CN107123902B - Ground contact module for a stack of contact modules - Google Patents

Abstract

A ground contact module (154) includes a ground dielectric body (172) holding a ground lead frame (170), the ground dielectric body having at least two ground contacts (174). The grounded dielectric body has a low loss layer (180) overmolded on the ground leadframe, and a lossy strip (182) electrically coupled to the at least two ground contacts. The lossy strip (182) is separate and separate from the low loss layer and is attached to the low loss layer in the vicinity of the at least two ground contacts. The lossy ribbon is fabricated from a lossy material having conductive particles in a dielectric binder material, wherein the lossy ribbon absorbs electrical resonances propagating through the ground contact module.

Description

Ground Contact Modules for Contact Module Stacks

technical field

The present invention relates to contact modules for electrical connectors.

Background technique

Some electrical connector systems utilize communication connectors to interconnect various components of the system for data communication. Some known communication connectors have performance issues, especially when transmitting at high data rates. For example, communication connectors typically utilize differential pairs of signal conductors to convey high-speed signals. Ground conductors improve signal integrity. However, when transmitting high data rates, the electrical performance of known communication connectors is suppressed by noise from crosstalk and return loss. Such a problem is more problematic for small pitch high speed data connectors, which are noisy and exhibit higher than expected return loss due to the close proximity of the signal and ground contacts. Energy from the ground contacts on either side of the signal pair may reflect in the spaces between the ground contacts, and such noise results in reduced connector performance and throughput.

There is a need for a high density, high speed electrical connector with reliable performance.

SUMMARY OF THE INVENTION

In accordance with the present invention, a ground contact module includes a ground lead frame having at least two ground contacts, each ground contact extending between a mating end and a terminating end where the mating end and the terminating end There are transitions in between. The transition portion is generally planar and has a first side and a second side opposite the first side. The grounded dielectric body holds the grounded leadframe. The ground dielectric body has a low loss layer overmolded over the ground leadframe and substantially surrounding transition portions of the at least two ground contacts. The grounded dielectric body has a lossy strip electrically coupled to the at least two ground contacts. A lossy strip is separate and separate from the low-loss layer, and is attached to the low-loss layer in the vicinity of the at least two ground contacts. The lossy ribbon is fabricated from a lossy material having conductive particles in a dielectric binder material, wherein the lossy ribbon absorbs electrical resonances propagating through the ground contact module.

Description of drawings

The invention will now be described by way of example with reference to the accompanying drawings, in which:

1 is a schematic diagram of an electrical connector system formed in accordance with an embodiment.

2 is a front perspective view of an electrical connector assembly formed in accordance with an exemplary embodiment.

3 is a front perspective view of a communication connector of the electrical connector assembly shown in FIG. 2, according to an exemplary embodiment.

4 is a perspective view of a ground contact module for the communication connector shown in FIG. 3, according to an exemplary embodiment.

5 is an exploded view of the ground contact module.

6 is a perspective view of a portion of the contact module stack of the communication connector shown in FIG. 3 showing the ground contact module and the signal contact module.

7 is a perspective view of a portion of a contact module stack according to an exemplary embodiment.

8 is a perspective view of a portion of a contact module stack according to an exemplary embodiment.

Detailed ways

FIG. 1 is a schematic diagram of an electrical connector system 10 formed in accordance with an embodiment. The electrical connector system 10 includes a first communication connector 12 and a second communication connector 14 that are configured to mate directly together. The electrical connector system 10 may be disposed on or in electrical components, such as servers, computers, routers, and the like.

In the exemplary embodiment, first communication connector 12 and second communication connector 14 are configured to be electrically connected to respective first circuit board 16 and second circuit board 18 . The first communication connector 12 and the second communication connector 14 are used to provide a signal transmission path to electrically connect the circuit boards 16, 18 to each other at a separable mating interface.

The communication connector 12 includes a housing 20 that holds a contact module stack 22 including a plurality of signal contact modules 24 and a plurality of ground contact modules 26 arranged in a stack. The contact modules 24, 26 may be wafers. In the exemplary embodiment, signal contact modules 24 and ground contact modules 26 are arranged in a ground-signal-signal-ground (GSSG) arrangement such that pairs of signal contact modules 24 have ground contact modules 26 on the sides. The signal contact modules 24 have contact pairs (eg, arranged as differential pairs), and the ground contact modules 26 provide shielding for the signal contact modules 24 . Optionally, the signal contact modules 24 are high-speed signal contact modules that transmit high-speed data signals. Optionally, at least some of the signal contact modules 24 may be low-speed signal contact modules that transmit low-speed signals (eg, control signals). The housing 20 includes a plurality of walls that define a cavity 30 that receives the contact module stack 22 . The housing 20 extends between a mating end 32 and a mounting end 34 that mounts to the circuit board 16 . The cavity 30 is open at the loading end 36 to receive the contact module stack 22 .

