CN107123902B

CN107123902B - Ground contact module for a stack of contact modules

Info

Publication number: CN107123902B
Application number: CN201710105922.2A
Authority: CN
Inventors: T.T.德博尔; M.J.菲利普斯; J.J.康索利; S.帕特尔; B.A.钱皮恩; L.E.希尔兹
Original assignee: TE Connectivity Corp
Current assignee: TE Connectivity Corp
Priority date: 2016-02-25
Filing date: 2017-02-24
Publication date: 2020-10-23
Anticipated expiration: 2037-02-24
Also published as: CN107123902A; US9666998B1

Abstract

A ground contact module (154) includes a grounded dielectric body (172) holding a grounded lead frame (170), the grounded dielectric body having at least two ground contacts (174). The grounded dielectric body has a low-loss layer (180) overmolded on the grounded lead frame, and a lossy band (182) electrically coupled to the at least two ground contacts. The lossy band (182) is separate and apart from the low-loss layer and is attached to the low-loss layer in the vicinity of the at least two ground contacts. The lossy band is fabricated from a lossy material having conductive particles in a dielectric adhesive material, wherein the lossy band absorbs electrical resonances that propagate through the ground contact modules.

Description

Ground contact module for a stack of contact modules

Technical Field

The invention relates to a contact module for an electrical connector.

Background

Some electrical connector systems utilize communication connectors to interconnect various components of the system for data communication. Some known communication connectors have performance problems, particularly when transmitting at high data rates. For example, communication connectors typically utilize differential pairs of signal conductors to carry high speed signals. The ground conductors improve signal integrity. However, when transmitting high data rates, the electrical performance of known communication connectors is suppressed by noise from crosstalk and return loss. Such problems are even more problematic for fine pitch high speed data connectors, which are noisy and exhibit higher than expected return loss due to the close proximity of the signal contacts and ground contacts. Energy from the ground contacts on either side of the signal pair may be reflected in the space between the ground contacts, and such noise results in reduced connector performance and throughput.

There is a need for a high density, high speed electrical connector having reliable performance.

Disclosure of Invention

According to the invention, a ground contact module comprises a ground lead frame having at least two ground contacts, each ground contact extending between a mating end and a terminating end with a transition portion between the mating end and the terminating end. The transition portion is substantially planar and has a first side and a second side opposite the first side. The grounded dielectric body holds a grounded lead frame. The grounded dielectric body has a low-loss layer overmolded over the grounded lead frame and substantially surrounding the transition portions of the at least two ground contacts. The grounded dielectric body has a lossy band electrically coupled to the at least two ground contacts. A lossy band is separate and apart from the low-loss layer and is attached to the low-loss layer near the at least two ground contacts. The lossy band is fabricated from a lossy material having conductive particles in a dielectric adhesive material, wherein the lossy band absorbs electrical resonances that propagate through the ground contact modules.

Drawings

The invention will now be described, by way of example, with reference to the accompanying drawings, in which:

fig. 1 is a schematic diagram of an electrical connector system formed in accordance with an embodiment.

Fig. 2 is a front perspective view of an electrical connector assembly formed in accordance with an exemplary embodiment.

Fig. 3 is a front perspective view of a communication connector of the electrical connector assembly shown in fig. 2 according to an exemplary embodiment.

Fig. 4 is a perspective view of a ground contact module for the telecommunications connector shown in fig. 3, according to an exemplary embodiment.

Fig. 5 is an exploded view of the ground contact module.

Fig. 6 is a perspective view of a portion of the contact module stack of the telecommunications connector shown in fig. 3, illustrating ground contact modules and signal contact modules.

Figure 7 is a perspective view of a portion of a contact module stack according to an exemplary embodiment.

Figure 8 is a perspective view of a portion of a contact module stack according to an exemplary embodiment.

Detailed Description

Fig. 1 is a schematic diagram of an electrical connector system 10 formed in accordance with an embodiment. The electrical connector system 10 includes a first communication connector 12 and a second communication connector 14 configured to mate directly together. The electrical connector system 10 may be provided on or in an electrical component, such as a server, computer, router, or the like.

In an exemplary embodiment, the first and

second communication connectors

12, 14 are configured to be electrically connected to respective first and

second circuit boards

16, 18. The first communication connector 12 and the second communication connector 14 are used to provide a signal transmission path to electrically connect the

circuit boards

16, 18 to each other at a separable mating interface.

