200404319 玖、發明說明 ㈣：發明所屬之技術領域、先前技術、内容、實施方式及圓 ]早《兒明） 【發明所屬之技術領域】 在電信業中且特別是在視訊傳輸業中，在同軸導體上 將訊號（譬如5MHz至1 GHz)從一頭端（headend)攜載至客戶 處。在系統的頭端上操縱多種訊號以達成廣泛不同的功能 及目的。譬如，可能將多種同軸纜線上所攜載的訊號整合 在單一同軸導體上。同樣地，可將一主同軸導體上的一訊 號分成在分支同軸導體上所攜載之複數個訊號。 除了整合、分離、轉向或添加訊號之外，帛端亦包括 10 15 一用於修改訊號之模組。譬如，為了適當地調整系統，可 能需要提供衰減器或類似物來將一訊號衰減至理想位準。 亚且，當在一段纜線長度上攜載寬頻射頻（RF)訊號時，訊 號的高頻範圍可能具有比訊號的低頻範圍更大之衰減。因 此，利用等化器來修改訊號使其在整體頻率範圍中具有 強度級（level intensity)。200404319 发明, description of the invention 技术: the technical field, prior art, content, implementation and circle of the invention] [Er. Ming] [Technical field to which the invention belongs] In the telecommunications industry and especially in the video transmission industry, coaxial Signals (such as 5MHz to 1GHz) are carried on the conductor from the headend to the customer. Manipulate multiple signals on the head end of the system to achieve a wide variety of functions and purposes. For example, signals carried on multiple coaxial cables may be integrated on a single coaxial conductor. Similarly, a signal on a main coaxial conductor can be divided into a plurality of signals carried on a branch coaxial conductor. In addition to integrating, separating, turning or adding signals, the terminal also includes a module for modifying signals. For example, in order to properly adjust the system, it may be necessary to provide an attenuator or the like to attenuate a signal to a desired level. Furthermore, when carrying a wideband radio frequency (RF) signal over a length of cable, the high frequency range of the signal may have a greater attenuation than the low frequency range of the signal. Therefore, an equalizer is used to modify the signal to have level intensity in the overall frequency range.
【先前J 發明背景 時常利用插接式（plug-in)裝置（譬如衰減器或等化器） 來達成調整作用。包括插接式裝置的示範性系統係揭露於 2〇吳國專利案6,289,210號，且該案以引用方式併入本文中。 一般而言，諸如整合器（combiner)等模組係具有安裝 在一印刷電路板上之插座。一插頭的終端係延伸入一插座 内並藉由全部位於電路板相同側之電組件電性耦合至電路 板。特定言之，電組件係與插座導通並譬如依需要利用通 6 坎、發明說明 逼將插頭的終端電性輕合至電路板的適當層。此種安裝 i式會增加電組件周圍輻射的訊號量而造成相鄰電路之串 曰干扱亚且，因為電組件的導線具有感應性，使用特殊 電路設計加以補償。 而要改良一模組上的相鄰埠之間的隔離量。此外，需 要IV低可生效應（parasitics)藉以降低一特定埠的損失及增 加插入損失。 務必對於容納電組件之模組提供電磁遮蔽。譬如，在 -整合II模組中，將用於容納電路之複數個衰減器插頭插 入杈組的一側。譬如，可將複數個衰減器插頭插入殼體的 插座中。一旦插頭插入時，則將一傳導性覆蓋件放置在插 頭及插座上以遮蔽電路板不受到外部環境影響，反之亦然 田後蓋件私去進行維修時，譬如，模組以比起載體低了 大、勺60刀貝（dB)將訊號輻射至外部環境中，此輻射將與頭 15端的操作產生干擾。有時候，在完成修理時可能未放回覆 牛另外有些日寸候，修理可能進行數小時且此時覆蓋件 必須保持移除狀態。 需要提供一種具有比載體至少低了 1〇〇dB的發射量之 模組藉以降低干擾的可能性。此外，需要提供一具有改良 20 的遮敝作用之模組。 【發明内容】 發明概要 根據本發明的第一型態，提供一用於容納一電路之模 組。此模組包括一殼體及一插座。殼體含有一具特定厚度 7 200404319 玖、發明說明 的前部，且可從殼體前部近接插座。插座的形狀可收納一 電路組件及形成一波導。 根據本發明弟二型悲’提供一用於容納一電路之模組 。此模組包括一殼體及一插座。殼體含有一具特定厚度的 鈾部，且可從殼體的一表面近接插座。插座的形狀可收納 一電路組件及形成一波導。 圖式簡單說明_ 第I圖為根據本發明的一較佳實施例之一種八埠射頻 整合器模組10的立體圖，其中已移除一頂板； 第2圖不意顯示第i圖的整合器之一插頭3〇的示範性電 路圖； 第3圖為苐1圖所示之八埠射頻模組1〇的立體圖，其中 已移除頂板； 第4圖為第1圖所示之模組的立體圖，其中已將一覆蓋 15件附接至殼體的前壁且已移除另一覆蓋件； 第5圖為第1圖所示的模組之分解圖； ' $6®為根據本發明的-較佳實施例之電路板、插頭 連接裔及插頭的一部份之分解圖； 第7圖為第1圖所示的模組之俯視圖； 20 圖 第8圖為第7圖所示的模組沿著線8_8所取之剖視圖； 第9圖為第8圖所示的剖面的—部份之放大圖； 第1〇圖為根據本發明另_較佳實施例的—模組之側視 第11圖為第10圖所示的模組之正視圖； 8 玖、發明說明 第12圖為根據本發明的一較佳實施例之一插座的一部 份之剖視圖。 C實施方式】 較佳實施例之詳細說明[Previous J Background of the Invention Plug-in devices (such as attenuators or equalizers) are often used to achieve adjustment. An exemplary system including a plug-in device is disclosed in 20 Wu Guo Patent Case No. 6,289,210, which is incorporated herein by reference. Generally, a module such as a combiner has a socket mounted on a printed circuit board. The terminal of a plug extends into a socket and is electrically coupled to the circuit board by all electrical components located on the same side of the circuit board. In particular, the electrical component is electrically connected to the socket, and for example, if necessary, the terminal of the plug is electrically closed to the appropriate layer of the circuit board. This type of installation will increase the amount of signal radiated around the electrical components and cause stringing of adjacent circuits. Moreover, because the wires of the electrical components are inductive, a special circuit design is used to compensate. To improve the isolation between adjacent ports on a module. In addition, low parasitics of IV are needed to reduce the loss of a particular port and increase the insertion loss. Be sure to provide electromagnetic