200403537 玖、發明說明： 【發明所屬之技術領域】 本發明係關於一種利用狹縫噴嘴對於基板塗佈處理液的 基板處理裝置的技術。 【先前技術】 在角形基板（液晶用玻璃角形基板、薄膜液晶用軟性基板 、光罩用基板、彩色濾光片用基板等），表面塗佈光阻等處 理液的情況，預先在保持台上的特定位置保持基板，進行 掃描塗佈，-其係一面利用狹縫喷嘴吐出處理液，一面掃描 基板表面。例如特開平11-165111號公報提出一種關於基板 處理裝置的技術：利用馬達使圓頭螺釘旋轉，使與狹縫喷 嘴兩端剛性結合的兩個移動台移動，藉此進行掃描塗佈。 這種技術在成為處理對象的基板為大型的情況或為角形基 板的情況，因旋轉塗佈（一面使基板旋轉，一面塗佈的手法） 的均勻藥液塗佈困難而特別有效。 飞這種基板處理裝置有時會產生如圖15所示的條紋狀露出 飛白的塗佈不良。此大多是狹縫噴嘴備用的期間，噴嘴前 端的處理液乾燥，處理液開始吐出時，不能正常從噴嘴吐 出處理液而產生。這些不良基板不應作為製品出貨，所以 以往在後製程，對於進行塗佈處理後的基板進行由塗佈處 理所形成的處理液層的檢查，進行不良基板的檢測，進行 該不良基板的再處理或廢棄。 【發明所欲解決之問題】 然而，在處理結束後的檢查製程檢測對於基板的塗佈不 84002.doc 200403537 反的情況，產生塗佈不良原因之後到檢測出塗佈不良有時 滯（time-lag)。因此，即使在基板處理裝置產生成為塗佈不 良的原因，也不能迅速因應，有下述問題··其間所處理的 基板因相同原子而成為不良基板。 此外’塗佈不良的基板也搬運到在到檢查製程之間所進 行的後製程處理，所以有下述問題：進行無用的處理。 此外，為了解決上述問題，例如若將用作進行和後製程 的檢查同等檢查的結構設於基板處理裝置，則有下述問題 •裝置結構徒然複雜化。 本發明係鑑於上述問題所完成的，其第一目的係提供一 種可早期檢測出塗佈不良，削減因塗佈不良而產生的浪費 的基板處理裝置。 此外，第二目的係提供一種不使裝置結構複雜化而可簡 易確認處理狀況的基板處理裝置。 【發明内容】 為了解決上述問題，申請專利範圍第1項之發明在具備塗 佈單元：一面在特定方向掃描角形基板，一面在前述基板 表面塗佈處理液；及，搬運機構：從前述塗佈單元搬出利 用萷述塗佈單元塗有前述處理液的基板，沿著特定搬運路 徑搬運到下一製程之基板處理裝置，更具備攝影機構：設 於從前述塗佈單元到前述基板交接給前述下 一製程的位置 的區間的任一處’拍攝塗有前述處理液的前述基板的表面 圖像’及’判定機構：根據前述攝影機構的攝影輸出，判 疋則述基板上的前述處理液的塗佈狀況。 84002.doc ρ此外’中請專利範圍第2項之發明在關於中請專利範園第 项之發明之基板處理裝置’更具備緩衝器，其用作暫時儲 :理中的前述基板，按照前述判定機構的判定結果將 U處理中的基板儲存於前述緩衝器。 2項此外旅申請專利範圍第3項之發明在關於申請專利範園第 述處 之基板處理裝置，具備多數前述緩衝器，按照前 中的基板處理狀況，從前述多數緩衝器巾選 則述處理中的基板的緩衝器。 予200403537 (1) Description of the invention: [Technical field to which the invention belongs] The present invention relates to a technology of a substrate processing apparatus for applying a processing liquid to a substrate using a slit nozzle. [Prior art] When corner substrates (glass corner substrates for liquid crystals, flexible substrates for thin film liquid crystals, substrates for photomasks, substrates for color filters, etc.) are coated on the surface with a treatment solution such as photoresist, they are preliminarily placed on a holding table. The substrate is held at a specific position and scanned for coating, which scans the surface of the substrate while ejecting the processing liquid using a slit nozzle. For example, Japanese Patent Application Laid-Open No. 11-165111 proposes a technique for a substrate processing apparatus: a motor is used to rotate a round head screw, and two moving tables rigidly coupled to both ends of a slit nozzle are moved to perform scan coating. This technique is particularly effective when the substrate to be processed is a large-sized substrate or a corner substrate, and it is difficult to apply a uniform chemical solution by spin coating (while rotating the substrate while applying the coating). Such a substrate processing apparatus may cause a stripe-like coating failure as shown in FIG. 15. This is mostly the period during which the slit nozzle is in standby, and the processing liquid at the tip of the nozzle dries. When the processing liquid starts to be discharged, the processing liquid cannot be normally discharged from the nozzle. These defective substrates should not be shipped as products, so in the past, in the post-process, the substrate after the coating process was inspected by the processing liquid layer formed by the coating process, the defective substrates were detected, and the defective substrates were reprocessed. Dispose of or discard. [Problems to be Solved by the Invention] However, after the end of the inspection, the inspection process detects that the coating of the substrate is not 84002.doc 200403537, and the coating failure sometimes lags after the detection of the coating failure. lag). Therefore, even if the substrate processing apparatus causes a poor coating, it cannot be quickly responded, and there are the following problems: The substrate being processed becomes a defective substrate due to the same atom. In addition, the substrate having a poor coating is also transferred to a post-processing process performed between the inspection process and the inspection process. Therefore, there is a problem that useless processing is performed. In addition, in order to solve the above-mentioned problems, for example, if a structure for performing the same inspection as the post-process inspection is provided in a substrate processing apparatus, there are the following problems. • The apparatus structure is unduly complicated. The present invention has been made in view of the above problems, and a first object thereof is to provide a substrate processing apparatus capable of detecting a coating failure early and reducing waste due to the coating failure. In addition, a second object is to provide a substrate processing apparatus that can easily confirm a processing state without complicating the apparatus structure. [Summary of the Invention] In order to solve the above-mentioned problems, the invention of claim 1 includes a coating unit: a corner substrate is scanned in a specific direction, and a processing liquid is coated on the surface of the substrate; and a transport mechanism: The unit carries out the substrate coated with the processing solution by the above-mentioned coating unit, and transfers it to the substrate processing apparatus of the next process along the specific conveying path. It also has a photographing mechanism: provided from the coating unit to the substrate to be transferred to the substrate. In any one of the sections of the position of a process, 'taking a surface image of the substrate coated with the processing liquid' and 'determination mechanism: based on the photographic output of the imaging mechanism, determining the application of the processing liquid on the substrate Cloth condition. 84002.doc ρ In addition, the invention of item 2 of the patent scope of the invention is a substrate processing device of the invention of the patent domain of the patent claim, and further includes a buffer for temporarily storing the aforementioned substrates in the process. The determination result of the determination means stores the substrate under U processing in the buffer. The second invention of the third scope of the patent application scope of the invention includes a substrate processing apparatus described in the patent application park, which has a large number of the aforementioned buffers. According to the substrate processing conditions described above, the majority of the buffers are selected and described. Buffer in the substrate. Give
此:卜，請專利範圍第4項之發明在關於申請專利範圍第 攝^任-項之發明之基板處理裝置，前述攝影機構的 二園為^基板表面中的—部分，另—方面前述攝影 :範:於和前述特定方向正交的方向’覆蓋前述基板的全This: Bu, please apply the invention in item 4 of the patent scope to the substrate processing device for the invention in any one of the scope of the patent application. The second circle of the aforementioned photography mechanism is-part of the surface of the substrate, and-the aforementioned photography : Fan: in a direction orthogonal to the aforementioned specific direction
I 此:卜中:請專利範圍第5項之發明在關於申請專 =項中任-項之發明之基板處理裝置，前述攝影範圍包 述塗料元的前述處理液的掃描塗佈開妒端 此::：請專利範園第6項之發明在關於申； 壬一項之發明之基板處理裝置，前述攝影範圍包 含則述基板的端邵附近。 此外，申請專利範圍第7項之發明在關於申請 6項之發明之基板處理裝置，前述攝影範園除了前述端= 近之外，還包含前述基板的中央部側。 此外，申請專利範園第8項之發明在關於申 1至7項中卜項之發明之基板處理裝置，前述攝影機= 84002.doc 200403537 則述塗佈單元内配置於前述基板的保持位置上方。 /此外，t請專利範園第9項之發明在具備保持台··保持 元基板，I橋構造：保持格水平方向延伸的狹縫喷嘴 水平架設於前述保持台上方’·及’移動機構：使前述架橋 =造沿著前述基板表面在略水平方向移動，藉由—面沿^ 前述基板表面使前述架橋構造移動，一面從前述狹縫;嘴 ^特定處理液吐出到前述基板表面，在前述表面形成前述. 處理液層之基板處理裝置，更具備攝影機構，其設於前述 保持台上方，拍攝前述基板上的表面圖像，根據前述攝影鲁 機構的攝影輸出判定前述處理液的塗佈狀況。 " 此外，中請專利範圍第1G項之發明在關於中請專利範圍 :9項之發明之基板處理裝置，前述攝影機構的攝影範固為 :述基板表面中的一部分’另一方面前述攝影範圍對於和 前述特定方向正交的方向’覆蓋前述基板的全部範園。 /外’申請專利範圍第㈣之發明在關於申請專利範園 弟9或_之發明之基板處理裝置，前述攝影範圍包含前述 塗佈單元的前述處理液的掃描塗佈開始端。 _ 价此外’申請專利範圍第12項之發明在關於申請專利範圍 第^至11中任一項（發明之基板處理裝置’前述攝影範圍包 含如述基板的端部附近。 此外，中請專利範園印項之發明在關於中請專利範圍 ㈣項之發明之基板處理裝置，前述攝影範圍除了前述端 邵附近之外，還包含前述基板的中央部側。 此外，中請專利範圍第14項之發明在關於中請專利範固 84002.doc 200403537 ^至U項中任-項之發明之基板處理裝置，前述基 面面板顯示器用的基板，前述處理液為光阻、液。 此外’中請專利範圍第15項之發明在具備保持台： 基板；狹縫喷嘴：對於前述基板 造：格水平加特疋處理液；架橋構 、f 2水千α於4保持台上方；及，移動機構··使前 2錢構造在沿著前述基板表面的㈣平方向移動，Μ —面可述移動機構在前料水平方向使前架橋構造移動， I面利用前述狹縫喷嘴掃描前述基板表面，對於前述基板 表面形成前述料處理液則形成層）之絲處縣置，更且 =τ:編述基板保持於前述保持台的狀態檢測 機槿所於層的厚度尺寸及，判定機構··根據由前述檢測 2構所檢財的前述形成料度尺寸狀料 處理好壞。 〜 Μ此外，中請專利範圍第16項之發明在關於申請專利範圍 =項之發明之基板處理裝置，前述檢測機構具有感測機 構·安裝於前述架橋構造中和前述基板表面對向的位置， ㈣和特定方向的存在物之間的距離；及，算出機構：根 據則述感測機構的檢測結果算出前述形成層的厚度尺寸。 批此外、’申請專利範圍第17項之發明在關於申請專利範圍 弟16項《發明之基板處理裝置，前述感測機構在形成前述 =成層的前後’檢測和前述基板表面之間的第一距離與和 」4/成層表面之間的第二距離’前述算出機構計算前述 第-距離和前述第二距離之差，藉此算出前述形成層的厚 度尺寸。 84002.doc -10 - 此外，申請專利範圍第18項之發明在關於申請專利範圍 第16或17項之發明之基板處理裝置，前述感測機構係雷射 式位移計’其在前述特定方向投射雷射光。以受光元件陣 列接收由如述存在物表面所反射的前述雷射光中的正反射 光’藉此檢測和前述存在物之間的距離。 此外，申請專利範圍第19項之發明在關於申請專利範圍 第16至18項中任一項之發明之基板處理裝置，更具備升降 機構：使前述狹縫噴嘴升降；及，控制機構：控制前述升 降機構，前述控制機構根據前述感測機構的檢測結果控制 前述升降機構。 此外，申請專利範圍第20項之發明在關於申請專利範圍 罘15至19項中任一項之發明之基板處理裝置，前述檢測機 構在特定方向投射雷射光，同時在受光元件陣列上接收前 述雷射光中由前述形成層表面所反射的第一正反射光和由 前述基板表面所反射的第二正反射光，根據因前述第一正 反射光而出現在受光元件陣列上的強度分佈的峰值和因前 述第二正反射光而出現在受光元件陣列上的強度分佈的峰 值的在爻光7C件陣列上的距離，檢測前述形成層的厚度尺 寸。 此外，申請專利範圍第21項之發明在關於申請專利範圍 第15至20項中任一項之發明之基板處理裝置，前述基板為 平面面板顯示器用的基板，前述特定處理液為光阻液。 【實施方式】 以下，就本發明的較佳實施形態一面參考附圖，一面詳 84002.doc -11- 200403537 細說明。 < 1 ·第一實施形態〉 圖1為顯示第一實施形態的基板處理裝置1結構的概念平 面圖。基板處理裝置1被給與作為基板處理系統SYS的一部 分’具備控制部6:控制裝置内的各結構；裝載器1〇 :將被 處理基板取入裝置内；洗滌機n ;搬運機器人（r〇b〇t) 12、 13 :沿著特定搬運路徑搬運基板；熱處理單元Hp :進行對 於基板的熱處理；冷卻單元CP :進行基板的冷卻；緩衝器 BF1至BF4 :暫時儲存處理中的基板；塗佈單元14 :在基板 表面塗佈光阻，·乾燥單元15:進行光阻的預備乾燥（例如送 風乾燥、減壓乾燥等）；標題器16:用作加管理號碼等標題 於基板；顯影機19 ;後烘焙裝置2〇 ··進行熱處理；及，卸 載器2 1 ··將處理完的基板搬出到裝置外。 基板處理裝置1和利用選擇性曝光在基板上形成電路圖 案等的曝光裝置（步進照像機）17鄰接。後述光阻塗佈等完 成的基板給與步進照像機17，用此步進照像機17結束曝光 後的基板藉由輸送機18搬運，回到基板處理裝置丨接受顯影 處理。又，控制邵6雖然省略圖示，但連接成可和基板處理 裝置1的各結構收發信號。 基板處理裝置1首先是裝載器1〇取入被處理基板，利用洗 滌機11洗滌基板，藉此除去附著於基板表面的污垢等。其 次，搬運機器人12將基板搬到熱處理單元肝。在熱處理單 元HP加熱基板而使洗滌液蒸發乾燥。接著，將被加熱的基 板搬到冷卻單元CP，冷卻到特定溫度。經由以上，結束用 84002.doc -12 - 作塗佈光阻的塗佈前製程。 前製程結束的基板用搬運機器人12搬到塗佈單元14，塗 佈光阻。 圖2為顯示為本發明實施形態的塗佈單元14結構的立體 圖。圖3為從上方看塗佈單元14的平面圖。此外，圖4及圖5 為塗佈單元14的正面圖及側面圖。 塗佈單το 14具備載物台3，其起作用作為作載置被處理基 板90而保持的保持台，同時也起作用作為附屬各機構的基 台。載物台3為長方體形狀的一體石製，其上面（保持面3〇) 及側面加工成平坦面。 載物口 3上面形成水平面，成為基板9〇的保持面3〇。多數 真二吸附口分佈形成於保持面30，在基板處理裝置1處理基 板90的期間，吸附基板9〇，藉此將基板⑽保持在特定水平 位置。 此保持面30中在隔著基板90載置區域（載置基板90的區 域）的兩端部固設與略水平方向平行延伸的一對移動軌道 移動軌道3 la和固設於架橋構造4兩端部的支持座31b 共同引導架橋構造4的移動（將移動方向規定在特定方向）， 將架橋構造4支持於保持面30的上方。 在載物台3上方設有由此載物台3兩側部分所略水平架設 的木橋構造4。架橋構造4主要包含以碳纖維樹脂為骨科的 喷嘴支持部40和支持其兩端的升降機構43、44。 在喷嘴支持邵40裝有狹縫喷嘴（slit nozzle) 41和間隙感測 益（gap sensor) 42。 84002.doc -13 - 200403537 在水平Y方向延伸的架橋構造41連接吐出機構（未圖示） ’其含有供應藥液（光阻液）到狹縫噴嘴41的配管或光阻用泵 。狹縫噴嘴41由光阻用泵輸送光阻液，藉由掃描基板9〇表 面，吐出光阻液到基板90表面的特定區域（以下稱「光阻塗 佈區域」）。 間隙感測器42在架橋構造4的噴嘴支持部4〇安裝於和基 板90表面對向的位置，檢測和特定方向（一 ζ方向）的存在物 (例如基板90或光阻膜）之間的距離（間隙），將檢測結果傳到 控制部6。— 間隙感測器42如成為狹縫噴嘴41附近般地安裝於喷嘴支 持部40，測量和下方存在物（例如基板9〇表面或光阻膜表面） 之間的高低差（間隙）。具體而言，此間隙感測器42包含光源 :向下方（基板方向）照射雷射光；及，受光元件：從下方接 收反射光，從其反射光檢測和存在於下方的物體的距離。 藉由如此在噴嘴支持部40安裝狹縫喷嘴41和間隙感測器 42 ’可固定這些構件的相對位置關係。