In an exemplary embodiment, the contact module stack 22 includes a lossy material configured to absorb at least a Some electrical resonance. For example, lossy material may be provided in the ground contact module 26 . The lossy material provides lossy electrical conductivity and/or magnetic loss through a portion of the communication connector 12 . Lossy materials are capable of conducting electrical energy, but with at least some loss. Lossy materials are less conductive than conductive materials, such as those of the contacts. Lossy materials can be designed to provide electrical losses in a certain target frequency range. The lossy material may contain conductive particles (or fillers) dispersed within a dielectric (binder) material. Dielectric materials such as polymers or epoxy resins are used as binders to hold the conductive particulate filler elements in place. These conductive particulate filler elements then impart loss, which converts the dielectric material into a lossy material. In some embodiments, the lossy material is formed by mixing a binder with a filler comprising conductive particles. Examples of conductive particles that can be used as fillers to form electrically lossy materials include carbon or graphite formed as fibers, flakes, or other particles. Metals in the form of powders, flakes, fibers, or other conductive particles may also be used to provide suitable loss properties. Alternatively, a combination of fillers can be used. For example, metal plated (or coated) particles can be used. Silver and nickel can also be used to coat the particles. Coated (or coated) particles can be used alone or in combination with other fillers such as carbon flakes. In some embodiments, the filler may be present in a sufficient volume percentage to allow conductive pathways to form from particle to particle. For example, when metal fibers are used, the fibers may be present in volume percentages as high as 40% or more. The lossy material can be magnetically lossy and/or electrically lossy. For example, the lossy material may be formed from a binder material in which magnetic particles are dispersed to provide magnetic properties. The magnetic particles may be in the form of flakes, fibers, or the like. Materials such as magnesium ferrite, nickel ferrite, lithium ferrite, yttrium garnet and/or aluminium garnet can be used as magnetic particles. In some embodiments, the lossy material may be both an electro-lossy material and a magnetic-lossy material. Such lossy materials may be formed, for example, by using partially conductive magnetic lossy filler particles, or by using a combination of magnetic lossy filler particles and electrical lossy filler particles.

As used herein, the term "binder" includes materials that encapsulate or impregnate the filler. The binder material can be any material that will set, cure, or otherwise be used to position the filler material. In some embodiments, the adhesive may be a thermoplastic material, such as those traditionally used in the manufacture of communication connectors. The thermoplastic material may be molded, for example, to mold the ground contact modules 26 into the desired shape and/or position. However, many alternative forms of adhesive material can be used. Curable materials such as epoxy resins can be used as adhesives. Alternatively, materials such as thermosetting resins or adhesives may be used.

Alternatively, communication connector 14 may be similar to communication connector 12 . For example, the communication connector 14 may include a contact module stack similar to the contact module stack 22, and may include ground contact modules with lossy material. In other various embodiments, the communication connector 14 may be another type of connector. For example, communication connector 14 may be a high-speed transceiver having a circuit card configured to mate with communication connector 12 . In such an embodiment, the communication connector 14 does not contain a contact module stack.

FIG. 2 is a front perspective view of an electrical connector assembly 100 formed in accordance with an exemplary embodiment. The electrical connector assembly 100 includes a cage member 102 and a communication connector 104 (shown schematically in FIG. 2 and also shown in FIG. 3 ) received in the cage member 102 . Pluggable modules 106 are loaded in cage members 102 to mate with communication connectors 104 . The cage member 102 and the communication connector 104 are intended to be placed on and electrically connected to a circuit board 107 (eg, a motherboard). The communication connector 104 is disposed within the cage member 102 for mating engagement with the pluggable module 106 . In the exemplary embodiment, pluggable module 106 includes a circuit card (not shown) configured to be plugged into communication connector 104 .