shielding for modules that contain electrical components. For example, in the -Integration II module, a plurality of attenuator plugs for accommodating a circuit are inserted into one side of the branch group. For example, a plurality of attenuator plugs can be inserted into the sockets of the housing. Once the plug is inserted, a conductive cover is placed on the plug and socket to shield the circuit board from the external environment, and vice versa when the back cover is private for repair, for example, the module is lower than the carrier The large and small spoon 60 scallops (dB) will radiate the signal to the external environment, and this radiation will interfere with the operation of the head 15 end. Sometimes, the repair may not be returned when the repair is completed. For other days, the repair may take several hours and the cover must remain removed at this time. There is a need to provide a module with an emission volume that is at least 100 dB lower than the carrier to reduce the possibility of interference. In addition, there is a need to provide a module with an improved shading effect of 20. SUMMARY OF THE INVENTION According to a first aspect of the present invention, a module for accommodating a circuit is provided. The module includes a housing and a socket. The housing contains a front part with a specific thickness 7 200404319 玖, description of the invention, and the socket can be accessed from the front of the housing. The shape of the socket can accommodate a circuit component and form a waveguide. According to the present invention, a second type module is provided for accommodating a circuit. The module includes a housing and a socket. The case contains a uranium portion of a specific thickness, and the socket can be accessed from one surface of the case. The shape of the socket can accommodate a circuit component and form a waveguide. Brief description of the drawings_ Figure I is a perspective view of an eight-port RF integrator module 10 according to a preferred embodiment of the present invention, in which a top plate has been removed; Figure 2 is not intended to show the integrator of Figure i An exemplary circuit diagram of a plug 30; FIG. 3 is a perspective view of the eight-port RF module 10 shown in FIG. 1 with the top plate removed; FIG. 4 is a perspective view of the module shown in FIG. One cover has been attached to the front wall of the housing and another cover has been removed; Figure 5 is an exploded view of the module shown in Figure 1; '$ 6® is a- An exploded view of a circuit board, a plug connector and a part of the plug of the preferred embodiment; FIG. 7 is a top view of the module shown in FIG. 1; FIG. 8 is a view of the module shown in FIG. A cross-sectional view taken along line 8_8; FIG. 9 is an enlarged view of a part of the cross-section shown in FIG. 8; FIG. 10 is a side view of a module according to another preferred embodiment of the present invention—the 11th The figure is a front view of the module shown in Fig. 10; 8). Description of the invention Fig. 12 is a part of a socket according to a preferred embodiment of the present invention Sectional view. Embodiment C] Detailed description of the preferred embodiment
5 現在茶照圖式Ή久rK _L 飞且。圖中相同的元件具有相同的編號， 現在描述本發明的較佳實施例。 °奢解所揭路的射頻組件只是本發明各種型態所適用 的又備類型之犯例。因此，亦瞭解本發明的各種型態係適 用於特別圖示者以外之射頻組件類型。並且’本發明可普 H)遍應用於電信領域且不限於㈣應用。 15 20 第1圖為根據本發明的一較佳實施例之-八埠射頻整 合器模組1〇的立體圖，其中已移除一頂板。模組1〇包括-殻體12。殼體12包括一前部16及-與前部16相對的背部18 。前部及背部！6、18由—對側邊取22接合。雖然圖中前 ^與背部彼此平行，其可能相對彼此呈-角度。在-較佳 實施例中，殼體12的主側24為開啟且主側％被一板關閉， 此板係形成為無法從殼體12移除之殼體12其餘部份的一整 體構件’且主側24由-被緊固件（譬如螺栓或螺絲）固定至 殼體12之可移除式板28所包圍。或者，主側26可開啟且受 到一譬如主側24之類的可移除式板所包圍。 Λ又収12適可至少部份地包圍射頻電路（譬如分離器電 路、整合器電路等）。雖然電路可具有任意數量的已知組 態^此電路較佳係設置於一具有可安裳在殼體咖的尺寸 之-电路板32上。模組1〇包括至少一個插座但較佳包括複數 9 200404319 玖、發明說明 個插座Η，以使各插座容納_可從殼體前部近接的插頭％ 。雖然將從模組1G前部近接的能力描述成為—較佳實施例 ，若從模組的背部、底部、頂部或側邊來近接插頭30，本 發明的此較佳實施例可分別使用於模組1〇的背部、底部、 頂部或側邊，且本發明不限於只經由模組前部加以近接。 下文詳述的插座Μ可由-延伸過殼體12的前部】6之切口以 及插頭連接器36]、36-2之組合所形成。或者’插座吻 如下文所詳述由-具有一内建波導的插頭連接器形成。可 ίο 瞭解具有提供一波導來遮蔽贿之其他組合且其中並非藉 由模組10的前部來近接可移除式插頭。 曰 15 20 在本發明的一實施例中，殼體12的前部16具有厚度1 且其生成-波導，此波導對於從殼體12發射的訊號提供了 〜、的衰減里。厚度較佳約為〇·2吋至約〇·8吋的範圍， f度更佳約為0·25忖’且厚度最佳約為〇75忖。在一較佳 只知例中，有八個插座14位於殼體中，各插座14的尺寸 可'其中收納-插頭30。