因此，基板處理裝 置1根據間隙感測器42的測量結果，可檢測出基板9〇表面和 狹縫喷嘴41的距離。又，本實施形態的基板處理裝置1具備 兩個間隙感測器42 ’但間隙感測器42的數目並不限於此， 也可以更具備許多間隙感測器42。此外，雖然省略圖示， 但塗佈單元14具備洗滌機構，其含有吐出用作洗條狹缝喷 嘴41的溶劑的洗滌噴嘴，洗滌喷嘴按照需要進行狹缝喷嘴 41的洗滌。 升降機構43、44分為狹縫喷嘴41的兩侧，用噴嘴支持部 84002.doc -14- 200403537 40和狹縫噴嘴41連結。升降機構43、44使狹縫噴嘴41平移 地升降，同時也使用用作調整狹縫喷嘴41在γζ平面内的姿 勢。 分為載物台3兩側所配置的一對AC無鐵心線性馬達（以下 只簡稱為「線性馬」）50分別固設於架橋構造4的兩端部。 一對線性馬達50七別具備定子（stator) 50a和動子5〇b，係 藉由足子50a和動子50b的電磁相互作用產生用作使架橋構 造4在X軸方向移動的驅動力的馬達。此外，各線性馬達5〇 的移動量及移動方向可由來自控制部6的控制信號控制。 配置於載物台3左右的一對線性編碼器52具備未圖示的 刻度4及感測器，檢測刻度部和感測器的相對位置關係而 轉移到控制部。刻度部固設於載物台3，感測器固設於各線 性馬達50附近，各線性馬達5〇固設於架橋構造4。因此，控 制4 6根據來自各線性編碼器52的檢測、结果，可檢測出各線 性馬達5G的位置，根據該檢測結果，可位置控制各線性馬 達50 〇 再者，塗佈單元14具備圖像辨識部22，纟包含攝影部2: 和判定部24。 攝影部（二維電荷1 禺合裝置攝影機）23裝在載物台3上方 ’拍攝塗佈處理液後的基板崎面的：維圖像。此外，揭 影邵23將拍攝的圖像資料轉移到判定部24。 判定部24設於載物台3内部，藉由對由攝㈣_移的圖 像資料（攝影輸出）進行圖像辨識處理，判定形成於基板9( 上的光阻塗佈狀況。此外，將料結果轉移到基板處理裝 84002.doc -15- 200403537 置1的控制部6。 塗佈單元14藉由利用搬運機器人12搬運塗佈前製程結束 的基板90，開始光阻塗佈處理。 首先’載物台3吸附基板90保持於保持面3〇上的特定位置 。接著，升降機構43、44使安裝於噴嘴支持部4〇的間隙感 測器4 2移動到比基板9 〇厚度部分高的特定高度（以下稱為 「測量高度」）。此時，控制部6根據設於升降機構43、44 各個的各旋轉編碼器442的檢測結果，藉由給與各個升降機 構43、44控-制信號，控制間隙感測器42的位置。 將間隙感測器42設定於測量高度，線性馬達5〇就使架橋 構U 4在X方向移動，藉此使間隙感測器“移動到光阻塗佈 區域上方。此時，控制部6根據線性編碼器52的檢測結果， 藉由、、、。與各個線性馬達5G控制信號，控制間隙感測器^的 位置。 其次，間隙感測器42P4始和光阻塗佈區域_隙測量。 :開始測量’線性馬達5G就使架橋構造4移動，間隙感測器η 掃描光阻塗体區域’將掃描中的測量結果轉移到控制部6。 間隙感測器4 2的掃描結束，控制部6就根據來自間隙感測 器42的測量結果’算出狹縫喷嘴4#Yz平面的姿勢成為適 當姿勢（狹縫喷嘴41和光阻塗佈區域的間隔為塗佈光阻而 成為適當間隔的姿勢。以下稱為「適當姿勢」）的喷嘴支持 部40位置’根據算出結果給與各個升降機構们、料控制信 號。根據其控制信號’各個升降機構43、44使嘴嘴支持部 40在Z軸方向移動，將狹縫噴嘴㈣整到適當姿勢。再者》， 84002.doc -16 - 200403537 線性馬達50使架橋構造4移動，使狹縫噴嘴41移動到吐出開 始位置。 狹縫喷嘴41移動到吐出開始位置，控制部6就給與線性馬 達50及光阻用泵（未圖示）控制信號。根據其控制信號，線性 馬達50使架橋構造4在一 X方向移動，狹縫喷嘴41掃描基板 90表面，在其狹縫喷嘴41掃描中，運轉光阻用泵，輸送光 阻到狹縫喷嘴41，狹縫喷嘴41吐出光阻到光阻塗佈區域。 藉此，在基板90表面上形成光阻層。 狹縫喷嘴_41移動到吐出結束位置，控制部6就給與線性馬 達5 0及光阻用泵控制信號。根據其控制信號，藉由光阻用 泵停止，來自狹缝噴嘴41的光阻吐出停止，同時線性馬達 5 0使架橋構造4移動到起始位置。 光阻塗佈處理結束’攝影部2 3就拍攝塗有光阻的基板9 〇 表面的圖像，轉移到判定部24。圖6為顯示攝影部23對於基 板90的攝影範圍230之圖。如圖6所示，攝影範圍230設定成 包含基板90的端部區部及光阻塗佈區域23 1的端部區域（開 始光阻塗佈的位置附近）。 這是因為如圖15所示的露出飛白的塗佈不良如前述，係 光阻塗佈開始時主要產生，所以大多在基板端部附近或開 始光阻塗佈的位置附近產生，藉由選擇地拍攝檢查這些區 域，可有效地檢測出這種塗佈不良。 如此，藉由攝影範圍230在狹縫噴嘴41的掃描方向（X轴方 向）為基板90表面的一部分，另一方面在和狹縫噴嘴41的掃 描方向正X的方向（γ軸方向）覆蓋基板9〇表面的全部範圍 84002.doc -17- 200403537 拍攝基板全邵表面的圖像的情況，可削減圖像的資料♦ 量，所以可謀求圖像辨識處理的高速化。此外，可使攝影 部23的解像度提高。 〜 攝影部23的攝影結束，判定部24就對圖像資料進行圖像 辨4處理’判定基板9〇上的光阻液的塗佈狀況，將其判定 結果轉移到控制部6。這種圖像處理和判定處理可藉由下述 進行：例如利用光阻塗佈部分比較暗，塗佈露出飛白部分 等塗佈缺陷部分比較亮，將各像素的受光資料以特定臨界 值亮度二值~化，按照像素數臨界值判定圖像中的明亮部分 的寬廣程度等。 如此，藉由按照設於塗佈單元14的攝影部23的圖像資料 判定基板90上的光阻液的塗佈狀況，比在基板處理裝置1的 一連串處理結束之後另設檢查製程的情況，可早期檢測出 基板9 0的塗佈不良。 判定部24的判定結果，未檢測出基板9〇塗佈不良（檢查結 果正常）時，基板處理裝置1如下進行對於基板90的特定處 理。 首先，載物台3停止基板90的吸附。接著，搬運機器人12 從保持面30拿起基板90，從塗佈單元14搬出，搬到乾燥單 元15。乾燥單元15例如利用減壓乾燥等進行塗佈在基板9〇 上的光阻的預備乾燥。 其次，熱處理單元HP對於基板90進行預烘（prebake)，冷 卻單元CP將預烘後的基板90冷卻到特定溫度。又，所謂預 烘，係熱處理，其係在基板上塗佈光阻後，為蒸發塗佈膜 84002.doc -18- 200403537 中的殘留落劑、強化塗佈膜和基板的密合性而實施。此外’ ’此期間的基板9〇的搬運也由搬運機器人12所進行。 > 在冷卻單元C P預烘後的冷卻結束的基板9 0為搬運機器人 13所搬到標題器（titler) 16，給與管理號碼後，搬到步進照 象機（stepper) 17而進行曝光處理。再者，一面為輸送機18 所搬運，一面施以顯影機19的顯影處理及後烘焙（postbake) -裝置20的後烘焙處理，為卸載器21所搬出到裝置外。 另一方面，利用判定部24檢測出基板90塗佈不良（檢查結 果異常）時，基板處理裝置丨如下進行對於基板9〇的處理。籲 又’以下稱檢測出塗佈不良的基板9〇為「不良基板91」。 首先，對於不良基板91，和正常基板9〇同樣進行到預烘 後的冷卻處理的處理。 預烘後的冷卻處理結束的不良基板91為搬運機器人13所 搬到緩衝器BF1或BF2。 如此，不將不良基板9 1搬到曝光處理等後製程而儲存於 緩衝器分類，藉此對於需要再處理的基板可削減無用的處 理。 · 此外，控制邵6為進行塗佈單元丨4的狹縫喷嘴41的洗滌而 控制塗佈單元14。首先，控制升降機構43、44及線性馬達 50，使狹縫噴嘴41移動到與前述洗滌機構對應的洗滌位置 。其次，洗滌喷嘴一面吐出藥劑，一面掃描狹縫喷嘴41的 噴嘴前端部，進行狹縫噴嘴41的洗滌。 如此，檢測出塗佈不良時，藉由對於成為塗佈不良主要原 因的狹縫喷嘴41自動進行洗滌處理，可使成為產生塗佈不 84002.doc -19- 200403537 良的狀態的基板處理裝置1有效地復原。又，洗滌狹縫噴嘴. 41的手法不限於前述手法，也可以使用其他結構及方法。 > 此外，控制部6到塗佈單元14結束狹縫噴嘴41的洗滌處理 的期間，為搬到緩衝器BF3或BF4而控制搬運機器人12。 狹縫噴嘴41的洗滌處理結束，搬運機器人12將儲存於緩 衝器BF3及BF4的基板90搬到塗佈單元14，塗佈單元14再開 · 始光阻塗佈處理。此外，搬到緩衝器BF丨及BF2的不良基板 91搬到光阻剥離製程，剝離不完全塗佈的光阻後，被再利 用。' ⑩ 如此’藉由對於保持產生塗佈不良狀態的塗佈單元14中 斷基板的搬運，可更加削減成為塗佈不良的基板產生，所 以可削減無用的處理。此外，檢測出塗佈不良時，按照塗 佈處理是否結束，將基板分別儲存於不同的緩衝器，藉此 可辨別所儲存的各基板的處理狀況，所以可對於所儲存的 各基板適當開始處理。 再開始光阻塗佈處理後，基板處理裝置丨和檢查結果正常 的情況同樣進行特定的處理。 以上，基板處理裝置1藉由在塗佈單元14設置圖像辨識部 22來檢查塗佈不良，比在一連辛處理結束的時點另設檢查 製程的情況，可早期檢測出塗佈不良。 ，此外，基板處理裝置1藉由將產生塗佈不良的基板儲存於 、、爰衝益，可防止將不良基板搬到後製程，所以可削減無用 的處理。 卜根據各x測出塗佈不良的時點的基板處理狀態，藉 84002.doc •20- 200403537 由選擇儲存各基板的緩衝器，可對於所儲存的基板適當再， 開始處理。又，再開始處理後又檢測出塗佈不良時，也可 以用警報通知作業員。這種情況，作業員停止來自裝載器 10的基板投入，實施噴嘴的交換作業。此外，也可以設置 噴嘴的自動交換功能。 此外，基板處理裝置i藉由適當設定攝影部23的攝影範圍 ，可削減基板表面的圖像資料的資料量，所以可進行有效 的檢查。 又，在此實施形態，為了攝影部23攝影而需要照明到可 拍攝基板表面的程度，但塗佈液為感光性材料時，此照明 必需疋其感光性材料不感光程度的強度或不感光的波長， 在其範圍進行照明。 <2·第二實施形態> 第一實施形態係將攝影部23的攝影範圍作為包含基板端 部區域及光阻塗佈區域的端部區域的範圍加以設定，但條 紋狀露出飛白的塗佈不良也因「光阻液不夠」或「噴嘴堵 塞」等而產生，因這種原因而產生時，在基板中央部的區 域也認為會產生露出飛白。於是，作為攝影部23的攝影範 圍，也可以設定成更包含基板中央部分的區域。 圖7為顯示按照這種原理構成的第二實施形態的基板處 理裝置1的攝影部23的攝影範圍232之圖。攝影範圍232除了 圖6所示的攝影範圍230之外，也包含基板90中央部分的區 域。 本實施形態的基板處理裝置1的攝影部23拍攝攝影範圍 84002.doc -21 - 200403537 232的圖像資料，轉移到判定部24。判定㈣和第—實施形 態同樣，對於圖像資料進行圖像辨識處理，判定有無塗佈 不良。 藉由以上，第二實施形態的基板處理裝置i可得到和第一 實她形怨同樣的效果，同時亦可檢測出在基板中央部分附 近產生露出飛白的塗佈不版，可進行正確的檢查。又，如本 實施形態的攝影部23,拍攝基板9〇表面中多數部分區域的 6況’也可以對於基板9〇可相對移動攝影部U般地攝影。 <3·第三實施形態> 圖8為顯示本發明第三實施形態之圖。本實施形態係可在 喷嘴支持部4G長度方向，即和喷嘴支持⑽移動方向（掃描 方向）正交的方向（Y軸方向）移動地設有安裝固定於噴嘴支 持部40的間隙感測器42，同時設有使其間隙感測器a移動 的驅動機構（未圖示）。 間隙感測器42測量和下方存在物的間隙，在第一實施形態 係在塗佈動作前測量安裝於噴嘴支持物的狹縫嘴嘴Μ (在圖8未圖示）和基板9〇的光阻塗佈區域的間隙，如將其間 隔成為適當間隔般地控制升降機構43、44 (在圖8未因二 而進行塗佈。在第三實施形態’進行和第一實施形態::) 的上述動作’並且在塗佈中，即嘴嘴支持部4〇在_χ方向移 動且從狹缝喷嘴41吐出塗佈液的期間，從噴嘴支持部切看 位於移動方向後側的間隙感測器42如圖中以箭頭Α所示，— 面在Y方向及_γ方向往復移動，—面進行測量動作。即，喷 嘴支持部40在圖8中_χ方向移動而進行塗体的期間，对 84002.doc -22- 200403537 於和喷嘴支持部40掃描方向正交的方向進行關於基板卯全. 寬的測量。 、藉此，其測量結果，塗有基板9〇表面上的塗佈液之處成 為到其塗佈膜上面的間隔，若有未塗佈之處，則該處成為 到先測量的基板上面的間隔。因此，對照測量結果和測量 時的間隙感測器42的X方向的位置資訊，則可得到顯現基板 90表面上的塗佈膜分佈的圖像（由顯示間隔的數值所作成 的疑似圖像，以下稱為「疑似圖像」），和上述實施形態同 樣，判足部24對該疑似圖像進行圖像辨識處理，辨別有無鲁 未塗佈之處。 這種情況也是，在狹缝噴嘴41的寬度方向，在一部分有 堵塞等而有未塗佈的未塗佈部分B，則如圖8所示，間隙感 ’貝J器42的移動路徑會橫過其未塗佈部分b，判定部μ可確實 檢測出未塗佈部分B的存在。再者，此實施形態將用作檢測 基板90和狹縫噴嘴41的間隙的間隙感測器42兼用於顯現未 塗佈邵分B的表面圖像的攝影（取得疑似圖像），無需設置專籲 用感測器（例如上述實施形態的攝影部23等）。 又’也可如本實施形態的間隙感測器42，另設一面沿著 狹縫噴嘴41移動’ 一面顯現未塗佈部分b的表面圖像攝影專 利的攝影機構。此外，在此實施形態也是，照射間隙感測 器42的雷射光的光源在塗佈液為感光性材料時，此照射的 雷射光必需是其感光性材料不感光程度的強度或不感光的 波長，在其範圍使用光源。 <4·第四實施形態> 84002.doc -23- 200403537 <4·1結構說明〉 上述實施形態的基板處理裝置1構成基板處理系統SYS 的一部分。但是，也可以將上述實施形態的基板處理裝置1 的塗佈單元（塗佈裝置）14看作基板處理裝置而實施本發明。 圖9為顯示基於這種原理所構成的第四實施形態的塗佈 裝置14a概略的立體圖。圖1〇為從上方看塗佈裝置i4a的本 體2的平面圖。此外，圖U及圖12為本體2的正面圖及側面 圖。 塗佈裝置14a大致區分為本體2和控制系統6a，以用作製 造液晶顯示裝置的畫面面板的角形玻璃基板為被處理基板 90，在選擇地蝕刻形成於基板9〇表面的電極層等的製程， 構成作為在基板90表面塗佈光阻液的基板處理裝置。因此 ，在此實施形態，狹缝喷嘴41就會對於基板90吐出光阻液 。又，塗佈裝置14a亦可變形利用作為不僅液晶顯示裝置用 的玻璃基板，而且一般在平面面板顯示器用的各種基板塗 佈處理液（藥液）的裝置。 圖13為顯示用於間隙感測器42的雷射位移計原理之圖。 間隙感測器42具備CCD (—般為受光元件陣列）420及受光 透鏡421，從未圖示的投光部向特定方向發射雷射光（投光） 。由投光部發射的電射光（入射光）在存在物表面SF1反射， 該反射的雷射光中的正反射光通過受光透鏡421，以 CCD420接收。 此處，在間隙感測器42，投光部、基準面SF0及CCD420 的各位置關係為已知，投光邵發射的雷射光的發射方向及 84002.doc -24- 200403537 受光透1¾ 4 21焦點位置也為已知。因此，間隙感測器4 2具有 下述功能：從接收的電射光在CCD420上的強度分佈（顯示 CCD420上的受光位置）基於三角測量法的原理檢測基準面 SF0和存在物表面SF1之間的距離（間隙）D。 如此’藉由在存在物表面反射的雷射光中，間隙感測器 42接收正反射光而進行和該存在物之間的距離檢測，比例 如接收擴散反射光的情況，可使分解度提高，所以可精度 良好地測量和存在物表面之間的距離。 控制系統6a在内部具備運算部6〇 :按照程式處理各種資 料；記憶部61 :保存程式或各種資料，具有和第一至第三 實施形態的控制部6大致同等的功能。此外，在前面具備操 作邵62 :用作操作員對於塗佈裝置輸入必要的指示；及 ’顯示部6 3 :顯示各種資料。 控制系統6a利用未圖示的電纜和附屬於本體2的各機構 連接，根據來自操作部62及各種感測器等的信號控制載物 台3、架橋構造4、升降機構43、44及線性馬達5〇等各結構。 特別是控制系統6a在此實施形態，根據間隙感測器42的 檢測結果控制狹縫噴嘴41對於基板9〇的姿勢及高度，並且 根據間隙感測器42的檢測結果算出形成於基板9〇表面的光 阻膜厚度尺寸，根據算出的厚度尺寸判定對於基板9〇的光 阻塗佈處理好壞。又，判定結果使其顯示於顯示部 就控制系統6a的具體結構而言，記憶部61係暫時記憶資 料的RAM、讀取專用的R〇M及磁碟裝置等適用，也可以是 可移動性磁光型磁碟或記憶卡等記憶媒體及這些記憶媒體 84002.doc -25- 200403537 的讀取裝置等。此外，操作部62為按鈕及開關類（包含鍵盤 或滑鼠等）等，但也可以如觸控式面板顯示器，係兼具顯示 部63的功能者。顯示部63係液晶顯示器或各種燈等適用。 <4.2動作說明〉 其次，就本實施形態的為基板處理裝置的塗佈裝置1仏的 動作加以說明。塗佈裝置14a藉由利用操作員或未圖示的搬 運機構搬運基板90到特定位置，開始光阻塗佈處理。又， 用作開始處理的指示也可以在基板9〇搬運完畢的時點，由 操作員操作操作部62所輸入。 首先，載物台3吸附基板90而保持於保持面30上的特定位 置。接著’根據來自控制系統6a的控制信號，升降機構43 44使裝在喷嘴支持部4〇上的間隙感測器42移動到測量高 度。 間隙感測器42設定於測量高度，線性馬達5〇就使架橋構 U 4在X方向移動，藉此使間隙感測器42移動到光阻塗佈區 域上方。此處，所謂光阻塗佈區域，係在基板9〇表面中要 塗佈光阻液的區域，通常係從基板9〇全部面積去掉沿著端 緣的特走寬度區域的區域。此時，控制系統6a根據線性編 碼器52的檢測結果，藉由給與各線性馬達50控制信號，控 制間隙感測器42的X軸方向的位置。 其次，間隙感測器42開始基板90表面的光阻塗佈區域的 基板90表面和狹縫喷嘴41的間隙測量。一開始測量，線性 馬達50就使架橋構造4再在χ方向移動，間隙感測器42掃描 光阻塗佈區域’將掃描中的測量結果傳到控制系統Q。此 84002.doc -26- 200403537 控制系統“將間隙感測器42的測量結果和由線性編碼 器52所檢測出的水平位置關聯化而保存於記憶部Q。 架橋構造4在X方向通過基板9〇上方，間隙感測器42的掃 描結束，控制系統6a就使架橋構造4在其位置停止，根據來 自間隙感測器42的檢測結果，算出狹縫噴嘴41在¥2平面的 姿勢成為適當姿勢的喷嘴支持部40位置，根據算出結果給 與各個升降機構43、44控制信號。根據其控制信號，各個 升降機構43、44使噴嘴支持部40在Z軸方向移動，將狹縫喷 嘴41調整到適當姿勢。 如此’塗佈裝置14a為實現光阻液的均勻塗怖而需要嚴密 _整狹缝喷嘴41和基板90表面的距離，控制系統6a根據間 隙感測器42的檢測結果，控制升降機構43、44。 再者，線性馬達50使架橋構造4在-X方向移動，使狹縫喷 嘴41移動到吐出開始位置。此處所謂吐出開始位置，係狹 縫喷嘴41大致沿沿著光阻塗佈區域一邊的位置。 狹縫喷嘴41移動到吐出開始位置，控制系統以就給與線 性馬達50及光阻用泵（未圖示）控制信號。根據其控制信號， 線性馬達5 0使架橋構造4在-X方向移動，狹縫喷嘴41掃描基 板90的表面，在其狹缝喷嘴41掃描中，運轉光阻用泵，輸 送光阻液到狹縫喷嘴41，狹縫喷嘴41吐出光阻液到光阻塗 佈區域。藉此，在基板90表面上形成光阻液層。 狹縫喷嘴41移動到吐出結束位置，控制系統6a就給與光 阻用泵、升降機構43、44及線性馬達50控制信號。根據其 控制信號，藉由光阻用泵停止，來自狹縫噴嘴41的光阻液 84002.doc -27- 200403537 的吐出停止，升降機構43、44使間隙感測器42移動到測量. 回度0 , 其’人，線性馬達50使架橋構造4在X方向移動，間隙感測 器42掃描光阻塗佈區域，測量和形成於基板9〇上的光阻膜 ，間隙而傳到控制系統6a。控制系統以計算光阻塗佈前測 量々門隙值（和基板9〇表面之間的距離）和光阻塗佈後測量 勺間隙值（和光阻膜表面之間的距離）之差，藉此算出形成於 基板90上的光阻膜的厚度尺寸。 · 斤再者，按照算出的厚度尺寸，和作為所容許的厚度尺寸 _ 範圍所預先設定的特定值比較，藉此判定對於基板9〇所進 行的塗佈處理的好壞，將判定結果顯示於顯示部63。 藉此，在基板90表面上形成處理液層（光阻膜）後，可迅速 進行好壞判定，所以根據顯示於顯示部63的判定結果，例 浚操作員等可迅速因應處理狀況。此外，該判定可只設間 隙感測器42進行，所以不會使裝置結果徒然成為複雜，可 簡易進行檢查。 又’使用間隙感測器42的檢查主要可進行χ軸方向的異常籲 檢測，所以可檢測出例如未塗佈光阻液（光阻液不夠）、吐出 開始位置或吐出結束位置偏離、在塗佈結束位置產生厚膜 化現象之類的異常。這種異常與其說是各個基板9〇產生， 不如說明對於在相同狀態所處理的全部基板9〇產生的可能 性咼，若是在後製程檢測出異常，則在其間也會產生不良 基板。因此，如塗佈裝置14a，由迅速因應而產生的效果大 。此外，藉由該判定，在對於基板9〇的處理檢測出異常時 ，不僅顯示判疋結果，而且也可以按照其程度停止處理而 B4002.doc -28· 200403537 進行噴嘴洗滌等自動進行恢復處理。 =且膜的檢查結束’載物台3就停止基板90的吸附，操作 貝，搬運機構從保持面3。拿起基板9。，搬到下一處理製程: 口以上，㈣裝置14a在塗佈光阻㈣前後，分別 隙感測器42㈣描，檢測和基㈣表面之間較離與和光 阻艇表面<間的距離’藉由計算這些差，#出形成於基板 9〇表面的光阻膜的厚度尺寸，藉由判定對於基㈣的處理 的好壞’在基板9G表面上形成處理液層後，可迅速進行好 壞判定’所以產生異常狀態時可迅速因應。此外，不需要 光阻膜厚測量專用的感測器，所以不會使裝置結構成為複 雜，可簡易進行檢查。 此外，控制系統6a根據間隙感測器42的檢測結果，藉由 控制使狹縫噴嘴升降的升降機構43、44，可用間隙感測器 42兼作狹縫喷嘴41姿勢及高度的檢測和光阻膜厚的測量， 撕品為檢測狹縫喷嘴的高度位置而另設專用的結構，可簡 化裝置結構。 <5·第五實施形態> 在第四實施形態說明藉由求出光阻塗佈前測量的間隙值 (和基板90表面的距離）和光阻塗佈後測量的間隙值（和光阻 膜表面的距離）之差，檢測光阻膜的厚度尺寸，判定塗佈處 理的好壞，但檢測光阻膜厚度尺寸的手法不限於此，也可 以如直接檢測光阻膜厚度尺寸般地構成。 圖14為說明基於這種原理構成的第五實施形態的間隙感 測器46原理之圖。又，第五實施形態的塗佈裝置14a因間隙 84002.doc -29- 200403537 感測器46以外的結構和第四實施形態大致同樣而省略說明。- 如圖14所示，間隙感測器46和第五實施形態的間隙感測 器42同樣，係具CCD460及受光透鏡461的雷射位移計，同樣 具有間隙感測器42具有的功能。再者，間隙感測器46具有 下述功能：同時在CCD460上接收投射的雷射光（入射光）中 第一反射光（在表面SF2反射的雷射光）和第二反射光（在表 面SF3反射的雷射光），根據因第一反射光而出現在CCD460 上的強度分佈的峰值和因第二反射光而出現在CCD460上 的強度分佈的峰值的在CCD460上的距離δ，檢測表面SF2 和表面SF3之間的距離d。即，間隙感測器46係表面SF2為形 成於基板90表面的光阻膜表面，表面SF3為基板90表面的情 況，可直接檢測光阻膜的厚度尺寸（距離d)。 檢測出的光阻膜厚度尺寸傳到控制系統6a，和第四實施 形態同樣，由控制系統6a進行判定。 藉由以上，在第五實施形態的塗佈裝置14a亦可得到和第 四實施形態同樣的效果。此外，藉由間隙感測器46直接檢 測光阻膜的厚度尺寸，無需控制系統6a算出光阻膜的厚度 尺寸，可削減在塗佈裝置14a的運算量。 <6.變形例> 以上就本發明實施形態加以說明，但本發明不限於上述 實施形態，可各種變形。 例如在上述第一至第三實施形態，設置圖像辨識部22的 地方不限於塗佈單元14。例如也可以在基板處理裝置1内的 基板90搬運路徑上方的特定位置等獨立設置圖像辨識部22 84002.doc -30- 200403537 ，搬運機器人12在圖像辨識部22的下方位置搬運光阻塗佈秦 後的基板90。此外，也可以在搬運機器人12從塗佈單元14 · 取出基板90時暫且停止，在其間進行攝影並檢查。即，若 是從塗佈單元14到X接基板9〇給下一製程（在圖}之例為乾 燥單元15)的位置的區間，則在哪裡設置圖像辨識部22都可 以0 此外，在上述第一至第三實施形態，也可以圖像辨識部 22的攝影部23和判定部24未必要設於相同地方。例如也可 以如將攝影邵23設於塗佈單元14内，將判定部24設於控制鲁 部6内般地構成。 