The telecommunications connector 12 includes a housing 20 that holds a contact module stack 22, the contact module stack 22 including a plurality of signal contact modules 24 and a plurality of ground contact modules 26 arranged in a stack. The

contact modules

24, 26 may be wafers. In an exemplary embodiment, the signal contact modules 24 and the ground contact modules 26 are arranged in a ground-signal-ground (GSSG) arrangement such that pairs of the signal contact modules 24 have the ground contact modules 26 on the sides. The signal contact modules 24 have contact pairs (e.g., arranged as differential pairs), and the ground contact modules 26 provide shielding for the signal contact modules 24. Optionally, the signal contact modules 24 are high-speed signal contact modules that transmit high-speed data signals. Optionally, at least some of the signal contact modules 24 may be low-speed signal contact modules that transmit low-speed signals (e.g., control signals). The housing 20 includes a plurality of walls that define a cavity 30, the cavity 30 receiving the contact module stack 22. The housing 20 extends between a mating end 32 and a mounting end 34, the mounting end 34 being mounted to the circuit board 16. The cavity 30 is open at the loading end 36 to receive the contact module stack 22.

In the exemplary embodiment, contact module stack 22 includes a lossy material configured to absorb at least some electrical resonances that propagate along current paths defined by the signal contacts and/or ground contacts through communication connector 12. For example, lossy material may be disposed in the ground contact modules 26. The lossy material provides lossy electrical and/or magnetic loss through a portion of the communications connector 12. The lossy material is capable of conducting electrical energy, but at least some loss. Lossy materials are less conductive than conductive materials (e.g., the conductive material of the contacts). Lossy materials can be designed to provide electrical losses in a certain target frequency range. The lossy material can comprise conductive particles (or fillers) dispersed within a dielectric (binder) material. A dielectric material (e.g., a polymer or epoxy) is used as an adhesive to hold the conductive particulate filler elements in place. These conductive particulate filler elements then impart a loss, which converts the dielectric material into a lossy material. In some embodiments, the lossy material is formed by mixing a binder with a filler that includes conductive particles. Examples of conductive particles that may be used as fillers to form the electrically lossy material include carbon or graphite formed into fibers, flakes, or other particles. Metals in the form of powders, flakes, fibers, or other conductive particles may also be used to provide suitable loss properties. Alternatively, a combination of fillers may be used. For example, metal plated (or coated) particles may be used. Silver and nickel may also be used to plate the particles. The plated (or coated) particles may be used alone or in combination with other fillers (e.g., carbon flakes). In some embodiments, the filler may be present in a sufficient volume percentage to allow a conductive pathway to be formed from particle to particle. For example, when metal fibers are used, the fibers may be present in up to 40% or more by volume. The lossy material can be magnetically lossy and/or electrically lossy. For example, the lossy material may be formed from a binder material in which magnetic particles are dispersed to provide magnetic properties. The magnetic particles may be in the form of flakes, fibers, and the like. Materials such as magnesium ferrite, nickel ferrite, lithium ferrite, yttrium garnet and/or aluminum garnet may be used as the magnetic particles. In some embodiments, the lossy material can be both an electrically-lossy material and a magnetically-lossy material. Such lossy material may be formed, for example, by using partially conductive magnetically lossy filler particles, or by using a combination of magnetically lossy filler particles and electrically lossy filler particles.

As used herein, the term "adhesive" includes materials that encapsulate or are impregnated with a filler. The binder material may be any material that will set, cure, or otherwise serve to position the filler material. In some embodiments, the adhesive may be a thermoplastic material, such as those materials conventionally used to make telecommunications connectors. The thermoplastic material may be molded, for example, to mold the ground contact modules 26 into a desired shape and/or position. However, many alternatives of adhesive materials may be used. A curable material (e.g., epoxy) may be used as the adhesive. Alternatively, a material such as a thermosetting resin or an adhesive may be used.

Alternatively, the communication connector 14 may be similar to the communication connector 12. For example, the telecommunications connector 14 may include a contact module stack similar to the contact module stack 22, and may include ground contact modules having lossy material. In other various embodiments, the communication connector 14 may be another type of connector. For example, the communication connector 14 may be a high-speed transceiver having a circuit card configured to mate with the communication connector 12. In such embodiments, the telecommunications connector 14 does not include a stack of contact modules.