各插頭具有-容納諸如衰減器電 路寺化裔電路或其他類似電路等電路之塑膠殼體。終端 29(見弟5圖）係在插頭的一後部露出以將插頭電性輕合至位 於電路板32上的電路。插頭連接器36韻队2安裝在電路 心⑽一邊緣上且參照第6圖詳述於下文。四個插頭30收 、内在插頭連接器36]中而其餘的插頭观納在其他插頭 /口. 中已知可提供一插頭連接器來收納所有插頭 於各插頭提供個別的插頭連接器，或為上述組態的 σ σ已知插頭連接器”用語係包括適於在插頭的終 10 200404319 玖、發明說明 端與所安裝的電路板之間收納或以其他方式提供電性連接 之裝置及配置。在較佳實施例中，插頭連接器適可提供與 諸如等化器插頭或衰減器插頭等多針腳射頻電路插頭之電 性連接。 當電路板32安裝在殼體12内時m具即可從殼體 21的前部16來近接衰減器插頭30。殼體12亦可包括固定至 殼體12的前部16之覆蓋件4()藉以如第4圖所示覆蓋住插座 14。覆蓋件40譬如可由鉚扣突棘15固定。可藉由從殼㈣ 移除覆蓋件40來近接衰減器插額。如下文所詳述，根據 10 本發明的較佳實施例之模組1G係與需要EMi遮蔽用的傳導 性覆盖件之已知系、統不同而不需要此種遮蔽。覆蓋件扣可 能為了美觀而設置或為了防止在未經准許情形下近接插頭 之用。然而’覆蓋件40可能由一諸如塑膠等非傳導性材料 ‘成’藉以節省成本。 15 參照第3圖，模組10進一步包括安裝在殼㈣的背部 18上之複數個連接器彻至42_8。雖然連接器訓至似 了具有任意數量之用於接收訊號的組態，連接器較佳係為 邊如BNC型連接器或F型連接器等㈣姆同軸連接器。連 接器仏G至42·8較佳係由諸如卡緣連接器等傳統技術連接 2路板32的—後邊緣。此外，連接㈣·〇至42·8的接地 遮蔽部較佳與殼體12具有電純觸。監視科㈣電性連 接至電路板32 ’且輕錢在殼體12的前部“上。 第2圖示意描述第】圖的整合器的一插頭％之示範性電 路圖。在-較佳實施例中’插頭3()容置有_衰減器電路。 20 200404319 玖、發明說明 =圖所示’整合器包括-較佳身為電性連接至插頭連 接心-1的變壓器形式之第一二對—式整合器体】。第— 整合器44 -1及一繁-敕入口口 弟一正合裔（未圖示）電性連接至一第五二 對-式整合器44-5。第五二對一式整合器44_5及一第六二 對-式整合器(未圖示)電性連接至一第七二對一式整合器 :-7。第七二對一式整合器44-7電性連接至-方向性叙合 方向性輕合器46電性連接至同轴連接㈣韻監視 fe埠41且為熟悉此技術者所習知。 10 雖然已經將第2圖的組態描述為一種八對一式耦合器 ’ 6月瞭解亦可藉由略微修改方向㈣合器46的組態來使用 相同組態作為具有監視器能力的八對一式分離器。易言之 ，熟悉此技術者瞭解可使用變壓器44_1至44_7作為分離器 及整合器。 芩照第2圖，插頭連接器36-1包括一介電殼體3〇〇，如 15同參照第6圖所詳述，只顯示此介電殼體300可安裝在電路 板邊緣上之一部份。兩個貫穿接觸部3〇2(亦即IN與0Uτ接 觸部）安裝在殼體300内。其中一個貫穿接觸部3〇2電性連 接至整合裔44-1，另一個貫穿接觸部3 〇2電性連接至同軸 連接器42-1。使用一傳導性旁通路徑3〇4在兩貫穿接觸部 20 302之間提供電性連接。旁通路徑304包括與各貫穿接觸部 302相鄰之接觸區306。基底構件連接器36-1亦包括一位於 兩貫穿接觸部302之間的接地接觸部305。接地接觸部305 電性連接至地極。 雖然貫穿接觸部302及接地接觸部305可具有多種不同 12 200404319 玖、發明說明 組^第2圖中將接觸部3〇2及3〇4描述為具彈性與傳導性 的彈簧。貫穿接觸部302較佳朝向旁通路徑3〇4的接觸區 3〇6偏Μ，所以當沒嫌請人殼體3⑻時，使貫穿接觸部 3〇2接合其各別的接觸區鳩（亦即，貫穿接觸部“在正常時 ’’將接合接觸區）。貫穿接觸部3〇2與接觸區3〇6之間的接合 作用將造成旁通路徑電路3G4_，所以即使缺少插頭時 ’訊號仍會途經插頭連接器36]。各插頭3()具有電性麵合 至電路板之三個暴露的終端期、31〇。可瞭解接觸部3〇2 、305及終端308及3 1〇可能未全部位於相同平面中。 10 15 20 如第3圖所示，殼體12的前部16具有一從成對側邊2〇 的一者延伸至另-侧壁22之縱軸就。位於殼體12的前部 16中之插座14亦各具有一縱軸線卜譬如，第3圖所示，各 插座14的縱軸線1係對於前部16的縱軸線乙呈現一角度“。 在-較佳實施例中，此角度可能位於約± 1()度至約±⑼度 的範圍内’-較佳實施例中，此角度約為± 45度。藉由此 角度，將使各插頭30的IN與0U 丁終端跨坐於電路板％。所 以，如同芩照第8圖所描述，in終端將接觸到電路板的第 一側而OUT終端將接觸到電路板的第二相對侧。因此不同 衣一種使所有終端位於電路板的一側之先前描述的安裝方 式，藉由插座的斜角式配置將不需要使用通道來譬如將一 終端與電路板的適當層產生電性接觸。因為以與〇1^ 丁終端 位於電路板的相反側上，彳改㈣之間的隔離仙。此外 ，亦降低寄生效應及插入損失，且增加一特定埠的回傳損 失（return loss)。 m 13 200404319 ίο 15 玖、發明說明 並且’藉由以一角度放置插座14’可因為使用較少空 間而增高插頭30的密度。 设體12的前部16具有一較佳位於約0 · 2忖至約〇. 8忖範 圍的厚度（t)。插座延伸經過前部1 6並生成一有助於降低從 模組發出的訊號之波導3 1。此外，因為前部丨6比習知系統 更厚’位於殼體12内部之電路板32係被進一步推動遠離殼 體12的前部16。由於間隔與厚波導形狀的插座14之合併效 果，杈組ίο不需在插座14上方具有任何額外的EMI遮蔽且 模組仍可輻射比載體低了超過1〇〇(18之訊號。在不使用遮 敝用的傳導性覆蓋件之模組中，當覆蓋件被移除時，係發 射出只比载體降低60dB之訊號且其造成頭端的干擾。因此 ，插頭30不用工具即可容易地近接且可放回，且射入頭端 的訊號量未顯著改變。此外，因為插頭3()具有較大長度藉 以觸及插頭連接器，位於插頭塑膠殼體内的電路係靠近插 頭的暴露終端。當插頭3〇插人插頭連接器日夺，插頭中的電 路此時係位於模組10内部而非外部。這亦提供了改良的效 20 圍繞插座的區域33可能如圖示為凹入狀以讓一覆蓋件 置在插座14上方。此覆蓋件雖然對於遮蔽用途並非必要 ，但基於美觀起見仍然需要此冑 ^ 而受此设盍件。此外，可能需要_ 覆蓋件來防止近接插頭。因為 U馮後盍件亚非遮蔽用途所需要 ，覆蓋件可由非傳導性材料掣 丨、、 何卄衣成，故可比習知系統更加節 省成本。 第4圖為第1圖所 示之模組的立體圖，其中有一 個覆蓋 14 200404319 玖、發明說明 件40附接至殼體12的前部16且有另一個覆蓋件4〇被移除。 覆蓋件40可能設有鉚扣突棘15以將覆蓋件4〇緊固至殼體12 的則部16。若要從前部16移除一覆蓋件4〇，可擠壓覆蓋件 的相對側使鉚扣突棘脫離前部丨6的凹入區域。 第5圖為第1圖所示的模組之分解圖，已知第$圖中大 邛份的電路板被往後推而遠離前部丨6。 ίο 15 第6圖為根據本發明的一較佳實施例之電路板、插頭 連接器及插頭的一部份之分解圖。插頭連接器36-1具有-著插頭連接g 36_1的—背壁延伸之溝槽37。電路板32的 一珂邊緣係配合在溝槽中。各插頭3〇具有位於插頭的一後 部中之三個暴露終端。三個插槽39部份地位於插頭連接器 36]中，其中各插頭終端可使用一個插槽π。插槽外只部 份地插入插頭連接器中，其餘部份則露出藉以如下文詳述 〃電路板32上的適當層產生電性接觸。電路板如有複數 们層板纟帛-側43上具有諸如變麼器等導電跡線及電 路(皆未圖示）。同樣地，—與第—側43相對的第二侧亦具 有W跡線及電路。電路板的前邊緣上設有複數個凹部料 ，凹部44暴露出_位於板中心處之導電跡線45,此導電跡 線4 5保持接地。當插梓3 9、杯 20 田拖才曰39、插碩連接器36-1、2及電路板 =組裳時’中間插槽係位於―凹部料中且插槽的暴露部份 =接至跡線45。與中間終端相鄰之另兩個終端係延伸通過 ，、各別的插槽’且一個終端將配置於電路板的一頂表面上 而另：個終端將配置於電路板的—底表面上。 第7圖為第1圖所示之模相6 衩、、且的俯視®。第8圖為第7圖所 15 404319 坎、發明說明 不的模m線8销取之剖視圖，且此職圖中所有元 件皆已組裝。第9圖為第8圖所示剖視圖的一部份之放大圖 ，且其中顯示插頭連接器36」、插頭3〇及電路板32之配置 。中間終端33在中間插槽内滑動，此中間插槽電性耦合至 位於電路板中心之接地跡線。另兩個終端％的其中一者係 在圖中接觸電路板的底表面，另—終端雖未圖示但接觸電 路板的頂表面。 10 15 弟10圖 為根據本發明另一 圖。模組100的部份内部結構 100之所有的内部結構。此外 較佳實施例的一模組之側視 以虛線顯示。並未顯示模組 ’為簡明起見並未顯示諸如 安裝凸緣或連接H等外部結構。在此較佳實施例中，一較 佳由傳導性材料製成的殼體112係容置有—電路板⑴。在 此較佳實施财，轉板已㈣目對於上魏佳實施例旋轉 90度。複數個具有可收納插頭⑽的尺寸之插座114係位於 殼體m的前部116中。插座114形成於傳導性材料所製成 的殼體中，因此插座形成可使發射物衰減之波導。第㈣ 為第10圖所示之模組100的正視圖。 弟12圖為根據本發明的一較 ^ 权1土 κ施例之一插座的一部 份之剖視圖。若不使殼體前部變 20 又/予稭以生成波導，插頭連 接器本身可設有自己的個別湓 刎及V如第12圖所示，插頭連 接器形成一插座來收納一 砌碩且具有—前部份200及一後 部份202。前部份2〇〇由傳導性鉍 、 寻¥〖生材枓製成，但後部份202由 非傳導性材料製成。插頭連接 只逆接态的則部份200係藉此形成 波導。 16 200404319 玖、發明說明 上述說明書、範例及資料係完整地描述本發明的組成 物之製造及使用方法，因為本發明可具有許多實施例而不 脫離本發明之精神與範圍，本發明由申請專利範圍所界定。 