The cage member 102 is a shielded, stamped and formed cage member that includes a plurality of shielding walls 108 that define a plurality of ports 110 , 112 for receiving the pluggable modules 106 . In the illustrated embodiment, the cage member 102 constitutes a stacked cage member having ports 110, 112 in a stacked configuration. In alternate embodiments, any number of ports may be configured. In the illustrated embodiment, the cage member 102 includes ports 110, 112 arranged in a single column, however, in alternate embodiments, the cage member 102 may include multiple columns of ports 110, 112 in groups (eg, 2X2, 3X2 , 4X2, 4X3, etc.). The communication connector 104 is configured to mate with the pluggable module 106 in the two stacked ports 110 , 112 . Alternatively, multiple communication connectors 104 may be arranged within cage member 102, such as when multiple ports are provided.

FIG. 3 is a front perspective view of the communication connector 104 according to an exemplary embodiment. The communication connector 104 includes a housing 120 that holds the contact module stack 150 . The housing 120 is defined by an upstanding body portion 122 having a top 123 , sides 124 , a loading end 126 , a mounting end 128 (configured to mount to a circuit board 107 (shown in FIG. 2 )), and a mating end 130 . In the illustrated embodiment, the mating end 130 is at the front, the loading end 126 is at the rear opposite the mating end 130, and the mounting end 128 is at the bottom of the housing 120; however, other configurations are possible in alternative embodiments. The body portion 122 may be molded from a dielectric material (eg, a plastic material) to form the housing 120 . The housing 120 has a cavity 131 open at the loading end 126 that is configured to receive the contact module stack 150 .

Upper extension 132 and lower extension 134 extend from body portion 122 to define stepped mating surfaces. A concave surface 136 is provided between the extensions 132 , 134 . For a single port cage member, the communication connector 104 may contain only a single extension. Mating slots 140 and 142 (eg, circuit card receiving slots) extend inwardly from the mating surfaces of each of the respective upper extension 132 and lower extension 134 and inwardly to the body portion 122 . The mating slots 140 , 142 are configured to receive mating components (eg, plug connectors), card edges of circuit cards of the corresponding pluggable modules 106 (shown in FIG. 2 ), or another type of mating feature. The plurality of contacts 164 , 174 of the contact module stack 150 are exposed within the mating slots 140 , 142 for mating with contact pads on the card edge of the corresponding pluggable module 106 . The contacts 164 , 174 have tails extending from the mounting end 128 for termination to the circuit board 107 . For example, the tails of the contacts 164 , 174 may constitute pins that are received in plated vias of the circuit board 107 . Alternatively, the tails of the contacts 164 , 174 may be terminated to the circuit board 107 in another manner, such as by surface mounting to the circuit board 107 .

Contact module stack 150 includes signal contact modules 152 (shown in FIG. 6 ) and ground contact modules 154 that provide electrical shielding for signal contact modules 152 . Alternatively, the ground contact modules 154 may be located on opposite sides of the signal contact modules 152 and positioned between pairs of the signal contact modules 152, eg, in a ground-signal-signal-ground (GSSG) contact module arrangement. Any number of signal contact modules 152 and ground contact modules 154 may be provided in the contact module stack 150 and may be positioned in any order. The signal contact modules 152 each include a signal leadframe 160 (shown in FIG. 6 ) and a signal dielectric body 162 (shown in FIG. 6 ). The ground contact modules 154 each include a ground lead frame 170 (shown in FIG. 4 ) and a ground dielectric body 172 (shown in FIG. 4 ).

