TH32822A - Prefabricated machines for wafer processing, wafer processing methods, and SOI wafer construction methods. - Google Patents

Abstract

DC60 (27/03/41) The wafer is held while being rotated by the wafer spinning shaft. Four grooved rods, the wafer is rotated by thrust delivered by a motor installed outside the sink. With wafer The ultrasonic bath will be provided underneath the wafer processing bath. And altrasonic waves that Caused by a wave source Altrasonic will be sent to Processing tub with wafer Ultrasonic waves will receive Efficient transmission to the wafer because The wafer is certified by the rod. Spin the wafer Only The wafer is supported while it is rotated by four wafer spinning rods with a groove. The wafer is rotated by the driving force. From a motor that has been installed outside the action bath With wafer The ultrasonic bath will be provided alongside. Under the bath, operations with wafers And altrasonic waves that Generated by the ultrasonic source, it will be sent to Processing tub with wafer Ultrasonic waves will receive Efficient transmission to the wafer because The wafer is certified by the wafer spinning shaft. Only

Claims (3)

1. Prefabrication for wafer processing For wafer processing by dipping the wafer into solution. Operations include: an action bath with a wafer; And a rotating support mechanism for holding the wafer in place while Rotate the wafer using multiple parallel arranged shank assemblies. 2. The equipment corresponding to claim 1 will be accompanied by an ultrasonic generator for Generating altrasonic waves in the basin 3.Tag: