TH8939B - Copper etching solution additive - Google Patents

Abstract

Copper etching solution additive For use with aqueous alkaline, ammonia, colcupric chloride etching agents. Including many compounds Each of which shows that Stabilizes the state of copper (I). Compounds discovered by this invention include iodide ions such as potassium iodide, ammonium iodide, sodium iodide, calcium iodide. And magnesium Other copper (I) stabilizers discovered by this invention include some water-soluble salts containing sulfur, such as thiocyanate ions (eg thiocyanate). Ion (such as ammonium cyanate, sodium thiocyanate, magnesium thiocyanate and calcium thiocyanate), and thiosulfate. Ions (such as ammonium, thiosulfate, potassium, thiosulfate, sodium thiosulfate, magnesium thiosulfate, and calcium thiosulfate) were studied. Marking for various concentrations of alkaline, ammonia, chlorophyll, chloride, iodide, ammonium thiocyanate and sodium thiosulfate. The luck of controlled trials Showed that the addition of the compound Any one of these compounds, at a concentration of up to approximately 1,200 mg / L, is added to the alkaline, ammonia, colcupric chloride etching solution, resulting in a 20% increase in the engraving rate - 130. %

Claims (9)

1. Etch solvent, alkaline, ammonia, coldepric chloride in water with accelerated additive. Milling selected from a group containing copper stabilizers (1) has been stabilized. Large enough to increase the etching rate of the said liquid than the same type of etching fluid that There is a minimum of 40 percent free of such additives. 2. Etch etiquette according to claim 1 that such additives are compounds selected from the iodide group. Thiocyanate ion and thiosulfate ion 3. etch etching agent according to claim 1 that such additive is Potassium iodide 4. etch etch according to claim 1 that such additive is Ammonium thiocyanate 5. etch etching agent according to claim 1 that the aforementioned additive is Sodium thiosulfate 6. Etching fluid according to claim 1 that contains the said additive less than 1200 mg / l of the said solution 7. Clause 6 that contains The aforementioned additive is in the above 50 mg / l volume. 8. etching agent according to claim 6 that contains such additive in the volume less than 700 mg / l 9. etching solution. Clause 6 in which an additive is less than 500 mg / l in the aforementioned solution 1 0. etch etch 7 selected from the group consisting of Potassium iodide Ammonium iodide Sodium iodide Calcium iodide and magnesium iodide 1 1. etch etch solution 2 selected from the group containing ammonium thiocyanate, potassium, thiocyanate. Nate Sodium thiocyanate, magnesium thiocyanate and calcium thiocyanate 1 2. Sculpting solution according to Claim 2, selected such additives from the group consisting of: Ammonium Thiosulfate Po-Tassium Thiosulfate Sodium thiosulfate Magnesium thiosulfate And calcium thiosulfate 1 3. etch etching agent 6 selected from the group containing thiocyanate ion and thiosulfate ion 1 4. etching solution An alkaline, ammonia, chloride, chloride in water with additives Accelerates selected from a group containing iodide ions, thiocyanate ions, and thiosulfate ions. There is a sufficient amount of such additive to increase the etching rate of the said solution. The etching rate of the same etching liquid without the aforementioned additives 1 5. Etch etiquette 14 with such additive is less than 1200 mg / l and above 50 mg. / L 1 6. Etching fluid according to claim 14 selected additives from the group containing potassium iodide, ammonium cyanate and sodium thiosulfate 1. 7. Claim etching 16 containing such additive less than 1200 mg / l and above 50 mg / l 1 8. etch etch 14 containing such additives. Prescribed in quantities below 700 mg / l and above 100 mg / l 1 9. etch etch 17 with such additives lower than 700 mg / l and above 100 mg / l. L. R 2 0. Method for accelerating the etching rate of alkaline ammonium col Q-pricchloride in water suitable for additive applications. The method consists of Adding a catalyst additive selected from a group containing a stabilizer (I) stabilizer, add such additive to the etching agent. In sufficient quantities to increase the bite rate The etch of the solution is higher than that of the same etch solution without such additive 2. 1. Method according to claim 20 in which the additive is a selective compound from the group containing iodithiocyanate ion and thiosulfate ion 2. 2. Method according to claim 21 selected additives from the group containing potassium iodide, ammonium iodide. Sodium Iodide, Calcium Iodide, Magnesium Iodide, Ammonium Thiocyanate, Potassium Thiocyanate, Sodium Thiocyanate, Magnesium Thiocyanate, Calcium Thiocyanate. Oxyanate, ammonium, thiosulfate, potassium, thiosulfate, sodium thiosulfate, magnesium thiosulfate and calcium thiosulfate 2. 3. Method according to claim 21 where such additives are lower than 1200 mg / l and above 50 mg / l 2. 4. Method according to claim 21, adding such additive to the etching fluid. In sufficient quantities to increase the rate The etching of the solution is at least 40 percent higher than that of the same type without additives. 2 5. Method for Claim 20 which consists of Provide a copper-clad printed circuit board with a shield. Reacts with etching fluids and calais, ammonia, colcupric chloride, in water with etching catalysts. 2 6. Method according to claim 25 in which the additive is a selected compound from a group containing salt iodide, thiocyanate ion and thiosulfate ion 2. 7. Method according to claim 26 selected additives from the group containing potassium iodide, ammonium iodide, sodium iodide, calcium iodide, magnesium iodide. Ammonium Thiocyanate, Potassium Thiocyanate, Sodium Thiocyanate, Magnesium Thiocyanate, Calcium Thiocyanate, Ammonium Thiosulfate, Potassium Calcium thiosulfate, sodium thiosulfate, magnesium thiosulfate, and calcium thiosulfate 2. 8. Method according to Claim 26 where such additive is less than 1,200 mg / L and above 50 mg / L 2. 9. Method according to claim 26 that there is sufficient amount of such additive in the etching fluid to increase Solution etching rate It is higher than that of the same etch solution without such additives. Say at least 40 percent