TW200300841A - System and method for inspection using white light interferometry - Google Patents

System and method for inspection using white light interferometry Download PDF

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Publication number
TW200300841A
TW200300841A TW091134653A TW91134653A TW200300841A TW 200300841 A TW200300841 A TW 200300841A TW 091134653 A TW091134653 A TW 091134653A TW 91134653 A TW91134653 A TW 91134653A TW 200300841 A TW200300841 A TW 200300841A
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Taiwan
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data
inspection
pixel
component
interference
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TW091134653A
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Chinese (zh)
Inventor
Sanjeev Mathur
Chu-Yin Chang
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Semiconductor Tech & Instr Inc
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Priority claimed from PCT/US2001/043178 external-priority patent/WO2003058163A1/en
Application filed by Semiconductor Tech & Instr Inc filed Critical Semiconductor Tech & Instr Inc
Publication of TW200300841A publication Critical patent/TW200300841A/en

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Abstract

A system for inspecting components is provided. The system includes an image data system that generates image data of the component, such as from a position overlooking the top of a bumped wafer. An interferometry inspection system is connected to the image data system and receives the image data, and analyzes the image data to locate interference fringing that is used to determine the surface coordinates of the bump contacts.

Description

200300841 A7 B7 五、發明説明(1 ) 發明領域 本發明與組件檢查系統的領域有關。更明確地說,本 發明與使用干涉量度學檢查組件的系統及方法有關,例如 白光干涉量度學,用以度量組件的3維特徵。 發明背景 使用影像資料的檢查系統是習知技術。典型上,這類 檢查系統是使用來自被相干或不相干光源照明之組件的影 像資料,並接著對影像資料進行影像分析處理,以決定組 件是否符合預先決定的標準。例如,影像資料分析是用來 決定組件是否被正確地標不’其特徵是否在正確位置,或 是否有其它特定的標準。關於此,“特徵”可包括所要的特徵 ,如接點,或不想要的特徵,例如損壞的接點,且損壞在 接點表面延伸或往表面內延伸。 目前所使用的這類組件檢查系統,組件的3維態樣必須 從影像資料推知。因此,在很多情況很難決定影像資料中 高於或低於平面或參考的指示是否來自特徵。同樣地,由 於這類影像資料分析是使用亮度的相對改變推斷特徵的位 置以及決定這些特徵是否落在預先決定的許可標準內,因 此,在單光源下經常發生特徵無法辨識。雖然在習知技術 中是使用多光源,諸如來自兩個不同角度的光源,不過, 這類光源所產生的影像資料仍無法很明確地辨識不符合特 定標準之組件的特徵,諸如精確地決定特徵的尺寸。 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X 297公釐) — I卜I-r----裝 — I (請先聞讀背面之注意事項再填寫本頁)200300841 A7 B7 V. Description of the invention (1) Field of the invention The present invention relates to the field of component inspection systems. More specifically, the present invention relates to systems and methods for inspecting components using interference metrology, such as white light interference metrology, to measure the 3-dimensional features of the component. BACKGROUND OF THE INVENTION Inspection systems using image data are conventional techniques. Typically, this type of inspection system uses image data from components illuminated by a coherent or incoherent light source, and then performs image analysis processing on the image data to determine whether the component meets a predetermined standard. For example, image data analysis is used to determine whether a component is correctly labeled, whether its features are in the correct location, or if there are other specific criteria. In this regard, "features" may include desired features, such as contacts, or unwanted features, such as damaged contacts, and the damage extends on or into the surface of the contact. At present, in this type of component inspection system, the 3D appearance of the component must be inferred from the image data. Therefore, in many cases it is difficult to decide whether the indication above or below the plane or reference in the image data comes from a feature. Similarly, since this type of image data analysis uses relative changes in brightness to infer the location of features and determine whether these features fall within a pre-determined permission standard, features often fail to be identified under a single light source. Although multiple light sources are used in the conventional technology, such as light sources from two different angles, the image data generated by such light sources still cannot clearly identify the characteristics of components that do not meet certain standards, such as accurately determining the characteristics. size of. This paper size applies to China National Standard (CNS) Α4 size (210X 297 mm) — I. I-r — — — I (Please read the precautions on the back before filling this page)

、1T 經濟部智慧財產局員工消費合作社印製 -5- 200300841 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明(2) 發明槪述 按照本發明,提出一種檢查組件的系統及方法,可以 克服目前與檢查組件相關的問題。 特別是,所提供檢查組件的系統及方法可以使用干涉 量度學決定組件的表面座標。 按照本發明例示性的實施例,提供一種檢查組件的系 統。該系統包括影像資料系統用以產生組件的影像資料, 諸如從某一位置俯視有焊塊之晶圓的頂部。干涉量度學檢 查系統連接到影像資料系統接收影像資料,並分析影像資 料以定位用來決定焊塊接點表面座標的干涉條紋。 本發明提供很多重要的技術優點。本發明重要的技術 優點之一是檢查組件的系統及方法是使用干涉量度學決定 組件的3維表面座標。本發明可以使用單色光或白光的干涉 量度學在組件上產生干涉條紋,從干涉條紋可以決定三軸 座標。 熟悉此方面技術之人士在配合附圖閱讀過詳細描述後 將可進一步暸解本發明的優點、卓越的特徵及其它重要的 態樣。 圖式簡單說明 圖1是按照本發明之例示性實施例使用干涉量度學執行 組件檢查之系統的槪圖; 圖2是按照本發明之例示性實施例使用干涉量度學分析: 影像資料之系統的槪圖; 本紙張尺度適用中國國家標準(CNS ) A4規格(21〇X297公釐) ~ -- -6 - (請先閲讀背面之注意事項再填寫本頁)Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs -5- 200300841 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (2) Description of the invention According to the present invention, a system and method for inspecting components are proposed. To overcome current problems associated with inspecting components. In particular, the systems and methods provided for inspecting components can use interferometry to determine the surface coordinates of the components. According to an exemplary embodiment of the present invention, a system for inspecting a component is provided. The system includes an image data system for generating image data of a component, such as looking down on the top of a wafer with a solder bump from a certain position. The interferometry inspection system is connected to the image data system to receive the image data and analyze the image data to locate the interference fringes used to determine the surface coordinates of the solder joints. The invention provides many important technical advantages. One of the important technical advantages of the present invention is that the system and method for inspecting a component is to determine the 3D surface coordinates of the component using interferometry. In the present invention, interference fringe of monochromatic light or white light can be used to generate interference fringes on the component, and the triaxial coordinates can be determined from the interference fringes. Those skilled in the art will further understand the advantages, excellent features, and other important aspects of the present invention after reading the detailed description in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram of a system for performing component inspection using interference metrology according to an exemplary embodiment of the present invention; FIG. 2 is a system for analyzing an image data using interference metrology according to an exemplary embodiment of the present invention槪 Figure; This paper size applies to Chinese National Standard (CNS) A4 specification (21 × 297 mm) ~--6-(Please read the precautions on the back before filling this page)

200300841 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明(3) 圖3是按照本發明之例示性實施例用以決定亮度變化之 系統的槪圖; 圖4是按照本發明之例示性實施例用以決定及控制用來 產生干涉條紋之鏡片或其它系統或組件之位置·之系統的槪 圖; 圖5是按照本發明之例示性實施例用以決定對應於影像 資料之圖素之組件表面座標的系統槪圖; 圖6是按照本發明之例示性實施例之教導的圖素亮度變 化圖; 圖7是按照本發明之例示性實施例使用干涉量度學決定 組件表面座標之方法的流程圖; 圖8是按照本發明之例示性實施例決定組件表面座標之 方法的流程圖;以及 圖9是按照本發明之例示性實施例執行組件檢查之方法 的流程圖。 主要元件對照 100 組件檢查系統 102 組件 104 組件載台 106 光源 116 遮板 110 鏡片 112 影像資料系統 (請先閱讀背面之注意事項再填寫本頁)200300841 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (3) Figure 3 is a hologram of a system for determining brightness changes according to an exemplary embodiment of the present invention; Figure 4 is an illustration according to the present invention A schematic diagram of a system for determining and controlling the position of a lens or other system or component used to generate interference fringes according to an exemplary embodiment; FIG. 5 is a diagram for determining pixels corresponding to image data according to an exemplary embodiment of the present invention Systematic diagram of component surface coordinates; Figure 6 is a graph of pixel brightness changes according to the teachings of an exemplary embodiment of the present invention; Figure 7 is a method for determining the surface coordinates of a component using interference metrics according to an exemplary embodiment of the present invention FIG. 8 is a flowchart of a method of determining a surface coordinate of a component according to an exemplary embodiment of the present invention; and FIG. 9 is a flowchart of a method of performing a component inspection according to an exemplary embodiment of the present invention. Comparison of main components 100 component inspection system 102 component 104 component stage 106 light source 116 shutter 110 lens 112 image data system (please read the precautions on the back before filling this page)

本紙張尺度適用中國國家標準(CNS ) A4規格(21〇X;297公釐) -7- 200300841 A7 B7 五、發明説明(4) 經濟部智慧財產局員工消費合作社印製 118 2維檢查系統 114 干 涉 量 度 學 檢 查系統 200 系 統 202 圖 素 圖 繪 製 系 統 204 売 度 變 化 系 統 206 座 標 系 統 208 圖 素 表 面 位 置 系統 210 特 徵 遺 失系 統 212 缺 陷 體 B-& 積 系 統 214 缺 陷 面 積 系 統 216 缺 陷 深 度 /高虔 :系統 300 系 統 204 壳 度 變 化 系 統 302 框 儲 存系 統 304 資 料 壓 縮 系 統 306 框 平均 系 統 308 掃 瞄 1¾ 域 系 統 400 系 統 402 追 蹤 速 率 控 制 器 404 座 標 產 生 系 統 406 追 蹤 加 速 系 統 502 売 度 繪 製 系 統 504 中 點 分析 系 統 506 條 紋 計 數 系 統 (請先閱讀背面之注意事項再填寫本頁) 本纸張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -8- 200300841 A7 B7 五、發明説明(5) 較佳實施例詳細說明 在以下的描述中,相同的組件在說明書及圖式中都使 用相同的參考編號。各圖的繪製並未也不需要按實際比例 ,某些組件是以一般或槪略的型式呈現,爲了明晰及簡潔 ,以商品名加以識別。 圖1是按照本發明之例示性實施例使用干涉量度學執行 組件檢查之系統1〇〇的槪圖。系統100可以使用干涉量度學 決定組件的3維表面座標,諸如使用白光干涉在組件上產生 干涉條紋,是組件之特徵高度的函數。 系統100包括位在組件載台104上的組件102。組件載台 104可以是晶粒載台、輸送帶、膜框架、托盤或其它任何適 用的組件檢查載台。組件102可以是半導體組件、晶圓、晶 粒、晶片尺度的封裝、有焊塊的晶圓、球狀柵格陣列、已 封裝的晶粒、在凝膠封裝中的晶粒、在模具有或托盤中的 晶粒、或其它在適當結構中之其它適當的組件。典型上, 組件102是以適當的系統或裝置送到干涉系統120下方,諸 如輸送帶、機械臂、或其它適合的系統或裝置。 系統100包括光源106,它可以是單色光源、多色光源 、白光光源、干涉或非干涉光源、或其它適合的光源。光 源106產生的光束在方向“ A”行進。當可抽取的遮板11 6位 在可調鏡片110前方時,光束“A”被反射離開分光鏡108在箭 頭“B”的方向行進。光線照射在組件102上並沿著箭頭C的 方向返回。接著,光線朝方向"D”前進到達影像資料系統112 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 、\吞This paper size applies the Chinese National Standard (CNS) A4 specification (21〇X; 297 mm) -7- 200300841 A7 B7 V. Description of the invention (4) Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Cooperatives 118 2-dimensional inspection system 114 Interferometry inspection system 200 system 202 pixel map drawing system 204 degree change system 206 coordinate system 208 pixel surface position system 210 feature loss system 212 defect body B- & product system 214 defect area system 216 defect depth / high : System 300 System 204 Shell Degree Change System 302 Frame Storage System 304 Data Compression System 306 Frame Averaging System 308 Scanning 1¾ Domain System 400 System 402 Tracking Rate Controller 404 Coordinate Generation System 406 Tracking Acceleration System 502 Midpoint Rendering System 504 Midpoint Analysis System 506 Stripe Counting System (Please read the notes on the back before filling this page) This paper size is applicable to China National Standard (CNS) A4 (210X297 mm)- 8- 200300841 A7 B7 V. Description of the invention (5) Detailed description of the preferred embodiments In the following description, the same components are given the same reference numbers in the description and drawings. The drawings are not drawn and do not need to be in actual proportions. Some components are presented in general or sketchy styles. For clarity and conciseness, they are identified by product names. FIG. 1 is a schematic diagram of a system 100 for performing component inspection using interference metrology according to an exemplary embodiment of the present invention. The system 100 may use interference metrology to determine the 3-dimensional surface coordinates of the component, such as using white light interference to generate interference fringes on the component, as a function of the characteristic height of the component. The system 100 includes a component 102 on a component carrier 104. The component stage 104 may be a die stage, a conveyor belt, a film frame, a tray, or any other suitable component inspection stage. The component 102 may be a semiconductor component, a wafer, a die, a wafer-scale package, a wafer with solder bumps, a spherical grid array, a packaged die, a die in a gel package, a die with or Dies in trays, or other suitable components in suitable structures. Typically, the component 102 is delivered below the interference system 120 by a suitable system or device, such as a conveyor belt, a robotic arm, or other suitable system or device. The system 100 includes a light source 106, which may be a monochromatic light source, a polychromatic light source, a white light source, an interference or non-interference light source, or other suitable light sources. The light beam produced by the light source 106 travels in the direction "A". When the extractable shutter 11 is in front of the adjustable lens 110, the light beam "A" is reflected off the beam splitter 108 and travels in the direction of the arrow "B". Light strikes the module 102 and returns in the direction of arrow C. Then, the light headed in the direction of "D" and reached the image data system 112. The paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) (Please read the precautions on the back before filling out this page) Intellectual Property of the Ministry of Economic Affairs Printed by the Bureau ’s consumer cooperatives

-9- 經濟部智慧財產局員工消費合作社印製 200300841 Α7 Β7 五、發明説明(6) ,光線在該處被轉換成ΝχΜ之圖素陣列的亮度資料或其它 適合的影像資料,其中Ν及Μ是整數。接著,此影像資料 被提供給2維檢查系統11 8,供其使用影像資料進行2維影像 分析。 此外,將可抽取遮板116抽離可調鏡片110的前方,如 此,在方向“Α”行進的光線被分光鏡108分光,在方向Ε行 進到達可調鏡片110。接著,光線沿著路徑F反射回分光鏡 108,在該處,光線沿著路徑Β被導向組件102,接著,來 自可調鏡片110的光線沿著路徑C反射回並沿著路徑D到達 影像資料系統112。可調鏡片110是以具有磁、光、或其它 方式指示之指示器的馬達驅動,以允許鏡片的位移與馬達 旋轉的角度相關,可以使用精密位置量測(例如以雷射度量) 決定鏡片的位置及所對應的表面座標,也可使用其它適用 的方法定出鏡片的位置。 由於分光鏡及反射的結果,影像資料系統11 2所產生的 影像資料中包括了干涉條紋。干涉條紋是當來自組件的光 線與接收自組件之另一光線的相位間相差分數波長時所造 成的現象。例如,如果光線的相位差爲180°或1/2波長,則 亮度資料會嚴重衰減,當同相位的光抵消掉不同相位的光 時,會使亮度降低。當相位差小於或大於180°時,亮度也 會降低,但不會如1 80°時的嚴重。在一例示性的實施例中 ,可調鏡片110是使用與被檢查之組件102相同的材料製成 ,例如,檢查由金製成的接點焊塊時可以使用金質鏡片以 增進使用白光干涉量度學所產生之干涉條紋圖案的品質。 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X297公釐) ~ (請先閱讀背面之注意事項再填寫本頁)-9- Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 200300841 Α7 Β7 V. Description of the invention (6), where the light is converted into the brightness data of the pixel array of N × M or other suitable image data, where N and M Is an integer. This image data is then provided to a two-dimensional inspection system 118 for use in image data for two-dimensional image analysis. In addition, the extractable shutter 116 is pulled away from the front of the tunable lens 110. Thus, the light traveling in the direction "A" is split by the beam splitter 108 and travels in the direction E to reach the tunable lens 110. Then, the light is reflected back to the beam splitter 108 along the path F, where the light is guided to the component 102 along the path B, and then the light from the adjustable lens 110 is reflected back along the path C and reaches the image data along the path D System 112. The adjustable lens 110 is driven by a motor with a magnetic, optical, or other indication indicator to allow the displacement of the lens to be related to the angle of rotation of the motor. Precision position measurement (such as laser measurement) can be used to determine the lens The position and corresponding surface coordinates can also be determined by other applicable methods. As a result of the beam splitter and reflection, the image data generated by the image data system 112 includes interference fringes. Interference fringes are phenomena that occur when the phase of a light from a component differs from the wavelength of another light received from the component. For example, if the phase difference of the light is 180 ° or 1/2 wavelength, the brightness data will be seriously attenuated, and when the light of the same phase cancels the light of different phases, the brightness will be reduced. When the phase difference is less than or greater than 180 °, the brightness will also decrease, but not as severe as at 180 °. In an exemplary embodiment, the adjustable lens 110 is made of the same material as the component 102 to be inspected. For example, a gold lens may be used to inspect the contact pads made of gold to enhance the use of white light interference. The quality of the interference fringe pattern produced by metrology. This paper size applies Chinese National Standard (CNS) Α4 specification (210X297 mm) ~ (Please read the precautions on the back before filling this page)

