TW200401001A - Anti-EMI epoxy colloid, method for producing such a colloid, and anti-EMI inductive element - Google Patents

Abstract

The present invention relates to an anti-EMI colloid prepared by adding a ferrite material into an epoxy, a method for producing such a colloid, and an inductive element using the colloid. The method mainly comprises grinding a sintered ferrite powder; adding a small amount of an epoxy resin as a binder, in which the ferrite material has an initial magnetic conductance of larger than 250 (μI > 250) and a particle size of less than 0.35 μ m (φ < 0.35 μ m), the epoxy resin is prepared in a dual-liquid preparation where the main agent is Bisphenol A and epichlorohydrin is used as a material to produce a general epoxy resin with an equivalent epoxy weight (EEW) of 185~195, and Bontamine with an amine value of 170 ± 20 is used as a hardening agent; and adding the mixed epoxy main agent and the hardening agent into the ferrite powder for a uniform mixing, thereby forming an anti-EMI colloid capable of being hardened rapidly and having excellent thermal resistance and acid/alkaline resistance. The anti-EMI colloid can be directly coated on a high frequency response component for a communication device to prevent the device from being interfered by noises, and can be applied on the encapsulation of an inductive element. The anti-EMI colloid can increase the inductance of an inductive element for more than two folds. Thereafter, electrical properties of an inductive element can be improved.

Description

^ _______________ V. # '明言 儿 明 (1) — ~ · —---- [Technical Field to which the Invention belongs] 铩, Magnetic: In the technical field of materials for electromagnetic interference, Xiaobei is related to preventing the second dry rent of materials (Ferr 1 te) Epoxy resin (EP0XV) is added to prepare colloids with f-blocking interference, and its manufacturing process and application to inductor components. [Previous technology] With the miniaturization of electronic products and the increase in demand for high-speed computing electronic components, electromagnetic interference (EMI, Electgr⑽agnetic)

Interference), radio wave interference (RFI, Radio).

Interference) and electrostatic discharge (ESD, Electro static);

Discharge) protection is also increasingly important. Miniaturized, high-density electronic components are most susceptible to electronic noise interference and electrostatic damage. Therefore, electromagnetic wave shielding and electrostatic protection treatment are needed, and electronic components need electrostatic protection materials during manufacturing, storage, transportation, and use of the final product to prevent electrostatic voltage caused by various behaviors. Once the electronic components exceed the tolerable level It is very easy to damage the normal operation of electronic components. Generally, polymer materials are good insulators, and their surface resistance is usually greater than 丨 〇 2 Ω / C m2, and it is very easy to generate charge accumulation on the surface of high-t subs. Therefore, conducting conductive modification directly in the polymer = (such as: po 丨 y an 1 I 1 ne, etc.) or adding conductive fillers (such as: conductive carbon black, metal powder) or antistatic agents can increase the polymer material The ability to avoid charge buildup or transfer of charge. The use of conductive polymers is divided according to different resistance requirements 'and commonly used conductive materials, and mainly includes four parts: the first is antistatic materials', which is often used for packaging materials. The second is ESD protection, which is commonly used in packaging materials or operating tools. The third is ^^ 丨 / Riq shielding, which is mainly used in the housing of electronic information and communication products, and can also be applied to high-voltage electricity.

