TH51119A - Methods for the manufacture of heat exchangers - Google Patents

Abstract

DC60 (08/11/44) Low melting point metals like Zn are sprayed onto the flat surface (3a) of the aluminum flat tube (3) to form the coating. The metal sprayed (15) on it immediately after the extrusion of the inner flat tube. Immediately afterwards, the solder foil (11) was attached to a mass. Same goes for the sprayed metal coating (15). The resulting flat tube (3) with the solder foil was combined with the fluted ball fins (4) to form the temporary assembly. Later the evil assembly This time, it was heated to a preset temperature to solder tubes (3) and fins (4) to form a metal heat exchanger core with a melting point. Low may be sprayed onto both the flat surface (3a) of the flat tube and the surface of the solder foil (11). As a result, it becomes possible to obtain a lighter flat fin and provide a reduction Material cost A metal with a low melting point, such as Zn, is sprayed onto the flat surface (3a) of the aluminum flat tube (3) to form the coating. The metal sprayed (15) on it immediately after the extrusion of the flat tube, and immediately afterwards the solder foil (11) was attached to a mass. Same goes for the sprayed metal coating (15). The resulting flat tube (3) with the solder foil was combined with the fluted ball fins (4) to form the temporary assembly. Later the evil assembly This time, it was heated to a preset temperature to solder tubes (3) and fins (4) to form a metal heat exchanger core with a melting point. Low may be sprayed onto both the flat surface (3a) of the flat tube and the surface of the solder foil (11). As a result, it becomes possible to obtain a lighter flat fin and provide a reduction Material cost

Claims (11)

1. The method for manufacturing heat exchangers consists of the following steps: rolling aluminum material into flat tubes, which form the heat exchanger tubes; bonding the solder foil to the tubes via a metal coating sprayed onto the flat surface of the tubes immediately after rolling; this metal coating has a melting point lower than the melting point of the solder foil; assembling the flat tubes with the solder foil onto fins; and heating the tubes with the solder foil and fins to melt the solder foil and connect the fins to the tubes. 2. The method for manufacturing heat exchangers involves several steps: rolling aluminum material into flat tubes to form the heat exchanger tubes; immediately applying solder foil to the flat surface of the tubes after rolling; spraying metal onto the flat surface of the tubes and/or the surface of the solder foil at the time of application to form a metal coating. This metal has a lower melting point than the solder foil. The solder foil is then pressed onto the flat surface of the tubes to adhere it through the sprayed metal coating. The tubes with the solder foil are then assembled with fins. Finally, the tubes with the solder foil and the fins are heated to melt the solder foil and fuse them together. 3. Method for manufacturing heat exchangers as specified in Claim 1 or 2. Herein, Zn is used as the said metal to be sprayed. 4. Methods for manufacturing heat exchangers as specified in Claim 1 or 2 herein, the total amount of such metal to be sprayed is within the range from 3 g/m² to 50 g/m². 5. Methods for manufacturing heat exchangers as specified in Claim 1 or 2 herein, the total amount of such metal to be sprayed shall be within the range from 5 g/m² to 50 g/m². 6. Methods for manufacturing heat exchangers as specified in Claim 1 or 2 herein, whereby the width of such soldered foil is one-fourth or more of the width of such flat tube. 7. Methods for manufacturing heat exchangers as specified in Claim 1 or 2 herein, where the width of such soldered foil is half or greater than the width of such flat tube. 8. Methods for manufacturing heat exchangers as specified in Claim 1 or 2 herein, the thickness of such solder foil falls within the range from 2 to 100 mm. 9. Methods for manufacturing heat exchangers as specified in Claim 1 or 2 herein, the thickness of such solder foil falls within the range from 2 to 40 mm. 10. Method for fabricating heat exchangers as specified in Claim 1 or 2 herein, such foils consist of 5 to 20 wt% of Si, 0 to 5 wt% of Zn, 0 to 0.5 wt% of In, and a balance of Al and impurities. 11. Methods for manufacturing heat exchangers as specified in Claim 1 or 2 herein, where the average diameter of the grains forming the solder foil is 20 mm or less.