此外在上述第一至第三實施形態，將攝影部23的攝影範 圍限足在產生露出飛白的可能性高的範圍，而不是基板的 表面全體，但也可以攝影部23的攝影範圍為基板表面全體 ，判足部24只對於攝影在圖像資料的範圍中產生露出飛白 的可此性南的範圍選擇地進行圖像辨識處理。 此外，在上述第一至第三實施形態，基板處理裝置丨作為 進行對於基板的一連串處理（不僅塗佈處理，而且顯影處理 等）的裝置加以說明，但不限於此，對於獨立只進行塗佈處 理的基板處理裝置亦可同樣適用。這種情況，在基板處理 裝置1可進行檢查，所以對於在基板處理裝置丨的處理結束 的基板，無需只設檢查製程。 此外，在上述第四及第五實施形態，也可以使用間隙感 測器，其具有例如同時檢測來自兩個面的反射光的功能， 以一次掃描同時求出光阻膜表面和基準面SF0之間的距離 84002.doc -31 - 200403537 及基板表面和基準面SF0之間的距離，藉由算出這些差，檢 測光阻膜的厚度尺寸。 、此外，在上述第四及第五實施形態，對於塗佈處理的判 疋結果顯示於顯示部63，但確認判定結果的方法不限於此 。例如可以用列印機等列印，也可以使用下述方法··操作 ^斤在的纟置離開的情況等，冑狀結果透過網路傳到遙 遠地方或者使警告聲產生等。 【發明之效果】 在申請專利範㈣⑴項所載之發明，藉由根據攝影機 =的攝影輸出判定基板上的處理液塗饰狀況，該攝影機構 設於從塗饰單元到基板交接給下—製程的位置的區間的任 -處，拍攝塗有處理液的基板的表面圖像，相較於一連串 2結束後另錄查製程㈣況，可早期發現料基板的 塗佈不良。 在申請專利範圍第2項所載之笋明，蕤 判定”將虚…Α 據判定機構的 =、.》果將處理中的基板儲存讀衝器，檢測 時，可中斷對於基板的處理，所以可削減無用的處理。 ^申㈣利範圍第3項所載之發明，藉由按照處理中的基 理從多數緩衝器中選擇儲存處理中的基板的緩 可識別所儲存岛各基板的處理狀況。 攝及10項所載之發明’藉由攝影機構的 ==面中的-部分，另-方面攝影範圍對於 率良好的檢杏向，覆蓋基板的全部範固，可進行效 84002.doc -32- 200403537 在申請專利範園第5及11项所載之發明，藉由攝影範圍包 含塗佈單元的處理液的掃描塗佈開始端，可拍攝容易產生 露出飛白的位置’所以可進效率良好的檢查。 在申請專利範圍第6及12項所載之發明，藉由攝影範圍包 含基板的端部附近，可拍攝容易產生露出飛白的位置，所 以可進行效率良好的檢查。 在申請專利範圍第7及13項所載之發明，藉由攝影範圍除 了端邵附近之外，還包含基㈣巾央㈣，即使只在 的中央部側產生露出飛白的情況，亦可檢測出塗佈不I， 所以可使檢測精度提高。 在中請專利範園第8項所載之發明，藉由攝影機構在塗体 早疋内配置於基板的保持位置上方，可早期檢測出塗佈不 良。 在申請專利範園第9至14項所載之發明，藉由根據攝影機 構的攝影輸出判定處理液的塗佈狀況，無“設檢查製程。 、在中請專利範園第15至21項所載之發明，藉由根據由檢 測機構所檢測出的形成層的厚度尺寸判定對於基板的處理 ^壞，在基板表面上形成處理液層後，可迅速進行好壞判 定’所以可迅速因應處理狀況。 在申請專利範圍第16項所載之發明，藉由檢測機構安裝 於架橋構造中和基板表面對向的位置，根據檢測和特定方 向的存在物之間的距離的感測機構的檢測結果算出前述形 成層的厚度尺寸，不會使裝置結構成為複雜，可簡易進^ 84002.doc -33- )0/ 在申凊專利範圍第丨8 、 ^ ^ 貝所载<發明，藉由檢測機構係雷 射式位移計，其藉由投射兩 f田射先到存在物，以受光元件陣 列接收由存在物表面反射兩 .^ ^ 耵的辑射光中的正反射光，檢測和 存在物之間的距離，可并 精度艮好地檢測和存在物之間的距 離。 在申睛專利範圍第19項所載之發明，藉由控制機構根據 感測機構的檢測結果控制升降機構，無需另設用作檢測狹 縫噴嘴和基板表面的輯的結構，可簡化裝置結構。 在申請專利範圍第20項所載之發明，藉由測量機構同時籲 在受光元件陣列上接收由形成層表面反射的第-正反射光 和由基板表面反射的第二正反射光，根據因第一正反射光 而出現於受光元件陣列上的強度分佈的峰值和因第二正反 射光而出現於爻光元件陣列上的強度分佈的學值的在受光 70件陣列上的距離，測量形成層的厚度尺寸，可削減運算 量。 【圖式簡單說明】 圖1為顯示第一實施形態的基板處理裝置結構的概略平 面圖。 圖2為顯示塗佈單元的立體圖。 圖3為塗佈單元的平面圖。 圖4為塗佈單元的正面圖。 圖5為塗佈單元的側面圖。 圖6為顯示第一實施形態的攝影邵的攝影範圍之圖。 圖7為顯示第二實施形態的攝影部的攝影範圍之圖。 84002.doc -34- 200403537 圖8為顯示第三實施形態的基板處理裝置結構的概略立 體圖。 圖9為顯示第四實施形態的基板處理裝置概略立體圖。 圖10為從上方看基板處理裝置本體的平面圖。 圖11為本體的正面圖。 圖12為本體的側面圖。 圖13為說明第四實施形態的間隙感測器原理之圖。 圖14為說明第五實施形態的間隙感測器原理之圖。 圖15為顯~示產生條紋狀露出飛白的塗佈不良的基板之圖。 【圖式代表符號說明】 1 基板處理裝置 10 洗條機 12、13 搬運機器人 14 塗佈單元 14a 塗佈裝置 22 圖像辨識部 23 攝影部 230 、 232 攝影範園 24 判定部 3 載物台 30 保持面 4 架橋構造 40 噴嘴支持部 41 狹縫噴嘴 84002.doc 200403537 42 間隙感測器 420 > 460 CCD 421 受光透鏡 43 > 44 升降機構 46 間隙感測器 50 線性馬達 52 線性編碼器 6 控制部 60 運算部 61 記憶部 6a 控制系統 90 基板 91 不良基板 BF1、BF2 、BF3、BF4 緩衝器 84002.doc -36-I this: Bu Zhong: Please apply for the invention of item 5 of the patent scope on the substrate processing device for the invention of any one of the item-item. The aforementioned photographic scope includes the scanning coating of the coating solution of the coating element. ::: The invention of item 6 of the patent fan park is requested to be related to the substrate processing device of the invention of the invention; the foregoing photographic scope includes the vicinity of the end of the substrate. In addition, the invention claimed in the seventh scope of the invention is a substrate processing apparatus related to the sixth invention, in addition to the above-mentioned end = near, the aforementioned photography model includes the center of the substrate. In addition, the invention of the eighth patent application for the invention relates to the substrate processing device of the inventions in the first to seventh applications. If the aforementioned camera = 84002.doc 200403537, the coating unit is arranged above the holding position of the aforementioned substrate. / In addition, the invention of item 9 of the patent fan garden is provided with a holding table ... a holding element substrate, an I-bridge structure: a slit nozzle extending in the horizontal direction of the holding grid is horizontally installed above the holding table 'and a moving mechanism: Move the aforementioned bridge in a slightly horizontal direction along the surface of the substrate, and move the aforementioned bridge structure along the surface of the substrate by ^, while moving the bridge structure from the slit; the mouth ^ specific treatment solution is discharged to the substrate surface, and The substrate processing device for forming the aforementioned processing liquid layer on the surface further includes a photographing mechanism, which is disposed above the holding table, captures a surface image on the substrate, and determines the coating status of the processing liquid based on the photographic output of the photographing mechanism. . " In addition, the invention of item 1G of the patent claim is about the substrate processing device of the patent claim 9 of the invention. The photography scope of the aforementioned photography mechanism is solid: said part of the surface of the substrate. The range 'covers all the ranges of the aforementioned substrate for a direction orthogonal to the aforementioned specific direction'. The invention of the third range of the application scope of the patent application is for the substrate processing device of the invention of patent application No. 9 or _, and the aforementioned photography scope includes the scanning coating start end of the processing solution of the coating unit. _ In addition, the invention of item No. 12 of the scope of patent application is in any one of the scope of patent application Nos. ^ To 11 (the substrate processing device of the invention.) The aforementioned photographic scope includes the vicinity of the end of the substrate as described above. The invention of the printed item is related to the substrate processing device of the invention claimed in the scope of the patent claim. In addition to the vicinity of the above-mentioned end, the above-mentioned photography range also includes the center portion side of the aforementioned substrate. In addition, the scope of the patent claim No. 14 The invention relates to a patent for a substrate processing apparatus of any one of the patents Fangu 84002.doc 200403537 ^ to U, the substrate for a base panel display, and the processing liquid is a photoresist and a liquid. In addition, a patent is requested The invention of claim 15 includes a holding table: a substrate; a slit nozzle: for the above-mentioned substrate: a grid level processing solution; a bridge structure, f 2 water thousand α above the 4 holding table; and a moving mechanism ·· The first two coin structures are moved in the horizontal direction along the surface of the substrate. The M-plane can be described as a moving mechanism that moves the front bridge structure in the horizontal direction of the former, and the I-plane is scanned using the slit nozzle. The surface of the substrate is formed on the surface of the substrate, and the layer is formed into a layer), and more is equal to τ: the thickness of the layer on which the state detector of the substrate is held on the holding table is determined. Mechanism ... The processing of the material in accordance with the above-mentioned formed material size size inspected by the aforementioned inspection 2 organization is good or bad. ~ Μ In addition, the invention claimed in item 16 of the patent scope is a substrate processing device for the invention claimed in the scope of patent application = item. The detection mechanism has a sensing mechanism. The detection mechanism is installed in the bridge structure and at a position opposite to the surface of the substrate. And the distance between the gallium and the existing object in a specific direction; and, a calculating mechanism: calculating a thickness dimension of the forming layer based on a detection result of the sensing mechanism. In addition, the invention of item 17 of the scope of patent application is related to the scope of patent application of the 16th invention of the substrate processing device of the invention, the aforementioned sensing mechanism detects the first distance between the formation of the aforementioned = layered front and back and the surface of the aforementioned substrate. The "and second" 4 / the second distance between the layered surfaces. The aforementioned calculation means calculates the difference between the first and second distances, thereby calculating the thickness dimension of the formed layer. 84002.doc -10-In addition, the invention of claim 18 is in the substrate processing device of the invention of claim 16 or 17, and the aforementioned sensing mechanism is a laser type displacement gauge which projects in the aforementioned specific direction laser. The light-receiving element array receives regular reflection light of the aforementioned laser light reflected from the surface of the object as described above, thereby detecting the distance from the object. In addition, the invention of claim 19 in the scope of patent application includes the substrate processing device of the invention in any of claims 16 to 18 of the scope of patent application, and further includes a lifting mechanism for raising and lowering the slit nozzle; and a control mechanism for controlling the foregoing. The lifting mechanism, the control mechanism controls the lifting mechanism according to a detection result of the sensing mechanism. In addition, for the invention claimed in the patent application No. 20, the invention relates to the substrate processing device of any one of the patent application Nos. 15 to 19, in which the aforementioned detection mechanism projects laser light in a specific direction and simultaneously receives the aforementioned laser on the light receiving element array. Among the incident light, the first regular reflection light reflected by the surface of the formation layer and the second regular reflection light reflected by the surface of the substrate are based on the peak sum of the intensity distribution of the intensity distribution appearing on the light receiving element array due to the first regular reflection light. The distance of the peak of the intensity distribution appearing on the light-receiving element array due to the aforementioned second specular reflection on the chirped 7C element array is used to detect the thickness dimension of the aforementioned formation layer. In addition, the invention according to claim 21 is a substrate processing apparatus related to the invention according to any one of claims 15 to 20, wherein the substrate is a substrate for a flat panel display, and the specific treatment liquid is a photoresist liquid. [Embodiment] Hereinafter, the preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings, as detailed in 84002.doc -11-200403537. < 1. First Embodiment > Fig. 1 is a conceptual plan view showing the structure of a substrate processing apparatus 1 according to a first embodiment. The substrate processing apparatus 1 is provided as a part of the substrate processing system SYS, and includes a control unit 6: each structure in the control apparatus; a loader 10: taking a substrate to be processed into the apparatus; a washing machine n; a transfer robot (r. b〇t) 12, 13: Transport the substrate along a specific transport path; heat treatment unit Hp: heat treatment of the substrate; cooling unit CP: cooling of the substrate; buffers BF1 to BF4: temporarily storing the substrate in process; coating Unit 14: Applying photoresist on the substrate surface, Drying unit 15: Preliminarily drying the photoresist (for example, air drying, vacuum drying, etc.); Titler 16: Adding a title such as a management number to the substrate; Developing machine 19 The post-baking device 20 performs heat treatment; and the unloader 2 1... Moves the processed substrate out of the device. The substrate processing apparatus 1 is adjacent to an exposure apparatus (step camera) 17 that forms a circuit pattern or the like on a substrate by selective exposure. The substrate, such as photoresist coating, which will be described later, is given to a stepper camera 17, and the substrate after the exposure is finished by this stepper camera 17 is transported by the conveyor 18, and returned to the substrate processing apparatus 丨 for development processing. Although not shown, the control unit 6 is connected so as to be able to transmit and receive signals to and from each component of the substrate processing apparatus 1. The substrate processing apparatus 1 first loads a substrate to be processed by a loader 10 and cleans the substrate with a washer 11 to remove dirt and the like attached to the surface of the substrate. Next, the transfer robot 12 transfers the substrate to the liver of the heat treatment unit. The substrate is heated in the heat treatment unit HP to evaporate and dry the washing solution. Next, the heated substrate is transferred to a cooling unit CP and cooled to a specific temperature. After the above, the pre-coating process using 84002.doc -12 as a photoresist is ended. The substrate transfer robot 12 after the previous process is transferred to the coating unit 14 and coated with a photoresist. Fig. 2 is a perspective view showing the structure of a coating unit 14 according to the embodiment of the present invention. FIG. 3 is a plan view of the coating unit 14 as viewed from above. 4 and 5 are a front view and a side view of the coating unit 14. The coating sheet το 14 is provided with a stage 3, which functions as a holding stage for holding the substrate 90 to be processed, and also functions as a stage for each subsidiary mechanism. The stage 3 is made of a rectangular parallelepiped, and the upper surface (the holding surface 30) and the side surface are processed into a flat surface. A horizontal plane is formed on the upper surface of the load port 3, and becomes a holding surface 30 of the substrate 90. Most of the true two suction openings are distributed on the holding surface 30. While the substrate processing apparatus 1 is processing the substrate 90, the substrate 90 is sucked, thereby holding the substrate ⑽ at a specific horizontal position. In this holding surface 30, a pair of moving rails 3a extending parallel to the horizontal direction and a bridge structure 4 are fixed to both ends of the mounting area (the area on which the substrate 90 is placed) across the substrate 90. The support bases 31 b at the ends guide the movement of the bridge structure 4 (specify the movement direction in a specific direction), and support the bridge structure 4 above the holding surface 30. Above the stage 3 is provided a wooden bridge structure 4 which is slightly erected horizontally from both sides of the stage 3. The bridge structure 4 mainly includes a carbon fiber resin as an orthopedic nozzle support portion 40 and lifting mechanisms 43 and 44 for supporting both ends thereof. A slit nozzle 41 and a gap sensor 42 are installed in the nozzle support unit 40. 84002.doc -13-200403537 The bridge structure 41 extending in the horizontal Y direction is connected to a discharge mechanism (not shown) ′, and it contains a pipe or a pump for supplying a photoresist (photoresist) to the slit nozzle 41. The slit nozzle 41 transports the photoresist liquid by a photoresist pump, and scans the surface of the substrate 90 to discharge the photoresist liquid to a specific area on the surface of the substrate 90 (hereinafter referred to as "photoresist coating area"). The gap sensor 42 is installed at the nozzle support portion 40 of the bridge structure 4 at a position opposite to the surface of the substrate 90, and detects the presence of a specific direction (a ζ direction) (such as the substrate 90 or a photoresist film). The distance (gap) transmits the detection result to the control unit 6. — The gap sensor 42 is mounted on the nozzle support portion 40 as if it is near the slit nozzle 41, and measures the height difference (gap) between the object and the object below (for example, the surface of the substrate 90 or the surface of the photoresist film). Specifically, the gap sensor 42 includes a light source: radiating laser light downward (in the direction of the substrate); and a light receiving element: receiving reflected light from below, detecting the distance from the reflected light and the object existing below. By attaching the slit nozzle 41 and the gap sensor 42 'to the nozzle support portion 40 in this manner, the relative positional relationship of these members can be fixed. Therefore, the substrate processing apparatus 1 can detect the distance between the surface of the substrate 90 and the slit nozzle 41 based on the measurement result of the gap sensor 42. The substrate processing apparatus 1 according to the present embodiment includes two gap sensors 42 ', but the number of the gap sensors 42 is not limited to this, and a plurality of gap sensors 42 may be further provided. Although not shown, the coating unit 14 includes a washing mechanism that includes a washing nozzle that discharges a solvent used as the strip slit nozzle 41, and the washing nozzle performs the washing of the slit nozzle 41 as necessary. The elevating mechanisms 43 and 44 are divided into two sides of the slit nozzle 41, and are connected to the slit nozzle 41 by a nozzle supporting portion 84002.doc -14-200403537 40. The elevating mechanisms 43 and 44 raise and lower the slit nozzle 41 in translation, and also use it to adjust the attitude of the slit nozzle 41 in the? Ζ plane. A pair of AC ironless linear motors (hereinafter simply referred to as "linear horses") 50 arranged on both sides of the stage 3 are fixed to the both ends of the bridge structure 4, respectively. A pair of linear motors 50 are provided with a stator 50a and a mover 50b, and generate a driving force for moving the bridge structure 4 in the X-axis direction by the electromagnetic interaction between the foot 50a and the mover 50b. motor. The moving amount and moving direction of each linear motor 50 can be controlled by a control signal from the control unit 6. A pair of linear encoders 52 arranged on the left and right sides of the stage 3 include a scale 4 and a sensor (not shown), and detects the relative positional relationship between the scale and the sensor and shifts to the control unit. The scale is fixed on the stage 3, the sensor is fixed near each linear motor 50, and each linear motor 50 is fixed on the bridge structure 4. Therefore, the control 46 can detect the position of each linear motor 5G based on the detection and result from each linear encoder 52, and based on the detection result, each linear motor 50 can be position-controlled. Furthermore, the coating unit 14 includes an image. The identification unit 22 includes a photography unit 2: and a determination unit 24. The photographing section (two-dimensional charge 1 coupling device camera) 23 is mounted above the stage 3 ′ to capture a dimensional image of the substrate on the substrate after the treatment liquid is applied. In addition, the revealer 23 transfers the captured image data to the determination unit 24. The determination unit 24 is provided inside the stage 3, and determines the photoresist coating condition formed on the substrate 9 () by performing image recognition processing on the image data (photographic output) shifted by the camera. The material result is transferred to the substrate processing device 84002.doc -15- 200403537 1. The control unit 6 is set to 1. The coating unit 14 starts the photoresist coating process by using the transfer robot 12 to transfer the substrate 90 that has completed the coating process. First, the photoresist coating process is performed. The stage 3 attracts the substrate 90 at a specific position on the holding surface 30. Next, the lifting mechanisms 43, 44 move the gap sensor 42 mounted on the nozzle support portion 40 to a position higher than the thickness of the substrate 90. Specific height (hereinafter referred to as "measurement height"). At this time, the control unit 6 controls each of the lifting mechanisms 43, 44 based on the detection results of the rotary encoders 442 provided in each of the lifting mechanisms 43, 44. Signal to control the position of the gap sensor 42. When the gap sensor 42 is set to the measurement height, the linear motor 50 moves the bridge U 4 in the X direction, thereby moving the gap sensor to the photoresist coating Above the cloth area. At this time, the control unit 6 The detection result of the linear encoder 52 controls the position of the gap sensor by the 5G control signals of the respective linear motors. Second, the gap sensor 42P4 starts and the photoresist coating area_gap measurement is started.: Start The measurement “the linear motor 5G moves the bridge structure 4 and the gap sensor η scans the photoresist coating body area” transfers the measurement result during scanning to the control unit 6. After the scanning of the gap sensor 4 2 is completed, the control unit 6 then Based on the measurement result from the gap sensor 42, the posture of the slit nozzle 4 # Yz plane is calculated to be an