatment After that, an insulating layer is formed on the surface of the ceramic body, so that the terminal electrodes of the element can be applied to traditional wafer-type components ^, in the plating process, the terminal electrodes are plated with a soldering interface layer, so that the terminal electrodes are alive. The surface of the body is in the subsequent electric system ^, which causes the product to fail. The coating system of the ceramic body = snow process can be before the ceramic body is sintered; or after the ceramic body is sintered and before 2 poles are made; After the end electrodes are made, the day before electroplating # Buzhi electrode clothing is coated with an insulating layer on the surface of other ceramic bodies. After: ϊΐ 原 t exposed internal electrode ends are blocked by the surface insulating layer, causing T Feng = the end electrode of the clothing It cannot be electrically connected to the internal electrode. The technique of the present invention is to apply the dipping method and the heat treatment method to make the end of the internal electrode to 4 (t, the internal electrode and the terminal electrode form a good electrical conduction. For the effectiveness of the prior art, the insulation method of the present invention has the following advantages: 1. The surface of the ceramic body has a flattening effect, which can be equal to that after the tin process.

200408333

V. Description of the invention (5) The cleaning effect of the flux, to avoid the leakage current caused by the flux residue, and the failure of the product; 3. The method of extending the inner electrode end outwardly according to the present invention can ensure the formation of the inner electrode end electrode Good electrical continuity without the need to increase the insulation layer at both ends of the component. 4. The heat treatment process of the surface insulation layer of the ceramic body can be combined with the firing process of the terminal electrodes, or it can be combined with the sintering process of the ceramic body. [Embodiment] The present invention is mainly coated on the surface of the multilayer ceramic overvoltage suppressor body with glass, organic compounds, metal oxides, metal salts or other highly insulating materials, and is formed on the surface of the ceramic body after heat treatment. An insulation layer makes the terminal electrode of the component can be applied to the traditional wafer-type components of electro-mineralization. The terminal electrode is plated with a soldering interface layer to make the terminal electrode have good connection characteristics and avoid the surface of the ceramic body. In the subsequent power mining process, dreaming of metal makes the two ends of the component conductive, which causes the product to short-circuit failure; the process of coating the ceramic layer on the surface of the ceramic body before the ceramic body is sintered; or after the ceramic body is sintered, the terminal electrode Before fabrication; or after ceramic body sintering and terminal dragging are made, and before electroplating, the specific implementation method is detailed as follows: Coating the insulating layer before the ceramic body sintering The entire surface of the multilayer ceramic green embryo that has not been sintered is coated with a layer Glass, organic compounds, metal oxides, metal salts or other highly insulating materials, with a thickness of about 1 ~ 1 0 0 // m, and then After the sintering process, an insulating layer is formed on the surface of the semiconductor ceramic pot body after sintering.

200408333 V. Description of the invention (6) I. Coating the insulating layer after the ceramic body is sintered and before the terminal electrode is made Coating the surface of the ceramic body after sintering and before the terminal electrode is made—glass, organic compounds, metal oxides, metal salts Or other high-insulation material, with a thickness of about 1 ~ 200 μm. After heat treatment, the surface f ceramic conductive material on the surface of Tao Wan body reacts with the surface coating material to form an insulating layer. 2. After the ceramic body is sintered and the terminal electrode is made, before the plating is coated with insulation scraps_ After the sintering process of the multilayer ceramic element is completed and the terminal electrode is made, the electricity: 刖, apply a layer of glass, organic compounds, and metal compounds on the entire surface of the element Salt or other insulating materials with a thickness of about 1 ~ 5 Q ”oxygen ^ After heat treatment, the semiconductor ceramic material on the surface of the ceramic body reacts with the surface ^ and ^ materials to form an insulating layer, and the coating material on the surface of the terminal electrode is ^ = The terminal electrode metal + is dissolved or mixed in the process, and it does not affect the subsequent electrical and electrical processes, and the current conduction. The electric money can be isolated for the above insulation coating, so that the internal electricity needs to be made into good electrical properties. There are two: 1. The burning value and soaking time of the ceramic body are relatively resistant to erosion. 2. The internal electrode contains six surfaces for resistive conduction of the surface insulation layer. Because the electrode and the terminal electrode are extended outward, the component is made of ceramic before the terminal electrode is produced. The body can make the originally exposed end of the internal electrode unable to extend outward from the end of the internal electrode electrode to ensure the internal electrical conduction, and the end of the internal electrode of the invention faces the junction. After being soaked with acid or alkali, the surface of the inner electrode is controlled to make the ceramic body surface eroded, and the end of the inner electrode is protruded out of the ceramic silver or silver alloy component. The surface is coated with acid or test solution to reduce the pH. The body. Insulation and production

