TH42042A - Fluorometric method for optimizing washing and recovery processes in semiconductor chip manufacturing. - Google Patents

Abstract

DC60 (22/09/49) Method for determining cleanliness of wafers by fluorometric measurements. Add in solution for washing wafer, semi-conductor chip A clean chip will have an indication, namely the concentration of what. The added contamination will begin to remain constant as the chip wash process continues. How to bring the water drained from The process of washing, reusing or recycling is most beneficial. By this method, the impurity was accurately measured in water, the method for determining the cleanliness of the wafer by fluorometric measurement, determination of the impurity in the wafer washing solution, semiconductor chips. A clean chip will have an indication that the increased impurity concentration will begin to stabilize as the chip wash process continues. The most useful way to reuse or recycle the water drained from the washing process. By this method, the impurity in the water was accurately measured.

Claims (9)

1.How to improve the efficiency of semiconductor chip cleaning (semiconductorchip) during the manufacture of semiconductor chips. This includes the following steps: a) Cleaning of the semiconductor chip by washing process to remove impurities from the chip surface by repeatedly dipping the chip. Into a solution of acacia for washing b) measurement of fluorometric rinsing solutions for impurities containing fluorescence while dipping the chip to determine the concentration of such impurities in the rinsing solution. c) the correlation of the fluorometric values for the impurity and the concentration of the impurity. d) observation of the increased impurity concentration during the washing process as defined in step c) and e) determination of the chip clean This is because the completion of the rinsing process can be indicated when the impurity concentration in the stop solution increases with step d) and begins to remain constant. 2. Method according to claim 1 by fluorometric measurement is a fluorescence technique. And the measurement has at least one value of fluorescence emission. 3. Method according to claim 1, where cleaning occurs after the polishing process in the semiconductor chip manufacturing. 4. Method according to claim 1, where the chips are soaked in succession in the rinsing solution in series. 5.How to improve the efficiency of cleaning semiconductors during semiconductor chip manufacturing. This includes the following steps: a) Cleaning of the semiconductor chip by washing process to remove impurities from the chip surface by repeatedly spraying the chip. With a solution of Acquies for washing b) Collecting used rinsing solution washed from chips. c) measurement of the aforementioned rinsing solution in a fluorometric way. To find fluorescent impurities To determine the concentration of such impurities in the said rinsing solution. d) the determination of the correlation between the fluorometric values for the impurity. With the concentration of said impurity e) observation of the increase in the concentration of impurity during the washing process as specified in step d) and f) determination of the cleanliness of the chip. This is because the completion of the rinsing process can be indicated when the impurity concentration in the rinsing solution has stopped increasing with the procedure. e) and has a constant 6. Method according to claim 5 by fluorometric measurement is a fluorescence technique. And the measurement has at least one value of fluorescence emission. 7. Method according to claim 5, where the cleaning occurs after the polishing process in the semiconductor chip manufacturing. 8.Method for optimizing the process of cleaning semiconductors during semiconductor chip manufacturing. It consists of the following steps: a) The semiconductor chip cleaning is done by a washing process to remove impurities from the chip surface by repeatedly dipping the chip. Into a solution of acacia for washing b) Measurement of fluorometric flushing solution for impurities containing fluorescence. c) the correlation of the fluorometric values for the impurity. With the concentration of said impurity and d) determination of whether the rinsing solution contains impurities in an impurity higher or lower than the pre-established acceptable threshold concentration for such impurity. e) the rinsing of the rinsing solution if the concentration of the said impurity is below the acceptable threshold concentration and f) the disposal of the rinsing solution. If the concentration of the said impurity is higher than the acceptable threshold concentration, 9. How to optimize the cleaning process of semiconductor chips during semiconductor chip manufacturing. This includes the following steps: a) Cleaning of the semiconductor chip by washing process to remove impurities from the chip surface by repeatedly spraying the chip. With a solution of Acquies for washing b) Collecting used rinsing solution rinsed from chips c) measurement of the rinsing solution in a fluorometric basis for impurities containing fluorescence. To determine the concentration of such impurities in the said rinsing solution. d) the determination of the correlation between the fluorometric values for the impurity. With the concentration of said impurity e) determination of whether such a used rinsing solution contains such impurity in a concentration higher or lower than the pre-established acceptable threshold concentration for that impurity, and f) the conduction of the solution. For the rinses to be reused, if the concentration of the impurity is lower than the acceptable concentration, the shift starts to change. g) Disposal of the rinsing solution. If the concentration of the said impurity is higher than the acceptable threshold concentration,