【圖式簡單說明】 - 5 第1圖為根據本發明的一較佳實施例之一種八埠射頻 正合為模組1 〇的立體圖，其中已移除一頂板； 第2圖不意顯不第1圖的整合器之一插頭％的示範性電 路圖； 弟3圖為第丨圖所示之八埠射頻模組1〇的立體圖，其中 10已移除頂板； 第4圖為第1SJ所示之模組的立體圖，其中已將一覆蓋 件附接至殼體的前壁且已移除另一覆蓋件； — 第5圖為第1圖所示的模組之分解圖； 、 、第6圖為根據本發明的一較佳實施例之電路板、插頭 15連接器及插頭的一部份之分解圖； 第7圖為第1圖所示的模組之俯視圖； · ”圖為第7圖所示的模組沿著線8销取之剖視圖； 第9圖為第8圖所不的剖面的一部份之放大圖； 第10圖為根據本發明$ _ ά + 另車父L貫施例的一模組之側視 一 20圖； 幻1圖為第10圖所示的模組之正視圖； — 第12圖為根據本發明 乂月的一較佳實施例之一插座的一部 份之剖視圖。 17 200404319 玫、發明說明 【圖式之主要元件代表符號表】 ίο···八埠射頻整合器模組 12,21，112…殼體 14,114…插座 15…鉚扣突棘 16，116…前部 18…背部 20,22…側邊 24,26···主側 28···可移除式板 29,308,310"_終端 30，130···插頭 31…波導 32，132···電路板 33···圍繞插座的區域 36-1,36-2···插頭連接器 37…溝槽 3 9…插槽 40…覆蓋件 41…監視器埠 42-0〜42-8···連接器 43…第一側 44-1…第一二對一式整合器 44-5…第五二對一式整合器 44-7…第七二對一式整合器 44…凹部 45…導電跡線 46…方向性耦合器 100···模組 200···前部份 202…後部份 300···介電殼體 302···貫穿接觸部 304…傳導性旁通路徑 305···接地接觸部 306···接觸區 L，l···縱軸線 t…厚度 α…角度5 Now tea according to the pattern of Ή 久 rK _L Feiji. The same elements in the figures have the same reference numerals, and a preferred embodiment of the present invention will now be described. ° Explaining the radio frequency components disclosed is just another type of crime applicable to various forms of the present invention. Therefore, it is also understood that various types of the present invention are applicable to types of RF components other than those specifically illustrated. And the present invention can be universally applied in the field of telecommunications and is not limited to ㈣ applications. 15 20 FIG. 1 is a perspective view of an eight-port radio frequency integrator module 10 according to a preferred embodiment of the present invention, in which a top plate has been removed. The module 10 includes a housing 12. The housing 12 includes a front portion 16 and a back portion 18 opposite the front portion 16. Front and back! 6, 18 by-take 22 on the side to join. Although the front and back in the figure are parallel to each other, they may be at an angle with respect to each other. In the preferred embodiment, the main side 24 of the casing 12 is open and the main side is closed by a plate, which is formed as an integral component of the rest of the casing 12 that cannot be removed from the casing 12 ' And the main side 24 is surrounded by a removable plate 28 that is fixed to the housing 12 by fasteners such as bolts or screws. Alternatively, the main side 26 may be opened and surrounded by a removable plate such as the main side 24. Λ also accepts 12 at least partially surrounding RF circuits (such as splitter circuits, integrator circuits, etc.). Although the circuit can have any number of known configurations, the circuit is preferably provided on a circuit board 32 having a size that can be placed on the housing. The module 10 includes at least one socket but preferably includes a plurality of 9 200404319 玖, description of the invention, a socket Η, so that each socket can accommodate a plug that can be accessed from the front of the housing%. Although the ability to approach the front part of the module 1G is described as a preferred embodiment, if the plug 30 is approached from the back, bottom, top, or side of the module, this preferred embodiment of the present invention can be used in each of the modules. The back, bottom, top or side of the group 10, and the invention is not limited to being approached only through the front of the module. The socket M, which will be described in detail below, may be formed by a combination of a cut-out extending through the front portion of the housing 12 and the plug connectors 36], 36-2. Alternatively, the 'socket kiss' is formed by a plug connector with a built-in waveguide, as detailed below. It can be understood that there are other combinations that provide a waveguide to cover the bribe and in which the removable plug is not accessed by the front of the module 10. 