-10- 200300841 Α7 Β7 五、發明説明(7) (請先閱讀背面之注意事項再填寫本頁) 使用與被檢查物相同材質之鏡片可增進品質的原因是在此 種架構下產生干涉之光波長的吸收減少,當使用不同材質 時就可能發生吸收情況。 經濟部智慧財產局員工消費合作社印製 使用此干涉原理,可調鏡片110、組件載台104、或系 統1〇〇中其它適合的組件要能移動以便在組件102上產生會 改變的干涉圖案。例如,如果可調鏡片110朝分光鏡108移 動,當可調鏡片110移動時,影像資料系統11 2所接收到之 不同相位與同相位光間的相位會改變。因此,組件102表面 上被照明的部分會出現干涉條紋。在組件102表面之不同點 的干涉條紋將會呈現亮度漸增或漸減。因此,影像資料系 統112所產生之ΝχΜ個影像資料圖素的亮度値將隨著分光鏡 108移向可調鏡片110而變化。按此方式,當分光鏡108朝向 分光鏡108移動時,可以使用影像資料系統112產生影像資 料的連續框,以便決定影像資料之每一個圖素的亮度變化 是可調鏡片110之位置的函數。因此,經由將干涉條紋的中 心定位,根據影像資料系統112所產生之連續影像中每一個 圖素的亮度與可調鏡片110的位置相關,即可決定組件102 表面上對應於每一個圖素之位置的座標。可以使用已知的 表面座標値校正可調鏡片110。 影像資料系統112連接到干涉量度學檢查系統114、2維 檢查系統11 8及干涉系統120。如本文中所用的“連接” 一詞包 括物理連接(如經由一或多個銅質連接器)、虛擬連接(諸如 一或多個隨機指定之資料記憶體裝置的資料記憶體位置)、 邏輯連接(諸如經由半導體電路的一或多個邏輯裝置)、無線 本紙張尺度適用中國國家標準(CMS ) Α4規格(210X297公釐) ~ -11 - 200300841 Α7 Β7 五、發明説明(8 ) 連接、超文字傳輸協定(HTTP)連接、其它適合的連接、或 這些連接適合的組合。在一例示性實施例中,系統及連接 可以經由中間系統及組件與其它系統及組件連接,諸如經 由通用處理平台的作業系統。 干涉量度學檢查系統114可以使用硬體、軟體或硬體及 軟體適當的組合實施,而且可以是在影像處理平台上操作 的一或多個軟體系統,諸如可從Dorval,Quebec之Matrox 處獲得的Matrox Genesis LC。干涉量度學檢查系統114從影 像資料系統11 2處接收連續的影像資料組,並分析每一個圖 素的亮度資料,以決定組件1 02表面上對應於每一個圖素之 各點的表面座標資料。同樣地,可調鏡片11 〇產生可調鏡片 的位置資料也經由影像資料系統112或其它適合的系統或組 件提供給干涉量度學檢查系統114,以允許干涉量度學檢查 系統114爲影像資料之ΝχΜ個每一個圖素的表面資料產生3 維座標。按此方式,使用干涉原理即可產生組件102之表面 座標的3維圖。 作業時,使用2維及3維技術檢查組件102。在一例示性 的實施例中,可以先用2維技術檢查組件,如果2維技術的 結果無法判定,則再執行組件之3維圖的繪製。因此,影像 資料系統11 2可將可抽取遮板11 6移開以便從2維檢查模式切 換爲3維檢查模式。影像資料系統112還提供控制資料給可 調鏡片11 0,以致使可調鏡片11 0以預先決定的速率、預先 決定的步進或其它適合的方式開始追蹤。接著,當可調鏡 片110以預先決定的速率或其它方式追蹤時,影像資料系統 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) ^---ί-----裝-- (請先閲讀背面之注意事項再填寫本頁) 、τ 經濟部智慧財產局員工消費合作社印製 -12- 200300841 A7 __ B7 五、發明説明(9) (請先閱讀背面之注意事項再填寫本頁) 112產生組件102之NxM個圖素連續順序的影像資料組。這 些影像資料組提供給干涉量度學檢查系統114,該系統即可 使用干涉原理及已知的可調鏡片110位置決定對應於每一個 圖素的表面座標。 在經由可調鏡片110產生所有的影像資料組之後,影像 資料系統112產生適當的控制命令或可調鏡片110的本地控 制器致使可調鏡片110回到預先決定的位置並插回可抽取遮 板116。同樣地,操作可調鏡片110的模式有兩種,其一是 可調鏡片110朝向分光鏡108移動以產生影像資料,其第二 是可調鏡片110離開分光鏡108以產生影像資料。按此方式 ,即不需要重置可調鏡片110。 圖2是按照本發明之例示性實施例用以分析影像資料的 系統200的槪圖。系統200可以分析2或更多組影像資料以決 定一或多個圖素的表面座標,諸如ΝχΜ個圖素陣列或其它 適合之圖素群或圖素組中的每一個圖素。 經濟部智慧財產局員工消費合作社印製 系統200包括干涉量度學檢查系統114及圖素圖繪製系 統202、亮度變化系統204、座標系統206、圖素表面位置系 統208、特徵遺失系統210、缺陷體積系統212、缺陷面積系 統214、缺陷深度/高度系統216,以上每一系統都可用硬體 、軟體、或軟硬適當的組合,以及在通用處理平台上操作 的一或多種軟體系統執行。如本文中所使用的軟體系統可 包括一或多項物件,代理程式(agents)、threads '副程式、 獨立的應用軟體、機器可讀取碼、原始碼、可執行碼,在 兩或多個獨立應用軟體 '兩個多個不同處理器或其它適合 本紙張尺度適用中國國家標準(CNS ) A4規格(21〇Χ297公釐) " -13- 200300841 A7 B7 五、發明説明(1〇) (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 之軟體架構中操作的兩或多行的碼或其它適合的軟體結構 。在一例示性實施例中,軟體系統是在通用應用軟體(如作 業系統)中操作的一或多行碼或其它適合的軟體結構,在特 殊用途應用軟體中操作的一或多行碼或其它適合的軟體結 構。在另一例示性實施例中,軟體系統可以是一或多行的 超文字標記語言(HTML)、可延伸標記語言(XML)、即插即 用的網路瀏覽器、或其它與網路瀏覽器共同操作的適用碼 。圖素圖繪製系統202爲NxM個圖素陣列中每一個圖素接收 表面座標資料,並產生與NxM個圖素陣列對應之組件的3 維影像。在一例示性的實施例中,圖素圖繪製系統202可以 產生使用者可讀取的顯示影像以允許操作員決定某品項是 否具有可接受或不可接受的特徵,諸如決定焊塊接點表面 上刮痕的大小,焊塊接點上的其它損壞,或組件上其它類 型的損壞。圖素圖繪製系統202也可執行組件表面資料的預 分析,諸如決定疑有損壞的區域、疑有損壞的深度、或其 它由使用者選擇的特徵,且當使用者選擇的特徵具有“不確 定”値或超出許可値時可請求作業員協助。圖素圖繪製系統 202還可決定損壞區域的體積,諸如根據預期表面位置與實 際表面位置間的差爲每一個圖素決定不連續的增量體積。 按此方法,圖素圖繪製系統202允許使用者指定一可接受的 損壞體積,如此即可根據組件的損壞體積或組件之特徵允 收或拒收該組件。 例如,組件是一半導體晶粒,其特徵是由金所構建成 的焊塊接點,焊塊接點預期的高度,例如是20微米。同樣 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -14 - 200300841 Α7 Β7 五、發明説明(Ή) (請先閱讀背面之注意事項再填寫本頁) 地,每一個圖素可涵蓋一預先決定的表面積,例如是25平 方微米。因此,使用者可以根據金焊塊之表面上刮痕或凹 痕的體積、金焊塊表面上的粗糙緣或瘤節、或根據損壞區 域之體積的其它類型損壞等選擇一通過/失敗的標準。在此 例示性的實施例中,如果刮痕致使表面低於20微米,則可 使用鄰接圖素的高度乘以25平方微米的面積,其體積等於 20微米與對應於該圖素之表面實際高度間的差。可以將每 一個這種鄰接圖素的面積相加,即可決定遺失材料的大約 體積。相同的處理也可用來決定瘤節、粗糙緣或其它延伸 超過表面之其它特徵的體積。按此方法,可根據損壞體積 的資料決定特徵的允收標準。 經濟部智慧財產局員工消費合作社印製 亮度變化系統204決定連續影像資料組中圖素間的亮度 變化。在一例示性的實施例中,亮度變化系統204可以爲單 一個圖素產生以高度爲函數之亮度變化的2維圖。例如,亮 度變化系統204可以從每一個影像資料組中擷取一個圖素的 亮度資料,並以可調鏡片110的位置爲函數繪製該圖素的亮 度資料圖。對應於圖素之組件表面的表面座標可以從干涉 條紋所致使的亮度變化及可調鏡片110、組件載台104或其 它適合之系統或組件的座標決定。按此方式,亮度變化系 統204可以爲每一個圖素構成亮度資料組,並分析該資料以 決定組件對應於該圖素位置的表面座標。亮度變化系統204 也能壓縮圖素的亮度資料,諸如接收影像資料的連續框, 並爲每一個圖素壓縮連續框間之變化在一預先決定之公差 範圍內的影像資料。按此方式,亮度變化系統204可以減少 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) " '— -15- 200300841 Α7 Β7 五、發明説明(12) 需要爲影像資料組儲存的資料,增加處理影像資料的速度 ,並能提供其它優點。在一例示性的實施例中,亮度變化 系統204可以接收1,000組的影像資料,每一組包括ΝχΜ陣 列的圖素亮度資料値。在此例示性的實施例中,決定對應 於任一圖素之組件表面的表面座標所需的影像資料組數只 是其中的一小部分,例如50組。亮度變化系統204還可以決 定具有定出每一個圖素表面位置所需之資料的影像資料組 ,並在決定某圖素之位置時丟棄其它組的資料,諸如使用3 維陣列資料壓縮技術或其它適用的資料壓縮技術。 座標系統206爲圖素資料組決定Ζ軸座標,並產生控制 資料用以控制可調鏡片110、組件載台104或其它用來產生 干涉條紋以便決定表面座標之系統或組件的位置。在一例 示性的實施例中,座標系統206可以決定每一個ΝχΜ陣列或 圖素資料框的高度或Ζ軸座標,無論圖素資料框是如何產 生(其中Ν及Μ陣列的位置分別用來決定X-及Υ-軸座標)。 因此,可調鏡片、可調組件載台1 04或其它適合的可調整特 徵都可用來控制每一圖素資料框沿著Ζ軸的相對位置。座 標系統206也可產生控制資料用以控制可調整組件的位置, 諸如可調鏡片110的表面。在此例示性的實施例中,座標系 統206可致使可調鏡片110或其它適合的系統或組件移動通 過不需要影像資料的區域,諸如使影像資料組“快速前進”通 過預期圖素表面沒有改變的區域,諸如沿著金焊塊之長度 軸向延伸到表面,一直到進入其中有期望之組件特徵的表 面區域。 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製-10- 200300841 Α7 Β7 V. Description of the invention (7) (Please read the precautions on the back before filling out this page) The use of lenses made of the same material as the object under test can improve the quality because interference light is generated under this structure The absorption of the wavelength is reduced, and absorption may occur when different materials are used. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Using this interference principle, the adjustable lens 110, the component carrier 104, or other suitable components in the system 100 must be able to move to produce a change in interference pattern on the component 102. For example, if the adjustable lens 110 is moved toward the beam splitter 108, when the adjustable lens 110 is moved, the phase between the different phase and the same-phase light received by the image data system 112 will change. Therefore, interference fringes appear on the illuminated portion of the surface of the component 102. Interference fringes at different points on the surface of the component 102 will show increasing or decreasing brightness. Therefore, the brightness 値 of the N × M image data pixels generated by the image data system 112 will change as the beam splitter 108 moves toward the adjustable lens 110. In this way, when the beam splitter 108 is moved toward the beam splitter 108, the image data system 112 can be used to generate a continuous frame of image data in order to determine that the brightness change of each pixel of the image data is a function of the position of the adjustable lens 110. Therefore, by locating the center of the interference fringe, according to the brightness of each pixel in the continuous image generated by the image data system 112 and the position of the adjustable lens 110, the surface of the component 102 corresponding to each pixel can be determined. The coordinates of the location. The tunable lens 110 can be corrected using known surface coordinates 値. The image data system 112 is connected to an interference metrology inspection system 114, a two-dimensional inspection system 118, and an interference system 120. The term "connection" as used herein includes physical connections (such as via one or more copper connectors), virtual connections (such as data memory locations of one or more randomly assigned data memory devices), logical connections (Such as one or more logic devices via semiconductor circuits), wireless paper size applies Chinese National Standard (CMS) A4 specification (210X297 mm) ~ -11-200300841 Α7 B7 V. Description of the invention (8) Connection, hypertext Transmission Protocol (HTTP) connections, other suitable connections, or a suitable combination of these connections. In an exemplary embodiment, the systems and connections may be connected to other systems and components via intermediary systems and components, such as operating systems via a common processing platform. The interference metrology inspection system 114 may be implemented using hardware, software, or a suitable combination of hardware and software, and may be one or more software systems operating on an image processing platform, such as available from Matrox, Dorval, Quebec Matrox Genesis LC. The interference measurement inspection system 114 receives a continuous image data set from the image data system 112 and analyzes the brightness data of each pixel to determine the surface coordinate data on the surface of the component 102 corresponding to each point of each pixel. . Similarly, the position data of the adjustable lens 110 generated by the adjustable lens is also provided to the interference measurement inspection system 114 via the image data system 112 or other suitable systems or components, so as to allow the interference measurement inspection system 114 to be the N × M of the image data. The surface data of each pixel generates 3D coordinates. In this way, a 3-dimensional map of the surface coordinates of the component 102 can be generated using the principle of interference. During operation, the module 102 is inspected using 2D and 3D techniques. In an exemplary embodiment, the component may be inspected using a two-dimensional technique, and if the result of the two-dimensional technique cannot be determined, then a three-dimensional drawing of the component is performed. Therefore, the image data system 112 can remove the extractable shutter 116 to switch from the 2-dimensional inspection mode to the 3-dimensional inspection mode. The image data system 112 also provides control data to the adjustable lens 110, so that the adjustable lens 110 starts tracking at a predetermined rate, a predetermined step, or other suitable methods. Then, when the adjustable lens 110 is tracked at a predetermined rate or in other ways, the paper size of the image data system applies the Chinese National Standard (CNS) A4 specification (210 × 297 mm) ^ --- ί ----- install- -(Please read the notes on the back before filling this page), τ Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs-12- 200300841 A7 __ B7 V. Description of Invention (9) (Please read the notes on the back before filling (This page) 112 generates an image data set of NxM pixel sequential order of component 102. These image data sets are provided to the interference metrology inspection system 114, which can use the principle of interference and the known position of the adjustable lens 110 to determine the surface coordinates corresponding to each pixel. After generating all the image data sets through the adjustable lens 110, the image data system 112 generates an appropriate control command or the local controller of the adjustable lens 110 causes the adjustable lens 110 to return to a predetermined position and insert the removable shutter 116. Similarly, there are two modes for operating the adjustable lens 110, one is that the adjustable lens 110 moves toward the beam splitter 108 to generate image data, and the second is that the adjustable lens 110 leaves the beam splitter 108 to generate image data. In this way, there is no need to reset the adjustable lens 110. FIG. 2 is a schematic diagram of a system 200 for analyzing image data according to an exemplary embodiment of the present invention. The system 200 may analyze 2 or more sets of image data to determine the surface coordinates of one or more pixels, such as each pixel in an N × M pixel array or other suitable pixel group or pixel group. The Intellectual Property Bureau employee consumer cooperative printing system 200 of the Ministry of Economic Affairs includes an interference measurement inspection system 114 and a pixel map drawing system 202, a brightness change system 204, a coordinate system 206, a pixel surface position system 208, a feature loss system 210, and a defect volume. The system 212, the defect area system 214, and the defect depth / height system 216, each of the above systems can be implemented by using hardware, software, or a suitable combination of hardware and software, and one or more software systems operating on a general-purpose processing platform. A software system as used herein may include one or more objects, agents, threads' subroutines, independent application software, machine-readable code, source code, executable code, in two or more independent Application software 'Two or more different processors or other suitable for this paper size Applicable Chinese National Standard (CNS) A4 specification (21〇 × 297 mm) " -13- 200300841 A7 B7 V. Description of the invention (1〇) (Please (Please read the notes on the back before filling out this page.) Two or more lines of code or other suitable software structures operating in the software architecture printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. In an exemplary embodiment, the software system is one or more lines of code or other suitable software structures operating in general-purpose application software (such as an operating system), one or more lines of code or other operating in special-purpose application software Suitable software structure. In another exemplary embodiment, the software system may be one or more lines of Hypertext Markup Language (HTML), Extensible Markup Language (XML), a plug-and-play web browser, or other web browsing Code for common operation of the controller. The pixel map drawing system 202 receives surface coordinate data for each pixel in the NxM pixel array, and generates a 3-dimensional image of a component corresponding to the NxM pixel array. In an exemplary embodiment, the pixel map drawing system 202 can generate a user-readable display image to allow an operator to determine whether an item has acceptable or unacceptable characteristics, such as determining the solder joint surface The size of the scratches, other damage on the solder bump contacts, or other types of damage on the component. The pixel map drawing system 202 can also perform a pre-analysis of the surface information of the component, such as determining the area of suspected damage, the depth of the suspected damage, or other features selected by the user, and when the features selected by the user have "indefinite "" Or if permission is exceeded, operator assistance can be requested. The pixel map drawing system 202 may also determine the volume of the damaged area, such as determining a discontinuous incremental volume for each pixel based on the difference between the expected surface position and the actual surface position. In this way, the tile drawing system 202 allows the user to specify an acceptable damage volume, so that the component can be accepted or rejected based on the damaged volume of the component or the characteristics of the component. For example, a component is a semiconductor die, which is characterized by bump contacts made of gold. The expected height of the bump contacts is, for example, 20 microns. Similarly, this paper size applies the Chinese National Standard (CNS) A4 specification (210X297mm) -14-200300841 Α7 Β7 V. Description of the invention (Ή) (Please read the precautions on the back before filling this page) Each pixel It can cover a predetermined surface area, for example 25 square microns. Therefore, the user can select a pass / fail criterion based on the volume of scratches or dents on the surface of the gold bump, rough edges or knobs on the surface of the gold bump, or other types of damage based on the volume of the damaged area. . In this exemplary embodiment, if the scratches cause the surface to be below 20 microns, the height of the adjacent pixel can be multiplied by an area of 25 square microns, with a volume equal to 20 microns and the actual height of the surface corresponding to the pixel The difference. The area of each such adjacent pixel can be added together to determine the approximate volume of missing material. The same treatment can be used to determine the volume of nodules, rough edges, or other features that extend beyond the surface. According to this method, the acceptance criteria of the characteristics can be determined based on the data of the damaged volume. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. The brightness change system 204 determines the brightness change between pixels in the continuous image data set. In an exemplary embodiment, the brightness change system 204 may generate a two-dimensional map of brightness changes as a function of height for a single pixel. For example, the brightness change system 204 may retrieve the brightness data of a pixel from each image data set, and draw the brightness data map of the pixel using the position of the adjustable lens 110 as a function. The surface coordinates of the component surface corresponding to the pixels can be determined from the changes in brightness caused by interference fringes and the coordinates of the adjustable lens 110, the component stage 104, or other suitable system or component. In this way, the brightness change system 204 can form a brightness data set for each pixel, and analyze the data to determine the surface coordinates of the component corresponding to the pixel position. The brightness change system 204 can also compress the brightness data of pixels, such as receiving continuous frames of image data, and compress image data within a predetermined tolerance range for each pixel. In this way, the brightness change system 204 can reduce the size of this paper to apply the Chinese National Standard (CNS) Α4 specification (210 × 297 mm) " '— -15- 200300841 Α7 Β7 5. Description of the invention (12) Need to store for the image data set Data, increase the speed of processing image data, and can provide other advantages. In an exemplary embodiment, the brightness change system 204 may receive 1,000 sets of image data, each group including pixel brightness data of the N × M array 阵. In this exemplary embodiment, the number of image data sets required to determine the surface coordinates of the component surface corresponding to any pixel is only a small part of them, such as 50 sets. The brightness change system 204 can also determine the image data set that has the data needed to determine the position of each pixel surface, and discard other groups of data when determining the position of a certain pixel, such as using 3D array data compression technology or other Applicable data compression technology. The coordinate system 206 determines the Z-axis coordinates for the pixel data set, and generates control data for controlling the adjustable lens 110, the component stage 104, or other systems or components for generating interference fringes to determine the position of the surface coordinates. In an exemplary embodiment, the coordinate system 206 may determine the height or the Z-axis coordinate of each N × M array or pixel data frame, regardless of how the pixel data frame is generated (where the positions of the N and M arrays are used to determine X- and Υ-axis coordinates). Therefore, adjustable lenses, adjustable component stage 104, or other suitable adjustable features can be used to control the relative position of each pixel data frame along the Z axis. The coordinate system 206 may also generate control data to control the position of the adjustable component, such as the surface of the adjustable lens 110. In this exemplary embodiment, the coordinate system 206 may cause the adjustable lens 110 or other suitable system or component to move through areas that do not require image data, such as "fast forward" the image data set through the expected pixel surface without change The area, such as extending axially to the surface along the length of the gold bump, all the way to the surface area where the desired component characteristics are entered. This paper size applies to China National Standard (CNS) Α4 specification (210 × 297 mm) (Please read the precautions on the back before filling this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs

-16- 200300841 A7 _ ΒΊ 五、發明説明(13) 圖素表面位置系統208從亮度變化系統204或其它適合 的系統接收亮度資料,並使用干涉量度學原理決定用以識 別組件上與某圖素相關之某點之表面座標的圖素資料組。 在一例示性的實施例中,圖素表面位置系統208逐框分析 ΝχΜ組的圖素資料,並決定每一框中用以識別組件表面上 某點之座標的圖素。在另一例示性的實施例中,圖素表面 位置系統208分析圖素資料組,並根據位在內有被定位表面 之資料組前或後之一或多組圖素資料決定每一圖素資料組 中用以識別組件表面上之點的圖素。在此例示性的實施例 中,圖素表面位置系統208能決定圖素的亮度變化,並根據 最大變化決定對應於每一個圖素的表面,一內插點存在於 最大變化處,根據圖素亮度資料或其它適合資料的改變指 示干涉圖案的中心條紋。同樣地,圖素表面位置系統208也 可在逐圖素的基礎上分析連續框的圖素資料組,諸如所有 的資料組都是首次被儲存並接著分析。 ^ 特徵遺失系統210接收表面座標資料並產生遺失特徵的 資料。在一例示性的實施例中,特徵遺失系統2 1 〇接收每一 個圖素的表面座標資料,並根據表面座標資料決定是否有 特徵遺失,諸如經由決定是否有預先決定之數量的圖素沒 有相關的表面座標,經由決定特徵的表面座標資料與預期 的表面座標資料不一致,或經由其它適合的程序決定。特 徵遺失系統2 1 0可產生檢查通過/失敗資料指示檢查結果是允 收、不確定或拒收,也可以產生通知資料以告知作業員有 特徵遺失,或可以產生其它適合的資料。 本紙張尺度適用中.國國家標準(CNS ) Α4規格(210X 297公釐) — -17- I ί 一 批衣-- (請先閲讀背面之注意事項再填寫本頁) 、11 經濟部智慧財產局員工消費合作社印製 200300841 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明(id 缺陷體積系統212接收表面座標資料並產生缺陷體積資 料。在一例示性的實施例中,缺陷體積系統21 2接收每一個 圖素的表面座標資料,並決定刮痕或其它缺陷進入表面的 體積,凸出表面的瘤節或其它缺陷,出現在特徵側面上的“ 鼠啃”或其它缺陷,或根據表面座標資料所決定的其它類型 缺陷,諸如經由決定每一個圖素預期與實際表面座標資料 間的差,以及經由加總與這些不相符圖素相關的體積,或 經由其它適合程序決定。缺陷體積系統212可產生檢查通過/ 失敗資料指示檢查結果是允收、不確定或拒收,也可以產 生通知資料以告知作業員有特徵遺失,或可以產生其它適 合的資料。 缺陷面積系統214接收表面座標資料並產生缺陷面積資 料。在一例示性的實施例中,缺陷面積系統214接收每一個 圖素的表面座標資料,並決定刮痕或其它缺陷進入表面的 面積,凸出表面的瘤節或其它缺陷,出現在特徵側面上的“ 鼠啃”或其它缺陷,或根據表面座標資料所決定的其它類型 缺陷,諸如經由決定實際具有表面座標資料之鄰接圖素群 的表面積高於或低於預期的表面座標値,或經由其它適合 程序決定。缺陷面積系統214可產生檢查通過/失敗資料指示 檢查結果是允收、不確定或拒收,也可以產生通知資料以 告知作業員有特徵遺失,或產生其它適合的資料。 缺陷高度/深度系統2 1 6接收表面座標資料並產生缺陷高 度/深度資料。在一例示性的實施例中,缺陷高度/深度系統 216接收每一個圖素的表面座標資料,並決定刮痕或其它缺 ----S---:-----裝-- (請先閱讀背面之注意事項再填寫本頁) 訂 本紙張尺度適用中國國家榇準(CNS ) A4規格(210X297公釐) -18- 200300841 Α7 Β7 五、發明説明(y (請先閱讀背面之注意事項再填寫本頁) 陷進入表面的深度,瘤節或其它缺陷凸出表面的高度,在 特徵側面延伸的“鼠啃”或其它缺陷,或根據表面座標資料所 決定的其它類型缺陷,諸如經由決定每一個圖素預期與實 際表面座標資料間的差,並決定最大高度/深度、平均高度/ 深度,或經由其它適合程序決定。缺陷高度/深度系統216可 產生檢查通過/失敗資料指示檢查結果是允收、不確定或拒 收,也可以產生通知資料以告知作業員有特徵遺失,或產 生其它適合的資料。 作業時’系統200可分析影像資料以決定組件對應於 ΝχΜ圖素資料組中一或多個圖素的表面座標。系統2〇〇使用 兩或多個ΝχΜ圖素資料組的框定位組件對應於每一個圖素 的表面。按此方式,系統200可以執行組件表面的3維圖繪 製’以允許精確地估計延伸到特徵表面以上或以下之區域 的體積,或是允許精確地估計組件的3維特徵。 經濟部智慧財產局員工消費合作社印製 圖3是按照本發明之例示性實施例系統3 〇〇的槪圖,用 以決定亮度變化。系統300包括亮度變化系統204、以及框 儲存系統302、資料壓縮系統304、框平均系統306、以及掃 瞄區域系統308,以上每一個系統都可用硬體、軟體 '或軟 硬適當的組合,以及在通用處理器平台上操作的一或多種 軟體系統執fj。 框儲存系統302接收2或多個圖素資料框,每一框包括 一圖素資料的ΝχΜ陣列。在一例示性的實施例中,連續圖 素資料框每一個中之圖素的座標,都與被檢查之組件或其 它物品表面上具有已知(Χ,Υ,Ζ)座標的區域對應。按此方式 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X 297公釐) -19- 200300841 Α7 Β7 五、發明説明(θ ,可以經由分析連續框中圖素間亮度的變化以決定組件之 表面上某點的表面座標。同樣地,框儲存系統3 〇 2中可儲存 圖素亮度値的3維陣列,如此,可以個別地擷取與分析在預 先決定之座標位置處的圖素資料組。例如,每一個圖素資 料框中包括座標(Χ,Υ)的圖素資料。同樣地,也可以知道或 從其它資料中推知每一個框的Ζ軸位置,諸如從可調鏡片 11 0的移動速率、位置控制器系統、或其它適合的系統。按 此方式’框儲存系統302中可以儲存亮度資料的3維陣列, 陣列中的每一點對應於(Χ,Υ,Ζ)座標系統中一預先決定的位 置。框儲存系統302也可分析沿著Ζ軸的各個圖素間、沿者 X或Υ軸的圖素列間、圖素資料組間的變化,諸如在沿著Ζ 軸的連續資料框中在沿著X及Υ軸一預先決定之方向延伸 的圖素資料組,或其它的資料組合。 資料壓縮系統304可用來壓縮儲存在框儲存系統302或 其它適合系統中的資料。在一例示性的實施例中,資料壓 縮系統304可以決定在Ζ軸的連續資料框中具有相同(Χ,Υ)座 標之圖素間的變化是否在預先決定的許可變化範圍內,如 此,可將沒有亮度變化指示的圖素刪除,以便減少需要儲 存的資料量。在一例示性的實施例中,資料壓縮系統304可 以檢視資料的連續框並做此決定,諸如,分析連續兩或多 個圖素的亮度變化以決定該圖素的資料對於決定被檢查之 組件的表面座標是否重要。資料壓縮系統304也可將檢查過 之組件的資料壓縮後儲存,諸如使用那些已被確認爲無用 資料要從資料組中刪除的表面位置資料。 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X297公羡1 ~一 "~ -20 - (請先閲讀背面之注意事項再填寫本頁) -裝· 、1Τ 經濟部智慧財產局員工消費合作社印製 200300841 A7 B7 五、發明説明( (請先閲讀背面之注意事項再填寫本頁) 框平均系統3 0 6從用來決定對應於每一圖素之表面座標 資料的圖素亮度資料產生移動平均資料。在一例示性的實 施例中,框平均系統306從頭數個資料框的平均中減去一平 均偏移値(諸如使用圖素的亮度資料),或使用其它適合的方 法。在此平均値被減去之後,框平均系統306接著取亮度資 料的絕對値,儲存爲每個圖素所產生之最後5個資料框之亮 度資料的移動平均,並偵測移動平均何時降低一預定量。 接著,與前第三個框的位置相關即可決定與該圖素對應的 表面。同樣地,其它適合的框數量,其它適合運算連續圖 素亮度資料値的數學運算,或是可飛動地決定每一個圖素 表面座標資料的其它適用處理都可使用。 經濟部智慧財產局員工消費合作社印製 掃瞄區域系統308根據晶圓傾斜資料、適用的掃瞄資料 或其它適合的資料產生掃瞄區域資料。在一例示性的實施 例中,晶圓傾斜資料是根據量測晶圓中預先決定之位置的 表面座標所產生,諸如決定因晶圓載台、晶圓表面變化或 其它傾斜源所造成的晶圓傾斜。此資料可從晶圓的一側高 於晶圓對側的高度來決定,諸如25微米。掃瞄區域系統308 調整掃瞄的區域,諸如要掃瞄以定出焊塊接點表面的位置 ,在該處,焊塊表面的預期高度已知,以便產生最佳數量 的資料框供分析。在此例示性的實施例中,在預期有焊塊 接點表面的區域中要取能包含30個資料框的掃瞄區域。由 於晶圓傾斜或其它因素,30個框區域在晶圓某一側所包含 的焊塊接點的表面座標,可能高於或低於30個框區域在晶 圓另一側包含的焊塊接點的表面座標。掃瞄區域系統308可 本纸張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -21 - 經濟部智慧財產局員工消費合作社印製 200300841 A7 ______B7 _ 五、發明説明(id 調整掃瞄區域以補償這種晶圓傾斜或其它因素。掃瞄區域 系統308也能產生適用的掃瞄資料,諸如藉其決定特徵的表 面座標是否被定位在掃瞄區域中間的附近。在一例示性的 實施例中,掃瞄區域包括產生30個位置的亮度資料框,每 一個圖素的表面座標期望在第15個框附近。掃瞄區域系統 308也可決定被檢知的表面座標是否不在此期望位置,諸如 在第1 5個框或在第1 2到第1 5個框,並調整掃瞄區域以適應 晶圓的扭曲、傾斜或其它變異。 作業時,系統300可以分析圖素的亮度變化,並儲存成 圖素資料組。系統300還可支援資料壓縮技術,諸如檢視在 兩(X,Y)陣列中目前與先前圖素亮度値之改變的資料壓縮技 術’檢視兩或多組資料並從亮度變化參數決定資料是否可 被壓縮的資料壓縮技術,使用移動平均決定對應於每一個 圖素的表面座標的技術,或其它適用的表面座標定位技術 。系統300還能將所儲存的資料提供給其它系統供分析,諸 如鏡像位置系統、圖素表面位置系統、圖素圖繪製系統或 其它適合的系統。 圖4是按照本發明之例示性實施例的系統400,用以決 定及控制用以產生干涉條紋之鏡片或其它系統或組件的位 置。系統400包括座標系統206以及追蹤速率控制器402、座 標產生系統404、以及追蹤加速系統406,以上每一個系統 都可用硬體、軟體、或軟硬適當的組合,以及在通用處理 平台上操作的一或多種軟體系統執行。 追蹤速率控制器4 0 2用以控制定義圖素資料組之座標的 本紙張尺度適用中國國家標準(CNS ) Α4規格(210 X 297公釐) ' ' --- -22- (請先閱讀背面之注意事項再填寫本頁)-16- 200300841 A7 _ ΒΊ V. Description of the invention (13) The pixel surface position system 208 receives the brightness data from the brightness change system 204 or other suitable systems, and uses the principle of interference measurement to decide to identify the component and a certain pixel. The pixel data set of the surface coordinates of a certain point. In an exemplary embodiment, the pixel surface position system 208 analyzes the pixel data of the N × M group frame by frame, and determines the pixels in each frame to identify the coordinates of a point on the surface of the component. In another exemplary embodiment, the pixel surface position system 208 analyzes the pixel data set, and determines each pixel according to one or more sets of pixel data before or after the data set including the positioned surface. A pixel in a data set used to identify points on the surface of a component. In this exemplary embodiment, the pixel surface position system 208 can determine the brightness change of the pixel, and determine the surface corresponding to each pixel according to the maximum change. An interpolation point exists at the maximum change. According to the pixel, Changes in brightness data or other suitable data indicate the center fringe of the interference pattern. Similarly, the pixel surface position system 208 can analyze pixel data sets of continuous frames on a pixel-by-pixel basis, such as all data sets are stored for the first time and then analyzed. ^ Feature loss system 210 receives surface coordinate data and generates missing feature data. In an exemplary embodiment, the feature loss system 2 10 receives the surface coordinate data of each pixel and determines whether there is a feature loss based on the surface coordinate data, such as by determining whether a predetermined number of pixels are not relevant. The surface coordinates of the surface coordinates determined by the feature are not consistent with the expected surface coordinates, or determined by other suitable procedures. The feature loss system 2 1 0 can generate inspection pass / fail data to indicate whether the inspection result is acceptable, uncertain, or rejected. It can also generate notification data to inform the operator that a characteristic is missing, or other suitable data can be generated. This paper size is applicable. National National Standard (CNS) Α4 specification (210X 297 mm) — -17- I ί a batch of clothing-(Please read the precautions on the back before filling this page), 11 Intellectual Property of the Ministry of Economic Affairs Printed by the Consumer Cooperatives of the Bureau of the People's Republic of China 200300841 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economy The system 21 2 receives the surface coordinate data of each pixel, and determines the volume of scratches or other defects entering the surface, the nodules or other defects protruding from the surface, the "rat mole" or other defects appearing on the side of the feature, or Other types of defects determined based on surface coordinate data, such as by determining the difference between each pixel's expected and actual surface coordinate data, and by summing the volumes associated with these non-conforming pixels, or by other suitable procedures. Defects The volume system 212 can generate inspection pass / fail data to indicate that the inspection result is acceptable, uncertain or rejected, and can also generate a pass Data to inform the operator that features are missing, or other suitable data can be generated. The defect area system 214 receives surface coordinate data and generates defect area data. In an exemplary embodiment, the defect area system 214 receives each pixel's Surface coordinate data, and determine the area of scratches or other defects entering the surface, nodules or other defects protruding from the surface, "mouse" or other defects appearing on the side of the feature, or other types determined based on surface coordinate data Defects, such as by determining that the surface area of adjacent pixel groups that actually have surface coordinate data is higher or lower than the expected surface coordinates, or by other suitable procedures. The defect area system 214 may generate inspection pass / fail data to indicate that the inspection result is Acceptance, uncertainty, or rejection can also generate notification materials to inform operators of missing features or other suitable information. Defect height / depth system 2 1 6 Receives surface coordinate data and generates defect height / depth data. In an exemplary embodiment, the defect height / depth system 216 receives each The surface coordinate information of a pixel, and determine the scratches or other defects ---- S ---: ----- install-(Please read the precautions on the back before filling this page) China National Standard (CNS) A4 specification (210X297 mm) -18- 200300841 Α7 Β7 V. Description of the invention (y (Please read the precautions on the back before filling this page) Depth of recession into the surface, nodules or other defects The height of the protruding surface, "mouse" or other defects extending on the side of the feature, or other types of defects determined based on surface coordinate data, such as by determining the difference between each pixel expected and actual surface coordinate data, and determining Maximum height / depth, average height / depth, or by other suitable procedures. The defect height / depth system 216 can generate inspection pass / fail data to indicate whether the inspection result is acceptable, uncertain, or rejected. It can also generate notification materials to inform the operator of missing features or other suitable information. During operation ', the system 200 may analyze the image data to determine the surface coordinates of the component corresponding to one or more pixels in the N × M pixel data set. The system 200 uses two or more N × M pixel data sets to locate the components corresponding to the surface of each pixel. In this way, the system 200 can perform 3D mapping of the component surface ' to allow accurate estimation of the volume extending to areas above or below the feature surface, or to allow accurate estimation of the 3D features of the component. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Fig. 3 is a schematic diagram of a system 300 according to an exemplary embodiment of the present invention for determining brightness changes. The system 300 includes a brightness change system 204, and a frame storage system 302, a data compression system 304, a frame averaging system 306, and a scanning area system 308. Each of the above systems may use a suitable combination of hardware, software, or hardware and software, and One or more software systems operating on a general-purpose processor platform execute fj. The frame storage system 302 receives two or more pixel data frames, and each frame includes an N × M array of pixel data. In an exemplary embodiment, the coordinates of the pixels in each of the continuous pixel data frames correspond to areas with known (X, Y, Z) coordinates on the surface of the component or other item being inspected. In this way, the paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) -19- 200300841 Α7 Β7 V. Description of the invention (θ) The component can be determined by analyzing the changes in brightness between pixels in continuous frames. The surface coordinates of a point on the surface. Similarly, the frame storage system 3 02 can store a 3-dimensional array of pixel brightness 値, so that the pixel data set at a predetermined coordinate position can be individually retrieved and analyzed For example, each pixel data frame includes pixel data of coordinates (X, Y). Similarly, the position of the Z axis of each frame can also be known or inferred from other data, such as from the adjustable lens 110 Movement rate, position controller system, or other suitable systems. In this way, a 3-dimensional array of brightness data can be stored in the frame storage system 302. Each point in the array corresponds to one in the (X, Y, Z) coordinate system. Pre-determined positions. The frame storage system 302 can also analyze changes between individual pixels along the Z axis, between pixel rows along the X or Y axis, and between pixel data sets, such as continuous The pixel data group or other data combination extending in a predetermined direction along the X and Υ axes in the material frame. The data compression system 304 can be used to compress the data stored in the frame storage system 302 or other suitable systems. In an exemplary embodiment, the data compression system 304 can determine whether the changes between pixels with the same (X, Y) coordinates in the continuous data frame of the Z axis are within a predetermined permitted change range. Pixels without indication of brightness changes are deleted in order to reduce the amount of data that needs to be stored. In an exemplary embodiment, the data compression system 304 may view continuous frames of data and make such decisions, such as analyzing two or more consecutive images The brightness change of the pixel determines whether the data of the pixel is important for determining the surface coordinates of the component being inspected. The data compression system 304 can also compress the data of the inspected component and store it, such as those that have been identified as useless Surface position data deleted from the data set. This paper size applies the Chinese National Standard (CNS) Α4 specification (210X297 public envy 1 ~ a " ~ -20-(Please read the precautions on the back before filling out this page)-Installed, printed by 1T Intellectual Property Bureau, Ministry of Economic Affairs, Consumer Consumption Cooperative, 200300841 A7 B7 V. Description of the invention ((Please read the precautions on the back first (Fill in this page again) The frame averaging system 3 0 6 generates moving average data from the pixel brightness data used to determine the surface coordinate data corresponding to each pixel. In an exemplary embodiment, the frame averaging system 306 starts from the beginning. An average offset 値 is subtracted from the average of each data frame (such as using pixel brightness data), or other suitable methods are used. After this average 値 is subtracted, the frame averaging system 306 then takes the absolute value of the brightness data 値, Stores a moving average of the brightness data of the last 5 data frames generated for each pixel, and detects when the moving average decreases by a predetermined amount. Then, depending on the position of the first third frame, the surface corresponding to the pixel can be determined. Similarly, other suitable numbers of frames, other mathematical operations suitable for calculating continuous pixel luminance data, or other suitable processing that can determine the surface coordinate data of each pixel on the fly can be used. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. The scanning area system 308 generates scanning area data based on wafer tilt data, applicable scanning data, or other suitable data. In an exemplary embodiment, the wafer tilt data is generated based on measuring the surface coordinates of a predetermined position in the wafer, such as determining a wafer caused by a wafer stage, a wafer surface change, or other tilt source tilt. This information can be determined from the height of one side of the wafer above the opposite side of the wafer, such as 25 microns. The scanning area system 308 adjusts the scanning area, such as to scan to determine the position of the solder joint surface, where the expected height of the solder bump surface is known in order to generate the optimal number of data frames for analysis. In this exemplary embodiment, a scanning area capable of containing 30 data frames is taken in the area where the surface of the solder bump contact is expected. Due to wafer tilt or other factors, the surface coordinates of the solder bump contacts included on one side of the wafer in the 30 frame areas may be higher or lower than the solder bump contacts included in the 30 frame areas on the other side of the wafer. The surface coordinates of the point. Scanning area system 308 can apply the Chinese National Standard (CNS) A4 specification (210X297 mm) on this paper size. -21-Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 200300841 A7 ______B7 _ V. Invention Description (id adjustment scan Area to compensate for such wafer tilt or other factors. The scan area system 308 can also generate applicable scan data, such as by which the surface coordinates of a feature are determined to be positioned near the middle of the scan area. An exemplary In the embodiment, the scanning area includes a brightness data frame generating 30 positions, and the surface coordinates of each pixel are expected to be near the 15th frame. The scanning area system 308 may also determine whether the detected surface coordinates are not expected here. Position, such as in the 15th frame or in the 12th to 15th frames, and adjust the scanning area to accommodate wafer distortion, tilt, or other variations. During operation, the system 300 can analyze pixel brightness changes And save it as a pixel data set. The system 300 can also support data compression techniques, such as viewing the current and previous pixel brightness changes in two (X, Y) arrays. Technology 'Data compression technology that examines two or more sets of data and determines whether the data can be compressed from the change in brightness parameters, using a moving average to determine the surface coordinates corresponding to each pixel, or other applicable surface coordinate positioning techniques. System The 300 can also provide the stored data to other systems for analysis, such as a mirror position system, a pixel surface position system, a pixel map drawing system, or other suitable systems. Figure 4 is a system according to an exemplary embodiment of the invention 400 for determining and controlling the position of a lens or other system or component used to generate interference fringes. System 400 includes a coordinate system 206 and a tracking rate controller 402, a coordinate generation system 404, and a tracking acceleration system 406. Each of the above systems Both can be implemented by hardware, software, or a suitable combination of hardware and software, and one or more software systems operating on a general-purpose processing platform. The tracking rate controller 402 is used to control the size of the paper that defines the coordinates of the pixel data set. Applicable to China National Standard (CNS) Α4 specification (210 X 297 mm) '' --- -22- (please first Note Complete this page and then read it back)

