TH79863A - Tool for wire binders - Google Patents

Abstract

DC60 (16/03/53) A wire bonding apparatus for connecting the terminals of a semiconductor chip (43) to the leads of a lead frame by means of a wire or nub attached to the semiconductor chip backing, comprising a means for applying a DC pulse to the wire or nub, a means for detecting the response waveform from the wire or nub applied to the DC pulse, and a means for determining whether the wire or nub has been successfully bonded by comparing the response waveform with the response waveform of an unsuccessful bond obtained by applying a DC pulse to the unsuccessfully bonded wire or nub. A wire bonding apparatus for connecting the terminals of a semiconductor chip (43) to the leads of a lead frame by means of a wire or nub attached to the semiconductor chip backing. The conductor shall comprise a means of applying a DC pulse to apply the DC pulse to the wire or node, a detection means of detecting the response waveform from the wire or node to which the DC pulse is applied, and a classification means of determining whether the wire or node has been successfully bonded by comparing the response waveform with the response waveform of an unsuccessful bond obtained by applying the DC pulse to the unsuccessfully bonded wire or node.

Claims (6)

Disclaimers (all) that will not appear on the advertisement page: 1. A tool for wire binders to make the electrodes connection of semiconductor chips. The conductors of the guide frame are carried out by means of wire or convex binders with the pads of the semiconductor chip, which are composed of Way of application of DC pulses To apply a DC pulse to a wire or bulge, a sensing pathway to detect the response waveform from a wire or bulge. It is applied to DC pulses and pathways for identification of either wire or bulge. Given the bonded connection is successful or not? By comparing the response waveform with the Response of unsuccessful binders obtained by applying DC pulses to Unsuccessful binder wire or blister 2. Instrument for wire bonding according to claim 1, where the DC pulse application method is designed for the application of pulses. DC with capacitors via variable resistors. Including with a wire or blister convex by Through the food side The sensing path is designed to detect the response waveform from the collector. Such charge The response waveform from the aforementioned wire or the aforementioned bulge and the variable resistor has been modified to yield the product of the It is obtained by subtracting the electric capacity of the object to be detected from the capacitance of one side of the Such wire Or such a bulge And the resistance of such a resistor Almost equal to Product of the capacitance of such capacitors And the resistance of such variable resistors 3. Tools for bonding wires according to claim No. 1 or No. 2, provided that the detection path has a circuit for shaping. Or processing Such response waveform 4. Tools for bonding wires according to claim 3, where such circuit shaping or waveform processing There will be a circuit where the response waveform The response is amplified by the differential amplifier after the differential processing. And the waveform that has been Expanded, filtered and transformed into a rectangular waveform. Or triangular waveform 5. Apparatus for bonding wire according to any one of the claims 1 to 4, whereby such classification method is performed in the classification by comparing the threshold value. Change one value Obtained by multiplying the such unsuccessful binder response waveform by the threshold coefficient with the said response waveform. 6. A tool for wire binders to make the electrodes connection of semiconductor chips. Lead to the guides of the guiding frame by means of wire or convex bonding to the pads of the semiconductor chip, which are included. Way of application of DC pulses To apply a DC pulse to a wire or bulge, a sensing pathway to detect the response waveform from a wire or bulge. It is applied to DC pulses and its classification to determine whether the wire is Or such a bump is successful Success in binder or not. By such classification method This includes the various stages of application of DC pulses to the wire. Or such a bulge In applied way Use such a DC pulse Before the above wire Or such a bulge Will touch the electrodes of the semi-substance chip Conductors to detect unsuccessful bonding response waveforms from the said wire. Or such a nodule by the means of detection Application of DC pulses to such wires Or such a bulge In applied way Use such a DC pulse When such a wire Or such a bulge touch the electrodes of the semiconductor chip. To detect a successful binder response waveform from the said wire or the bulge. With such detection methods The threshold coefficient was calculated by using a non-binding binder response waveform. Achieved such success And such a successful binder response waveform Application of DC pulses to such wires Or such a bulge In applied way Use such a DC pulse After making such a wire Or such blister blisters Solder with electrodes Of semiconductor chips To detect the response waveform from the said wire Or such a bulge as well The methods of detection and comparison of the response waveforms with the threshold values obtained by waveform multiplication. The response of such an unsuccessful binder with the threshold coefficient.