Page 10 200408333 V. Description of the invention (7) " After the terminal electrode 'is subjected to a heat treatment of more than 250 ° C, the metal silver of the internal electrode is stretched outward due to the pulling of the silver component in the terminal electrode by the text. Examples: The above generally describes the present invention. The present invention will be described in more detail with reference to specific preferred embodiments, so that the present invention can be further understood. Example 1: This example is shown in the ceramic body. The material passes through a ceramic green embryo, and the surface of other green embryos containing the ceramic body 10 and the internal electrode 20 is coated with a main layer 40. The thickness of the dried coating layer and its surface The sintering process conditions for firing the coating layer together. The sintered ceramic body is included after sintering. 2. The surface of the man body is sintered. Next, the end of the element is shown with the inner electrode 22 that was originally exposed and blocks the inside. The end of the electrode 22 and the end of the electricity need to be pulled through the silver component of the heat treated electrode 32 above 50 ° C. As shown in Figure 2D, if the process is selected so that the end of the inner electrode 22 is extended outward and sintered before coating Cloth insulation layer, such as the 2A picture making, printing stacking and cutting into single element green embryo, etc., the glass coating layer with boron-silicon as the main component is about 20 ~ 30 // m. In the sintering condition, the element is originally formed into a structure as shown in FIG. 2B, and the internal electrode 22 and the surface insulating layer 60 formed by the reaction between the glass coating layer and the ceramic are formed. After the terminal electrode and firing, a small amount of glass coating 80 may remain as shown in FIG. 2C, and electrical conduction between the electrodes 30 may occur. Therefore, the metal silver in the internal electrode 22 is extended outward to form a good electrical property. Guide the appropriate terminal electrode material. The implementation procedure of this heat treatment exhibition can be combined with the terminal electrode sintering 200408333. V. Description of the invention (8) '----- The combined process is implemented to obtain the same effect. ^ After the above procedure is completed, the element can be passed through the conventional wafer-type element and subsequent electro-mineralization process to obtain the normal plating effect. After the surface of the ceramic body between the terminal electrodes is insulated, no metal will be deposited. In the embodiment, the edge layer, that is, the pole 22, is mixed with the compound as shown in 3B, and the raw material is 80. Therefore, the effect of the heat of the edge layer subjected to the terminal conduction treatment is tied to Tao Jing in the example. After the body is sintered and before the end of the t-pole is coated, it is coated with the insulation material: made of ceramic green sheet, printed and stacked, cut, and sintered = the structure shown in Figure 3A, including Tao Jingben and internal electricity to coat the sintered components Lay a layer of zinc-boron-silicon oxygen coating layer, and then perform a heat treatment of 50 (TC to 85 (rc), that is, the structure shown is formed, including ceramic body 12, internal galvanic oxide, and oxide coating layer and ceramic The surface material of the body reacts with a surface insulating layer 60 during the heat treatment. After this, the end of the element is coated with a terminal electrode and fired, and a small amount of oxide may remain on the end of the exposed internal electrode 22 as shown in Figure 3c. In order to block the electrical conduction between the end of the internal electrode 22 and the terminal electrode 30, a heat treatment above 500 ° C is required. The silver component of the metal silver electrode 32 in the internal electrode 22 is pulled outward and stretched out to form a good electricity. 'As shown in Figure 3D, The implementation process of the end electrode material, the thermal process of extending the end of the inner electrode 22 outward can be combined with the surface insulation treatment and the end electrode firing process at the same time to achieve the same. After the above procedures are completed, the component can be passed through the traditional wafer After the type element