_ 5. Description of the invention (?) Lacquer λθ is the fourth conductive part, and m π f 1 silver glue is used for testing. ^ The main application is reconductivity M "Anisotropic conductive voltage 3 | ^ E] -gu-}, ^-.. Continued; RC innovation continues to improve the improvement of ferrite materials, inductors, ★ on &quot; * ㈡ ㈡ Y ... 1 smart color, while ferrite materials are the market if wave and electromagnetic The core unit of electronic devices such as interference filters. An indispensable role in Fenji, the core of the I 1 instrument / deductible electronic device requires magnetic permeability and operating frequency requirements for ferrite materials. Strict [Content of the Invention] Some = the development of electronic products is short, small, light and thin design, so respectful; 7 ^ pieces and passive components must be made into small size, function 2. I $ π pieces. The invention is directed to the research of the development of inductive elements. The material of the 5 mesh element is mainly a ferrite magnet, and the material of the ferrite magnet has a function of preventing electromagnetic interference. If there is a gel, the electrical characteristics of the inductor can be improved. Is the goal of the current research and development of inductor manufacturers around the world: Feng invention That is, an epoxy epoxy (EMI) adhesive with EMI prevention function is made of ferrite material to replace the currently available epoxy resin colloid containing pure iron (iron). The conductive element is not suitable for the inductive element.) Therefore, the use of a non-conductive ferrite material (Fern te) material 'add appropriate epoxy resin for packaging body material is the best consideration. In theory, a Adding EMI glue to the closed magnetic circuit inductance element can increase the inductance value, and then you can modify the other characteristics of the element (the fixed DC resistance RDC, the fixed DC current IDC, the quality factor Q value, and the standard deviation Tolerance). The composition includes ferrite magnets and epoxy resins.

200401001 V. Description of the invention (3) Use the sintered ferrite magnet powder to refine the powder after grinding, and then add a little ring gas resin as a binder. The initial permeability of the ferrite magnet material is above 250 (# 1 & gt 250), the particle size of the ferrite magnet powder is below 0.35 m (0 &lt; 0.35 # m), so that the electromagnetic waves that generate electromagnetic interference can be completely shielded by the miniaturization of the powder; epoxy resin In terms of resin, its use conditions are a two-liquid blending method. The main agent uses bisphenol A (Bisphenol A) and epoxy gas propylene (E pich 1 〇r 〇hydri η) as raw materials, made of general-purpose epoxy resin. Resin, its epoxy equivalent (EEW) is 1 8 5 ~ 195. The hardening agent is a modified amine resin (M o di f i e d A m i n e), the amine value of which is 170 ± 20. In this way, the mixed epoxy resin main agent and hardening agent are added to the ferrite magnet powder and uniformly stirred, and an epoxy resin colloid that can be quickly cured by heating, has good heat resistance, good acid and alkali resistance, and prevents electromagnetic interference can be produced . Furthermore, if an open magnetic circuit coil with the same size and unit inductance value is compared with a closed magnetic circuit coil in an inductive element, the closed magnetic circuit coil will have a higher inductance value than the open magnetic circuit coil, and the Q value will be better, but the The value will be lower. If a closed-circuit (shie 1 ded) closed magnetic circuit inductance element is used alone, the following technical considerations will be made in the production: 1. The DR core must be placed in the toroidal core ( RI core) center. 2. Winding requires flattening. 3. Component assembly strives to be hermetically sealed. However, if the epoxy resin colloid of the present invention is used to fill the center of a drum core (D R c ore) and a ring core (R I c ore), the requirements of the above problems can be greatly reduced. Because the ferrite material of epoxy colloid is finished

Page 7 200401001 V. Description of the invention (4) Eliminate all the disturbances of the air layer, and at the same time, it also has the role of a bonding agent, so the drum core (DR c ore) and the ring iron can be ignored when packaging. Core (RI core) location and tightness issues. Please refer to the conventional standard closed magnetic circuit inductance element shown in the first figure. Generally, the closed magnetic circuit inductance element mainly includes a drum core (1 1), a ring core (1 0), and a winding (1 2). Please refer to the first diagram A again. From this diagram, it can be clearly seen that if the drum core DR core (1 1) is skewed during assembly, the inductance value will increase slightly because one side is closer to the closed magnetic circuit. Please refer to the second figure of the closed magnetic circuit inductance element of the present invention. The present invention is to fill a drum core DR core (1 1) with a ferrite magnet and epoxy resin anti-electromagnetic interference gel (A) and a ring core RI. Between core (1 0), the inductance element will be a completely closed magnetic circuit, and the inductance value will be increased by more than 2 times. The increased magnification is determined by the distance between the hem of the original drum core DR c 〇re (1 1) and the wall of the ring core RI c 〇re (1 0). If the original design distance is close, the inductance value will increase 5 倍 上。 Closer to 2 times, if the original design distance is longer, the degree of increase in inductance can be as high as 2.5 times or more. The principle is to directly increase the niche volume of the inductive element with the ferrite magnet material to achieve the purpose of increasing the inductance value. In order to make the inductive element completely a closed magnetic circuit element, the first half of the ferrite magnet material must be set to more than 250, so as to avoid the leakage of the magnetic field lines by the inductive element, resulting in poor product stability. . Please refer to the third figure again. The third figure shows the open magnetic circuit inductance element of the present invention, which mainly includes an E-shaped round core (2 0) [E-shaped round core E type ring core], Surface adhesive bead core (21) [Surface mount bead type core] and winding (22),