200300841 經濟部智慧財產局員工消合作社印製 A7 B7 五、發明説明(y 系統或組件的追蹤速率。在一例示性的實施例中,追蹤速 率控制器402可用來控制可調鏡片110的追蹤速率,以便控 制掃瞄組件一段長度後所產生的資料框數量。在一例示性 的實施例中,所產生的資料框數量決定系統的解析度,當 所需的解析度較小時,追蹤速率可以增加以減少資料框的 數量。同樣地,追蹤速率控制器402也可用來監視追蹤速率 以確認追蹤速率保持在一定速,或產生補償資料用以改變 追蹤速率,並將補償資料提供給座標產生系統404或其它適 合的系統。 座標產生系統404爲圖素資料的連續框產生Z軸的座標 資料。在一例示性的實施例中,座標產生系統404接收來自 追蹤速率控制器402的追蹤速率資料,並決定沿著Z軸的連 續資料框間期望與實際座標的分離。在此例示性的實施例 中,座標產生系統404可以補償追蹤速率的任何變化,以便 根據所量測到的差異修正實際座標位置。同樣地,座標產 生系統404可以從其它組件或系統(諸如組件載台104)的移動 決定沿著Z軸之連續資料框的座標。追蹤加速系統406允許 經由加速通過預期組件沒有損壞之區域或順序掃瞄偵測以 使檢查組件所需的時間最佳化。在一例示性的實施例中, 組件的特徵可能包括金焊塊或其它需要檢查多種不同缺陷 的特徵。例如,可能出現於金焊塊的缺陷之一是“鼠啃”,所 謂“鼠啃”是指金焊塊中缺少一段。在此例示性的實施例中, 金焊塊中“鼠啃”段的表面是在組件晶粒的底部或附近,如此 ,爲檢知此情況,只需掃瞄組件晶粒表面往上一段很短的 本紙張尺度適用中國國家標準(CNS ) A4規格(2!〇X;297公釐) (請先閱讀背面之注意事項再填寫本頁)200300841 Printed by A7 B7, Consumer Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs. 5. Description of the Invention (y) The tracking rate of the system or component. In an exemplary embodiment, the tracking rate controller 402 can be used to control the tracking rate of the adjustable lens 110. In order to control the number of data frames generated after a length of scanning component. In an exemplary embodiment, the number of data frames generated determines the resolution of the system. When the required resolution is small, the tracking rate can be Increase to reduce the number of data frames. Similarly, the tracking rate controller 402 can also be used to monitor the tracking rate to confirm that the tracking rate remains at a certain speed, or generate compensation data to change the tracking rate, and provide the compensation data to the coordinate generation system 404 or other suitable system. The coordinate generation system 404 generates Z-axis coordinate data for continuous frames of pixel data. In an exemplary embodiment, the coordinate generation system 404 receives tracking rate data from the tracking rate controller 402, And decided to separate the expected data from the actual coordinates between the continuous data frames along the Z axis. Here is an example implementation The coordinate generation system 404 can compensate for any changes in the tracking rate in order to correct the actual coordinate position based on the measured differences. Similarly, the coordinate generation system 404 can be determined from the movement of other components or systems, such as the component stage 104. Coordinates of a continuous data frame along the Z axis. The tracking acceleration system 406 allows to accelerate detection through the area where the component is expected to be undamaged or to sequentially scan for detection to optimize the time required to inspect the component. In an exemplary embodiment In the component, the characteristics of the component may include gold solder bumps or other features that need to be inspected for a variety of different defects. For example, one of the defects that may appear in the gold solder bump is "rat mole". The so-called "rat bug" refers to the lack of In this exemplary embodiment, the surface of the “rat” segment in the gold solder bump is at or near the bottom of the component die, so to detect this, simply scan the surface of the component die upward. A short paragraph of this paper size applies to Chinese National Standard (CNS) A4 (2! 〇X; 297 mm) (Please read the precautions on the back before filling this page)