200408333

Often == between the terminal electrodes ... this third embodiment: coating, printing, stacking, cutting and sintering before and after the terminal electrodes are produced, including the ceramic body 12 and internal electricity / encapsulated in 0 · 5% HC1 aqueous solution 1 It is internally contracted so that the end portion of the internal electrode 22 'applies a layer after the processing to the material layer, and then implements 500. 〇 to the structure shown in the figure, including ceramics and ceramic body surface material on the layer 60. After the ",", and the electrode are attached, as shown in Figure 4D, there is an insulating layer heat treatment process between the end and the end electrode 32. The process can have the same effect as the end. This embodiment is based on the sintered edge layer of the ceramic body. After the embryo sheet is manufactured, the structure pole 22 shown in FIG. 4A is formed, and then the sintered component is immersed in the bell. As the ceramic body 12 is etched, it protrudes outward, as shown in FIG. 4B, and the second layer is mainly The composition is the heat treatment of 70- ° C glass-deleted-broken glass coating, which forms the surface insulation produced by the reaction of the 4C body 1 2, the internal electrode 2 2 and the glass coating layer. Then, the end of the component is coated. The terminal end shows that the internal electrodes 22 which had been exposed to the outside have good electrical conduction characteristics. After the above-mentioned surface electrode firing process is combined and implemented to obtain more than the above procedures, the component can be passed through the conventional electroplating process of conventional wafer-type components. A normal electroplating effect is obtained, and the surface of the ceramic body between the terminal electrodes is not bonded to metal after the insulation treatment. Embodiment 4: This embodiment is performed after the components are sintered and the terminal electrodes are manufactured.

Page 13 200408333 V. Description of the invention (10) The structure of the insulating layer before coating is applied after the traditional multilayer wafer type component manufacturing process, and the structure shown in FIG. 5A is obtained before plating, including the ceramic body 12, the internal electrode 22 and The terminal electrode 32 is then coated on the surface of the element with a glass coating layer 40 whose main component is lead-b-boron-silicon, as described above, and then performed at 500 ° C to 700 t. ^ ^ ^ U | Ding Gou, including the Tao study body 12?: =; [:: = Figure 5C knot electrode ", terminal electrode 32 and the layer of Youcanling M and Tao Jing body surface material mixed into the terminal electrode metal after heat treatment In the end, ㊁ = the heat conduction process dissolved in or heat-treated on the surface insulation layer during the heat treatment process can have good conductive properties, and the same effect is obtained. After the firing process of the filial piezo electrode is combined with the implementation of the above procedures, the device continues to run the clock After the manufacturing process to obtain a normal plating effect of the chip-type components, the body surface will not be plated with the ceramics between the gold electrodes after the insulation treatment. The above description is only for the purpose of ^ already. Any ^ ^ preferred embodiment and: creative The following about this ^ :: system is to cover the scope of the patent application for this creation. Any modification or change on page 14 200408333 Brief description of the diagram Figure 1A is a conventional multilayer chip type ceramic overvoltage suppressor A schematic plan view of the element; FIG. 1B is a longitudinal cross-sectional structural view of a conventional multilayer wafer type ceramic overvoltage suppressor element shown in FIG. 1a; FIG. 1C is a conventional view shown in FIG. 1a A cross-sectional structural view of a multilayer wafer-type ceramic overvoltage suppressor element in a transverse direction; FIG. 2A is a first embodiment of the multilayer wafer-type ceramic overvoltage suppressor element of the present invention. Before the ceramic body is sintered, a surface is coated with glass Schematic diagram of cross-section structure of paint layer;

Fig. 2B is a schematic cross-sectional structure diagram of an insulating layer formed on the surface after sintering following the process of Fig. 2A; Fig. 2C is a cross-section of the component with end electrodes coated and fired following the process of Fig. 2B Schematic diagram; Figure 2D is a schematic diagram of the cross-sectional structure of the component after heat treatment in Figure 2C. Figure 3A is the first example of the multilayer wafer-type ceramic overvoltage suppressor element of the present invention, and the ceramic body is sintered. The cross-sectional structure before and after the terminal electrode is manufactured is shown in FIG. 3B, which is a layer following the 3A drawing, and then processed by heat treatment. FIG. 3C is a schematic view of the cross-sectional structure following FIG. 3B. FIG. 3D is a process following FIG. 3C. A coating process is formed on the surface, a process is formed on the surface, and the end of the component is coated. In the process, the component is mixed with an oxide layer and a layer of an insulating layer is attached to the end electrode, and the cross-section structure after firing is shown.

