SU988533A2 - Device for correcting cut angle of crystallographically oriented slice - Google Patents

Description

The invention relates to the electronics industry, the communications industry, the radio industry, and can be used in the manufacture of microchip substrates on crystals, including piezoelectric quartz.

According to the main auth. No. 768616 discloses a device for correcting the cut angle of crystallographically oriented substrates, made in the form of a housing and working sections, each of which consists of one fixed and one movable bushings mounted on a common shaft, each having one perpendicular to the axis and one skewed under equal end corners and contacting each other with a FRIEND along the perpendicular ends, and at the beveled end of a movable sleeve provided with a retainer, a pivoting cassette with a through hole corresponding to form-temperature corrected emoy l substrate.

A disadvantage of the known device is the impossibility of correcting the cut angles of substrates of various thickness; The known device is applicable only to substrates of one particular specific thickness, at which

the center of the substrate lies on the axis of rotation (axis of the movable sleeve) around which the substrate is rotated (here and hereinafter, the center of the substrate means the central point on the surface of the substrate after removing the machining allowance). when the substrate thickness changes, its center will be shifted relative to the axis of rotation, and during processing, the substrate will rotate around an additional uncontrolled axis.

The aim of the invention is the expansion of technological capabilities.

devices by treating the mean. zhk different thicknesses.

The goal is achieved by the fact that in the device for correcting the angle of cut

20 crystallographically oriented plates are additionally introduced a table mounted for movement in a guide made on the beveled end of the movable sleeve,

25 equipped with a calibration scale, and the cassette is mounted on the table.

Claims (2)

Fig. 1 shows the proposed device, a section in Fig. 2, section A-A in Fig. 1; Fig. 3 is a diagram illustrating the alignment of the center of the substrate with the axis of rotation of the movable sleeve; Fig. 4 shows the position of the substrate after adjustment at a certain cut angle; figure 5 - the proposed device, top view. The device consists of two bushings, a movable 1 and a fixed 2, a common hollow shaft 3, with the help of which the bushings are attached to the housing 4 and in the cavity of which a vacuum is created, the fixing nut 5, the cartridge 6, the table 7, the stand 8, the calibrated head 9 and a microscrew 10. Each of the bushings has, respectively, perpendicular and beveled at identical end angles. The constant contact of the sleeves with mutual rotation is carried out on the perpendicular ends, while one of the beveled ends constantly serves as a base, and a table 7 is based on the ends of the second end. A nut 5 serves to fix the relative angular position of the sleeves 1 and 2. The processing substrate 11 is placed in the through hole of the cassette b. A support 8 is attached to the movable sleeve 1. The device is operated and adjusted as follows. Substrate 11 being machined is installed onto the base plane of table 7. After this, a vacuum is created in the cavity of the device and the substrate is fixed on the surface of table 7. Then at a given theoretical thickness h (obtained after removing the allowance) using a micro screw 10 and a head 9, tared in Depending on the theoretical thickness of the substrate, they move in a horizontal plane. When the substrate thickness is changed to bh. there is a mismatch of the center of intersection of the axes by a distance equal to D, in connection with which, when the movable sleeve 1 rotates, the substrate rotates both along the X axis (by a given angle) and along the Y axis (by a secondary angle that introduces an error It is necessary to displace the table with the substrate with the help of a microscrew 10 and the head 9 by D and align point B located on the axis 11-11, i.e., the X axis, with the vertical axis of the substrate 1-1. Then the base plane of the table is oriented. is tied to the required angle oC equal to the correction angle of the plane of the slice of the substrate, by rotating the sleeve 1 relative to the stationary sleeve along the limb (Fig. 4) .The required angle of is fixed by the nut 5. Next, the direction of inclination of the cutting plane relative to the grinding wheel 12 must be corrected by turning the cartridge 6 through the limb to the required angle /% (fig.Z). The design of the proposed device has wide technological capabilities — it allows eliminating such a negative phenomenon as simultaneous rotation of the substrate along two axes, which occurs when the center of the substrate does not move with the axis of rotation of the movable sleeve, which takes place in a known device during the ne thickness. Compared with the known, the proposed device gives BO3MokHOCTb to reduce the labor intensity by 20-40% and increase productivity due to the possibility of processing substrates of various thickness. Claims of the invention A device for correcting the cut angle of crystallographically oriented plates according to aut. No. 768616, characterized in that, in order to expand the technological capabilities of the device, it is provided with a table that is movable in position on. the beveled end of the movable bushing of the guide and carrying the swivel cassette. Sources of information taken into account during the examination 1. USSR Author's Certificate No. 768616, cl. B 24 B 41/00, 1978.