TW200406866A - Fixture and method for leveling flip-chip substrate bump - Google Patents

Abstract

The present invention is related to the fixture for leveling flip-chip substrate bump, in which the fixture is made of metal or non-metal and has a flat-plate rectangular shape with 0.1~0.2 cm thickness. On the fixture, one or plural grooves are formed to accommodate bar-shape strips which are disposed so as to eliminate the lower part need to be leveled inside the grooves based on the arrangement structure inside the bar-shape strip. If the external shape of the bar-shape strip is smaller, plural grooves can be manufactured on one fixture and the empty part of the fixture can be used to raise the down pressed head to perform leveling process. If the material includes metal such as stainless steel, aluminum alloy and so on, the fixture can be manufactured by mechanical processing. If its material is non-metal such as plastic-based material, the fixture can be manufactured by mechanical processing or ejecting formation. The invention is featured that the fixture can be manufactured to form different sizes and shapes depending on the practical requirement in the leveling process so as to accommodate the bar-shape strip body composed of units, in which 9, 12, or 16 strips are used as a unit. The fixtures can be used repeatedly and can be stacked. In addition, the invention is also related to the application method of the fixture for leveling flip-chip substrate bump.

Description

200406866 [Technical field to which the invention belongs] 敫 Single information on carrier bump positive / negative in semiconductor integrated circuit packaging process ^ Especially regarding flip chip substrate bumps (Presolder 〇r called β) [Previous technology] Six well-known major processes of the current general semiconductor integrated circuit manufacturing process include: pulling crystals to grow ingots, wafer slicing and polishing, wafer fabrication (oxidation, diffusion, deposition, Photomasking is used to form patterns and etch), wafer testing, wafer cutting, packaging, etc. Therefore, after the wafer is cut into wafers at the final stage of this process, it must go through a packaging process in order to be made into a variety of A semiconductor integrated circuit finished product unit with a specific function is used for various specific purposes. At present, the product and technology development of the carrier board used in the packaging process is most mature with the BGA (Ball Grid Array) package. There are also the most abundant types of board materials. At present, there are many types of BGA, including: ceramic BGA, plastic BGA, metal BGA, and tape BGA. BGA seals 'Refers to a single or multiple pieces 1C IC wafer to wafer bonding wires (W / B), tape

200406866

(B) and flip-chip (FC) and other methods to join the carrier board, and the lower edge of the carrier board is connected to the motherboard with solder balls (Solder Ball) bumps, and the circuit board is densely covered with sophisticated and complicated circuits. It has the function of replacing the traditional lead frame. Compared with other 1C packages, BGAs have more I / O packages and Shitian II packages. 2. Solder balls provide an excellent way to dissipate heat, and they make the package's electrical properties better. 3 The solder ball height is lower than the pins, which can achieve the purpose of encapsulation, and the pins are not easy to twist and deform; 4. The bonding failure rate of the package is lower than that of other types of packages; 5. The size of the ball between the 1C line width is still very large The improvement is that the number of pins provided is the highest known, up to 2500. Therefore, FC (Flip Chip) package is also widely used. The IC chip used is reversed, and through precision alignment and bonding technology, the tin-lead bump on the chip (Solder · Bump) is used. ) Packaging technology for attaching an IC chip to a carrier board after hot melting. The contact between the contacts on the 1C chip and the carrier is face-to-face, which improves the disadvantages of the large package size of traditional wire bonding, and the need to pass through the two, (Molding), the exposed back of the die can provide better heat dissipation. The number of 1/0 provided by outfitting is currently the highest known, which can reach _continued j, which can fully respond to the trend of high efficiency and non- = t in today's electronic products. Moreover, since the wafer and the carrier pass through the bumps, ,,, the inductance between the wafer and the carrier can be greatly reduced, so as to improve the performance. A heat sink can also be attached to the back of this flip chip, which can quickly dissipate the heat generated during the operation of this 1C chip. Therefore, flip chip

Page 6 200406866 V. Description of the invention (3) Technology is especially required for products that operate at high speed and generate high heat. At present, there are a variety of flip-chip technologies that are being developed. The main difference lies in the fact that the material and the way of formation are different. Compared with solder bumps (Solder), gold bumps (God), and conductive polymer bumps, BUmP > '

Bump) There are four types, 1 in total

rRllm. A Japanese clothing includes the production of bumps before assembly (two =, said; circular cutting (Die Saw), and wafer connection of assembly operations: (B = g), soldering (Refl0w) 1 washing (C: The subject matter claimed in this post has a direct and close relationship. First, 'Please refer to the wafer bonding process in Figure 2. The wafer bonding is at 1; after the wafer with the tin bumps is overturned, it is connected to the carrier board. Connection of solder joints: The furnace is heated so that the soldering of the tin bumps and the carrier board is connected: the bumps need to be covered with flux (Flux) before the machine can be turned on. Put it on the carrier board, because after the return of about two Vi :: to relax the error value of the wafer placement.-Generally self-alignment of a quarter carried within 25 γ, and the placement of the wafer and the carrier board The offset can be good. The flux not only has the function of temporarily fixing the wafer and the carrier: the oxide on the surface of the tin bump is activated to form a good block, because the tin-lead bump is attached to the substrate ^ Irregular and uniform, so the wafer and the carrier

