TH85884B - Circuit board - Google Patents

Abstract

The invention here provides a wired circuit board that can reduce transmission loss. With its simple layer structure, it also exhibits excellent long-term reliability. By preventing the occurrence of ions movement between the metal foil and the Insulation to improve the adhesion between the metal foil and the insulating layer and the electrical conductivity of the Better conductors A metal support panel was prepared and a thin metal membrane was placed on the panel. Metal supports by metal putty or electroplating. Metal foil is prepared on the membrane. Thin metal one by electroplating A second thin metal membrane is prepared over the foil. Metals and metal support panels by electroless plating or metal plastering. Insulated base layer Was prepared on a second thin metal membrane Conductive patterns are defined as the per circuit pattern. Wires on such insulated base pieces An insulating cover is prepared on the insulated base layer. To cover the pattern of the wiring circuit.

Claims (2)

1. A circuit board to the sight consisting of - a metal backing - a thin metal membrane that is placed on the metal support - a metal foil formed on one such thin metal membrane - a metal membrane. A second thin layer prepared on such metallic foil - an insulating layer prepared on such a second thin metal membrane, and - a conductive pattern prepared on the layer. That is such an insulator 2. The circuit board is wired in accordance with claim 1 where the metallic foil is made of copper and membranes. Such a second thin metal