15 20 In an embodiment of the present invention, the front portion 16 of the casing 12 has a thickness of 1 and its generation-waveguide, and this waveguide provides ~~, attenuation to the signal emitted from the casing 12. The thickness is preferably in the range of about 0.2 inches to about 0.8 inches, the f degree is more preferably about 0.25 忖 ', and the thickness is most preferably about 0.75 忖. In a preferred example, eight sockets 14 are located in the housing, and each socket 14 can be sized to accommodate a plug 30 therein. Each plug has a plastic housing that houses a circuit such as an attenuator circuit or other similar circuit. The terminal 29 (see FIG. 5) is exposed at a rear portion of the plug to lightly close the plug to a circuit on the circuit board 32. The plug connector 36 is installed on one edge of the circuit core and is described in detail below with reference to FIG. 6. The four plugs 30 are received in the inner plug connector 36] and the remaining plugs are viewed in other plugs / mouths. It is known that a plug connector can be provided to accommodate all the plugs. A separate plug connector is provided for each plug, or The term “σ σ known plug connector of the above configuration” includes the device and configuration suitable for accommodating or otherwise providing electrical connection between the terminal 10 200404319 玖 of the plug, the invention description end, and the installed circuit board. In a preferred embodiment, the plug connector is suitable for providing electrical connection with a multi-pin RF circuit plug, such as an equalizer plug or an attenuator plug. When the circuit board 32 is installed in the housing 12, it can be removed from The front portion 16 of the housing 21 is close to the attenuator plug 30. The housing 12 may also include a cover 4 () fixed to the front portion 16 of the housing 12 so as to cover the socket 14 as shown in Fig. 4. The cover 40 For example, it can be fixed by the rivet prongs 15. The attenuator insert can be accessed by removing the cover 40 from the case 。. As described in detail below, the module 1G according to the preferred embodiment of the present invention 10 requires EMi Known systems for shielding conductive coverings Different types of systems do not require such shielding. The cover buckle may be provided for aesthetics or to prevent the use of a proximity plug without permission. However, the 'cover 40 may be made of a non-conductive material such as plastic. 15 to save costs. 15 Referring to FIG. 3, the module 10 further includes a plurality of connectors mounted on the back 18 of the case to 42_8. Although the connectors are trained to have any number of configurations for receiving signals The connector is preferably a coaxial connector such as a BNC type connector or an F type connector. The connectors 仏 G to 42 · 8 are preferably connected to the 2-way board 32 by a conventional technology such as a card edge connector. -The rear edge. In addition, the ground shields connecting ㈣ · 0 to 42 · 8 preferably have pure electric contact with the housing 12. The monitoring unit is electrically connected to the circuit board 32 'and the light money is in front of the housing 12. Ministry "on. FIG. 2 schematically illustrates an exemplary circuit diagram of a plug% of the integrator of FIG. In the -preferred embodiment, the 'plug 3 () houses a _ attenuator circuit. 20 200404319 发明 、 Explanation of the invention = The 'integrator shown in the figure includes-preferably the first two pair-type integrator body which is in the form of a transformer electrically connected to the plug connection core-1]. No. 1-Integrator 44 -1 and Yifan-Yan entrance. A younger brother (not shown) is electrically connected to a 522 pair-type integrator 44-5. The fifth two-to-one type integrator 44_5 and a sixth two-to-one type integrator (not shown) are electrically connected to a seventh two-to-one type integrator: -7. The seventy-two-to-one type integrator 44-7 is electrically connected to the directional coupling. The directional light coupler 46 is electrically connected to the coaxial connection, and the rhyme monitoring fe port 41 is well known to those skilled in the art. 10 Although the configuration of Figure 2 has been described as an eight-to-one coupler, it was learned in June that the same configuration can be used as an eight-to-one with monitor capability by slightly modifying the configuration of the directional coupler 46. Splitter. In other words, those skilled in the art understand that transformers 44_1 to 44_7 can be used as separators and