TH100356A - Electronic interfaces and methods and systems for their manufacture. - Google Patents

Abstract

DC60 A method for producing an electronic interface card, consisting of the arrangement of a pair of pass slots in Base layer, the antenna is applied to the base layer in such a way that the ends are opposite each other. The antenna has an end point at the pass, inserting conductors into each of these channels, connecting the antenna to the conductors, creating a niche in the base layer, conducting wire connections. Continuous It is attached to more than one chip module, bringing a continuous connection wire to the conductor. More than one on the base layer is more than one corresponding layer, the intersection of the connecting wire at Successively to keep the different parts That connects each chip module to a corresponding pair of conductors and Seal the chip module in the recess.

Claims (15)

OCR 08PV 1. The method for manufacturing a chip card consisting of an electronic interface; the designation of a pair of through-holes (150) in the base layer (114); the application of antennas (112) to the said base layer (114) in such a way that the opposite ends (152) of the said antennas (112) terminate in the said through-holes (150); the insertion of a metal element (132) in each of the said through-holes (150); the connection of the said ends (152) of the said antennas (112) to the said metal element (132); the stacking of the said base layer (114) to the said top layer (106) and the said bottom layer (116); the creation of a niche (122) in the said top layer (106) and the said base layer (114) in such a way that the metal element (132) is exposed in the created niche. Attach the end of the connecting wire (130) to the metal element (132), then attach the opposite end of the connecting wire (130) to the chip module (120), then insert the chip module (120) into the recess (122), and seal the chip module (120) in the recess (122). 2. The method in accordance with claim 1 and also includes the provision of an additional first (118) and a second (108) base layer on the underside of the aforementioned base layer (114) prior to such stacking. 3. The method according to claim 1 or claim 2 and where such top layer consists of the first top support layer (106) and the second top support layer (102). 4. The method in accordance with claim 3 and includes the exposure of the recessed surface (136) of the second top layer (102) such as near the recess (122) and where such sealing is made by applying glue to the underside of the chip module (120) such as and inserting the chip module (120) such as into the recess (122) such as the underside aligns with the recessed surface (136). 5. Any of the methods under claims 1-4 and in conjunction with the folding of the wire (130) as mentioned above in the area below the module of the chip (120) as mentioned above. 6. Any of the methods under claims 1-5, and where such methods are executed automatically. 7. Any of the methods under claims 1-6 and in which the attachment of such end of the connecting wire (130) to the metal element (132) is made by laser welding. 8. Any of the methods under claims 1-7 and where the attachment of the opposing ends of such connecting wire (130) to the chip module (120) consists of soldering. 9. Any method under any of the claims 1-8 and where such wire (130) is longer than the distance between the opposite ends respectively in such electronic interface card, 10. The system for manufacturing the SheepGuard. The SheepGuard consists of an electronic interface, a base containing at least one base layer (114), at least two metallic elements (132) positioned in the passages of at least one base layer (114), and a wire antenna (112) connected to the base. The wire antenna's ends are electrically connected to at least two metallic elements (132). The system consists of a layer stacker which operates to stack the aforementioned base layer (114), in which the metallic elements and the wire antenna are placed, onto the top (106) and bottom (116) layers; and a niche maker which operates to create a niche (122) in the top (106) and the aforementioned base layer (114) in such a way that the metallic elements (132) are exposed in the created niche. The first wire embedder operates to attach the end of the connecting wire (130) to the metal element (132). The second wire embedder operates to attach the opposite end of the connecting wire (130) to the chip module (120) before the chip module (120) is inserted into the slot (122). The sealing device operates to seal the chip module (120) in the slot (122). 11. The system for the production of life guards under claim 10, and where the first wire-attaching machine is a wire-attaching machine by laser welding. 12. A system for the production of life guards under Claim 10 and Claim 11, and where such second wire-attaching machine is a wire-attaching machine by soldering. 13. A chip card consisting of: an electronic interface of the chip card consisting of a base containing at least one base layer (114); at least two metallic elements (132) positioned in at least one such base layer (114); a wire antenna (112) connected to such base (114) and whose ends are electrically connected to at least two such metallic elements (132); a top layer (106) superimposed on the base layer (114); a chip module (120) mounted in a recess (122) made in such base (114) and top layer (106); and a wire (130) providing an electrical connection between such chip module (120) and such wire antenna (112) through such metallic elements (132), where such wire (130) is of a length significantly greater than the distance between the opposite ends, respectively. 14. The chip card under claim 13 and where the modulus of the chip (120) is contained, is a smart chip card package. 15. The chip guard interface assembly as per claim 13 or claim 14, and where such wire (130) is folded directly under the such chip module (120) in such recess (122).