200401001 V. Description of the invention (5) The E-shaped round iron core (20) and the surface on which the magnetic core (2 1) is adhered and the partial surface of the winding (2 2) have a main component of a ferrite magnet and Anti-electric and magnetic interference colloid (A) of epoxy resin. Please refer to the fourth figure again. The fourth figure shows the direct-packaged _ inductor element of the present invention. The present invention can be directly packaged on the surface of the inductor element. For example, the inductor element of this embodiment includes a drum core (3 0). , The electrode (3 1) and the winding (3 2), which are attached to the surface of the winding (3 2) by means of tape or infusion, etc., so that the surface of the winding (3 2) has a layer whose main component is a ferrite magnet and Anti-electromagnetic interference colloid (A) of epoxy resin. Furthermore, the ring-shaped core R I c ore of the conventional inductive element is subjected to a molding and sintering process, and then assembled with other components to form an inductive element. The invention can directly mold the anti-electromagnetic interference colloid (A) of the ferrite magnet and the epoxy resin by mold infusion or other methods, and can replace the original toroidal iron core R I c ore and greatly reduce the production cost. For example, referring to the fifth and sixth figures, the anti-electromagnetic interference colloid (A) of the ferrite magnet and the epoxy resin of the present invention is injection-molded on the surface of the winding (5 2) (6 2), which can replace the original Ring-shaped iron core RI core (51) (61), very economical. In addition, with the increasing use frequency of communication products, the layout of electronic components on circuit boards is more and more required to prevent electromagnetic wave interference. In the past, circuit 4 promoters would use copper plates or nameplates to package components that mainly generate electromagnetic waves. However, if the "electromagnetic interference preventing colloid of ferrite magnet and epoxy resin" of the present invention is used to directly package components that generate electromagnetic waves, the use of copper plates and aluminum plates can be saved, and the problem of rust and oxidation of copper plates or aluminum plates can be eliminated.

Page 9 20041001 V. Description of the invention (6) [Embodiment] The "anti-electromagnetic interference colloid of ferrite magnet and epoxy resin" of the present invention -prepared, explained by way of example as follows: 1. Preparation # 1 = 7 0 0 Ferrite powder. F e2 03 2 3 2 7. 7 g, Ni 0 = 32.7 g, ZnO 2 108.5 g, CuO = 34.5 g. Put it into a ball mill tank (containing 1 K g 0 = 1 0 oxidized balls) and add water 4 0 0 m 1 and dispersant B Y K-1 1 1 = 2 g. Ball milled for 2 hrs. 2. Dry the above-mixed slurry at 1 2 0 3C. 3. The dried powder is crushed with a sieve (ma s h = 80), and then sintered at 900 ° C for 3 h r s = to obtain ferrite powder with the function of preventing electromagnetic interference. 4. The sintered ferrite magnet powder is magnetic, and then put into a ball mill tank containing 0 3 0: 0 1 〇 ·· 0 3 = 2: 3: 5 zirconia balls, set to low speed grinding at 2 5 rpm 1 8 hour. Particle size &lt; 0. 3 5 // m. 5. After the fine ferrite magnet powder is dried, pulverize it with a fine sieve 2 0 0 mash 3 6. Prepare an anti-electromagnetic interference colloid (EM I Epoxy Res 1 η) of ferrite magnet and epoxy resin: Take Epoxy resin main agent = 10 g, hardener = 2 g I main agent: hardener = 1 0 0: 1 6 ~ 2 3) Mix and stir well, and then add Ferrer 11 e = 1 0 8 g and dispersant BYK-1 1 1 = 1 g. Just mix well. Ε ρ ο X y added amount = 1 0 ~ 15% Note: Ε Μ I Ε ρ ο X y r e s i η If the viscosity is too high, a little nail can be added for thinning. The following experimental designs are targeted at three different inductive components currently on the market.