Page 15 200408333

The figure briefly illustrates the intent; 4 ^ is the tf embodiment of the multilayer wafer-type ceramic overvoltage suppressor element of the present invention. The cross-sectional structure after the ceramic body is sintered and before the terminal electrode is manufactured. Figure 4B is a process following Figure 4A. The component is immersed in a 05%} 1 (: 1 aqueous solution. After the clock, the cross-sectional structure of the internal electrode ends protruding outwards; Figure 4C is a process following Figure 4B, the component surface is coated with a layer of glass The coating layer is subjected to a heat treatment process to form a sectional structure diagram of an insulating layer on the surface; FIG. 4D is a schematic sectional structure diagram following FIG. 4C. FIG. 5A is a fourth embodiment of the present invention. Intent; In the process, the end of the element is coated with a multilayer wafer-type ceramic body, and the cross-section junction of the voltage suppressor element after firing is completed after the terminal electrode is attached and the voltage suppressor element after firing is completed.

Figure 5B is a schematic cross-sectional structure diagram of the process following Figure 5A; Figure 5C is a schematic cross-sectional structure diagram of an insulating layer formed on the surface after the heat-treatment process. [Simple description of element symbols] Ceramic body that has not been sintered 10 Ceramic body after sintering 1 2 Internal electrode that has not been sintered 2 0 Internal electrode after sintering 2 2

Page 16 200408333 The diagram simply illustrates the end electrode that has not yet been affixed. 30 The end electrode after sintering. 3 2 Coating layer on the surface of the ceramic body without heat treatment. 40 Surface insulation layer. Remaining paint 8 0 11 ·· Page 17

Claims (1)