appropriate posture (the interval between the slit nozzle 41 and the photoresist application area is a posture where the photoresist is applied at an appropriate interval. Hereinafter The position of the nozzle support 40 in the "appropriate posture") is given to each lifting mechanism and the material control signal based on the calculated result. Based on the control signal, each lifting mechanism 43 and 44 moves the nozzle support 40 in the Z-axis direction, Adjust the slit nozzle to an appropriate position. Furthermore, 84002.doc -16-200403537 The linear motor 50 moves the bridge structure 4 and moves the slit nozzle 41 to the ejection start position. Slit nozzle 41 Moving to the ejection start position, the control unit 6 gives control signals to the linear motor 50 and a photoresist pump (not shown). Based on the control signals, the linear motor 50 moves the bridge structure 4 in the X direction, and the slit nozzle 41 Scan the surface of the substrate 90, and during the scanning of the slit nozzle 41, the photoresist pump is operated to send the photoresist to the slit nozzle 41, and the slit nozzle 41 ejects the photoresist to the photoresist coating area. A photoresist layer is formed on the top. When the slit nozzle _41 is moved to the ejection end position, the control unit 6 gives a linear motor 50 and a photoresist pump control signal. Based on the control signals, the photoresist pump stops and the photoresist The photoresist discharge of the slit nozzle 41 stops, and at the same time, the linear motor 50 moves the bridge structure 4 to the starting position. After the photoresist coating process is completed, the photographing unit 23 takes an image of the surface of the photocoated substrate 90 and transfers the image to the determination unit 24. FIG. 6 is a diagram showing the photographing range 230 of the substrate 90 by the photographing section 23. As shown in FIG. 6, the imaging range 230 is set to include the end region of the substrate 90 and the end region of the photoresist coating region 23 1 (near the position where photoresist coating is started). This is because, as shown in FIG. 15, the coating failure is mainly caused at the beginning of photoresist coating as described above, so it is mostly generated near the end of the substrate or near the position where photoresist coating is started. These areas can be effectively detected by photographing these areas. In this way, the scanning range (X-axis direction) of the slit nozzle 41 is a part of the surface of the substrate 90 by the imaging range 230, and on the other hand, the substrate is covered in the direction (X-axis direction) that is positive X to the scanning direction of the slit nozzle 41. The entire range of 90 surface 84002.doc -17- 200403537 When the image of the entire surface of the substrate is captured, the amount of image data can be reduced, so that the speed of image recognition processing can be increased. In addition, the resolution of the imaging section 23 can be improved. ~ After the photographing by the photographing unit 23 is finished, the judging unit 24 performs image discrimination 4 processing on the image data 'to judge the coating state of the photoresist liquid on the substrate 90, and transfers the judgment result to the control unit 6. This image processing and judgment processing can be performed by, for example, using a photoresist to apply a darker coating portion, and applying a coating to expose a coating-defective portion such as a whitening portion, which is relatively bright. The value is changed to determine the width of the bright part in the image according to the threshold of the number of pixels. In this way, by judging the application state of the photoresist liquid on the substrate 90 based on the image data of the imaging unit 23 provided in the coating unit 14, rather than setting up an inspection process after a series of processing by the substrate processing apparatus 1, Defective coating of the substrate 90 can be detected early. As a result of the determination by the determination unit 24, if the substrate 90 is not coated poorly (the inspection result is normal), the substrate processing apparatus 1 performs specific processing on the substrate 90 as follows. First, the stage 3 stops the adsorption of the substrate 90. Next, the transfer robot 12 picks up the substrate 90 from the holding surface 30, removes it from the coating unit 14, and transfers it to the drying unit 15. The drying unit 15 performs preliminary drying of the photoresist applied on the substrate 90 by, for example, reduced-pressure drying. Next, the heat treatment unit HP prebakes the substrate 90, and the cooling unit CP cools the prebaked substrate 90 to a specific temperature. In addition, the so-called pre-baking is a heat treatment, which is performed after the photoresist is applied to the substrate to evaporate the residual agent in the coating film 84002.doc -18- 200403537 and strengthen the adhesion between the coating film and the substrate. . In addition, the substrate 90 is transported by the transport robot 12 during this period. > After the pre-baking of the cooling unit CP, the cooled substrate 90 is moved to the titler 16 by the transfer robot 13, and given a management number, it is moved to a stepper 17 for exposure deal with. Furthermore, while being conveyed by the conveyor 18, the developing process of the developing machine 19 and the postbake-postbake process of the device 20 are applied while being carried out of the device by the unloader 21. On the other hand, when the application of the substrate 90 is detected by the determination unit 24 (the inspection result is abnormal), the substrate processing apparatus 丨 performs the processing on the substrate 90 as follows. The "substrate 90" in which a poor coating is detected is hereinafter referred to as "defective substrate 91". First, with respect to the defective substrate 91, the same processing as that of the normal substrate 90 is performed until the cooling process after pre-baking is performed. The defective substrate 91 after the pre-baking cooling process is carried by the transfer robot 13 to the buffer BF1 or BF2. In this way, the defective substrate 91 is not sorted and stored in a buffer without being transferred to a post-process such as an exposure process, thereby reducing useless processing for a substrate requiring reprocessing. In addition, the control unit 6 controls the coating unit 14 for washing the slit nozzles 41 of the coating unit 1-4. First, the lifting mechanisms 43 and 44 and the linear motor 50 are controlled to move the slit nozzle 41 to a washing position corresponding to the washing mechanism. Next, while the medicine is discharged from the washing nozzle, the nozzle tip portion of the slit nozzle 41 is scanned to wash the slit nozzle 41. In this way, when a coating failure is detected, the substrate processing apparatus 1 can be made to be in a good state by applying a washing process to the slit nozzle 41 which is the main cause of the coating failure, thereby causing a coating failure 84002.doc -19- 200403537. Effective recovery. The method of washing the slit nozzle 41 is not limited to the aforementioned method, and other structures and methods may be used. > The control unit 6 controls the transfer robot 12 to move to the buffer BF3 or BF4 until the application unit 14 finishes the washing process of the slit nozzle 41. After the washing process of the slit nozzle 41 is completed, the transfer robot 12 transfers the substrate 90 stored in the buffers BF3 and BF4 to the coating unit 14, and the coating unit 14 starts the photoresist coating process. In addition, the defective substrates 91 transferred to the buffers BF 丨 and BF2 are transferred to the photoresist peeling process, and the incompletely coated photoresist is peeled off and then reused. '⑩ ⑩' By discontinuing the transfer of the substrate to the coating unit 14 which keeps the state of poor coating, the occurrence of poor substrates can be further reduced, so unnecessary processing can be reduced. In addition, when a coating failure is detected, the substrates are stored in different buffers according to whether or not the coating process is completed, so that the processing status of each stored substrate can be discriminated, so the processing can be appropriately started for each stored substrate. . After the photoresist coating process is restarted, the substrate processing apparatus 丨 performs a specific process similarly to the case where the inspection result is normal. As described above, the substrate processing apparatus 1 can detect the coating failure by providing the image recognition unit 22 in the coating unit 14, and can detect the coating failure earlier than when a separate inspection process is provided at the end of the continuous process. In addition, the substrate processing apparatus 1 can prevent the defective substrates from being transferred to the post-processing by storing the substrates that cause coating failures in Kyodo, Kojima, and Koji, so that useless processing can be reduced. According to the substrate processing status at the time when the coating failure is detected by each x, the buffer for storing each substrate can be selected by using 84002.doc • 20-200403537, and the stored substrate can be appropriately restarted and processing can be started. If a coating failure is detected after the process is restarted, the operator may be notified by an alarm. In this case, the operator stops the substrate input from the loader 10 and performs the nozzle replacement operation. In addition, the automatic nozzle exchange function can be set. In addition, by appropriately setting the imaging range of the imaging section 23 in the substrate processing apparatus i, the data amount of the image data on the substrate surface can be reduced, so that effective inspection can be performed. Moreover, in this embodiment, it is necessary to illuminate the surface of the substrate in order to shoot by the imaging unit 23, but when the coating liquid is a photosensitive material, the illumination must be based on the intensity of the photosensitive material or the degree of insensitivity of the photosensitive material. The wavelength is illuminated within its range. < 2. Second Embodiment > In the first embodiment, the imaging range of the imaging section 23 is set as a range including the end