TH127188A - Hardwired circuit board - Google Patents

Abstract

DC60 (07/11/55) The hardwired circuit consists of a metallic backing layer, a first insulating layer, a conductive layer, a second insulating separator layer, and a grounding layer. The opening of the first insulating separator layer is enclosed by the opening. The second of the second insulating layer when protruding in the direction of thickness, and the earth layer fills the opening. The first through the second opening to come into contact with the top surface of the metal swirl layer.Alternatively, the first opening surrounds the second opening when protruding in the direction of the thickness, the separator layer. The second insulator fills the peripheral end of the first opening, and the ground layer fills the second opening for entry. Come in contact with the top surface of the metal support layer

Claims (4)

Disclaimer (all) which will not appear on the advertisement page. : ------ 24/01/2018 ------ (OCR) Page 1 of 2 pages Disclaimer 1. Wireline circuit board includes: Metal support layer; The insulating separator layer is built on the metal support layer; A conductive layer is built on the insulating separator layer; A second insulating separator layer is built on the top of the insulating separator to cover the conductive layer; And the earth layer, which was built on the second insulating separator, where the insulating separator layer is created with an opening that leads through it in a circular shape. Overall, in a direction by thickness, a second insulating layer is created so that a second opening passes through it into a spherical shape. The opening in the thickness is to be in conjunction with the duct opening, and the duct opening is enclosed by a second opening when protruding in the thickness direction and the soil layer will Originally, the opening at the front through the second opening to make contact with the upper surface of the Metal support shelf 2. Wiring rack assembly including: metal support rack; The insulating separator layer is built on the metal support layer; A conductive layer is built on the insulating separator layer; A second insulation separator layer is built on the insulating separator layer to cover the conductive layer; And the Chong soil layer was built on the second insulating layer, where the insulating separator layer was created with an opening leading through it in the direction of thickness. Two are created so that a second opening passes through it in a directional direction. Thickness to correspond to the opening on the front, and the second of the number 2, the front opening surround the second opening when protruding in the thickness direction. Where separator layer The second insulator fills the peripheral end of the opening at the sheath. And the soil level will fill a second opening to 3. A circuit-wired circuit according to claim 1 or 2, where the peripheral surface of the opening in the insulating separator layer is created. Keep it skewed when you consider From the direction along the thickness, and / or the peripheral surface of the second opening in the second insulator layer is made to be tilted when determined. From the direction by thickness 4. A wired circuit board according to claims 1 to 3, any requirement whereby the insulation separator layer at the specified and / or The second insulating separator layer is constructed with a light-sensitive resin. 5. Wiring circuit boards in accordance with claim 4, wherein the insulating separator layer and / or the second insulating separator layer. It is created by exposing sensitive resins to light through a light mask ------------ 1. Circuit boards which contain the following components: Metal rotary rack The first insulating separator layer built on a metal support layer; Conductive layer built on the first insulating separator; A second insulating separator, built on the first insulator to cover the conductive layer; And the earth layer, which was built on the second separator, where the first separator was made with the first opening passing through it in the direction of thickness, the second insulating layer was created to have The second opening passes through the part in a thick direction. In accordance with the first opening and the first opening is enclosed by a second opening, when protruding in the direction of the thickness and the soil layer fills the first opening. Through a second opening to make contact with the top surface of the layer Rotating metal type; Or the first opening surrounds the second opening when protruding in the thickness direction. Insulation separator layer at The second fills the peripheral end of the first opening, and the soil layer fills the second opening to allow entry. Come in contact with the top surface of the metal rotating layer 2. A hardwired circuit board according to claim 1, where the peripheral surface of the first opening separator is made to be tilted when considered. From the direction along the thickness, and / or the peripheral surfaces of the second opening in the second insulating layer were made to be tilted when considered. From direction by thickness 3. Circuit board wired according to claim 1, where the first insulation layer and / or the second insulation layer Made from photosensitive resin 4. Circuit board routed according to claim 1, where the first and / or second insulation layer. It is made by allowing the photosensitive resin to be obtained through a light mask.