-23- 200300841 Α7 Β7 經濟部智慧財產局員工消費合作社印製 五、發明説明(2() 長度。如果沒有其它能在金焊塊底與頂部間的Z軸座標上 造成損壞的損壞機制,在掃瞄完底部後,僅需再掃瞄金焊 塊的頂。在此例示性的實施例中,除了金焊塊的頂部區域 ,不需要沿著Z軸產生釋像資料。追蹤加速系統406可以加 速可調鏡片110或其它適合組件或系統的位置,以便"快速前 進”通過不需要檢查的區域,並可另外提供資料給影像資料 系統11 2,不爲這些位置產生影像資料組。按此方式,組件 的產生與檢查可以最佳化,以便集中能力只爲決定組件檢 查是否通過所需的區域產生影像資料。 作業時,系統400控制鏡片或其它適合組件的位置,以 便能精確地追蹤及監視(X,Y,Z)座標。系統400還可加速追蹤 通過不需要檢查的區域,以便減少需要產生與分析的資料 量。 圖5是按照本發明之例示性實施例的系統500,用以決 定組件對應於影像資料之圖素的表面座標。系統500包括圖 素表面位置系統208以及亮度圖繪製系統502、中點分析系 統504及條紋計數系統506,以上每一個系統都可用硬體、 軟體、或軟硬適當的組合,以及在通用處理平台上操作的 一或多種軟體系統執行。 亮度圖繪製系統502繪製連續之圖素資料組的亮度變化 。在一例示性的實施例中,亮度圖繪製系統5 〇 2接收位在座 標(Χ,Υ)位置之圖素在Ζ軸方向之連續的亮度値,以便分析 該圖素在Ζ軸的變化。按此方式,亮度圖繪製系統502執行 逐圖素分析,以便爲每一個圖素決定對應的表面位置。亮 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X297公釐)~ ' -24 - (請先閱讀背面之注意事項再填寫本頁) 200300841 經濟部智慧財產局員工消費合作社印製 A7 B7___五、發明説明(21) 度圖繪製系統5 0 2還可產生使用者可讀取的顯示,諸如允許 使用者看到某圖素沿著Z軸的亮度値變化。 中點分析系統504決定爲每一個圖素所產生之干涉圖案 的中點。在一例示性的實施例中,中點分析系統504可以接 收單一個圖素沿著Z軸之圖素亮度資料組的變化,並分析 圖素亮度資料組的變化以決定中點,諸如,該中點可以是 數學上的中點或是兩端間的中途點。同樣地,中點可以經 由計數決定,或是決定最大及最小亮度値的數量,中點即 出現在此兩端點之間,或是將中點指定在根據其它資料中 點會存在的實際或理論的位置,諸如使用包跡匹配、曲線 匹配、或其它適合的技術。中點分析系統504也能處理圖素 資料組,諸如每一框或所有框之ΝχΜ組圖素資料的子集, 或其它適合的組合。 條紋計數系統506對影像資料組執行條紋計數分析以決 定對應於每一個圖素的組件表面。在一例示性的實施例中 ’條紋計數系統506可以儲存適當的資料,諸如亮度値高於 或低於平均亮度値的大小及方向。在此例示性的實施例中 ’條紋計數系統506可以儲存單組的亮度値,並可根據每一 個連續框沿著Ζ軸的亮度値修改亮度値。條紋計數系統506 可以用來儲存不需要資料的(Χ,Υ,Ζ)陣列,諸如可以根據分 析圖素資料的連續框來決定對應於每一個圖素的表面資料 ’就如同它們被量測。 作業時,系統500執行圖素資料分析以決定組件對應於 ΝχΜ個圖素陣列中每一個圖素的表面。系統5〇〇允許使用者 本紙張尺度適用中國國家標準(CNS ) Α4規格(2ΐ〇χ297公釐)~'' -25- (請先閱讀背面之注意事項再填寫本頁)-23- 200300841 Α7 Β7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of invention (2 () length. If there is no other damage mechanism that can cause damage to the Z-axis coordinate between the bottom and the top of the gold welding block, After scanning the bottom, you only need to scan the top of the gold pad. In this exemplary embodiment, except for the top area of the gold pad, there is no need to generate interpretation data along the Z axis. The tracking acceleration system 406 can Accelerate the position of the adjustable lens 110 or other suitable component or system in order to " fast forward " through areas that do not need to be inspected and provide additional data to the image data system 11 2 without generating image data sets for these positions. Click here In this way, the generation and inspection of components can be optimized, so that the ability to concentrate is only used to determine whether the component inspection generates image data through the required area. During operation, the system 400 controls the position of the lens or other suitable components in order to accurately track and Monitor (X, Y, Z) coordinates. System 400 can also speed up tracking through areas that do not need to be inspected in order to reduce the amount of data that needs to be generated and analyzed. 5 is a system 500 according to an exemplary embodiment of the present invention for determining the surface coordinates of pixels corresponding to pixels of image data. The system 500 includes a pixel surface position system 208, a luminance map drawing system 502, and a midpoint analysis system 504 And fringe counting system 506, each of the above systems can be implemented using hardware, software, or a suitable combination of hardware and software, and one or more software systems operating on a general-purpose processing platform. The luminance map drawing system 502 draws continuous pixel data The brightness change of the group. In an exemplary embodiment, the brightness map drawing system 502 receives the continuous brightness 値 of the pixel at the coordinate (χ, Υ) position in the direction of the Z axis in order to analyze the pixel in the Changes in the Z axis. In this way, the luminance map drawing system 502 performs a pixel-by-pixel analysis to determine the corresponding surface position for each pixel. The paper size of this paper applies the Chinese National Standard (CNS) Α4 specification (210X297 mm) ~ '-24-(Please read the notes on the back before filling out this page) 200300841 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economy A7 B7___ The Ming (21) degree map drawing system 502 can also generate user-readable displays, such as allowing the user to see the brightness change of a certain pixel along the Z axis. The midpoint analysis system 504 decides for each map The midpoint of the interference pattern generated by the pixel. In an exemplary embodiment, the midpoint analysis system 504 can receive the change in the pixel luminance data set of a single pixel along the Z axis, and analyze the pixel luminance data set. To determine the midpoint. For example, the midpoint can be a mathematical midpoint or a halfway point between the two ends. Similarly, the midpoint can be determined by counting, or the number of maximum and minimum brightness chirps. A point appears between these two ends, or the midpoint is specified at an actual or theoretical location where the point would exist based on other data, such as envelope matching, curve matching, or other suitable techniques. The mid-point analysis system 504 can also process pixel data sets, such as a subset of the χM group of pixel data for each box or all boxes, or other suitable combinations. The fringe counting system 506 performs fringe counting analysis on the image data set to determine the component surface corresponding to each pixel. In an exemplary embodiment, the 'strip counting system 506 may store appropriate data, such as the magnitude and direction of the brightness 値 above or below the average brightness 値. In this exemplary embodiment, the 'strip counting system 506 may store a single set of brightness 値, and may modify the brightness 根据 according to the brightness 每一 of each continuous frame along the Z axis. The fringe counting system 506 can be used to store (X, Y, Z) arrays that do not need data. For example, the surface data corresponding to each pixel can be determined according to the continuous frame of analyzing pixel data as if they were measured. During the operation, the system 500 performs pixel data analysis to determine the surface of the component corresponding to each pixel in the N × M pixel array. The system 500 allows users. This paper size applies the Chinese National Standard (CNS) Α4 specification (2ΐ〇χ297mm) ~ '' -25- (Please read the precautions on the back before filling this page)

200300841 A7 ____ B7_ 五、發明説明( (請先閲讀背面之注意事項再填寫本頁) 觀看某圖素或圖素組沿著Z軸之資料顯示的變化,以及執 行中點分析、條紋計數或其它適合的功能,以便將組件對 應於圖素陣列中每一個圖素的表面定位。 經濟部智慧財產局員工消費合作社印製 圖6是按照本發明之例示性實施例所教導的圖素亮度變 化圖600。圖素亮度變化圖600包括鏡片位置軸及亮度軸。 如圖所示,隨著鏡片位置增加,圖素亮度604的變化是平坦 的,直到干涉條紋開始出現。干涉條紋致使圖素的亮度値 增加到最大値,對應到圖素表面602時降至最小,接著再度 增加到最大値,之後又回到中線値。在此例示性的實施例 中,這3條干涉條紋即可決定出對應於圖素的組件表面。熟 悉此方面技術之人士應瞭解,圖素亮度變化602只是例示性 ’實際的圖素亮度變化量測並不需要落在如圖所示的平滑 曲線,且不需要僅只有3條干涉條紋,也可包括大量的變化 。因此,可用諸如圖中包跡606所示的包跡分析來估計圖素 表面602。同樣地,也可以使用包跡的端點,諸如經由決定 圖素表面602對應於包跡的中點。在另一例示性的實施例中 ,可以使用移動平均亮度608,以移動平均下降某預先決定 之量的位置來決定圖素表面602的座標。同樣地,也可以使 用其它適合的分析程序來決定對應於某圖素位置的表面座 標。 圖7是按照本發明之例示性實施例使用干涉量度學決定 組件之表面座標的方法700流程圖。方法700從702開始,在 702產生一干涉層。在一例示性的實施例中,千涉層可以使 用分光鏡、可調鏡片加上白光產生,以便可減少條紋數及 本紙張尺度適用中國國家標準(CNS ) A4規格(210X29*7公釐) -26- 200300841 經濟部智慧財產局員工消費合作社印製 A7 ____B7_五、發明説明(29 簡化定位干涉圖案中點的處理,或也可使用其它適合的干 涉法。接著,該方法前進到704。 在704儲存圖素亮度陣列。在一例示性的實施例中,圖 素亮度陣列是包括ΝχΜ個圖素亮度値的陣列,諸如單位面 積的圖素數量要能提供足夠的解析度以執行組件的檢查。 接著,該方法前進到706。 在706決定Ζ軸最後位置的ΝχΜ個圖素資料陣列是否 已產生。在一例示性的實施例中,沿著Ζ軸的位置產生預 先決定數量的ΝχΜ個圖素資料陣列,諸如,每當所需的解 析度爲0.5微米時,則每0.5微米產生一個,或是以適當的間 距產生。在此例示性的實施例中,組件上具有高於表面向 上延伸X微米的特徵,所產生之資料連續框的公差因數須 爲Χ/2 + /-,以便產生用於繪製組件表面圖的表面資料。如 果最後一層已產生,則方法前進到710。否則,方法前進到 708,在此,系統設定到下一層。在一例示性的實施例中, 是以設定的速率移動鏡片產生影像資料層,如此,鏡片的 速率不改變,但爲儲存下一個ΝχΜ圖素陣列之資料的設定 被改變。同樣地,可追蹤鏡片移動速率的變化以便產生正 確的位置資料,可以使用步進馬達致使鏡片步進到下一個 位置,也可使用其它適合的程序。接著,該方法回到702。 在710,每一個圖素之干涉陣列的中央條紋被產生或被 決定。在一例示性的實施例中,可以分析每一個圖素沿著Ζ 軸的圖素資料組以定位中央條紋,諸如形成一包跡,並決 定出包跡的中點,找到圖素亮度資料變化超出預先決定之 (請先聞讀背面之注意事項再填寫本頁) .裝. 、1Τ 線 本紙張尺度適用中國國家標準(CNS ) Α4規格(2】0Χ297公釐) -27- 經濟部智慧財產局員工消費合作社印製 200300841 A7 _ B7_ 五、發明説明(24 公差的位置,並根據變化的端點決定它的中點,經由決定 從中點變化的大小及方向,並決定亮度値大小的變化是漸 增或漸減,或是以其它適合的方法決定。接著,該方法前 進到7 1 2。 在7 1 2,儲存對應於圖素的組件表面座標。在此例示性 的實施例中,座標可儲存成ΝχΜ陣列,如此,當組件被分 析時陣列被塡入,當塡入陣列的資料足以決定組件允收或 拒收時分析結束。接著,該方法前進到714。 在7 14決定最後一個圖素是否已被分析。在一例示性的 實施例中,分析被量測之圖素的方法可以將圖素群組、分 析個別圖素或其它適合的方法。如果在714決定最後一個圖 素尙未被分析,則方法前進到7 1 6,在此選擇下一個圖素或 圖素群,接著,該方法回到710。否則,如果在714決定最 後一個圖素已被分析,諸如當所有的圖素都已被分析或已 決定組件檢查通過或失敗,接著,該方法前進到71 8。 在7 1 8產生組件的圖,要產生圖的情況諸如是:由於以上 的分析產生了無法判定的影像資料組,作業員需要分析影 像以便決定組件是允收或拒收。 作業時’方法700分析組件以決定組件的3維座標是否 可被接受。方法700允許在得到足以決定組件是否允收的資 料後停止繼續檢查,當資料無法明確決定允收或拒收時, 該方法可識別無法判定的値允許作業員檢視檢查資料以便 做決定。 圖8是按/照本發明之例示性實施例決定組件之表面座標 ^紙張尺度適用中國國家標準(格(210>< 297公釐) (請先閱讀背面之注意事項再填寫本頁)200300841 A7 ____ B7_ V. Description of the invention ((Please read the notes on the back before filling this page) Watch the changes in the data display of a pixel or pixel group along the Z axis, and perform midpoint analysis, fringe counting or other A suitable function to position the component corresponding to the surface of each pixel in the pixel array. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Figure 6 is a graph of pixel brightness changes according to an exemplary embodiment of the present invention 600. Pixel brightness change graph 600 includes the lens position axis and the brightness axis. As shown, as the lens position increases, the change in pixel brightness 604 is flat until interference fringes begin to appear. The interference fringes cause the brightness of the pixels値 increases to the maximum 値, decreases to the minimum when corresponding to the pixel surface 602, and then increases to the maximum 値 again, and then returns to the center line 値. In this exemplary embodiment, these three interference fringes can be determined Corresponds to the component surface of the pixel. Those familiar with this technology should understand that the pixel brightness change 602 is only an exemplary 'actual pixel brightness change measurement and is not required. The smooth curve shown in the figure does not need to have only 3 interference fringes, and can also include a large number of changes. Therefore, envelope analysis such as envelope 606 in the figure can be used to estimate the pixel surface 602. Similarly Ground may also use the endpoints of the envelope, such as by determining that the pixel surface 602 corresponds to the midpoint of the envelope. In another exemplary embodiment, a moving average brightness 608 may be used to decrease the moving average by a predetermined Position of the pixel to determine the coordinates of the pixel surface 602. Similarly, other suitable analysis programs can also be used to determine the surface coordinates corresponding to a certain pixel position. Fig. 7 illustrates the use of interference measures according to an exemplary embodiment of the present invention. A flowchart of a method 700 for determining the surface coordinates of a component. The method 700 starts at 702 and generates an interference layer at 702. In an exemplary embodiment, the interfering layer can be generated using a beam splitter, an adjustable lens, and white light. In order to reduce the number of stripes and the size of this paper, the Chinese National Standard (CNS) A4 specification (210X29 * 7 mm) is applicable. -26- 200300841 Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Print A7 ____B7_ V. Description of the Invention (29 Simplify the process of locating the midpoint of the interference pattern, or other suitable interference methods can be used. Then, the method proceeds to 704. The pixel brightness array is stored at 704. In one example In the embodiment, the pixel luminance array is an array including N × M pixel luminance 値, such as the number of pixels per unit area should provide sufficient resolution to perform component inspection. Then, the method proceeds to 706. At 706 Determines whether N × M pixel data arrays at the last position of the Z axis have been generated. In an exemplary embodiment, a predetermined number of N × M pixel data arrays are generated at positions along the Z axis, such as whenever a desired When the resolution is 0.5 micron, one is generated every 0.5 micron, or it is generated at an appropriate pitch. In this exemplary embodiment, the component has a feature that extends X microns above the surface, and the tolerance factor of the continuous frame of the generated data must be X / 2 + /-in order to generate a surface for drawing the surface of the component. data. If the last layer has been generated, the method proceeds to 710. Otherwise, the method advances to 708, where the system is set to the next level. In an exemplary embodiment, the image data layer is generated by moving the lens at a set rate. In this way, the rate of the lens is not changed, but the setting for storing the data of the next N × M pixel array is changed. Similarly, changes in the lens movement rate can be tracked to produce the correct position data. Stepping motors can be used to cause the lens to step to the next position, or other suitable programs can be used. The method then returns to 702. At 710, the center fringe of the interference array for each pixel is generated or determined. In an exemplary embodiment, the pixel data set of each pixel along the Z axis can be analyzed to locate the central fringe, such as forming an envelope, and determining the midpoint of the envelope to find the change in pixel brightness data. Exceeding the pre-determined (please read the precautions on the reverse side and fill in this page). The size of the paper, 1T line paper is applicable to the Chinese National Standard (CNS) A4 specification (2) 0 × 297 mm. -27- Intellectual Property of the Ministry of Economic Affairs Printed by the Bureau ’s Consumer Cooperatives 200300841 A7 _ B7_ V. Description of the Invention (24 Tolerance position, and its midpoint is determined according to the endpoint of the change. By determining the magnitude and direction of the change from the midpoint, and determining the change in the brightness 値 size is Increasing or decreasing, or determined by other suitable methods. Next, the method proceeds to 7 1 2. At 7 1 2, the component surface coordinates corresponding to the pixels are stored. In this exemplary embodiment, the coordinates may be Stored as a χχ array, so that the array is inserted when the component is analyzed, and the analysis ends when the data entered into the array is sufficient to determine whether the component is acceptable or rejected. Then, the method proceeds to 714. At 7 1 4 Determine whether the last pixel has been analyzed. In an exemplary embodiment, the method of analyzing the measured pixels can be grouped into pixels, analyze individual pixels, or other suitable methods. If determined at 714 The last pixel 尙 has not been analyzed, the method proceeds to 7 1 6 where the next pixel or pixel group is selected, and then the method returns to 710. Otherwise, if it is determined at 714 that the last pixel has been analyzed For example, when all the pixels have been analyzed or the component check has passed or failed, then the method proceeds to 71 8. The component diagram is generated at 7 1 8. The situation to generate the diagram is as follows: due to the above analysis An unidentifiable image data set is generated, and the operator needs to analyze the image to determine whether the component is acceptable or rejected. At work, the method 700 analyzes the component to determine whether the 3D coordinates of the component are acceptable. The method 700 allows sufficient determination If the component accepts the data, the inspection will be stopped. When the data cannot be clearly determined to be accepted or rejected, this method can identify the undeterminable. Allow the operator to view the inspection data. Figure 8 is to determine the surface coordinates of the module according to / according to the exemplary embodiment of the present invention ^ Paper size applies Chinese national standards (Grid (210 > < 297mm)) (Please read the notes on the back before filling (This page)