region of the substrate and the photoresist coating region. The poor cloth is also caused by "Insufficient Photoresist Liquid" or "Clogged Nozzle", etc. When this happens, the area in the central part of the substrate is also considered to be exposed and white. Therefore, the imaging range of the imaging section 23 may be set to include an area further including the central portion of the substrate. Fig. 7 is a diagram showing an imaging range 232 of the imaging section 23 of the substrate processing apparatus 1 according to the second embodiment configured in accordance with this principle. The imaging range 232 includes an area in the center of the substrate 90 in addition to the imaging range 230 shown in FIG. 6. The imaging unit 23 of the substrate processing apparatus 1 of the present embodiment captures image data in the imaging range 84002.doc -21-200403537 232, and transfers it to the determination unit 24. Judgment ㈣ is the same as the first embodiment. Image recognition processing is performed on the image data to determine whether there is a defective coating. Based on the above, the substrate processing apparatus i of the second embodiment can obtain the same effect as that of the first embodiment, and at the same time, it can detect that the coating is not printed near the center of the substrate, and the correct inspection can be performed. . In addition, as in the imaging section 23 of this embodiment, the imaging of most parts of the area on the surface of the substrate 90 can be performed in the manner that the imaging section U can relatively move to the substrate 90. < 3. Third Embodiment > Fig. 8 is a diagram showing a third embodiment of the present invention. In this embodiment, a gap sensor 42 fixed to the nozzle support portion 40 is provided in the 4G length direction of the nozzle support portion, that is, a direction (Y-axis direction) orthogonal to the nozzle support ⑽ moving direction (scanning direction). At the same time, a driving mechanism (not shown) for moving the gap sensor a is provided. The gap sensor 42 measures the gap with the object below. In the first embodiment, the slit nozzle M (not shown in FIG. 8) mounted on the nozzle support and the light of the substrate 90 are measured before the coating operation. The gaps in the coating-resistant region are controlled to raise and lower the mechanisms 43 and 44 as if the gaps are set at appropriate intervals (the coating is not performed in FIG. 8 because of the second. The third embodiment is performed and the first embodiment is: :) In the above operation, during the coating, that is, while the nozzle support portion 40 is moving in the _χ direction and the coating liquid is discharged from the slit nozzle 41, the gap sensor located on the rear side of the moving direction is viewed from the nozzle support portion. 42 As shown by the arrow A in the figure, the surface moves back and forth in the Y direction and the _γ direction, and the surface performs a measurement operation. That is, while the nozzle support portion 40 moves in the _χ direction to perform coating in FIG. 8, 84002.doc -22- 200403537 is performed on the substrate in a direction orthogonal to the scanning direction of the nozzle support portion 40. Width measurement . As a result, according to the measurement result, the place where the coating liquid on the surface of the substrate 90 is coated becomes the interval to the upper surface of the coating film. If there is an uncoated portion, the place becomes the upper surface of the substrate measured first. interval. Therefore, by comparing the measurement results with the position information in the X direction of the gap sensor 42 during the measurement, an image showing the distribution of the coating film on the surface of the substrate 90 (a suspected image made by the value of the display interval) can be obtained. Hereinafter, it is referred to as a "suspect image". As in the above-mentioned embodiment, the foot determination unit 24 performs image recognition processing on the suspect image, and discriminates whether there is any uncoated area. In this case, too, in the width direction of the slit nozzle 41, there is an uncoated uncoated portion B in a part of the blockage, etc., as shown in FIG. Through the uncoated portion b, the determination unit μ can reliably detect the presence of the uncoated portion B. Furthermore, in this embodiment, the gap sensor 42 used as the gap between the substrate 90 and the slit nozzle 41 is also used for photographing (obtaining a suspect image) a surface image showing the uncoated Shao B, without the need to set a special A sensor (for example, the imaging unit 23 in the above embodiment) is called for. It is also possible to provide a photographing mechanism that is a surface image photographing patent that displays the uncoated portion b while moving along the slit nozzle 41 like the gap sensor 42 of this embodiment. In addition, in this embodiment as well, when the coating light source of the laser light that irradiates the gap sensor 42 is a photosensitive material, the laser light that is irradiated must have an intensity or wavelength that is insensitive to the photosensitive material. Use a light source within its scope. < 4. Fourth Embodiment > 84002.doc -23- 200403537 < 4.1 Structure Description > The substrate processing apparatus 1 of the above embodiment constitutes a part of the substrate processing system SYS. However, the coating unit (coating device) 14 of the substrate processing apparatus 1 of the above embodiment may be regarded as a substrate processing apparatus to implement the present invention. Fig. 9 is a schematic perspective view showing a coating apparatus 14a according to a fourth embodiment constructed based on this principle. Fig. 10 is a plan view of the main body 2 of the coating device i4a as viewed from above. Figs. U and 12 are a front view and a side view of the main body 2. Figs. The coating device 14a is roughly divided into a main body 2 and a control system 6a. The process is to use a corner glass substrate used as a screen panel for manufacturing a liquid crystal display device as the substrate 90 to be processed, and selectively etch an electrode layer formed on the surface of the substrate 90. It constitutes a substrate processing apparatus that applies a photoresist liquid on the surface of the substrate 90. Therefore, in this embodiment, the slit nozzle 41 ejects a photoresist liquid to the substrate 90. In addition, the coating device 14a may be modified and used as a device for applying a processing liquid (chemical solution) to various substrates for flat panel displays, in addition to glass substrates for liquid crystal display devices. FIG. 13 is a diagram showing the principle of a laser displacement meter used for the gap sensor 42. The gap sensor 42 includes a CCD (generally a light receiving element array) 420 and a light receiving lens 421, and emits laser light (light projection) from a light projection unit (not shown) in a specific direction. Electro-radiated light (incident light) emitted by the light projection unit is reflected on the surface SF1 of the object, and the regular reflected light of the reflected laser light passes through the light-receiving lens 421 and is received by the CCD 420. Here, in the gap sensor 42, the positional relationship between the light-emitting part, the reference plane SF0, and the CCD420 is known. The emission direction of the laser light emitted by the light-emitting Shao and 84002.doc -24- 200403537 light-receiving 1¾ 4 21 The focus position is also known. Therefore, the gap sensor 42 has the function of detecting the difference between the reference plane SF0 and the surface of the existing object SF1 based on the principle of triangulation from the intensity distribution of the received electric radiation on the CCD420 (showing the light receiving position on the CCD420). Distance (clearance) D. In this way, by detecting the distance between the gap sensor 42 and the existing laser light reflected from the surface of the existing object, the gap sensor 42 can improve the resolution compared to the case of receiving diffused reflected light. Therefore, the distance from the surface of an object can be measured with high accuracy. The control system 6a includes an internal computing unit 60 that processes various data in accordance with a program, and a memory unit 61 that stores programs or various data and has functions substantially equivalent to those of the control unit 6 in the first to third embodiments. In addition, the front side is provided with an operation Shao 62: used for the operator to input necessary instructions for the coating device; and a 'display section 63': displaying various materials. The control system 6a is connected to various mechanisms attached to the main body 2 by a cable (not shown), and controls the stage 3, bridge structure 4, lifting mechanisms 43, 44 and linear motors based on signals from the operation unit 62 and various sensors. 