In an exemplary embodiment, each grounded dielectric body 172 includes a lossy material configured to absorb at least some electrical resonances propagating along the signal leadframe 160 and/or the ground leadframe 170 . For example, a lossy material may form part of the grounded dielectric body 172 . In an exemplary embodiment, grounded dielectric body 172 includes lossy strips that are attached to other portions of grounded dielectric body 172 . The lossy material provides lossy electrical conductivity and/or magnetic loss through a portion of the ground contact module 154 . Lossy materials are capable of conducting electrical energy, but with at least some loss. Lossy materials are less conductive than conductive materials, such as the conductive material of ground lead frame 170 . Lossy materials can be designed to provide electrical losses in a certain target frequency range. The lossy material may contain conductive particles (or fillers) dispersed within a dielectric (binder) material. Dielectric materials such as polymers or epoxy resins are used as binders to hold the conductive particulate filler elements in place. These conductive particulate filler elements then impart loss, which converts the dielectric material into a lossy material. In some embodiments, the lossy material is formed by mixing a binder with a filler comprising conductive particles. Examples of conductive particles that can be used as fillers to form electrically lossy materials include carbon or graphite formed as fibers, flakes, or other particles. Metals in the form of powders, flakes, fibers, or other conductive particles may also be used to provide suitable loss properties. Alternatively, a combination of fillers can be used. For example, metal plated (or coated) particles can be used. Silver and nickel can also be used to coat the particles. Coated (or coated) particles can be used alone or in combination with other fillers such as carbon flakes. In some embodiments, the filler may be present in a sufficient volume percentage to allow conductive pathways to form from particle to particle. For example, when metal fibers are used, the fibers may be present in volume percentages as high as 40% or more. The lossy material can be magnetically lossy and/or electrically lossy. For example, the lossy material may be formed from a binder material in which magnetic particles are dispersed to provide magnetic properties. The magnetic particles may be in the form of flakes, fibers, and the like. Materials such as magnesium ferrite, nickel ferrite, lithium ferrite, yttrium garnet and/or aluminium garnet can be used as magnetic particles. In some embodiments, the lossy material may be both an electro-lossy material and a magnetic-lossy material. Such lossy materials may be formed, for example, by using partially conductive magnetic lossy filler particles, or by using a combination of magnetic lossy filler particles and electrical lossy filler particles.

FIG. 4 is a perspective view of the ground contact module 154 according to an exemplary embodiment. FIG. 5 is an exploded view of the ground contact module 154 . The ground leadframe 170 includes at least one ground contact 174 extending between the mating end 176 and the terminating end 178 with a transition portion 179 between the mating end 176 and the terminating end 178 . In the illustrated embodiment, the mating end 176 is at the front of the ground contact module 154 and the terminating end 178 is at the bottom of the contact module 154 . The transition portion 179 transitions 90° between the mating end 176 and the terminating end 178 . Other configurations in alternate embodiments are possible. The mating end 176 is configured to mate with the pluggable module 106 (shown in FIG. 2 ), eg, a circuit card of the pluggable module 106 . The terminations 178 are configured to be terminated to the circuit board 107 (shown in FIG. 2 ), such as by using compliant pins that are press fit into plated vias of the circuit board 107 , or surface mounted to the surface of the circuit board 107 tail. In alternative embodiments, the terminations 178 may be otherwise terminated to a circuit board or another component, such as an end of a wire or cable.

The grounded dielectric body 172 encapsulates the grounded leadframe 170 , such as the transition portion 179 . In an exemplary embodiment, the mating end 176 extends forward of the grounded dielectric body 172 and the terminating end 178 extends below the grounded dielectric body 172 . The grounded dielectric body 172 may be an overmolded dielectric body overmolded on the grounded leadframe 170 . Alternatively, the grounded dielectric body 172 may be a pre-molded piece coupled together around the grounded leadframe 170 .

In an exemplary embodiment, the grounded dielectric body 172 includes a lossy material. For example, the grounded dielectric body 172 includes at least one low loss layer 180 and at least one lossy strip 182 attached to the low loss layer 180 . The low loss layer 180 is fabricated from a low loss material, such as a plastic material. Low loss dielectric materials have dielectric properties that vary relatively little with frequency. The low loss layer(s) 180 are disposed on the first side 184 and the second side 186 of the grounded leadframe 170 . Optionally, the ground leadframe 170 may be substantially planar between the first side 184 and the second side 186 . For example, the mating end 176 and the terminating end 178 and the transition portion 179 may be substantially planar between the first side 184 and the second side 186 thereof. The low loss layer(s) 180 may be overmolded on the ground leadframe 170 and form an overmolded dielectric layer on the ground leadframe 170 . The low loss layer(s) 180 substantially surrounds the transition portion 179 of the ground contact(s) 174 . In the exemplary embodiment, the low loss layer(s) 180 includes a plurality of windows 188 that expose the ground contact(s) 174 to air and define the width of the ground contact(s) 174 Exposed surface 190 . The windows 188 may be formed by pinch-points of the grounded leadframe 170 during overmolding. The windows 188 can be sized and shaped to affect the electrical properties of the ground contact(s) 174 by exposing these portions to air.