-28- 200300841 A7 B7 五、發明説明( (請先閲讀背面之注意事項再填寫本頁) 的方法800流程圖。方法800從802開始,在802根據所要的解 析度設定鏡片的追蹤速率。在一例示性的實施例中,每次 掃瞄所產生的資料框數量可以根據追蹤速率及所要的解析 度選擇,如此,表面位置的精確度是使用者所指定之標準 的函數。在另一例示性的實施例中,可以使用圍繞於馬達 周圍的數個光學或磁性量測點做爲編碼器以使馬達的步進 或角位置與沿著被檢查物件之高度軸的座標相關。如此, 當量測到一預先決定的旋轉角度時即產生一觸發。接著, 該方法前進到804。 在804掃瞄被初始化。在一例示性的實施例中,可經由 沿著一軸以預先決定的速率在該軸正或負的方向移動可調 鏡片、使用預先決定之編碼器的步階數、或其它適合的方 法將掃瞄初始化。同樣地,也可經由移動組件載台或其它 適合的系統或裝置將掃瞄初始化。接著,該方法前進到806 〇 經濟部智慧財產局員工消費合作社印製 在806,儲存鏡片目前所在位置的影像資料框,諸如在 接收到由計數編碼器所產生的觸發信號之後。在一例示性 的實施例中,產生影像資料框的速率可遠快於鏡片的移動 ,如此,就不需要產生用於補償的圖素影像資料。同樣地 ,鏡片或其它產生Z軸位置之組件的相對移動在某速率時 發生差異致使需要補償,諸如第一次掃瞄所得到的圖素Z 軸座標與最後一次掃瞄得到的不同,或者,每一個圖素的 亮度資料變化過大,影像資料中可包括此Z軸位置差異的 指示、亮度資料的內插、或其它適合的修正資料。在另一 本紙張尺度適用中.國國家標準(CNS ) A4規格(210X297公釐) -29- 200300841 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明( 例示性的實施例中,可以使用飛動(on-the-fly)處理決定對 應於每一個圖素的表面座標,諸如使用圖素亮度的移動平 均,當平均売度下降一預先決定的量時決定表面座標。在 此例示性的實施例中,儲存每一個圖素資料框,且不必做 接下來步驟814到824的分析。接著,該方法前進到808。 在808決定掃猫是否完成。如果掃猫尙未完成,方法前 進到810決定是否接收到下一次的觸發或其它適合的指示。 如果在808決定掃瞄已完成,則方法前進到812重置鏡片。 在一例示性的實施例中,鏡片只能在一個方向追蹤,因此 ,在掃瞄過一組件後,鏡片必須回到開始位置做掃瞄的初 始化方能提供位置點之可靠的公差估計。同樣地,鏡片可 以在第一個方向移動做第一個組件的掃瞄,從Z = 0開始沿著 Z軸產生影像資料框,於Z =組件特徵最大高度時結束。同 樣地,接下來的掃瞄可以在相反的方向執行,例如從Z =組 件特徵最大高度處開始,到Z = 0處結束。其它適合的程序也 可使用。接著,該方法前進到814。 在8 14初始化圖素的位置。在一例示性的實施例中,圖 素位置的初始化包括從圖素(0,0)開始到圖素(N,M)結束。在 此例示性的實施例中,每一個圖素被個別地、連續地分析 ,或可使用平行處理器平行地分析圖素組。同樣地,圖素 位置也可根據Z軸座標初始化,所有圖素一起平行地被分 析。在又一例示性的實施例中,可以在框掃瞄期間分析圖 素,如此,在量測到圖素亮度的變化大到足以決定對應於 圖素位置之表面的程度後,圖素被分析。接著,該方法前 (請先閱讀背面之注意事項再填寫本頁) •裝· -訂 線 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) -30- 200300841 Α7 __ Β7 經濟部智慧財產局員工消費合作社印製 五、發明説明(27) 進到816。 在8 1 6爲每一個圖素繪製亮度變化圖。在一例示性的實 施例中,爲每一個Z座標値擷取座標(χ,γ)處之圖素的圖素 資料組,將亮度値的改變繪製成圖,諸如經由決定中心線 ’決定與中心線資料的偏差,或其它適合的程序。接著, 該方法前進到81 8。 在8 1 8利用干涉原理決定圖素表面資料。在一例示性的 實施例中,可以根據尋找干涉圖案的中心條紋、根據尋找 干涉區域的中點、根據干涉區域的包跡、使用大小及方向 的設定或經由其它適合的程序決定對應於圖素位置的組件 表面。接著,該方法前進到820。 在820決定最後一個圖素是否已被分析。在一例示性的 實施例中,如果圖素被用來分析損壞,則在820的決定可以 是損壞是否超過預先決定的容許範圍。同樣地,圖素是被 個別地連續檢查,可決定位於(Ν,Μ)位置的圖素是否已被分 析。如果820的決定是最後一個圖素已被分析,則方法前進 到824儲存圖素圖,諸如每一個圖素之表面位置値的圖,可 以用來分析影像資料。否則,方法前進到822增加一圖素, 諸如執行連續圖素分析順序地到下一個圖素,或以其它適 合的方法。 作業時,方法800允許使用干涉量度學決定組件表面的 3維座標。方法800使用ΝχΜ陣列的圖素資料或其它適合的 資料組,並根據干涉圖案在沿著組件之Ζ軸方向軸向移動 時的亮度變化決定每一點的表面位置。此項處理致使當表 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) (請先閲讀背面之注意事項再填寫本頁)-28- 200300841 A7 B7 V. Flow chart of method 800 of the description of the invention ((Please read the precautions on the back before filling this page). Method 800 starts from 802 and sets the tracking rate of the lens according to the required resolution at 802. In an exemplary embodiment, the number of data frames generated by each scan can be selected according to the tracking rate and the desired resolution. In this way, the accuracy of the surface position is a function of the standard specified by the user. In another example In an exemplary embodiment, several optical or magnetic measurement points surrounding the motor can be used as an encoder to make the step or angular position of the motor related to the coordinates along the height axis of the object being inspected. Thus, when A trigger is generated when a predetermined rotation angle is measured. Then, the method proceeds to 804. Scanning is initiated at 804. In an exemplary embodiment, a predetermined rate can be passed along an axis at a predetermined rate. This axis moves the adjustable lens in the positive or negative direction, initializes the scan using a predetermined number of encoder steps, or other suitable methods. Similarly, it can also be performed by moving The component carrier or other suitable system or device will initialize the scan. Then, the method advances to 806. The Intellectual Property Bureau Employee Consumer Cooperative of the Ministry of Economic Affairs prints it at 806 and stores the image data frame where the lens is currently located, such as upon receiving After the trigger signal generated by the counting encoder. In an exemplary embodiment, the rate of generating the image data frame can be much faster than the movement of the lens, so there is no need to generate pixel image data for compensation. Ground, the relative movement of the lens or other component that produces the Z-axis position differs at a certain rate and needs to be compensated. For example, the Z-axis coordinates of the pixel obtained in the first scan are different from those obtained in the last scan. The brightness data of a pixel has changed too much, and the image data may include an indication of the position difference of the Z axis, the interpolation of the brightness data, or other suitable correction data. In another paper standard application. National Standards (CNS) A4 specifications (210X297 mm) -29- 200300841 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs In the illustrative embodiment, on-the-fly processing may be used to determine the surface coordinates corresponding to each pixel, such as using a moving average of the pixel brightness, when the average degree decreases by a predetermined amount Determine the surface coordinates. In this exemplary embodiment, each pixel data frame is stored without having to perform the analysis of the next steps 814 to 824. Then, the method proceeds to 808. At 808, it is determined whether the cat scan is complete. If The scan is not complete, the method proceeds to 810 to determine whether a next trigger or other suitable indication is received. If it is determined at 808 that the scan is complete, the method proceeds to 812 to reset the lens. In an exemplary embodiment The lens can only be tracked in one direction. Therefore, after scanning a component, the lens must return to the starting position and initialize the scan to provide a reliable tolerance estimate of the position. Similarly, the lens can be moved in the first direction to scan the first component, starting from Z = 0 to generate an image data frame along the Z axis, and ending at Z = component feature maximum height. Similarly, subsequent scans can be performed in the opposite direction, starting at Z = component feature maximum height and ending at Z = 0. Other suitable programs can also be used. The method then proceeds to 814. The pixels are initialized at 8-14. In an exemplary embodiment, the initialization of the pixel position includes starting from pixel (0,0) and ending at pixel (N, M). In this exemplary embodiment, each pixel is analyzed individually and continuously, or a group of pixels can be analyzed in parallel using a parallel processor. Similarly, the pixel position can be initialized according to the Z-axis coordinates, and all pixels are analyzed in parallel together. In another exemplary embodiment, the pixels can be analyzed during the frame scan. In this way, after measuring the change in the brightness of the pixels sufficiently to determine the degree of the surface corresponding to the position of the pixels, the pixels are analyzed. . Next, before this method (please read the precautions on the back before filling this page) • Binding ·-Binding This paper size applies Chinese National Standard (CNS) A4 specification (210X 297 mm) -30- 200300841 Α7 __ Β7 Economy Printed by the Consumer Cooperatives of the Ministry of Intellectual Property Bureau V. Invention Description (27) Go to 816. Draw a brightness change map for each pixel at 8 1 6. In an exemplary embodiment, a pixel data set of pixels at coordinates (χ, γ) is captured for each Z coordinate 座, and the change in luminance 値 is plotted, such as via a decision centerline Deviations from centerline data, or other suitable procedures. The method then proceeds to 81.8. At 8 1 8 the pixel surface data is determined using the principle of interference. In an exemplary embodiment, the corresponding pixel may be determined according to the center fringe of the interference pattern, the midpoint of the interference region, the envelope of the interference region, the use size and direction settings, or other suitable programs. Position of the component surface. The method then proceeds to 820. It is determined at 820 whether the last pixel has been analyzed. In an exemplary embodiment, if pixels are used to analyze damage, the decision at 820 may be whether the damage exceeds a predetermined tolerance range. Similarly, the pixels are continuously checked individually to determine whether the pixels at the (N, M) position have been analyzed. If the decision of 820 is that the last pixel has been analyzed, the method proceeds to 824 to store the pixel map, such as a map of the surface position of each pixel, which can be used to analyze the image data. Otherwise, the method advances to 822 to add a pixel, such as performing sequential pixel analysis sequentially to the next pixel, or other suitable method. In operation, the method 800 allows interferometric measurements to be used to determine the 3-dimensional coordinates of the component surface. The method 800 uses the pixel data of the NχM array or other suitable data sets, and determines the surface position of each point according to the brightness change of the interference pattern when it moves axially along the Z-axis direction of the component. This process caused the current paper size to comply with the Chinese National Standard (CNS) Α4 specification (210 × 297 mm) (Please read the precautions on the back before filling this page)

-31 - 200300841 經濟部智慧財產局員工消合作社印製 A7 B7五、發明説明( 面對應到干涉圖案中心位置時發生最大亮度變化。按此方 式,組件表面對應到每一個圖素的位置可以決定,且可產 生組件的3維圖。 圖9是按照本發明之例示性實施例執行組件檢查的方法 900流程圖。方法900使用2維分析執行組件測試,且當2維分 析產生不決的結果或指示須進一步分析時再用3維分析。同 樣地,可以使用方法900對某些影像特徵執行2維分析,對 其它影像特徵執行3維分析,諸如整個組件都使用2維分析 ,但僅其中的一段使用3維分析。 方法900從902開始執行2維掃瞄。在一例示性的實施例 中,執行2維掃瞄可以使用單色光或多色光照射組件,沒有 任何干涉條紋現象。光線可以是相干光或不相干光。接著 ,方法前進到904。 在904分析2維影像資料,諸如使用傳統的影像分析技 術。這些影像分析技術可以2維影像資料中之亮度値的變化 偵測到缺陷。同樣地,可以產生亮度値的直方圖,根據振 幅(excursion)數量、斜率或其它適合之直方圖資料所訂的通 過/失敗標準都可用來分析資料。接著,該方法前進到906。 在906決定資料指示該組件是檢查通過、失敗或無法判 定。如果906的決定是組件通過檢查,則方法前進到908並 結束。否則,方法前進到910。在另一例示性的實施例中, 如果組件失敗’則該組件被拒收,如果該組件的檢查結果 是無法判定,則方法只前進到91 〇。在又一例示性的實施例 中,如果組件檢查失敗,則該組件被拒收,如果該組件的 (請先閱讀背面之注意事項再填寫本頁)-31-200300841 Printed by A7 B7, Employee Cooperative of Intellectual Property Bureau, Ministry of Economic Affairs. 5. Description of Invention (The maximum brightness change occurs when the surface corresponds to the center position of the interference pattern. In this way, the position of the component surface corresponding to each pixel can be determined. 3D diagram of the component can be generated. Figure 9 is a flowchart of a method 900 for performing component inspection according to an exemplary embodiment of the present invention. The method 900 uses 2D analysis to perform component testing, and when the 2D analysis produces inconclusive results Or use 3D analysis when further analysis is required. Similarly, method 900 can be used to perform 2D analysis on certain image features and 3D analysis on other image features, such as 2D analysis of the entire component, but only A section uses 3D analysis. Method 900 performs a 2D scan starting at 902. In an exemplary embodiment, performing a 2D scan can use monochromatic or polychromatic light to illuminate the component without any interference fringes. Light This can be coherent or incoherent light. The method then proceeds to 904. At 904, the 2D image data is analyzed, such as using traditional image analysis techniques These image analysis techniques can detect defects in the luminance 値 changes in the 2D image data. Similarly, a histogram of the luminance 値 can be generated, which is based on the number of amplitudes, slopes, or other suitable histogram data. Both pass / fail criteria can be used to analyze the data. Then, the method proceeds to 906. The decision data at 906 indicates whether the component passed, failed, or could not be determined. If the decision of 906 is that the component passed the check, the method proceeds to 908 and ends Otherwise, the method proceeds to 910. In another exemplary embodiment, if the component fails, the component is rejected, and if the result of the inspection of the component is undeterminable, the method proceeds only to 91 °. In another In the exemplary embodiment, if the component inspection fails, the component is rejected, if the component (please read the precautions on the back before filling this page)

