TH36196A - New chemical mechanics interruption For the layer of material that is separated that is a silicon or silicon derivative. - Google Patents

Abstract

DC60 (24/06/42) Process for chemical mechanics polishing. Of the layer of the separated material Come in silicon Or silicon derivatives.In this regard, abrasion of the separate layers of material is carried out by scrubbing that layer with fibers. Which is dipped in an abrasive containing substance Dissolve the acidic suspension Of colloidal silica With silica colloid particles alone, not bound by silosane bonds And water is the intermediate of this new suspension and abrasive in this suspension. Process for chemical mechanics polishing Of layers of materials separated such as silicon Or silicon derivatives.In this regard, abrasion of the separate layers of material is carried out by scrubbing that layer with fibers. Which is dipped in an abrasive containing substance Dissolve the acidic suspension Of colloidal silica The colloidal silica particles are not bound by silosane bonds and water is the intermediate of the suspension. And this new abrasive substance is in this suspension.

Claims (2)

1. Chemical mechanical polishing process In this regard, the abrasion of the separate layer of material proceeds. By rubbing the layer with a fiber containing an abrasive substance, the feature of the abrasive compound is: Aquias suspension solution The acidic colloidal silica With solitary colloidal silica particles, not bound by silosane bonds And water as the medium Of suspensions 2. The process according to claim 1, characteristics of the substance Dissolve the Acetic Acid Suspension of Silica Colloid.