Fig. 2 is a front perspective view of an electrical connector assembly 100 formed in accordance with an exemplary embodiment. The electrical connector assembly 100 includes a cage member 102 and a communication connector 104 (shown schematically in fig. 2, and also shown in fig. 3) received in the cage member 102. The pluggable module 106 is loaded into the cage member 102 to mate with the communication connector 104. Cage member 102 and communication connector 104 are intended to be placed on a circuit board 107 (e.g., a motherboard) and electrically connected to circuit board 107. The communication connector 104 is disposed within the cage member 102 for mating engagement with the pluggable module 106. In an exemplary embodiment, the pluggable module 106 includes a circuit card (not shown) configured to be plugged into the communication connector 104.

The cage member 102 is a shielded, stamped and formed cage member that includes a plurality of shielding walls 108, the shielding walls 108 defining a plurality of

ports

110, 112 for receiving the pluggable module 106. In the illustrated embodiment, cage member 102 constitutes a stacked cage

member having ports

110, 112 in a stacked configuration. In alternate embodiments, any number of ports may be configured. In the illustrated embodiment, cage member 102 includes

ports

110, 112 arranged in a single column, however, in alternative embodiments, cage member 102 may include multiple columns of grouped ports 110, 112 (e.g., 2X2, 3X2, 4X2, 4X3, etc.). The communication connector 104 is configured to mate with the pluggable module 106 in two

stacked ports

110, 112. Optionally, a plurality of communication connectors 104 may be disposed within cage member 102, such as when a plurality of ports are provided.

Fig. 3 is a front perspective view of the communication connector 104 according to an exemplary embodiment. The communications connector 104 includes a housing 120 that holds a stack of contact modules 150. The housing 120 is defined by an upstanding body portion 122, the body portion 122 having a top 123, sides 124, a loading end 126, a mounting end 128 configured to be mounted to the circuit board 107 (shown in fig. 2), and a mating end 130. In the illustrated embodiment, the mating end 130 is located at the front, the loading end 126 is located at the rear opposite the mating end 130, and the mounting end 128 is located at the bottom of the housing 120; however, other configurations are possible in alternative embodiments. The body portion 122 may be molded from a dielectric material (e.g., a plastic material) to form the housing 120. The housing 120 has a cavity 131 open at the loading end 126 that is configured to receive the contact module stack 150.

An upper extension 132 and a lower extension 134 extend from the body portion 122 to define a stepped mating surface. A recessed surface 136 is disposed between the

extensions

132, 134. For a single port cage member, the communication connector 104 may contain only a single extension. Mating slots 140 and 142 (e.g., circuit card-receiving slots) extend inwardly from the mating surface of each of the respective upper and

lower extensions

132 and 134 and inwardly to the body portion 122. The

mating slots

140, 142 are configured to receive a mating component (e.g., a plug connector), a card edge of a circuit card of a corresponding pluggable module 106 (shown in fig. 2), or another type of mating component. The plurality of

contacts

164, 174 of the contact module stack 150 are exposed within the

mating slots

140, 142 to mate with contact pads on the card edge of the corresponding pluggable module 106. The

contacts

164, 174 have tail portions extending from the mounting end 128 for termination to the circuit board 107. For example, the tail portions of the

contacts

164, 174 may constitute pins that are received in plated vias of the circuit board 107. Alternatively, the tail portions of the

contacts

164, 174 may be terminated to the circuit board 107 in another manner, such as by surface mounting to the circuit board 107.

The contact module stack 150 includes signal contact modules 152 (shown in figure 6) and ground contact modules 154 that provide electrical shielding for the signal contact modules 152. Optionally, the ground contact modules 154 may be located on opposite sides of the signal contact modules 152 and between pairs of the signal contact modules 152, such as in a ground-signal-ground (GSSG) contact module arrangement. Any number of signal contact modules 152 and ground contact modules 154 may be disposed in the contact module stack 150 and may be positioned in any order. The signal contact modules 152 each include a signal lead frame 160 (shown in fig. 6) and a signal dielectric body 162 (shown in fig. 6). The ground contact modules 154 each include a ground lead frame 170 (shown in fig. 4) and a ground dielectric body 172 (shown in fig. 4).