In the illustrated embodiment, the grounded dielectric body 172 includes a plurality of lossy strips 182 . Each lossy strip 182 is a separate and separate piece configured to be coupled to the low loss layer 180 . The lossy strip 182 includes at least one strip 192 and at least one protrusion 194 extending inwardly from the inner surface of the corresponding strip 192 (FIG. 4). The protrusions 194 extend toward the ground contact(s) 174 . The lossy strips 182 are electrically coupled to the corresponding ground contact(s) 174 . For example, the lossy strips 182 may be electrically coupled directly to the corresponding ground contact(s) 174 . Alternatively, the lossy strips 182 may be electrically coupled to the corresponding ground contact(s) 174 indirectly, such as through capacitive coupling. The lossy strip 182 is fabricated from a lossy material, such as a lossy material with conductive particles in a dielectric adhesive material, which absorbs and dissipates electrical resonances propagating through the ground contact module 154 . Lossy materials have dielectric properties that vary with frequency.

The lossy tape 182 may be secured to the low loss layer 180, such as by a friction fit, by lamination or adhesion to the low loss layer 180, by securing features formed in or on the lossy tape 182 and the low loss layer 180 (eg, posts and holes), by using separate securing features such as clips, or by other securing means. Alternatively, the lossy strip 182 may be formed with the low loss layer 180, such as in a multi-stage overmolding process.

In the exemplary embodiment, lossy strips 182 are received in recesses 196 formed in one or both sides of low loss layer 180 . The recesses 196 allow the lossy strips 182 to be recessed in the low loss layer 180 , which can reduce the overall thickness of the grounded dielectric body 172 . Optionally, the outer surface 198 of the strips 192 of the lossy tape 182 may be coplanar with the outer surface of the low loss layer 180 on the first side 184 and/or the second side 186 . Alternatively, the recesses 196 may overlap the windows 188 and the protrusions 194 may be aligned with the windows 188 and extend into the windows 188 toward the ground contacts 174 . The protrusions 194 may engage the exposed surfaces 190 of the ground contacts 174 . In an exemplary embodiment, each strip 192 may overlap a plurality of ground contacts 174 and have a plurality of protrusions 194 electrically coupled to the corresponding ground contacts 174 . Optionally, the lossy strips 182 on the opposite first side 184 and second side 186 may be tied together by a low loss layer 180 . For example, at least some of the protrusions 194 may engage each other, or engage the straps 192 on opposite sides of the ground contact module 154 instead of engaging the ground contacts 174 .

The electrical performance of the communication connector 104 is enhanced by including lossy material in the ground contact module 154 . For example, the lossy band 182 suppresses return loss at various data rates, including high data rates. For example, the return loss of the small pitch, high speed data of the contact module stack 150 due to the close proximity of the signal contacts 164 and the ground contacts 174 is reduced by the lossy strips 182 . For example, energy from the ground contacts 174 on either side of a signal pair and reflected in the spaces between the ground contacts 174 is absorbed, thus enhancing connector performance and throughput.

FIG. 6 is a perspective view of a portion of the contact module stack 150 showing the ground contact modules 154 on the side of the signal contact modules 152 . In the illustrated embodiment, two arrays of GSSG contact modules are shown in the GSSGSSG arrangement of ground contact modules 154 and signal contact modules 152 . Any number of signal contact modules 152 and ground contact modules 154 may be stacked together.

The signal leadframe 160 includes at least one signal contact 164 extending between the mating end 166 and the terminating end 168 with a transition portion between the mating section 166 and the terminating end 168 . In the illustrated embodiment, the mating ends 166 are at the front of the signal contact modules 152 and the terminating ends 168 are at the bottom of the signal contact modules 152 . The transition portion transitions 90° between the mating end 166 and the terminating end 168 . Other configurations in alternate embodiments are possible. The mating end 166 is configured to mate with the pluggable module 106 (shown in FIG. 2 ), such as a circuit card of the pluggable module 106 . The terminations 168 are configured to be terminated to the circuit board 107 (shown in FIG. 2 ), such as using compliant pins that are press fit into plated vias of the circuit board 107 , or surface mounted to the surface tails of the circuit board 107 . In alternative embodiments, the terminations 178 may be otherwise terminated to a circuit board or another component, such as an end of a wire or cable.

The signal dielectric body 162 encapsulates the transition portion of the signal leadframe 160 . Signal dielectric body 162 may be an overmolded dielectric body overmolded on signal leadframe 160 . Alternatively, the signal dielectric body 162 may be a pre-molded piece coupled together around the ground leadframe 160 .