Page 10 200401001 V. Explanation of the invention (7) The product "ferromagnetic magnet and epoxy resin anti-electromagnetic interference colloid" E Μ I e ρ ο X y r e s i η added to the product is discussed below. R Η 0 9 1 0 series ---- Comparison of open magnetic circuit and closed magnetic circuit R Η 0 9 1 0 Refer to the seventh figure for the inductance component, which mainly includes: DR core (40), drum core, The winding (41) and the shell (4 2) of plastic bakelite are filled with an anti-electromagnetic interference gel (A) of a ferrite magnet and an epoxy resin. The method is: 1. Take the fabricated RH 0 9 1 0 1 5 0 Y inductor 12 pcs. 2. Use a syringe to inject the anti-electromagnetic interference colloid of the ferrite magnet and epoxy resin into the space between the drum core (40) and the casing (42), and then dry it at 7 5 3C for 20 minutes. 3. Take the dried coil and measure the inductance. Compare the differences between open and closed magnetic circuits. SH 5 0 2 8 series ---- Comparison of closed magnetic circuit and anti-electromagnetic interference colloid (A) of epoxy resin with ferrite magnet: S Η 5 0 2 8 series inductive components It mainly includes: drum core DR c 〇re (50), ring core RIc 〇re (51), winding (5 2) and electrode (53) 5 and filled with ferrite magnets Anti-electromagnetic interference colloid (A) with bad oxygen resin. The method is as follows: &quot; 1. Take the drum core DR c 〇re and the ring core 3 2 required for making S Η 5 0 2 8 series. Fix the drum iron core (50) to the winding. There are a total of 1 2 pcs in 50 turns in the middle of the tool. 3. The 1 2 pc s wound coil and ring-shaped core (5 1) are wrapped with tape to 1

200401001 V. Description of the invention (8) v ο 1 t 1 k Η z measures the inductance value. 4. Use the syringe to inject the anti-electromagnetic interference colloid of ferrite magnet and epoxy resin _ (A) into the space between the drum core (50) and the ring core (51), and then fill it with 7 Dry at 5 ° C for 40 minutes. · 5. Take the dried coil to measure the inductance. Compare the differences between the two closed magnetic circuits. SS 0 6 0 3 series ---- Overall comparison of SS 0 6 0 3 series inductive components Please refer to the ninth figure, which mainly includes: DR core (DR) (60), RI core (Ring core) 61), a winding (6 2), an electrode (6 3) and a base (6 4), and filled with an anti-electromagnetic interference colloid (A) of a ferrite magnet and an epoxy resin. The method is as follows: 1. Take the drum iron core, the ring iron core and the bottom plastic bakelite required for making SS 0 6 0 3 series inductance components. 2. Fix the drum core in the winding jig and wind it for 2 3.5 turns. A total of 1 2 pcs 0 3. Measure the inductance at 1 v ο 1 t 1 k 将 z with the wound coil of 1 2 p c s, and then measure the inductance again with a ring-shaped iron core wrapped in tape. Compare the differences between open and closed magnetic circuits. 4. Use the syringe to inject the ferrite magnet and epoxy resin to prevent the electromagnetic interference colloid (A) from entering, completely fill the space between the drum core and the ring core, and then dry it at 7 5 t 4 0 minute. 5. Take the dried coil and measure the inductance. Compare the differences between the two closed magnetic circuits. test results·