本紙張尺度適用中國國家標準(CNS ) A4規格(210 X 297公釐) -32- 200300841 Α7 Β7 五、發明説明(29) 檢查結果是無法判定,則方法前進到910執行3維分析。 (請先閲讀背面之注意事項再填寫本頁) 在9 10對組件執行3維掃瞄。在一例示性的實施例中是 使用干涉量度學技術執行3維掃瞄,諸如當以能產生干涉圖 案的光照射組件時,產生組件之若干ΝχΜ的圖素資料框。 連續的影像資料框可用來產生組件的3維圖,或可使用其它 適合的3維繪圖技術。接著,該方法前進到912。 經濟部智慧財產局員工消費合作社印製 在912決定組件是否通過、失敗或無法判定。在一例示 性的實施例中,組件會被分析以決定缺陷或裂縫的大小, 諸如缺陷或裂縫的表面積、缺陷或裂縫的體積(諸如材料遺 失或多出的量)、缺陷或裂縫的平均或最大高度或深度、特 徵是否遺失,或其它適合的3維資料分析都可執行。如果在 9 12決定組件通過,則方法前進到914並結束。在另一例示 性的實施例中,如果組件失敗即被拒收,如果組件檢查的 結果是無法判定,則方法只會前進到91 6。在又一例示性的 實施例中,如果組件失敗即被拒收,但如果組件檢查的結 果是通過或無法判定,則方法前進到9丨6供作業員檢視。不 问地τη 方法則進到91 6處爲組件產生影像資料。在—^例示 性的實施例中會產生3維影像供作業員檢視,諸如當組件的 資料是無法判定或介於允收與拒收之間時。接著,該方法 則進到9 1 8,在此提醒作業員檢視影像資料並做出允收或拒 收的決定。接著,該方法前進到92〇,在此決定作業員是否 做了組件通過檢查或檢查失敗的指示。在一例示性的實施 例中,作業員可以使用一或多樣分析工具,諸如形狀工具 、體積工具、顯示可接受或不可接受之損壞標準的樣版, 本紙張尺度適用中國國家標準(CNS ) Μ規格(21〇χ7^羡) ----- - 33- 200300841 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明(3d> 或其它適合資料。如果在920所做的決定是組件通過,則方 法前進到922,組件在此處被允收。否則,該方法前進到 924拒收該組件。 作業時,方法900允許使用2維及3維影像資料分析的順 序檢查組件,如此,可縮短檢查組件所需的時間。方法9〇〇 執行初步的2維分析以找出容易決定組件可允收或拒收的位 置,如果需要額外的分析以便更看淸組件時,則繼續執行3 維分析,諸如當組件是無法判定時。同樣地,如果只是對 通過2維分析的組件執行額外的3維分析,方法900允許只對 第一次決定被允收的組件執行3維分析,不對被決定爲拒收 的組件做不必要的處理。 雖然本文中已詳細描述了本發明之系統及方法的例示 性實施例,但熟悉此方面技術之人士應瞭解,這些系統及 方法可做各種的取代及修改,不會偏離所附申請專利範圍 的範圍與精神。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公麓) (請先閲讀背面之注意事項再填寫本頁」This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) -32- 200300841 Α7 Β7 V. Description of the invention (29) If the inspection result cannot be determined, the method proceeds to 910 to perform 3D analysis. (Please read the precautions on the back before filling out this page) Perform a 3D scan of the component on 9 10. In an exemplary embodiment, a 3-dimensional scan is performed using interference metrology techniques, such as when the component is illuminated with light capable of generating an interference pattern, generating a number of pixel data frames of the component. Continuous image data frames can be used to generate 3D maps of components, or other suitable 3D drawing techniques can be used. The method then proceeds to 912. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs At 912, it is determined whether the component is passed, failed, or cannot be determined. In an exemplary embodiment, the component is analyzed to determine the size of the defect or crack, such as the surface area of the defect or crack, the volume of the defect or crack (such as the amount of material lost or extra), the average of the defect or crack, or Maximum height or depth, whether features are missing, or other suitable 3D data analysis can be performed. If it is decided at 9 12 that the component passes, the method proceeds to 914 and ends. In another exemplary embodiment, if the component fails and is rejected, if the result of the component inspection is undecidable, the method will only advance to 91.6. In another exemplary embodiment, if the component fails, it is rejected, but if the result of the component inspection is passed or cannot be determined, the method proceeds to 9 and 6 for the operator to review. Regardless of the τη method, it goes to 916 to generate image data for the component. In the ^ exemplary embodiment, a 3-dimensional image is generated for the operator to review, such as when the component data cannot be determined or is between acceptable and rejected. The method then proceeds to 9 1 8 where the operator is reminded to review the image data and make a decision on whether to accept or reject. The method then proceeds to 92, where it is determined whether the operator has given an indication that the component has passed inspection or failed inspection. In an exemplary embodiment, an operator may use one or more analysis tools, such as a shape tool, a volume tool, and a template showing acceptable or unacceptable damage standards. The paper dimensions are applicable to the Chinese National Standard (CNS) M Specifications (21〇χ7 ^ 喜) ------33- 200300841 Printed by the Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (3d > or other suitable information. If the decision made at 920 is a component If it passes, the method proceeds to 922, where the component is accepted. Otherwise, the method proceeds to 924 to reject the component. At work, method 900 allows the components to be inspected using the order of 2D and 3D image data analysis, so, Can reduce the time required to inspect components. Method 900 performs a preliminary 2D analysis to find where it is easy to decide whether a component can be accepted or rejected, and if additional analysis is needed to better look at the component, continue to 3 Dimensional analysis, such as when a component is undecidable. Similarly, if an additional 3-dimensional analysis is performed only on a component that passes a 2-dimensional analysis, the method 900 allows only the first decision Accepted components perform 3D analysis without unnecessary processing of components determined to be rejected. Although the exemplary embodiments of the system and method of the present invention have been described in detail herein, those familiar with the technology in this regard It should be understood that these systems and methods can be replaced and modified in various ways without departing from the scope and spirit of the scope of the attached patent application. This paper size applies to the Chinese National Standard (CNS) A4 specification (210X297). (Please read the back first Please pay attention to this page before filling in this page "

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Claims (1)