In an exemplary embodiment, each grounded dielectric body 172 includes a lossy material configured to absorb at least some electrical resonances propagating along the signal lead frame 160 and/or the ground lead frame 170. For example, the lossy material can form a portion of the grounded dielectric body 172. In an exemplary embodiment, the grounded dielectric body 172 includes a loss band attached to other portions of the grounded dielectric body 172. The lossy material provides lossy electrical conductivity and/or magnetic loss through a portion of the ground contact modules 154. The lossy material is capable of conducting electrical energy, but at least some loss. The lossy material is less conductive than the conductive material (e.g., the conductive material of grounded lead frame 170). Lossy materials can be designed to provide electrical losses in a certain target frequency range. The lossy material can comprise conductive particles (or fillers) dispersed within a dielectric (binder) material. A dielectric material (e.g., a polymer or epoxy) is used as an adhesive to hold the conductive particulate filler elements in place. These conductive particulate filler elements then impart a loss, which converts the dielectric material into a lossy material. In some embodiments, the lossy material is formed by mixing a binder with a filler that includes conductive particles. Examples of conductive particles that may be used as fillers to form the electrically lossy material include carbon or graphite formed into fibers, flakes, or other particles. Metals in the form of powders, flakes, fibers, or other conductive particles may also be used to provide suitable loss properties. Alternatively, a combination of fillers may be used. For example, metal plated (or coated) particles may be used. Silver and nickel may also be used to plate the particles. The plated (or coated) particles may be used alone or in combination with other fillers (e.g., carbon flakes). In some embodiments, the filler may be present in a sufficient volume percentage to allow a conductive pathway to be formed from particle to particle. For example, when metal fibers are used, the fibers may be present in up to 40% or more by volume. The lossy material can be magnetically lossy and/or electrically lossy. For example, the lossy material may be formed from a binder material in which magnetic particles are dispersed to provide magnetic properties. The magnetic particles may be in the form of flakes, fibers, and the like. Materials such as magnesium ferrite, nickel ferrite, lithium ferrite, yttrium garnet and/or aluminum garnet may be used as the magnetic particles. In some embodiments, the lossy material can be both an electrically-lossy material and a magnetically-lossy material. Such lossy material may be formed, for example, by using partially conductive magnetically lossy filler particles, or by using a combination of magnetically lossy filler particles and electrically lossy filler particles.

Fig. 4 is a perspective view of the ground contact module 154 according to an exemplary embodiment. Fig. 5 is an exploded view of the ground contact module 154. The ground lead frame 170 includes at least one ground contact 174 extending between a mating end 176 and a terminating end 178, with a transition portion 179 between the mating end 176 and the terminating end 178. In the illustrated embodiment, the mating ends 176 are at the front of the ground contact modules 154 and the terminating ends 178 are at the bottom of the contact modules 154. The transition portion 179 transitions 90 ° between the mating end 176 and the terminating end 178. Other configurations in alternative embodiments are possible. The mating end 176 is configured to mate with the pluggable module 106 (shown in figure 2), such as with a circuit card of the pluggable module 106. The termination ends 178 are configured to be terminated to the circuit board 107 (shown in fig. 2), such as by using compliant pins press fit into plated vias of the circuit board 107 or surface mounted to surface tails of the circuit board 107. In alternative embodiments, the termination end 178 may be otherwise terminated to a circuit board or another component, such as an end of a wire or cable.

The grounded dielectric body 172 encapsulates the grounded lead frame 170, such as the transition portion 179. In the exemplary embodiment, the mating end 176 extends to the front of the grounded dielectric body 172 and the terminating end 178 extends below the grounded dielectric body 172. The grounded dielectric body 172 may be an overmolded dielectric body that is overmolded onto the grounded lead frame 170. Alternatively, the grounded dielectric body 172 may be premolded pieces coupled together around the grounded lead frame 170.

In an exemplary embodiment, the grounded dielectric body 172 comprises a lossy material. For example, the grounded dielectric body 172 includes at least one low-loss layer 180 and at least one lossy tape 182 attached to the low-loss layer 180. The low-loss layer 180 is made of a low-loss material, such as a plastic material. Low loss dielectric materials have dielectric characteristics that vary relatively little with frequency. The low-loss layer(s) 180 are disposed on a first side 184 and a second side 186 of the grounded lead frame 170. Optionally, the ground lead frame 170 may be substantially planar between the first side 184 and the second side 186. For example, the mating and terminating ends 176, 178 and the transition portion 179 may be generally planar between the first and

second sides

184, 186 thereof. The low-loss layer(s) 180 may be overmolded on the ground lead frame 170 and form an overmolded dielectric layer on the ground lead frame 170. The low-loss layer(s) 180 substantially surround the transition portion 179 of the ground contact(s) 174. In the exemplary embodiment, low-loss layer(s) 180 include a plurality of windows 188 that expose ground contact(s) 174 to air and define an exposed surface 190 of ground contact(s) 174. The windows 188 may be formed by pinch-points of the grounded lead frame 170 during overmolding. The window 188 may be sized and shaped to affect the electrical characteristics of the ground contact(s) 174 by exposing these portions to air.