Page 12, 200401001 V. Description of the invention (9) Please refer to the tenth figure, please refer to the eleventh figure, please refer to the twelfth figure. RH 0910 series SH 5028 series SS 0603 series junction equipment · 1. Open and closed magnetic circuit Comparison of the increase of inductance value 2. The gap between drum core DR core hem and ring core RI core discusses the so-called true closed magnetic circuit 3. Adding ferrite magnet and epoxy anti-electromagnetic interference colloid (A) pair The improvement of the unit inductance value of the actual inductive element is in terms of R Η 0 9 1 0. 'Because the design of the RI core is based on the plastic bakelite, the element does not have the function of magnetic shielding. If the ferrite magnet and the anti-electromagnetic interference colloid (A) of the soil-oxygen resin are completely sealed by the syringe injection, the element is an inductive element with magnetic shielding. At the same time, we found that the inductance value of the open magnetic circuit and the closed magnetic circuit alone increased the inductance value of the closed magnetic circuit by 2 times. Next, we use the above three different series of products as the comparison of drum core DR core rim and ring core RI core wall space size to the real magnetic shielding effect. The drum core D R c o r e of the R r series is in full contact with the plastic core R I core, the SH series has a little gap, and the SS series has the largest gap. Comparing the increase of the inductance value of an epoxy resin (E ρ ο X y) package with an EM I function from a magnetically shielded inductor originally packaged with a general epoxy resin (E ρ ο X y) It can be found that the original open-circuit inductor element packaged ring-shaped iron core RI core becomes a closed-circuit inductor, and the increase of its inductance value varies with the gap.

Page 13 200401001 V. Description of the invention The situation is the same after filling the ferrite magnet and epoxy resin's anti-electromagnetic interference colloid (E Μ I e ρ ο X y r e s i η), the larger the gap is, the smaller the inductance value increases. Of course, the increase rate of the inductance value is only a phenomenon. To discuss in detail, the unit inductance value of the ring core R I core must be considered. We have known that the electromagnetic interference-resistant gel (E Μ I epoxy resin) filled with ferrite magnets and epoxy resin in the inductive element can help to increase the inductance value of the element. After that, you can engage in the following research and development. 1. Make small size special product inductance components with ultra high inductance value 2. Under certain inductance value requirements, improve the RDC and IDC characteristics of the component by changing the wire diameter of the enameled wire 3. The product's positive and negative standard deviation (Tolerance) is too high It can be reduced by changing the drum core DR c ore with a lower unit inductance. (Theoretically, the larger the unit inductance of the magnetic material, the larger the initial permeability. "The larger the error." Because the inductive element has a rather contradictory theory of electric and magnetic fields. The electric field will be greatly limited (the inductor has a smaller current). Therefore, when the inductor with magnetic shielding is generally designed, the unit inductance value of the DR core of the drum core will be 0.3 times smaller than the unit inductance value of the ring core RI c 〇re. Ε Μ Ε ρ ο X yresi η produced with a magnetic permeability of more than 250 (# i &gt; 2 50) as the packaging material will reduce the withstand current value of the inductor by more than half. Therefore, it is necessary to use a ferrite magnet with an initial permeability of 8 or less (, (/ i &lt; 8) as a material for improving the characteristics of an inductor.