200300841 A8 B8 C8 D8 々、申請專利範圍1 1·一種用以檢查組件的系統,包括: 影像資料系統,產生影像資料;以及 (請先閲讀背面之注意事項再填寫本頁) 千涉量度學檢查系統,連接到影像資料系統,干涉量 度學檢查系統接收影像資料並根據使用干涉量度學所產生 之表面座標資料來產生檢查通過/失敗的資料。 2 ·如申g靑專利範圍第1項的系統,其中,干涉量度學檢 查系統另包括圖素圖繪製系統,用以接收組件表面資料並 產生表面的圖素圖資料。 3 ·如申請專利範圍第1項的系統,其中,干涉量度學檢 查系統包括売度變化系統’用以接收影像資料並儲存複數 個影像資料的框。 4 ·如申請專利範圍第3項的系統,其中,干涉量度學檢 查系統另包括資料壓縮系統,用以接收組件表面資料並刪 除一或多個圖素資料値。 5 ·如申請專利範圍第1項的系統,其中,干涉量度學檢 查系統包括鏡片位置系統,用以接收鏡片位置資料並使鏡 片位置資料與影像資料相關。 經濟部智慧財產局員工消費合作社印製 6. 如申請專利範圍第1項的系統,其中,干涉量度學檢 查系統另包括追蹤速率控制器,用以產生鏡片位置控制資 料。 7. 如申請專利範圍第1項的系統,其中.,干涉量度學檢 查系統另包括追蹤加速系統,用以產生追蹤速率資料。 8. 如申請專利範圍第1項的系統,其中,干涉量度學檢 查系統包括圖素表面位置系統,用以接收影像資料並產生 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 經濟部智慧財產局員工消費合作社印製 200300841 A8 B8 C8 —— _ D8 六、申請專利範圍 2 圖素表面資料。 9 ·如申請專利範圍第1項的系統,其中的干涉量度學檢 查系統包括亮度繪製系統,用以接收影像資料並產生圖素 亮度繪圖資料。 10·如申請專利範圍第丨項的系統,其中,干涉量度學檢 查系統包括亮度繪製系統,用以接收影像資料並產生圖素 中點資料。 11·如申請專利範圍第丨項的系統,其中,干涉量度學檢 1系統包括條紋計數系統,用以接收影像資料並產生條紋 計數資料。 12.如申請專利範.圍第丨項的系統,其中,干涉量度學檢 查系統包括特徵遺失系統,用以接收表面座標資料,並產 生特徵遺失資料。 13·如申請專利範圍第1項的系統,其中,干涉量度學檢. 查系統包括缺陷體積系統,用以接收表面座標資料並產生 缺陷體積資料。 14. 如申請專利範圍第1項的系統,其中,干涉量度學檢 查系統包括缺陷面積系統,用以接收表面座標資料並產生 缺陷面積資料。 15. 如申請專利範圍第1項的系統,其中,干涉量度學檢 查系統包括缺陷深度/高度系統,用以接收表面座標資料並 產生缺陷深度/高度資料。 16. —種用以檢查組件的方法,包括: 產生組件的兩或多組影像資料; (請先閲讀背面之注意事項再填寫本頁)200300841 A8 B8 C8 D8 々 、 Scope of patent application 1 1 · A system for inspecting components, including: image data system to generate image data; and (please read the precautions on the back before filling this page) The system is connected to the image data system. The interference measurement inspection system receives the image data and generates inspection pass / fail data based on the surface coordinate data generated using the interference measurement. 2 · The system of item 1 of the patent scope, wherein the interference measurement inspection system further includes a pixel map drawing system for receiving component surface data and generating surface pixel map data. 3. The system according to item 1 of the scope of patent application, wherein the interference measurement inspection system includes a degree change system 'for receiving image data and storing a plurality of image data frames. 4 · The system according to item 3 of the patent application scope, wherein the interference measurement inspection system further includes a data compression system for receiving component surface data and deleting one or more pixel data. 5. The system according to item 1 of the patent application scope, wherein the interference measurement inspection system includes a lens position system for receiving lens position data and correlating the lens position data with the image data. Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 6. If the system of the first patent application scope, the interference measurement inspection system also includes a tracking rate controller to generate lens position control data. 7. The system of item 1 in the scope of patent application, wherein the interference measurement inspection system further includes a tracking acceleration system for generating tracking rate data. 8. If the system of the first scope of the patent application, the interference measurement inspection system includes a pixel surface position system to receive image data and generate the paper size applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 200300841 A8 B8 C8 —— _ D8 VI. Patent Application Scope 2 Pixel surface information. 9 · The system according to item 1 of the patent application scope, wherein the interference measurement inspection system includes a brightness rendering system for receiving image data and generating pixel brightness mapping data. 10. The system according to item 丨 of the patent application scope, wherein the interference measurement inspection system includes a brightness rendering system for receiving image data and generating pixel midpoint data. 11. The system according to item 丨 of the patent application range, wherein the interference measurement system 1 includes a fringe counting system for receiving image data and generating fringe count data. 12. The system according to item 丨 of the patent application, wherein the interference measurement inspection system includes a feature loss system to receive surface coordinate data and generate feature loss data. 13. The system according to item 1 of the patent application scope, wherein the interference measurement and inspection system includes a defect volume system for receiving surface coordinate data and generating defect volume data. 14. The system of item 1 of the patent application scope, wherein the interference measurement inspection system includes a defect area system for receiving surface coordinate data and generating defect area data. 15. The system according to item 1 of the patent application scope, wherein the interference measurement inspection system includes a defect depth / height system for receiving surface coordinate data and generating defect depth / height data. 16. —A method for inspecting components, including: generating two or more sets of image data of components; (please read the precautions on the back before filling this page) 本紙張尺度適用中國國家標準(CNS ) A4規格(210 X 297公釐) -36- 200300841 ABCD 六、申請專利範圍3 決定每一組影像資料中之複數個圖素每一個的亮度資 料; (請先閲讀背面之注意事項再填寫本頁) 根據干涉量度學而使用每一個圖素亮度資料的改變來 爲每一個圖素決定表面資料;以及 使用表面資料來產生檢查通過/失敗資料。 17.如申請專利範圍第1 6項的方法,其中,根據干涉量 度學而使用每一個圖素亮度資料的改變來爲每一個圖素決 定表面資料包括爲每一個圖素決定干涉條紋的中心。 1 8 ·如申請專利範圍第1 6項的方法,其中,根據干涉量 度學而使用每一個圖素売度資料的改變來爲每一個圖素決 定表面資料包括根據每一個圖素的最小及最大亮度杳料:爲 每一個圖素決定表面資料。 1 9 ·如申請專利範圍第1 6項的方法,其中,根據干涉量 度學而使用每一個圖素亮度資料的改變來爲每一個圖素決 定表面資料包括: 爲每一個圖素計數干涉條紋的數量;以及 根據干涉條紋的數量爲每一個圖素設定表面資料。 經濟部智慧財產局員工消費合作社印製 20·如申請專利範圍第16項的方法,其中,爲每一組影 像資料中之複數個圖素決定每一個的亮度資料另包括: 爲每一個圖素決定亮度資料的改變是否超過預定値; 以及 .如果改變沒有超過預先決定的値則爲每一個圖素壓縮 亮度資料。 21·如申請專利範圍第16項的方法,其中,根據干涉量 本紙張尺度適用中國國家標準(CNS ) A4規格(21〇χ297公资] ---------— 200300841 A8 B8 C8 D8 六、申請專利範圍4 度學而使用每一個圖素亮度資料的改變來爲每一個圖素決 定表面資料包括: (請先閱讀背面之注意事項再填寫本頁) 爲預定數目的每一個圖素計算移動平均;以及 根據移動平均下降的量大於某預定量時來決定表面資 料。 22· —種用以檢查組件的方法,包括: 相對於組件移動干涉系統的鏡片以便在組件的特徵上 產生改變的干涉圖案; 根據干涉原理而使用複數個圖素中每一個的亮度値改 變來爲每一個圖素決定表面資料; 使用表面資料來產生組件檢查通過/失敗資料。 23·如申請專利範圍第22項的方法,其中,預定的速率 係根據預定的解析度來予以選擇的。 24·如申請專利範圍第22項的方法,其中,預定的速率. 包括第一速率及第二速率。 經濟部智慧財產局員工消費合作社印製 25.如申請專利範圍第22項的方法,其中,預定的速率 包括當產生影像資料時所使用的第一速率及當不產生影像 資料時的第二速率。 _ 2 6 · —種用以檢查組件的系統,該組件上具有以某材料 成形的特徵,該系統包括: 光源,用以產生光線; 分光’用以分光’並將第一*光束在第一'方向導向特 徵及將第二光束導向第二方向; 鏡片,由該材料製成,將第二光束反射回分光鏡並反 本^張尺度適用中國國家標準( CNS ) A4規格(210X297公釐) -38- 200300841 A8 B8 C8 D8 六、申請專利範圍5 射在特徵上;以及 使用第一光束與第二光束之間的干涉來決定特徵的表 面座標。 (請先閲讀背面之注意事項再填寫本頁) 27·如申請專利範圍第26項的系統,其中,特徵爲一焊 塊接點,並且材料爲金。 28·如申請專利範圍第26項的系統,另包括: 影像資料系統,用以產生被第一光束及第二光束照明 之特徵的影像資料; 干涉量度學檢查系統,接收影像資料並產生檢查通過/ 失敗資料。 * 29.—種使用干涉量度學來檢查組件的系統,包括: 圖素表面位置系統,使用干涉量度學產生表面座標資 料;以及 組件檢查系統,接收表面座標資料並產生檢查通過/失 敗資料。 3 0 ·如申g靑專利範圍第2 9項的系統,其中,組件檢查系 統包括特徵遺失系統,用以產生遺失特徵資料。 經濟部智慧財產局員工消費合作社印製 31·如申請專利範圍第29項的系統,其中,組件檢查系 統包括缺陷體積系統,用以產生缺陷體積資料。 3 2·如申請專利範圍第29項的系統,其中,組件檢查系 統包括缺陷面積系統,用以產生缺陷面積資料。 .3 3 ·如申請專利範圍第29項的系統,其中,組件檢查系 統包括缺陷深度/高度系統,用以產生缺陷深度/高度資料。 3 4 · —種使用干涉量度學來檢查組件的方法,包括: 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 200300841 8 8 8 8 ABCD 六、申請專利範圍6 使用干涉量度學產生表面座標資料;以及 根據表面座標資料來產生組件檢查通過/失敗資料。 (請先聞讀背面之注意事項再填寫本頁) 35·如申請專利範圍第34項的方法,其中,根據表面座 標資料來產生檢查通過/失敗資料包括: 決定表面資料超出預定範圍之圖素的數目;以及 如果圖素的數目大於預先決定的數目,則產生特徵遺 失的資料。 3 6·如申請專利範圍第34項的方法,其中,根據表面座 標資料來產生檢查通過/失敗資料包括: 加總每一個表面座標資料與預期表面資料不同之圖素 的體積,以產生總體積;以及 如果總體積大於預先決定的體積,則產生檢查失敗的 資料。 3 7 ·如申請專利範·圍第3 4項的方法,其中,根據表面座 標資料來產生檢查通過/失敗資料包括: 加總每一個表面座標資料與預期表面資料不同之圖素 的面積,以產生總面積;以及 經濟部智慧財產局員工消費合作社印製 如果總面積大於預先決定的面積,則產生檢查失敗的 資料。 38·如申請專利範圍第34項的方法,其中,根據表面座 標資料來產生檢查通過/失敗資料包括: .決定每一個表面座標資料與預期表面資料不同之圖素 的最大深度或高度;以及 如果最大深度或高度大於預先決定的最大深度或高度 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) ^40- ' 200300841 經濟部智慧財產局員工消費合作社印製 A8 B8 C8 D8 _六、申請專利範圍7 ,則產生檢查失敗的資料。 39.如申請專利範.圍第34項的方法,其中,根據表面座 標資料來產生檢查通過/失敗資料包括: 決定每一個表面座標資料與預期表面資料不同之圖素 的平均深度或高度;以及 如果平均深度或高度大於預先決定的平均深度或高度 ,則產生檢查失敗的資料。 4 0. —種用以檢查組件的系統,包括: 2維檢查系統,接收影像資料並產生2維的檢查通過/失 敗資料; 干涉量度學檢查系統,接收影像資料並產生干涉量:度 學檢查的通過/失敗資料;以及 其中,干涉量度學系統在2維檢查系統產生2維檢查通 過/失敗資料之後接收影像資料。 41 ·如申請專利範圍第4 0項的系統,其中,干涉量度學 檢查系統只在2維檢查系統產生2維檢查通過資料後接收影 像資料。 42·如申請專利範圍第40項的系統,其中,干涉量度學 檢查系統只在2維檢查系統產生2維檢查失敗資料後接收影 像資料。 43·如申請專利範圍第40項的系統,其中,工1_ ^ 十涉量度學 檢查系統只在2維檢查系統產生2維檢查無法判… / J疋資料後接 收影像資料。 4 4 ·—種使用干涉量度學來檢查組件的方法 依,包栝: 本紙張尺度適用巾關家轉(CNS) Α4· ( 21()><297公幻 ~: (請先閱讀背面之注意事項再填寫本頁) •裝· 訂 絲_ 200300841 A8 B8 C8 D8 六、申請專利範圍8 執行組件的2維檢查,並產生2維的檢查通過/失敗資料 根據2維檢查的通過/失敗資料執行組件的干涉量度學檢 查。 45·如申請專利範圍第44項的方法,其中,根據2維檢查 通過/失敗資料執行組件的干涉量度學檢查包括只有在2維檢 查的通過/失敗資料指示失敗才執行組件的干涉量度學檢查 〇 46·如申請專利範圍第44項·的方法,其中,根據2維檢查 通過/失敗資料執行組件的干涉量度學檢查包括只有在2維檢 查的通過/失敗資料指·示通過才執行組件的干涉量度學檢:查 〇 47·如申請專利範圍第44項的方法,其中,根據2維檢查 通過/失敗資料執行組件的干涉量度學檢查包括只有在2維檢 查的通過/失敗資料指示無法判定的結果才執行組件的干涉 量度學檢查。 48·—種用以檢查組件的系統,包括': 2維檢查系統’接收影像資料並產生2維的檢查通過/失 敗資料; 干涉量度學檢查系統,接收影像資料並產生干涉量度 學檢查的通過/失敗資料;以及 .干涉系統,具有一可抽取的遮板,當有遮板遮擋時,2 檢查系統接收影像資料,當遮板不遮擋時,干涉量度學系 統連接影像資料。 本紙張尺度適用中國國家樣準(CNS ) A4規格(210X297公董) --·---^-----裝-- (請先聞讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 -42 200300841 經濟部智慧財產局員工消費合作社印製 A8 B8 C8 D8 六、申請專利範圍9 49·如申請專利範圍第48項的系統,其中,干涉系統另 包括一分光鏡,當有遮板遮擋時分光鏡傳送第一光束,以 及,當遮板不遮擋時,分光鏡傳送第一及第二光束。 50. 如申請專利範圍第48項的系統,其中,當2維檢查系 統產生2維檢查通過資料時,遮板保持遮擋。 51. 如申請專利範圍第48項的系統,其中,當2維檢查系 統產生2維檢查失敗資料時,遮板保持遮擋。 52. 如申請專利範圍第48項的系統,其中,當2維檢查系 統產生2維檢查無法判定資料時,遮板保持遮擋。 · 53·—種用以檢查組件的方法,包括: 遮擋干涉系統中的鏡片’以便以光線的第一*光束照明 組件; 接收組件的影像資料並產生2維的檢查通過/失敗資料; 不遮擋干涉系統的鏡片,以便第一光東及第二光束照. 明組件;以及 接收組件的表面資料並產生干涉量度學檢查的通過/失 敗資料。 54.如申請專利範圍第53項的方法,其中,遮擋干涉系 統的鏡片以阻止來自分光鏡的第二光束照明組件。 55·如申請專利範圍第53項的方法,其中,當2維檢查系 統產生2維檢查通過的資料時,不遮擋干涉.系統的鏡片以使 用第一光束及第二光束照明組件。 56·如申請專利範圍第53項的方法,其中,當2維檢查系 統產生2維檢查失敗的資料時,不遮擋干涉系統的鏡片以使 (請先閱讀背面之注意事項再填寫本頁)This paper scale applies Chinese National Standard (CNS) A4 specification (210 X 297 mm) -36- 200300841 ABCD VI. Patent application scope 3 Determine the brightness data of each pixel in each group of image data; (please Read the notes on the back before filling this page.) Use the change in brightness of each pixel to determine the surface data for each pixel based on interference measurement; and use the surface data to generate inspection pass / fail data. 17. The method of claim 16 in the scope of patent application, wherein determining the surface data for each pixel using a change in the luminance data of each pixel according to the interference metric includes determining the center of the interference fringe for each pixel. 18 · The method according to item 16 of the scope of patent application, wherein the change of the data of each pixel is used to determine the surface data for each pixel according to the interference measurement, including the minimum and maximum of each pixel. Brightness data: Determine the surface data for each pixel. 19 · The method according to item 16 of the scope of patent application, wherein the change of the luminance data of each pixel to determine the surface data for each pixel according to the interference measurement includes: counting the number of interference fringes for each pixel Number; and set surface data for each pixel based on the number of interference fringes. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 20 · If the method of applying for the scope of patent No. 16 is used, determining the brightness data of each of the plurality of pixels in each group of image data additionally includes: for each pixel It is determined whether the change of the luminance data exceeds a predetermined threshold; and if the change does not exceed a predetermined threshold, the luminance data is compressed for each pixel. 21 · If the method of applying for the scope of the patent No.16, in which the paper size according to the amount of interference applies the Chinese National Standard (CNS) A4 specification (21〇297297) ---------— 200300841 A8 B8 C8 D8 VI. Applying for a patent scope of 4 degrees and using the changes in the brightness data of each pixel to determine the surface data for each pixel includes: (Please read the precautions on the back before filling this page) for a predetermined number of each image To calculate the moving average; and to determine the surface data based on a decrease in the moving average greater than a predetermined amount. 22 · —A method for inspecting a component, including: moving the lens of an interference system relative to the component to produce a characteristic on the component Changed interference pattern; Use the brightness change of each of a plurality of pixels to determine the surface data for each pixel according to the interference principle; Use surface data to generate component inspection pass / fail data. The method of 22 items, wherein the predetermined rate is selected according to the predetermined resolution. 24. The method of item 22 in the scope of patent application Including the first rate and the second rate. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 25. The method of claim 22 in the scope of the patent application, where the predetermined rate includes the time when image data is generated. The first rate used and the second rate when no image data is generated. _ 2 6 · —A system for inspecting a component, the component has a feature formed by a material, the system includes: a light source for Generates light; splits light 'to split light' and directs the first * beam in the first 'direction to the feature and directs the second beam in the second direction; a lens, made of this material, reflects the second beam back to the beamsplitter and reflects it This standard is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -38- 200300841 A8 B8 C8 D8 6. Application for patent scope 5 on the feature; and using the interference between the first and second beams To determine the surface coordinates of the feature. (Please read the notes on the back before filling this page) 27. If the system of the scope of patent application No. 26, where the feature is a solder bump connection And the material is gold. 28. If the system under the scope of the patent application is No. 26, it also includes: an image data system for generating image data of the features illuminated by the first and second light beams; an interference metrology inspection system, receiving Image data and inspection pass / fail data. * 29.—A system for inspecting components using interference metrology, including: a pixel surface position system that generates surface coordinate data using interference metrology; and a component inspection system that receives surface coordinates Data and produce inspection pass / fail data. 30 • The system of item 29 in the scope of the patent application, where the component inspection system includes a missing feature system to generate missing feature data. Printed by the Employees' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 31. If the system of the scope of patent application No. 29, the component inspection system includes a defect volume system to generate defect volume data. 3 2. The system according to item 29 of the patent application scope, wherein the component inspection system includes a defect area system for generating defect area data. .3 3 · The system according to item 29 of the patent application, wherein the component inspection system includes a defect depth / height system for generating defect depth / height data. 3 4 · —A method of inspecting components using interference metrology, including: This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) 200300841 8 8 8 8 ABCD VI. Application for patent scope 6 Use of interference metrology Generating surface coordinate data; and generating component inspection pass / fail data based on the surface coordinate data. (Please read the precautions on the back before filling out this page) 35. For the method of applying for the scope of patent No. 34, which generates inspection pass / fail data based on the surface coordinate data, including: determining the pixels whose surface data exceed the predetermined range The number of pixels; and if the number of pixels is greater than a predetermined number, data with missing features is generated. 36. The method according to item 34 of the scope of patent application, wherein generating pass / fail data based on surface coordinate data includes: summing up the volume of each pixel whose surface coordinate data differs from the expected surface data to generate a total volume ; And if the total volume is greater than a predetermined volume, data for failed inspections are generated. 3 7 · If the method of applying for a patent ranges from item 34, in which the inspection pass / fail data is generated based on the surface coordinate data includes: summing up the area of each pixel whose surface coordinate data differs from the expected surface data to Generate the total area; and printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. If the total area is larger than the predetermined area, the data of inspection failure will be generated. 38. The method of claim 34, wherein generating pass / fail data based on surface coordinate data includes: determining the maximum depth or height of each pixel whose surface coordinate data differs from the expected surface data; and if The maximum depth or height is greater than the predetermined maximum depth or height. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) ^ 40- '200300841 Printed by the Employees ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A8 B8 C8 D8 _6 If the scope of patent application is 7, the inspection failure data will be generated. 39. The method of claim 34, wherein generating pass / fail data based on surface coordinate data includes: determining the average depth or height of each pixel whose surface coordinate data differs from the expected surface data; and If the average depth or height is greater than a predetermined average depth or height, data that fails to check is generated. 4 0. — A system for inspecting components, including: a 2-dimensional inspection system that receives image data and generates 2-dimensional inspection pass / fail data; an interference metrology inspection system that receives image data and generates interference quantities: metrological inspection Pass / fail data; and the interference measurement system receives the image data after the 2-dimensional inspection system generates the 2-dimensional inspection pass / fail data. 41 · If the system is under the scope of patent application No. 40, the interference measurement inspection system only receives the image data after the 2D inspection system generates the 2D inspection pass data. 42. The system according to item 40 of the scope of patent application, wherein the interference measurement inspection system only receives image data after the 2D inspection system generates 2D inspection failure data. 43. If the system of the scope of patent application is No. 40, among which the 1-dimensional measuring inspection system only produces 2D inspections that cannot be judged by the 2D inspection system ... / J 疋 receives the image data after the data. 4 4 · —A method for inspecting components using interference metrology, including: The paper size is suitable for towels (CNS) Α4 · (21 () > < 297 Public Magic ~: (Please read the back first) Please pay attention to this page before filling in this page) • Binding and Stitching _ 200300841 A8 B8 C8 D8 VI. Patent Application Range 8 Perform 2D inspection of components and generate 2D inspection pass / fail data. Pass / fail according to 2D inspection Interference measurement inspection of data execution components. 45. The method according to item 44 of the patent application, wherein the interference measurement inspection of execution components based on the 2-dimensional inspection pass / fail data includes the pass / fail data indication only in the 2-dimensional inspection. Interferometry inspection of the component is performed only if it fails. 46. The method as described in item 44 of the patent application scope, wherein performing the interference metrology inspection of the component based on the 2-dimensional inspection pass / fail data includes passing / failing only in the 2-dimensional inspection. The data indicates that the interference measurement of the component is performed only after the test is passed: check 47. If the method of the scope of patent application is 44, the pass / fail data execution group is based on the 2-dimensional inspection. Interferometry inspection includes performing interferometry inspection of components only if the pass / fail data of the 2-dimensional inspection indicates an undeterminable result. 48 · —A system for inspecting components, including ': 2-dimensional inspection system' reception Image data and generate 2D inspection pass / fail data; Interferometry inspection system, receive image data and generate pass / fail data for interference metrology check; and. Interference system, with an extractable mask, When the board is blocked, the 2 inspection system receives the image data, and when the shield is not blocked, the interference measurement system connects the image data. This paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 public director) ------- ^ ----- Pack-(Please read the precautions on the back before filling out this page) Order Printed by the Employees 'Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs-42 200300841 Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A8 B8 C8 D8 VI. Application scope 9 49. For the system under item 48 of the scope of patent application, the interference system also includes a beam splitter. The light mirror transmits the first light beam, and when the shutter is not blocked, the beam splitter transmits the first and second light beams. 50. For example, the system of the 48th aspect of the patent application, wherein when the 2D inspection system generates a 2D inspection pass When the data is applied, the shutter remains blocked. 51. For example, the system of item 48 in the scope of patent application, where the 2D inspection system generates the 2D inspection failure data, the shield remains in the area of the application. 52. A system in which the shutter remains occluded when the 2-dimensional inspection system generates data that cannot be determined by the 2-dimensional inspection. · 53 · —A method for inspecting a component, including: shielding a lens in an interference system so as to illuminate the component with the first * beam of light; receiving image data of the component and generating 2D inspection pass / fail information; not blocking The lens of the interference system, so that the first light beam and the second light beam illuminate the component; and receive the surface data of the component and generate the pass / fail data of the interference metrology inspection. 54. The method of claim 53, wherein the lens of the interference system is blocked to prevent the second beam illumination component from the beam splitter. 55. The method according to item 53 of the patent application scope, wherein when the 2-dimensional inspection system generates the data passed by the 2-dimensional inspection, it does not block the interference. The lens of the system uses the first beam and the second beam to illuminate the component. 56. If you apply for the method in the 53rd scope of the patent application, when the 2D inspection system generates 2D inspection failure data, do not block the lens of the interference system so that (please read the precautions on the back before filling this page) -43- 200300841 A8 B8 C8 _________ 08 六、申請專利範圍1〇 用第一光束及第二光束照明組件。 (請先閲讀背面之注意事項再填寫本頁) 57. 如申請專利範圍第53項的方法,其中,當2維檢查系 統產生2維檢查無法判定的資料時,不遮擋干涉系統的鏡片 以使用第一光束及第二光束照明組件。 58. 如申請專利範圍第1、26、29、40或48項的系統,其 中,該組件爲矽晶圓、晶粒、薄膜框上的矽晶圓、薄膜框 上的晶粒、封膠中的晶粒、晶粒托架上的晶粒、輸送帶上 的晶粒、托盤上的晶粒、模具中的晶粒、半導體組件、晶 片大小的封裝組件、有焊塊的晶圓、以及具有球狀柵格陣 列的晶粒的其中之一。 59. 如申請專利範圍第16、22、34、44或53項的方’法 ,其中,該組件爲矽晶圓、晶粒、薄膜框上的矽晶圓、薄 膜框上的晶粒、封膠中的晶粒、晶粒托架上的晶粒、輸送 帶上的晶粒、托盤上的晶粒、模具中的晶粒、半導體組件· 、晶片大小的封裝組件、有焊塊的晶圓、以及具有球狀柵 格陣列的晶粒的其中之一。 經濟部智慧財產局員工消費合作社印製 本紙張尺家標準(CNS ) A4規格(210X297公釐) _ 44 _-43- 200300841 A8 B8 C8 _________ 08 VI. Scope of patent application 1 Use the first beam and the second beam to illuminate the component. (Please read the precautions on the back before filling this page) 57. For the method of applying for the scope of patent No. 53, when the 2D inspection system generates data that cannot be determined by the 2D inspection, the lens of the interference system is not blocked for use The first light beam and the second light beam illumination component. 58. If the system of claim 1, 26, 29, 40 or 48 is applied for, the component is a silicon wafer, a die, a silicon wafer on a thin film frame, a die on a thin film frame, a sealant Die, die on carrier, die on conveyor, die on tray, die in mold, semiconductor component, wafer-sized package, wafer with solder bump, and One of the grains of a spherical grid array. 59. If the method of claim 16, 22, 34, 44 or 53 is applied, the component is a silicon wafer, a die, a silicon wafer on a thin film frame, a die on a thin film frame, a package Die in the glue, die on the die carrier, die on the conveyor belt, die on the tray, die in the mold, semiconductor components, wafer-sized package components, wafers with solder bumps And one of crystal grains having a spherical grid array. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper ruler standard (CNS) A4 specification (210X297 mm) _ 44 _
TW091134653A 2001-12-05 2002-11-28 System and method for inspection using white light interferometry TW200300841A (en)

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PCT/US2001/043178 WO2003058163A1 (en) 2001-12-05 2001-12-05 System and method for inspection using white light intererometry

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