50 and other structures. In particular, in this embodiment, the control system 6a controls the attitude and height of the slit nozzle 41 with respect to the substrate 90 based on the detection result of the gap sensor 42, and calculates the surface formed on the substrate 90 based on the detection result of the gap sensor 42. The thickness of the photoresist film is determined based on the calculated thickness dimension. In addition, the determination result is displayed on the display unit. As for the specific structure of the control system 6a, the storage unit 61 is a RAM for temporarily storing data, a ROM for reading only, a magnetic disk device, and the like, and it may be removable. Storage media such as magneto-optical disks or memory cards, and reading devices for these storage media 84002.doc -25- 200403537. In addition, the operation unit 62 is a button or a switch (including a keyboard or a mouse), but may be a function of the display unit 63 such as a touch panel display. The display portion 63 is a liquid crystal display or various lamps. < 4.2 Operation description > Next, the operation of the coating apparatus 1 'which is a substrate processing apparatus according to this embodiment will be described. The coating apparatus 14a starts the photoresist coating process by transferring the substrate 90 to a specific position by an operator or a transport mechanism (not shown). The instruction for starting the processing may be input by the operator operating the operation unit 62 at the time when the substrate 90 is transferred. First, the stage 3 sucks the substrate 90 and holds it at a specific position on the holding surface 30. Next, based on a control signal from the control system 6a, the lifting mechanism 43 44 moves the gap sensor 42 mounted on the nozzle support portion 40 to a measurement height. The gap sensor 42 is set at the measurement height, and the linear motor 50 moves the bridge U 4 in the X direction, thereby moving the gap sensor 42 above the photoresist coating area. Here, the photoresist coating region refers to a region where a photoresist liquid is to be coated on the surface of the substrate 90, and is generally a region in which a special width region along the edge is removed from the entire area of the substrate 90. At this time, the control system 6a controls the position in the X-axis direction of the gap sensor 42 by giving a control signal to each linear motor 50 based on the detection result of the linear encoder 52. Next, the gap sensor 42 starts the gap measurement of the surface of the substrate 90 and the slit nozzle 41 in the photoresist-coated area of the surface of the substrate 90. Upon the start of measurement, the linear motor 50 moves the bridge structure 4 in the χ direction, and the gap sensor 42 scans the photoresist coating area 'to transmit the measurement result during the scan to the control system Q. This 84002.doc -26- 200403537 control system "correlates the measurement result of the gap sensor 42 and the horizontal position detected by the linear encoder 52 and stores it in the memory section Q. The bridge structure 4 passes through the substrate 9 in the X direction. 〇 Above, the scanning of the gap sensor 42 is completed, the control system 6a stops the bridge structure 4 at its position, and based on the detection result from the gap sensor 42, the posture of the slit nozzle 41 on the ¥ 2 plane is calculated to be the appropriate posture. The position of the nozzle support portion 40 is given a control signal to each of the lifting mechanisms 43 and 44 based on the calculated result. Based on the control signal, each lifting mechanism 43 and 44 moves the nozzle support 40 in the Z-axis direction and adjusts the slit nozzle 41 to In this way, the coating device 14a needs to be tight to achieve uniform coating of the photoresist. The distance between the slit nozzle 41 and the surface of the substrate 90 is adjusted. The control system 6a controls the lifting mechanism based on the detection result of the gap sensor 42. 43, 44. Furthermore, the linear motor 50 moves the bridge structure 4 in the -X direction, and moves the slit nozzle 41 to the ejection start position. Here, the so-called ejection start position refers to the slit ejection. 41 is roughly along the position along one side of the photoresist coating area. The slit nozzle 41 moves to the ejection start position, and the control system gives control signals to the linear motor 50 and the photoresist pump (not shown). According to the control signals The linear motor 50 moves the bridge structure 4 in the -X direction. The slit nozzle 41 scans the surface of the substrate 90. During the scanning of the slit nozzle 41, the photoresist pump is operated to send the photoresist liquid to the slit nozzle 41. The slit nozzle 41 discharges the photoresist liquid to the photoresist coating area. As a result, a photoresist layer is formed on the surface of the substrate 90. The slit nozzle 41 moves to the ejection end position, and the control system 6a gives a photoresist pump, Lifting mechanisms 43, 44 and linear motor 50 control signals. Based on the control signals, the photoresist pump stops with the photoresist liquid from slit nozzle 41 84002.doc -27- 200403537, and the lift mechanisms 43, 44 stop. The gap sensor 42 is moved to the measurement. The degree of return is 0. The linear motor 50 moves the bridge structure 4 in the X direction. The gap sensor 42 scans the photoresist coating area and measures and forms it on the substrate 90. Photoresist film to the control system 6a. The control system calculates the difference between the gate gap value (the distance from the surface of the substrate 90) before the photoresist coating and the gap value (the distance from the photoresist film surface) after the photoresist coating. This calculates the thickness of the photoresist film formed on the substrate 90. Furthermore, according to the calculated thickness, a specific value set in advance as an allowable thickness dimension_range is compared to determine the thickness of the substrate 9. The quality of the coating process performed is displayed on the display portion 63. With this, after the processing liquid layer (photoresist film) is formed on the surface of the substrate 90, the quality can be quickly determined, so it is displayed on the display according to the display. As a result of the determination by the unit 63, the operator can quickly respond to the processing situation. In addition, since the determination can be performed by only the gap sensor 42, the device result is not unnecessarily complicated, and the inspection can be easily performed. Also, the inspection using the gap sensor 42 mainly detects abnormal calls in the x-axis direction, so it can detect, for example, that the photoresist liquid is not applied (the photoresist liquid is not enough), the ejection start position or the ejection end position is deviated, and An abnormality such as a thickening phenomenon occurs at the end of the cloth. This kind of abnormality is not so much caused by each substrate 90, but it is better to explain the possibility of the occurrence of all substrates 90 processed in the same state. If an abnormality is detected in a later process, a defective substrate may also be generated in the meantime. Therefore, such as the coating device 14a, the effect caused by rapid response is large. In addition, by this determination, when an abnormality is detected with respect to the processing of the substrate 90, not only the judgment result is displayed, but processing can be stopped to the extent, and B4002.doc -28 · 200403537 can automatically perform recovery processing such as nozzle washing. = And the inspection of the film is completed 'The stage 3 stops the suction of the substrate 90, operates the bead, and the transport mechanism moves from the holding surface 3. Pick up the substrate 9. Move to the next processing process: above the mouth, the device 14a before and after coating the photoresist, respectively, and the gap sensor 42 traces the detection, and the distance between the substrate and the surface is different from the surface of the photoresist boat. < The distance between the 'the thickness of the photoresist film formed on the surface of the substrate 90 by calculating these differences, and judging the quality of the treatment of the substrate' after forming a treatment liquid layer on the surface of the substrate 9G , Can quickly make good or bad judgment 'so it can respond quickly when an abnormal state occurs. In addition, since a dedicated sensor for photoresist film thickness measurement is not required, the device structure is not complicated and inspection can be performed easily. In addition, the control system 6a controls the lifting mechanisms 43 and 44 for raising and lowering the slit nozzle based on the detection result of the gap sensor 42. The gap sensor 42 can also be used to detect the posture and height of the slit nozzle 41 and the thickness of the photoresist film. For the measurement, the tearing product has a special structure to detect the height of the slit nozzle, which can simplify the device structure. < 5. Fifth Embodiment > In the fourth embodiment, the gap value (the distance from the surface of the substrate 90) measured before the photoresist coating and the gap value (and the photoresist film) measured after the photoresist coating are determined. Surface distance), detecting the thickness of the photoresist film, and determining the quality of the coating process, but the method of detecting the thickness of the photoresist film is not limited to this, and it can also be constituted as directly detecting the thickness of the photoresist film. Fig. 14 is a diagram for explaining the principle of the gap sensor 46 according to the fifth embodiment constructed based on this principle. The coating device 14a of the fifth embodiment has the same configuration as the fourth embodiment except for the gap 84002.doc -29-200403537, and its description is omitted. -As shown in FIG. 14, the gap sensor 46 is similar to the gap sensor 42 of the fifth embodiment in that a laser displacement meter having a CCD 460 and a light receiving lens 461 also has the functions of the gap sensor 42. Furthermore, the gap sensor 46 has the following functions: the first reflected light (laser light reflected on the surface SF2) and the second reflected light (reflected on the surface SF3) of the projected laser light (incident light) are simultaneously received on the CCD 460; Laser light), based on the distance δ of the peak of the intensity distribution appearing on the CCD460 due to the first reflected light and the peak of the intensity distribution appearing on the CCD460 due to the second reflected light on the CCD460, the surface SF2 and the surface are detected The distance d between SF3. That is, when the surface SF2 of the gap sensor 46 is the surface of the photoresist film formed on the surface of the substrate 90 and the surface SF3 is the surface of the substrate 90, the thickness dimension (distance d) of the photoresist film can be directly detected. The detected thickness of the photoresist film is transmitted to the control system 6a, and is determined by the control system 6a in the same manner as in the fourth embodiment. As described above, the coating device 14a of the fifth embodiment can also obtain the same effects as those of the fourth embodiment. In addition, since the thickness of the photoresist film is directly detected by the gap sensor 46, the thickness of the photoresist film is not required to be calculated by the control system 6a, and the calculation amount in the coating device 14a can be reduced. < 6. Modifications > The embodiments of the present invention have been described above, but