200408333 1 · A multilayer wafer-type ceramic overvoltage suppressor method 'is before the sintering of the ceramic body, the entire surface of the multilayer ceramic green embryo sintered with high insulation, and then advances; ::: unsintered semiconductor ceramic The surface of the body is formed with _ ^ =, q, and the end portion is extended outward to ensure that the internal electrode at the end of the internal electrode disc is conductive. Electricity and / or oatmeal have good electrical properties, such as the multilayer type described in item 1 of the scope of the patent application, which is called "y" and "fine"-# > * 丨 4 7G pieces of surface insulation method, wherein the heat treatment method makes the The implementation procedure of the electrode tip extending outward can be implemented in combination with the firing process of the terminal electrode to obtain the same effect. A method of surface ablation of a multilayer wafer-type ceramic overvoltage suppressor element is applied to the surface of the ceramic body with a highly insulating material after the ceramic body is sintered and before the terminal electrodes are manufactured, and then a heat treatment process is performed. An insulating layer is formed on the surface of the bulk ceramic body; after the end electrode coating and firing process is completed, the internal electrode end of the element is extended outward by heat treatment to ensure that the internal electrode and the terminal electrode form Good electrical continuity. 4. The surface insulation method of the multilayer wafer-type ceramic overvoltage suppressor element as described in item 3 of the scope of the patent application, wherein the implementation procedure of the heat treatment method for extending the electrode end of the element outwardly can be combined with the surface insulation layer The heat treatment and the firing process of the terminal electrodes are combined and implemented at the same time to obtain the same effect. 5 · A method for surface insulation of a multilayer wafer-type ceramic overvoltage suppressor element 'after the ceramic body is sintered and before the terminal electrodes are manufactured, the element is immersed in a owe or test solution' so that the surface of the Taoman body is affected. Immersion retraction, internal electrode Page 18, 200408333. The scope of Liushen's patent. A metal is light, * and then γ j etched to form the end of the internal electrode protruding out of the ceramic body. Γ Hot place: a marginal material is coated on the surface of the Taoman body. Then proceed to the last step to make a semi-conductor ceramic body surface to form an insulating layer; the electrical conductivity of the 2 terminal electrode can ensure that the internal electrode and the terminal electrode form a good 6 抑: Γΐ: as described in item 5 of the scope of interest The multi-layer wafer-type ceramic overvoltage can be combined with the surface insulation method of the terminal lightning #, in which the surface insulation layer heat treatment process 7—the heating process of the firing process is combined and implemented to obtain the same effect. Method, based ΐ ^ iv Wan overvoltage suppression rear surface of the insulating side fired and end electrodes made insulating material ;; 11 elements of, prior to plating, to a high semiconductive ceramic £ present static 3 porcelain surface of the body, and then a heat treatment process Electrode surface—or mixed into the terminal electrode metal, terminal suppressor, components: 7 factors: the multi-layer type ceramic overvoltage mentioned above can be burned with the terminal electrode. The process of heat treatment of the surface insulation layer is remembered. 9. If the scope of the patent application is the first one, the same effect is obtained. The ceramic overvoltage suppressor element or the multilayer wafer-type ceramics described in item 7 may be glass. The surface insulation method, wherein the highly insulating material 10 The layered wafer type material described in item 5 or 7 of the ceramic overvoltage suppressor element of the first patent application range may be an organic compound. Insulation method 'wherein the high insulation U. Multi-layer wafer type 20U4U «3J3 Surface insulation method 'Table 6 of the high-insulation part, patent application scope Ceramic overvoltage suppressor element material can be metal oxide12. Such as patent application scope 1, 3 or 7 of ceramic overvoltage suppressor element The layered wafer type material may be a metal salt. Surface insulation method, wherein the high insulation property 1 3 · Such as a ceramic overvoltage suppressor element of the scope of patent application No. 1 and 3 A semiconductor or low insulation material is used for surface insulation. The multi-layer wafer type surface insulation method described in item 5 or 7 is also applicable to other wafer-type electronic components, which are the main body, the table suppressor components, and the Ur multilayer multilayer chip-type ceramic overvoltage development method. After the end portion of the internal electrode is extended outward, w is applied. "In the heat treatment of Feijie / 乂 in the production of the surface insulation layer and the electrode of the terminal electrode, the metallic silver in the internal electrode is pulled out of the ceramic body by the terminal silver wound. Yong Sheru, a The method for surface insulation of the multilayer wafer-type ceramic overvoltage P and the element described in item 3 of the patent scope, wherein the method of extending the end of the internal electrode outward is characterized by: Behind the terminal electrode, a heat treatment of more than 250 ° C is applied, and the metallic silver in the internal electrode is pulled out of the ceramic body by the silver component in the terminal electrode. The surface insulation square of the multilayer wafer type ceramic over-current suppressor element described in the household patent, wherein the method of extending the end of the internal electrode outward is characterized in that after the ceramic body is sintered, the surface insulation layer is made. The element is immersed in acid or alkaline solution, so that the surface of the ceramic body is contracted by the immersion money, and the internal electrode metal protrudes out of the ceramic body. Page 20, 200408333 VI. Application for patent scope 17 · If the scope of patent application is the first] The method for surface insulation of the multilayer wafer-type ceramic overvoltage suppressor element according to item 14, wherein the method of extending the inner electrode end outward is also applicable to other wafer-type semiconductor or low-insulation materials as the body Electronic components 18. The surface insulation method of the multilayer wafer-type ceramic overvoltage suppressor component described in the patent application scope item 3 or 15, wherein the method of extending the end of the internal electrode outward is also applicable to other methods A semiconductor-type or low-insulation material is used as the main body of the wafer-type electronic element. 19. The surface insulation method of the multilayer wafer-type ceramic insulator as described in item 5 or 16 of the patent application scope, wherein The method for spreading the inner electrode ends is also applicable to other wafer M t sub-elements using semiconductor or low-insulation materials as the body. Page 21