The ground contact modules 154 provide electrical shielding for the signal contact modules 152 when the contact module stack 150 is assembled. The conductive ground contacts 174 provide electrical shielding to shield pairs of signal contacts 164 from other pairs of signal contacts 164 (eg, signal contacts in another portion of the contact module stack 150). The electrical shielding improves the electrical performance of the communication connector 104 (shown in FIG. 3 ). The lossy material of the lossy strips 182 further improves the electrical performance of the communication connector 104 by absorbing electrical resonances propagating through the contact module stack 150 . The lossy material reduces the energy reflected along the signal contacts 164 and/or the ground contacts 174, thereby improving performance.

7 is a perspective view of a portion of contact module stack 150 showing ground contact modules 154 with lossy strips 182 formed in accordance with an exemplary embodiment. In contrast to the multiple lossy strips 182 shown in FIG. 6 , the ground contact module 154 contains a single lossy strip 182 . A lossy strip 182 is electrically coupled to each ground contact 174 . In the illustrated embodiment, the strip 192 of the lossy strip 182 is electrically coupled to each ground contact 174 at a location approximately centered between the mating end 176 and the terminating end 178; however, in alternative embodiments Possibly another location.

FIG. 8 is a perspective view of a portion of contact module stack 150 showing ground contact modules 154 with lossy strips 182 formed in accordance with an exemplary embodiment. In contrast to the multiple lossy strips 182 shown in FIG. 6 , the ground contact module 154 contains a single lossy strip 182 .

The lossy strip 182 includes a plurality of strips, such as a first strip 200 and a second strip 202 extending from the first strip. In the illustrated embodiment, the strips 200, 202 are oriented perpendicular to each other; however, other orientations are possible in alternative embodiments. The strips 200, 202 may be located near the front and bottom edges of the ground contact module 154, respectively.

Both strips 200 , 202 are configured to be electrically coupled to the plurality of ground contacts 174 . In the illustrated embodiment, both strips 200 , 202 are electrically coupled to each ground contact 174 . The strips 200 , 202 are electrically coupled to the same ground contact 174 at different locations along the ground contact 174 .

Claims (9)

1. A ground contact module (154) comprising a ground lead frame (170) having at least two ground contacts (174), and a ground dielectric body (172) holding the ground lead frame, each ground contact The head extends between the mating end (176) and the terminating end (178) and has a transition portion (179) between the mating end and the terminating end, the transition portion being generally planar and having A first side (184) and a second side (186) opposite said first side, said ground lead frame (170) having no signal contacts, characterized by: The ground dielectric body has a low loss layer (180) overmolded on the ground leadframe and substantially surrounding the transition portion of the at least two ground contacts, the ground dielectric The body has a lossy strip (182) electrically coupled to the at least two ground contacts, the lossy strip (182) being separate and separate from the low loss layer and adjacent to the at least two ground contacts Attached to the low loss layer, the lossy tape is fabricated from a lossy material having conductive particles in a dielectric adhesive material, wherein the lossy tape absorbs electrical resonances propagating through the ground contact module . 2. The ground contact module of claim 1, wherein the lossy strip (182) directly engages at least one of the at least two ground contacts (174). 3. The ground contact module of claim 1, wherein the lossy strip (182) comprises a strip (192) having an outer surface (198) and a distance from an inner surface of the strip An inwardly extending protrusion (194) extending toward one of the at least two ground contacts (174). 4. The ground contact module of claim 1, wherein the lossy strip (182) includes an outer surface (198) that is coplanar with an outer surface of the low loss layer (180). 5. The ground contact module of claim 1, wherein the lossy strip (182) is disposed in a recess (196) in the low loss layer (180). 6. The ground contact module of claim 1, wherein the low loss layer (180) includes a window (188) exposing an exposed surface of one of the at least two ground contacts (174) (190), the lossy tape extends into the window and engages the exposed surface. 7. The ground contact module of claim 1, wherein the lossy strip (182) is a first lossy strip, and the ground dielectric body (172) includes electrical coupling to the at least two grounds The second lossy strip (182) of the contact (174). 8. The ground contact module of claim 7, wherein the first lossy strip and the second lossy strip are disposed on respective opposite sides of the ground lead frame (170). 9. The ground contact module of claim 1, wherein the lossy strip (182) comprises a first strip (200) and a second strip (202) extending from the first strip, the Each of the first strip and the second strip is electrically coupled to the at least two ground contacts at different locations along the at least two ground contacts.

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