integrators. According to FIG. 2, the plug connector 36-1 includes a dielectric housing 300. As described in detail in FIG. 6 with reference to FIG. 6, only the dielectric housing 300 can be installed on one of the edges of the circuit board. Part. Two penetrating contact portions 302 (i.e., IN and 0Uτ contact portions) are installed in the housing 300. One of the penetrating contact portions 302 is electrically connected to the integrated connector 44-1, and the other penetrating contact portion 302 is electrically connected to the coaxial connector 42-1. A conductive bypass path 304 is used to provide an electrical connection between the two through-contacts 20 302. The bypass path 304 includes a contact region 306 adjacent to each of the through contact portions 302. The base member connector 36-1 also includes a ground contact portion 305 between the two through contact portions 302. The ground contact portion 305 is electrically connected to the ground electrode. Although the penetrating contact portion 302 and the ground contact portion 305 may have a variety of different types, the contact portions 302 and 304 are described in the second figure as elastic and conductive springs. The penetrating contact portion 302 is preferably oriented toward the contact area 300 of the bypass path 300. Therefore, when the case 3 is not called for, the penetrating contact portion 302 is engaged with its respective contact area dove (also That is, the penetrating contact portion will engage the contact area "in normal time". The bonding effect between the penetrating contact portion 302 and the contact area 306 will cause the bypass path circuit 3G4_, so even when the plug is missing, the 'signal remains Will pass through the plug connector 36]. Each plug 3 () has three exposed termination periods, 31 °, which are electrically connected to the circuit board. It can be understood that the contact portions 3202, 305, and the terminations 308, 3, 10 may not All are located in the same plane. 10 15 20 As shown in FIG. 3, the front portion 16 of the housing 12 has a longitudinal axis extending from one of the paired side edges 20 to the other-side wall 22. It is located in the housing Each of the sockets 14 in the front portion 16 of 12 also has a longitudinal axis. For example, as shown in FIG. 3, the longitudinal axis 1 of each socket 14 represents an angle to the longitudinal axis B of the front portion 16. In a preferred embodiment, the angle may be in a range of about ± 1 () degrees to about ± ⑼ degrees .'- In a preferred embodiment, the angle is about ± 45 degrees. From this angle, the IN and 0U terminals of each plug 30 will sit across the circuit board%. Therefore, as described in Fig. 8, the in terminal will contact the first side of the circuit board and the OUT terminal will contact the second opposite side of the circuit board. Therefore, unlike the previously described mounting method in which all terminals are located on one side of the circuit board, the beveled configuration of the socket will not require the use of channels to, for example, make a terminal in electrical contact with the appropriate layer of the circuit board. Because the terminal is located on the opposite side of the circuit board, it is necessary to change the isolation between the terminals. In addition, it also reduces parasitics and insertion loss, and increases the return loss of a particular port. m 13 200404319 ίο 15 发明, description of the invention and ‘by placing the socket 14 at an angle’, the density of the plug 30 can be increased because less space is used. The front portion 16 of the body 12 has a thickness (t) preferably in a range of about 0.2 to about 0.8 mm. The socket extends through the front 16 and creates a waveguide 31 that helps reduce the signal from the module. In addition, because the front part 6 is thicker than the conventional system ', the circuit board 32 located inside the case 12 is further pushed away from the front part 16 of the case 12. Due to the combined effect of the spacing and the thick waveguide-shaped socket 14, the branch group ίο does not need to have any additional EMI shielding above the socket 14 and the module can still