Page 7 200406866 V. Description of the invention (4) ------ The joints must be leveled'Coining (Flatten) before they can be used to ensure that the chip and the carrier board are solid and firm. Join.卩 The current level of technology in this field can be made into two forms of this type of carrier: one is in the form of a single unit | the carrier board with the bumps must be cut into a single unit and then integrated Another method of flattening is to combine a plurality of these carrier plates into a strip carrier body (Strip), and then perform leveling after forming. However, the bump leveling machine designed with the current technical level can only be used to manually or automatically level the bumps on these single carrier boards. Blocks do not have the ability to auto level. Therefore, the throughput and efficiency of the current leveling process of the carrier board are quite limited, and the proportion of warpage and deformation of the carrier board after this leveling process is very high. Since the function of the bump leveling technology of the flip chip carrier board of the conventional technology has the above-mentioned disadvantages and limitations, the inventor of this case? Dedicated to research and development and experimental improvement based on his experience and ideas in this industry field, the invention came into being. / [Summary of the Invention] Therefore, the object of the present invention is to provide a novel flip chip substrate bump leveling jig and method to achieve the goal of improving bump leveling efficiency and automated mass production. This device is based on the existing bump leveling technology for flip chip substrates

200406866

The invented Fixture has both the function of automatically leveling the above-mentioned single carrier plate and the function of leveling the convexity of the upper plate of the strip carrier body, which can not only enhance such convexity The output of the block leveler can provide its use flexibility. In addition, it can also improve the problem of warping and deformation of these carriers. [Embodiment] = Japan's theory, features, and advantages can be further understood by the following description and referring to the attached drawings. Flat machine UI4 Ganshen ^ Figure 1 'shows the bumps used in the present invention). Among them, the carrier board (14) set on the right side of the leveler body (12) is an input i2t4 bump to be leveled. It can be input from the right to the left into the leveler body to implement the leveling right. From the inside of the main body of the leveler, there are two leveled carrier plates (15), and the output unit (13). By using the jig of the present invention for leveling, the two = management can achieve leveling of multiple carrier boards at one time (which may depend on the passenger thousand: two occasions: not, and can be adjusted to as many as 9, 12, or 16 etc. The number of purposes) has thus significantly increased the productivity and efficiency of the process. Bu Pangu, eight times, please refer to Figure 4, which shows the fixture (20) of the present invention, the alloy two plates (21); this fixture is made of metal (including non-recorded steel, county ,, or genus) or non-metal (mainly plastic), which is a flat rectangular shape with a thickness of, for example, about 2 cm.

200406866 V. Description of the invention (6) Slots. The purpose of these grooves is to accommodate the internal arrangement of the carrier board. It will need to be recessed: internal basis. According to the present invention, the outer shape of the strip-shaped carrier plate is relatively small, and a plurality of concave stands π · flat 乂 j, can be made flat on a jig. If: the hollow part of the bismuth can provide a lower pressure head for lifting. If the basin material i A1 is metal, then the jig can be made by machining; "" the jig can be made by machining, or injected. It is made by the method. In addition, these jigs can be stacked. ,,,,,, and two t. Yin Ming refers to Figures 5 (a) to 5 (c), which shows the implementation of a flip chip carrier using the m tool of the present invention. Steps of the bump leveling method: T Place the strip substrate on the present invention, which can be placed by hand manually, or automatically placed by equipment (see Figure 5 (a)) ; Pre-cutting and placement (-2) / After the above placement is completed, move the fixture and the carrier board to the appropriate position, and align the display with the charge (CCD) (see section 敫 平 n 在隹 Check that the alignment is correct'Move the jig with the strip carrier to Yuqian £ to enter the leveling (see Figure 5 (a)); to Λ4) Λ leveling Λ process, first, The fixture and the strip carrier move f ^ 廿: After the stop position, the lower leveling fixture is raised and the strip carrier is lifted f: i, and the upper level fixture is lowered until it is with the strip carrier. Level up to the touch (see Figure 5 (b)); during this leveling process, the upper and lower jigs can be set to various temperatures according to actual needs, with a range between 25_25 (rc, and Can be demanded

200406866 V. Description of the invention (7) _ Set different pressure and pressure holding time 1000kgf, and the pressure holding time range ^ Ligan circumference is 0- (5) After the above suppression, it is 0-10 seconds; After the tool is moved back to the original position and the journey is completed, level up and down the jigs together with the carrier plate placed on it, and then repeat this hairpin in the form of * to revisit Figure 5 (Figure 0); and All the bumps are leveled out; then, all the carrier boards on the carrier board are discharged manually or automatically; Jiang J can use this strip carrier board-lifter repeatedly. Take out the strip-shaped carrier board; In addition, in the implementation of the jig-type using the present invention, the extension is one thousand days guard, and two types can be used. The first type is a single operation mode. The size of the lower part is slightly larger than the size of a single carrier board. __A I is the operation of leveling fixtures. 夂 Leveling only one carrier board. One is a multi-operation mode. The upper and lower sides are used to press the leveling bar at the same time. ^ / Zhengqian / mouthpiece can be based on the actual need for a carrier board. For example, as many as 9, 12, or 16 pieces of Yizheng strip-shaped carrier boards are described as the features and advantages of f :, please refer to 6U) and 6 (a). According to the conventional technology, the carrier plate bump leveling method and method can only press and flatten a carrier with bumps on it at a time. Fig. 6 (b) shows the use of the bump leveling method of the present invention. Fixtures and squares ^ _ One can level multiple carriers with bumps (which can be adjusted up to 9, 12, or 16 depending on the actual requirements of the customer), so this can be greatly improved