the present invention is not limited to the above-mentioned embodiments, and can be variously modified. For example, in the first to third embodiments, the place where the image recognition unit 22 is provided is not limited to the application unit 14. For example, the image recognition unit 22 may be independently provided at a specific position above the substrate 90 transport path in the substrate processing apparatus 1 84002.doc -30-200403537, and the transfer robot 12 transfers the photoresist coating at a position below the image recognition unit 22. Substrate 90 after Butin. In addition, when the transfer robot 12 takes out the substrate 90 from the coating unit 14 ·, it may be temporarily stopped, and imaging and inspection may be performed therebetween. That is, if the interval from the coating unit 14 to the position of the X-connection substrate 90 for the next process (the drying unit 15 in the example in the figure), the image recognition unit 22 can be set anywhere. Moreover, in the above, In the first to third embodiments, the imaging section 23 and the determination section 24 of the image recognition section 22 may not necessarily be provided in the same place. For example, the imaging unit 23 may be provided in the coating unit 14 and the determination unit 24 may be provided in the control unit 6. In addition, in the first to third embodiments described above, the photographing range of the photographing section 23 is limited to a range that is highly likely to be exposed, rather than the entire surface of the substrate. However, the photographing range of the photographing section 23 may be the substrate surface. As a whole, the foot determination unit 24 selectively performs image recognition processing only on the range in which the whiteness is exposed in the range of the image data. In the first to third embodiments described above, the substrate processing apparatus 丨 is described as a device that performs a series of processing (not only coating processing, but also developing processing, etc.) on the substrate, but is not limited to this, and only coating is performed independently. The processed substrate processing apparatus can also be applied in the same manner. In this case, since inspection can be performed in the substrate processing apparatus 1, it is not necessary to set only an inspection process for a substrate whose processing has been completed in the substrate processing apparatus. In addition, in the above-mentioned fourth and fifth embodiments, a gap sensor may also be used, which has a function of simultaneously detecting, for example, reflected light from two surfaces, and simultaneously obtains the photoresist film surface and the reference surface SF0 in one scan. The distance between them is 84002.doc -31-200403537 and the distance between the substrate surface and the reference surface SF0. By calculating these differences, the thickness of the photoresist film is detected. In addition, in the above-mentioned fourth and fifth embodiments, the result of the determination of the coating process is displayed on the display portion 63, but the method of confirming the determination result is not limited to this. For example, you can print with a printer, etc., or you can use the following methods: · When you leave the device, the results are transmitted to a remote place through the network or a warning sound is generated. [Effect of the invention] In the invention contained in the patent application item, the processing liquid coating condition on the substrate is determined according to the photographic output of the camera =. The photographing mechanism is provided from the coating unit to the substrate transfer to the process. At any place in the interval of the position, the surface image of the substrate coated with the processing liquid is taken. Compared with a separate recording process inspection after the end of a series of 2, the coating failure of the substrate can be found early. According to the article 2 in the scope of the patent application, it is determined that "there will be a false ... A according to the judgment agency's = ,." "If the substrate being processed is stored in the reader, it can interrupt the processing of the substrate during inspection, so Useless processing can be reduced. ^ In the invention described in item 3 of the scope of application, the processing status of each substrate on the storage island can be identified by selecting the substrate during storage from the majority of buffers in accordance with the processing principle. Photographs and the inventions contained in the 10 items' by the photography agency's == part of the face, and the other-the photographic range is good for the inspection of the coverage, covering the entire range of the substrate, can be performed 84002.doc- 32- 200403537 In the inventions listed in Items 5 and 11 of the applied patent park, by scanning the coating start end of the processing liquid including the coating unit, the position where the whitening is prone to be exposed can be captured, so the efficiency can be improved. In the inventions listed in the 6th and 12th of the scope of patent application, the imaging scope includes the vicinity of the end of the substrate, and it is possible to photograph the position where the whitening is prone to be exposed, so the inspection can be performed efficiently. The inventions described in items 7 and 13 of the benefit range include the coverage of the base in addition to the vicinity of the end, and the base can be detected. Even if the white part of the center is exposed, the coating can be detected. Not I, so the detection accuracy can be improved. In the invention described in item 8 of the patent application, the photography mechanism can be arranged above the substrate holding position in the coating body early to detect the coating failure early. In the inventions listed in items 9 to 14 of the patent application park, there is no "inspection process" by determining the coating status of the processing liquid based on the photographic output of the photography agency. In the inventions contained in items 15 to 21 of the Chinese Patent Patent Park, the processing of the substrate is judged by determining the thickness of the formed layer detected by the detection mechanism. After the processing liquid layer is formed on the surface of the substrate, The quality can be determined quickly, so it can respond to the processing situation quickly. In the invention described in item 16 of the scope of the patent application, the detection mechanism is installed in the bridge structure and is positioned opposite to the substrate surface, and the foregoing is calculated based on the detection result of the detection mechanism that detects the distance between the existence of the object and the specific direction. The thickness dimension of the formed layer will not make the device structure complicated, and can be easily added ^ 84002.doc -33-) 0 / In the patent application No. 丨 8, ^ ^ < Invention, the detection mechanism is a laser-type displacement meter, which projects two f fields to reach the existing object first, and receives an array of light-receiving elements to reflect two orthographic reflections reflected by the surface of the existing object. ^ ^ 耵The distance between light, detection, and the presence of objects can be detected with accuracy and distance. In the invention described in item 19 of Shenyan's patent scope, the control mechanism controls the lifting mechanism according to the detection result of the sensing mechanism, and it is not necessary to provide a separate structure for detecting the slit nozzle and the surface of the substrate, which can simplify the device structure. In the invention contained in item 20 of the scope of the patent application, the measurement mechanism simultaneously calls on the light receiving element array to receive the first regular reflection light reflected by the surface of the formation layer and the second regular reflection light reflected by the surface of the substrate. The distance between the peak value of the intensity distribution of the regular reflection light appearing on the light receiving element array and the value of the intensity distribution of the second regular reflection light appearing on the light emitting element array on the 70 light receiving array, and the formation layer was measured. Thickness can reduce the amount of calculation. [Brief Description of the Drawings] Fig. 1 is a schematic plan view showing the structure of a substrate processing apparatus according to a first embodiment. FIG. 2 is a perspective view showing a coating unit. Fig. 3 is a plan view of a coating unit. Fig. 4 is a front view of a coating unit. Fig. 5 is a side view of a coating unit. FIG. 6 is a diagram showing a photographing range of the photographing shade of the first embodiment. FIG. 7 is a diagram showing a photographing range of the photographing section of the second embodiment. 84002.doc -34- 200403537 Fig. 8 is a schematic perspective view showing a structure of a substrate processing apparatus according to a third embodiment. FIG. 9 is a schematic perspective view showing a substrate processing apparatus according to a fourth embodiment. FIG. 10 is a plan view of the main body of the substrate processing apparatus viewed from above. Fig. 11 is a front view of the main body. Fig. 12 is a side view of the main body. FIG. 13 is a diagram illustrating the principle of a gap sensor according to a fourth embodiment. FIG. 14 is a diagram illustrating the principle of a gap sensor according to a fifth embodiment. FIG. 15 is a view showing a substrate on which a coating failure caused by streak-like exposure and blushing occurs; [Illustration of representative symbols of the drawings] 1 Substrate processing device 10 Strip washing machine 12, 13 Handling robot 14 Coating unit 14a Coating device 22 Image recognition section 23 Photographing section 230, 232 Photographing garden 24 Judging section 3 Stage 30 Holding surface 4 Bridge structure 40 Nozzle support 41 Slot nozzle 84002.doc 200403537 42 Gap sensor 420 > 460 CCD 421 Receiving lens 43 > 44 Lifting mechanism 46 Gap sensor 50 Linear motor 52 Linear encoder 6 Control Section 60 Computing section 61 Memory section 6a Control system 90 Substrate 91 Defective substrate BF1, BF2, BF3, BF4 Buffer 84002.doc -36-