Page 14 200401001 Brief description of the diagram The first diagram is a schematic diagram of a conventional closed magnetic circuit inductance element. The second figure is a schematic diagram of the closed magnetic circuit inductance element of the present invention. _ The third diagram is a schematic diagram of the open magnetic circuit inductance element of the present invention. The fourth diagram is a schematic diagram of an embodiment of a direct-packaged inductor element according to the present invention. ‘The fifth diagram is a schematic diagram of another embodiment of the present invention, which is directly packaged in an inductive element. The sixth diagram is a schematic diagram of an embodiment in which the present invention is directly packaged in an inductive element. The seventh diagram is a schematic diagram of the present invention applied to a commercially available RH 0 9 10 inductive element. The eighth figure is a schematic diagram of the present invention applied to a commercially available SH 5 0 2 inductor element. The ninth figure is a schematic diagram of the present invention applied to a commercially available SS 0 6 0 3 inductive element. The tenth graph is the test result of the present invention applied to a commercially available RH 0 9 10 inductance element. The eleventh figure shows the test results of the present invention applied to a commercially available SH 5 0 2 inductor element. The twelfth figure is the test results of the present invention applied to a commercially available S 0 06 03 inductive element. The thirteenth figure is a comparison diagram of characteristics of the present invention applied to commercially available RH 0910, SH 5 0 2 8 and SS 0 6 0 3 inductance elements. [Reference number in the drawing] (10) RI core

(1 1) Drum core (DR c 〇re) V (J 2) winding (A) anti-electromagnetic interference colloid of iron gas magnet and bad oxygen resin (20) E-shaped round core (E type ring core) (21) Surface mount bead type core (/ 2 2)

Page 15 200401001 Schematic diagram (30 (31 (3 2 (40 (41 (42 (50 (51 (52 (53 (60 (61 (62 163 (64 single instructions)))) DR core electrode) Winding) Drum Core (DR core) Winding) Housing) Drum Core core) Ring Core (RI core #) Winding) Electrode) Drum Core (DR core) Ring Core ( RI core) wound) electrode) base

Page 16

Claims (1)

200401001 6. Scope of patent application 1. An "epoxy resin colloid to prevent electromagnetic interference", the main components of which include ferrite magnets and oxygen cutting resins. 2. According to "Electromagnetic Interference-Preventing Epoxy Resin Colloid" described in item 1 of the scope of patent application, wherein the proportion of the main component is 90-85% · ferrite magnet and 10-15% Epoxy. 3. According to the "ring gas resin colloid for preventing electromagnetic interference" described in item 1 of the scope of patent application, wherein the ferrite magnet has an initial permeability of 250 or more (μ 1 &gt; 2 50), and the ferrite magnet powder Particle size below 0 · 3 5 # m (0 &lt; 0.3 5 ^ m) = ϋ 4. A "preparation of epoxy colloid to prevent electromagnetic interference", the main 'I includes the following steps: Formulating ferrite Put the magnet powder into the ball mill tank, add water and dispersant, and mix by ball milling. Dry the above-mentioned uniform slurry. The dried powder block is crushed with a sieve and then sintered to obtain a ferrite magnet with the function of preventing electromagnetic interference. Powder; sintered ferrite magnet powder is magnetic, and then ground at a low speed; after drying the fine ferrite magnet powder, pulverize it with a fine sieve; take the epoxy resin main agent and hardener and mix well, and then add baking After drying, the ferrite magnet powder and dispersant that have been reduced to fineness can be mixed and stirred to form an anti-electromagnetic interference winner of the ferromagnetic magnet and the ring gas resin. 5. —A kind of "closed magnetic circuit inductance element to prevent electromagnetic interference" 'mainly includes a drum core, a ring core and a winding, which is characterized in that the gap between the drum core and the ring core is filled with Main components are ferrite magnet and epoxy tree Page 17 200401001 6. Scope of patent application Grease anti-electromagnetic interference colloid. 6. —A kind of "open magnetic circuit inductance element to prevent electromagnetic interference", which mainly includes E-shaped round core (S type Surface core, Surfacem 〇untbeadtypec 〇re) and winding It is characterized in that the E-shaped round iron core and the surface adhered with the magnetic core and the surface of the winding part have anti-electromagnetic interference colloids whose main components are ferrite magnets and bad oxygen resins. 7. —A kind of "inductive element to prevent electromagnetic interference" 'The winding surface of the inductive element has a layer of anti-electromagnetic interference colloid whose main components are ferrite magnet and epoxy resin. Page 18