emit a signal that is lower than the carrier by more than 100 (18). When not in use In the module of shielding conductive cover, when the cover is removed, it emits a signal that is only 60dB lower than the carrier and it causes head-end interference. Therefore, the plug 30 can be easily accessed without tools. It can be put back, and the amount of signal injected into the head has not changed significantly. In addition, because the plug 3 () has a large length to reach the plug connector, the circuit located in the plastic housing of the plug is close to the exposed terminal of the plug. When the plug 30. The plug-in connector is released, and the circuit in the plug is now located inside the module 10 instead of the outside. This also provides an improved effect. The area surrounding the socket 33 may be recessed as shown to allow The cover is placed above the socket 14. Although this cover is not necessary for shielding purposes, it is still needed for aesthetic reasons and is subject to this setting. In addition, a _ cover may be required to prevent the proximity plug Because U Feng's post is required for the Asian-African shielding application, the cover can be made of non-conductive materials, and can be made of clothes, so it can save costs more than the conventional system. Figure 4 shows the module shown in Figure 1. A perspective view of a cover 14 200404319 玖, an invention description 40 is attached to the front 16 of the housing 12 and another cover 40 is removed. The cover 40 may be provided with a rivet protrusion 15 to The cover 40 is fastened to the portion 16 of the housing 12. To remove a cover 40 from the front portion 16, the opposite side of the cover can be squeezed to disengage the clasp from the recessed area of the front portion 6 Figure 5 is an exploded view of the module shown in Figure 1. It is known that the large circuit board in Figure $ is pushed backward and away from the front. 6 ίο 15 Figure 6 is according to the present invention An exploded view of a circuit board, a plug connector and a part of a plug of a preferred embodiment. The plug connector 36-1 has a groove 37 extending from the back wall of the plug connection g 36_1. K edge is fitted in the groove. Each plug 30 has three exposed terminals in a rear portion of the plug. Three plugs 39 is partially located in the plug connector 36], where each plug terminal can use a slot π. The outside of the slot is only partially inserted into the plug connector, and the rest is exposed for details as follows: Circuit board 32 Electrical contact is made on the appropriate layer on the circuit board. If the circuit board has a plurality of layers, there are conductive traces and circuits (such as transformers) on the 侧 -side 43. Similarly, the-and-side 43 The opposite second side also has W traces and circuits. The front edge of the circuit board is provided with a plurality of recesses, and the recesses 44 expose a conductive trace 45 located at the center of the board. This conductive trace 45 remains grounded. When inserting zi 3, cup 20, tian tuicai 39, inserting shuo connector 36-1, 2 and circuit board = group skirt, the middle slot is located in the recessed material and the exposed part of the slot = connect to Trace 45. The other two terminals adjacent to the middle terminal are extended through the respective slots, and one terminal will be disposed on one top surface of the circuit board and the other: one terminal will be disposed on the bottom surface of the circuit board. Figure 7 is the top view of the mold phase 6 衩 shown in Figure 1. Fig. 8 is a cross-sectional view of the 8 m-pin 8 pin of Fig. 7 and the description of the invention, and all the components in this job map have been assembled. FIG. 9 is an enlarged view of a part of the cross-sectional view shown in FIG. 8, and the configuration of the plug connector 36 ″, the plug 30 and the circuit board 32 is shown therein. The middle terminal 33 slides in the middle slot, which is electrically coupled to a ground trace located at the center of the circuit board. One of the other two terminals is in contact with the bottom surface of the circuit board in the figure, and the other-the terminal, although not shown, contacts the top surface of the circuit board. 