Page 11 200406866 V. Description of the invention (8) The production capacity and efficiency of the bump leveling machine are too bright. Therefore, it can be known from the above description that the bump leveling fixture and method of the male carrier board are indeed excellent. Yu Xi is dry; r. The present invention does have industrial advantages: Baizhi technology conforms to patent requirements #. Xiao "-_ novelty and progress, the above is only a preferred embodiment of the present invention and is not intended to limit the present invention and the application of the true brake R The content of the surroundings; any Chu Fanxiong who did not deviate from the spirit disclosed in the present invention, he should be included in the scope of the following patent application. 200406866

Figure 1 is a flowchart showing the flip chip packaging process; Figure is a schematic side view showing die bonding; Figure 3 is a side view of a flip chip carrier bump leveler. Figure 4 is a picture of the chip according to the present invention. The top view of / 土 each ', where the dry car is also signed. // The example of the flip chip carrier plate leveling fixture (substrate); First, a strip carrier plate placed on this tool (dr ip 方 ^ square f If the implementation steps of the chip-on-chip bump tail plus 100,000 method according to a preferred embodiment of the present invention are not; and

6th (a) and 6 (b) BA-A Carrier board bump leveling == Plant board bump leveling is more relevant to the present invention [Symbol Element Description] 10 Bump leveler 11 Input unit 12 Rectification Flat machine body 13 Carrier board of output unit 14 The bump is to be leveled 15 The bump is leveled 16 Wafer 17 Carrier plate 18 Vacuum nozzle

200406866 Page 14 Brief description of drawings 19 Tin-lead bumps 20 Fixtures 21 Strip-shaped carrier body 22 Carrier plates 23 Upper flat fixtures 24 Lower flat fixtures 27 Single carrier plates 28 Multiple carrier plates

Claims (1)

200406866 / n, Shen's patent scope 1 · A flip-chip carrier board bump leveling is a flat rectangular parallelepiped shape, made of non-metal, on which a bar-shaped carrier board body is accommodated, and the concave structure will be Must be leveled down to go smaller ', it can provide an injury on a jig, and it can provide a lower indenter to rise, which is characterized by the jig can be based on its corresponding article 2 · If the scope of patent application is the first! Xiang if its material is made of stainless steel machining; if the jig can be machined to 0, the thickness is about 0 · 1-2 cm, and it is made of metal or grooves, etc. The purpose of the groove is divided in the groove according to the internal arrangement of the strip carrier body. If the outer shape of the strip carrier body is made into multiple grooves, the emptying of the fixture is leveled. Must be made in size and shape. For fixtures, among them, aluminum alloy and other metals, the fixture can be made of non-metals mainly made of plastic, then made into clothing, or made by injection molding. 3 · If the fixture in the first scope of the patent application, The jig can be made into different scales according to the actual needs in this leveling process to carry and hold a carrier body composed of, for example, 9, 12, or 16 carrier boards. 、、 战 条条 4 · If the fixture in the scope of patent application No.1, the specialized fixture can be stacked. 200406866 VI. Scope of patent application 5 • If the fixture of the first scope of patent application is applied, the fixture can be used repeatedly. 6. A method for leveling bumps of a flip chip carrier board, including the following steps: placing a strip substrate on a jig, which can be placed manually by hand, or automatically sucked by equipment Placement: After the above-mentioned placement, move the fixture and the carrier board to an appropriate pre-set position for alignment with a charge-coupled display (CCD); after checking the alignment, load the fixture with the bar The board is moved to the leveling section for leveling. During the process, the jig and the strip carrier are first moved to the first position, and the lower leveling tool is raised to lift the strip carrier. The leveling and smelting tools are lowered until they come into contact with the strip-shaped carrier body. The original =; after:: After that, move the upper and lower leveling fixtures to the same position as above: = shifting: step position: U The jig of the present invention is leveled with a carrier board; and the position is stopped in order to carry out the next repeat of this leveling process, until an ancient block is leveled; all of the carrier boards on the strip carrier board are missing. Projection, manual; with strip carrier plate-automatic nozzles for row loading Taken out. For example, the method of applying for item 6 of the patent scope, which is on page 16, 200406866. 6. During the leveling process, the upper and lower fixtures can be set to various temperatures according to actual requirements, with a range of 25-2 50 °. Between C, and according to actual requirements, different pressures and pressure holding times can be set, the pressure range is 0-ΐ OOOkgf, and the pressure holding time range is 0-10 seconds. Page 17