In the illustrated embodiment, the grounded dielectric body 172 contains a plurality of lossy strips 182. Each lossy band 182 is a separate and distinct piece configured to couple to the low-loss layer 180. The lossy band 182 includes at least one strip 192 and at least one protrusion 194 extending inwardly from an inner surface of the corresponding strip 192 (fig. 4). The projection 194 extends toward the ground contact(s) 174. The lossy strips 182 are electrically coupled to corresponding ground contact(s) 174. For example, the lossy strips 182 can be directly electrically coupled to the corresponding ground contact(s) 174. Alternatively, the lossy strips 182 can be indirectly electrically coupled to the corresponding ground contact(s) 174, such as by capacitive coupling. The lossy tape 182 is fabricated from a lossy material, such as a lossy material having conductive particles in a dielectric adhesive material, that absorbs and dissipates electrical resonances propagating through the ground contact modules 154. The lossy material has dielectric properties that vary with frequency.

The lossy strip 182 can be secured to the low-loss layer 180, for example, by friction fit, by lamination or adhesion to the low-loss layer 180, by securing features (e.g., posts and holes) formed in or on the lossy strip 182 and the low-loss layer 180, by using a separate securing feature such as a clip, or by other securing means. Alternatively, the lossy strip 182 may be formed with the low-loss layer 180, for example in a multi-stage overmolding process.

In an exemplary embodiment, the lossy tape 182 is received in a recess 196 formed in one or both sides of the low-loss layer 180. The recess 196 allows the lossy strip 182 to be recessed in the low-loss layer 180, which can reduce the overall thickness of the grounded dielectric body 172. Optionally, the outer surface 198 of the strip 192 of the lossy tape 182 can be coplanar with the outer surface of the low-loss layer 180 at the first side 184 and/or the second side 186. Optionally, the recess 196 may overlap the window 188 and the projection 194 may be aligned with the window 188 and extend into the window 188 toward the ground contact 174. The projections 194 may engage the exposed surfaces 190 of the ground contacts 174. In an exemplary embodiment, each strip 192 may overlap a plurality of ground contacts 174 and have a plurality of projections 194 that are electrically coupled to corresponding ground contacts 174. Optionally, the lossy strips 182 on opposing first and

second sides

184, 186 may be tied together by a low-loss layer 180. For example, at least some of the projections 194 may engage each other, or the strips 192 on opposite sides of the ground contact modules 154, rather than the ground contacts 174.

The electrical performance of the communication connector 104 is enhanced by including lossy material in the ground contact modules 154. For example, at various data rates (including high data rates), the lossy band 182 suppresses return loss. For example, the return loss of fine pitch, high speed data of the contact module stack 150 due to the close proximity of the signal contacts 164 and the ground contacts 174 is reduced by the lossy band 182. For example, energy from the ground contacts 174 on either side of the signal pair and reflected in the space between the ground contacts 174 is absorbed, thus enhancing connector performance and throughput.

Fig. 6 is a perspective view of a portion of the contact module stack 150 showing the ground contact modules 154 at the side of the signal contact modules 152. In the illustrated embodiment, two GSSG contact module arrays are shown in the GSSGSSG arrangement of the ground contact modules 154 and the signal contact modules 152. Any number of the signal contact modules 152 and the ground contact modules 154 may be stacked together.

The signal lead frame 160 includes at least one signal contact 164 extending between a mating end 166 and a terminating end 168, with a transition portion between the mating segment 166 and the terminating end 168. In the illustrated embodiment, the mating ends 166 are at the front of the signal contact modules 152 and the terminating ends 168 are at the bottom of the signal contact modules 152. The transition portion transitions 90 ° between a mating end 166 and a terminating end 168. Other configurations in alternative embodiments are possible. The mating end 166 is configured to mate with the pluggable module 106 (shown in figure 2), such as with a circuit card of the pluggable module 106. The termination ends 168 are configured to be terminated to the circuit board 107 (shown in fig. 2), for example using compliant pins press fit into plated vias of the circuit board 107, or surface mounted to surface tails of the circuit board 107. In alternative embodiments, the termination end 178 may be otherwise terminated to a circuit board or another component, such as an end of a wire or cable.

The signal dielectric body 162 encapsulates the transition portion of the signal lead frame 160. The signal dielectric body 162 may be an overmolded dielectric body that is overmolded onto the signal lead frame 160. Alternatively, the signal dielectric bodies 162 may be premolded together around the ground lead frame 160.