10 15 Brother 10 is another picture according to the present invention. Part of the internal structure of the module 100. In addition, a side view of a module of the preferred embodiment is shown in dotted lines. Module is not shown ’External structure such as mounting flange or connection H is not shown for simplicity. In this preferred embodiment, a housing 112, which is preferably made of a conductive material, contains a circuit board ⑴. In this preferred implementation, the turntable has been rotated 90 degrees for the upper Weijia embodiment. A plurality of sockets 114 having a size capable of accommodating the plug ⑽ are located in the front portion 116 of the housing m. The socket 114 is formed in a housing made of a conductive material, so that the socket forms a waveguide that attenuates the emitted object. Figure ㈣ is a front view of the module 100 shown in Figure 10. Figure 12 is a cross-sectional view of a part of a socket according to one embodiment of the invention. If the front part of the housing is not changed to 20 // to generate a waveguide, the plug connector itself can be provided with its own individual 湓 刎 and V as shown in Figure 12, the plug connector forms a socket to accommodate a large and It has a front part 200 and a rear part 202. The front part 200 is made of conductive bismuth, and it is made of non-conductive material, but the rear part 202 is made of non-conductive material. The plug connection is only reversed, and part 200 is used to form the waveguide. 16 200404319 发明, description of the invention The above descriptions, examples, and materials completely describe the method of making and using the composition of the present invention, because the present invention can have many embodiments without departing from the spirit and scope of the present invention. Defined by scope. [Brief description of the drawings]-5 Figure 1 is a perspective view of an eight-port radio frequency integrated module 10 according to a preferred embodiment of the present invention, in which a top plate has been removed; Figure 2 is not intended to show Fig. 1 is an exemplary circuit diagram of the plug of one of the integrators; Fig. 3 is a perspective view of the eight-port radio frequency module 10 shown in Fig. 丨, of which 10 has the top plate removed; Fig. 4 is shown in Fig. 1SJ A perspective view of the module, where a cover has been attached to the front wall of the housing and another cover has been removed; — Figure 5 is an exploded view of the module shown in Figure 1; It is an exploded view of a part of a circuit board, a plug 15 connector, and a plug according to a preferred embodiment of the present invention; FIG. 7 is a top view of the module shown in FIG. 1; A cross-sectional view of the module shown along line 8 pins; FIG. 9 is an enlarged view of a part of the cross section not shown in FIG. 8; and FIG. 10 is a diagram according to the present invention. An example of a module is a side view of a 20 figure; the magic 1 picture is a front view of the module shown in Fig. 10;-Fig. 12 is a preferred implementation of the present invention A cross-sectional view of a part of the socket of one of the examples. 17 200404319 Description of the invention [List of symbols of the main components of the figure] ίο ·· Eight-port RF integrator module 12,21,112 ... case 14,114 ... socket 15 … Rivets 16, 116… front 18… back 20, 22… side 24, 26… main side 28… removable plate 29, 308, 310 " terminal 30, 130 ... plug 31 ... waveguide 32, 132 ... circuit board 33 ... area around socket 36-1, 36-2 ... plug connector 37 ... slot 3 9 ... slot 40 ... cover 41 ... monitor port 42 -0 ~ 42-8 ··· Connector 43 ... First side 44-1 ... First two-to-one integrator 44-5 ... Fifth two-to-one integrator 44-7 ... Seventh two-to-one integrator 44 ... recess 45 ... conducting trace 46 ... directional coupler 100 ... module 200 ... front 202 ... rear 300 ... dielectric case 302 ... through contact 304 ... conductivity Bypass path 305 ... ground contact 306 ... contact area L, l ... longitudinal axis t ... thickness? ... angle
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