The ground contact modules 154 provide electrical shielding for the signal contact modules 152 when the contact module stack 150 is assembled. The conductive ground contacts 174 provide electrical shielding to shield pairs of the signal contacts 164 from other pairs of the signal contacts 164 (e.g., signal contacts in another portion of the contact module stack 150). The electrical shielding improves the electrical performance of the communication connector 104 (shown in fig. 3). The lossy material of the lossy band 182 further improves the electrical performance of the communication connector 104 by absorbing electrical resonances that propagate through the contact module stack 150. The lossy material reduces the energy reflected along the signal contacts 164 and/or the ground contacts 174, thereby improving performance.

Fig. 7 is a perspective view of a portion of a contact module stack 150 illustrating a ground contact module 154 having a lossy band 182 formed in accordance with an exemplary embodiment. In contrast to the plurality of lossy strips 182 shown in fig. 6, the ground contact modules 154 contain a single lossy strip 182. A lossy strip 182 is electrically coupled to each ground contact 174. In the illustrated embodiment, the strip 192 of lossy tape 182 is electrically coupled to each ground contact 174 at a location approximately centered between the mating end 176 and the terminating end 178; however, other locations are possible in alternative embodiments.

Fig. 8 is a perspective view of a portion of a contact module stack 150 illustrating a ground contact module 154 having a lossy band 182 formed in accordance with an exemplary embodiment. In contrast to the plurality of lossy strips 182 shown in fig. 6, the ground contact modules 154 contain a single lossy strip 182.

The lossy strip 182 includes a plurality of strips, such as a first strip 200 and a second strip 202 extending from the first strip. In the illustrated embodiment, the

strips

200, 202 are oriented perpendicular to each other; however, other orientations are possible in alternative embodiments. The

strips

200, 202 may be located near the front and bottom edges of the ground contact modules 154, respectively.

Both strips 200, 202 are configured to be electrically coupled to the plurality of ground contacts 174. In the illustrated embodiment, both

straps

200, 202 are electrically coupled to each ground contact 174. The

strips

200, 202 are electrically coupled to the same ground contact 174 at different locations along the ground contact 174.

Claims

1. A ground contact module (154) comprising a ground lead frame (170) having at least two ground contacts (174), each ground contact extending between a mating end (176) and a terminating end (178) and having a transition portion (179) between the mating end and the terminating end, the transition portion being generally planar and having a first side (184) and a second side (186) opposite the first side, the ground lead frame (170) being devoid of signal contacts, characterized in that:

the ground dielectric body has a low-loss layer (180) overmolded onto the ground lead frame and substantially surrounding a transition portion of the at least two ground contacts, the ground dielectric body having a lossy band (182) electrically coupled to the at least two ground contacts, the lossy band (182) being separate and apart from the low-loss layer and attached to the low-loss layer in the vicinity of the at least two ground contacts, the lossy band being fabricated from a lossy material having conductive particles in a dielectric adhesive material, wherein the lossy band absorbs electrical resonances propagating through the ground contact module.

2. The ground contact module of claim 1, wherein the lossy band (182) directly engages at least one of the at least two ground contacts (174).

3. The ground contact module of claim 1, wherein the lossy band (182) comprises a strip (192) having an outer surface (198) and a projection (194) extending inwardly from the inner surface of the strip, the projection extending toward one of the at least two ground contacts (174).

4. The ground contact module of claim 1, wherein the lossy band (182) includes an outer surface (198) that is coplanar with an outer surface of the low-loss layer (180).

5. The ground contact module of claim 1, wherein the lossy tape (182) is disposed in a recess (196) in the low-loss layer (180).

6. The ground contact module of claim 1, wherein the low-loss layer (180) includes a window (188) exposing an exposed surface (190) of one of the at least two ground contacts (174), the lossy band extending into the window and engaging the exposed surface.

7. The ground contact module of claim 1, wherein the lossy band (182) is a first lossy band, and the ground dielectric body (172) includes a second lossy band (182) electrically coupled to the at least two ground contacts (174).

8. The ground contact module of claim 7, wherein the first and second lossy strips are disposed on respective opposite sides of the ground lead frame (170).

9. The ground contact module of claim 1, wherein the lossy band (182) includes a first band (200) and a second band (202) extending from the first band, each of the first and second bands being electrically coupled to the at least two ground contacts at different locations along the at least two ground contacts.