SU958064A1 - Flux for soldering copper and its alloys - Google Patents

Description

one

Belling refers to the soldering area, in particular to materials for brazing copper and its alloys, of sulfur and copper-phosphorus middle melting solders.

A pasty flux is known, where the ocHOBHbHviH components are 6oj per acid, potassium fluoride,. The presence of these components as the basis of the paste determines the high level of the onset of paste activity, which makes it unacceptable in mass production, since it does not provide the necessary labor productivity C1.

Also known flux 2, containing ts, wt.%:

Potassium fluoride14-16

Lithium hydroxide 0.5-1.5

Boric anhydride 110

Fluoroborate potassium Else 20

The disadvantage of this flux is the impossibility of obtaining from it a uniform paste resistant against thickening and the absence of finely dispersed

structures of seams, pa paras of copper-phosphorus intermediate midway across the pl.

The use of phytosa in the form of a paste increases the productivity of the process, since the process of feeding it during the soldering process is eliminated, a more uniform dosage of phytosa is ensured.

The goal of isofeten is to give the flux a uniform, stable pasozoic state, it additionally contains carnallite, a mixture of salts.

This goal is achieved by the fact that the flux D (nolnitelio soderokit carnallite, a mixture of haploid lithium salts (12% t: F + 88% L: Ce) and water in the following ratio, wt.%:

Taxfield 26-4O

Fluorbs at potassium 15-4O

Boric anpifid15-35

A mixture of galloid solium lithium 0.5-5 1-6 carnallite 30-55 from water dry weight of the mixture With the aim of applying a pastoral flux to the solder rod, it additionally fluorine rod 1-3.5 wt.% And potassium or sodium salt of polyphosphoric acid 0.5-T 15 wt.%, Carnallite is introduced in the indicated proportions in order to render the flux resistant to agglutination against the pasty cocTOHHtra. When the content of carnallite in the flux is less than 1%, the latter becomes less resistant to thickening, and with an increase in carnallite more than 6%, it is difficult to obtain a single paste form of the flux. The introduction of a mixture of galloid lithium salts improves the uniformity of the flux in the pasty state, and when using the flux with copper-phosphorous medium-melting solders, a finely dispersed structure of the seam is formed. The content of the mixture of fluoride and chloride salts less than 0.5% does not have a noticeable positive effect, and if the content is more than 5%, there is a tendency to a sharp decrease in the resistance of the soldered compound. Introduction of fluorspar and K or NGiiPonH polyphosphoric acid to flux Potassium fluoride Potassium fluorine borate Boric anhydride Salt mixture (12% Lif + 88% UiCe) Carnallite the form of the coating increases the strength of the coating and its (Soltvodnost with the bar solder. The destruction of the coating when the ripo rod with coating is dropped from a height of 1 m to the tile floor is 11% or less of the total area of the coating. The flux paste is prepared as follows. The arnallite is dissolved in hot water with a temperature of 70-90 C. To the resulting solution add a mixture of salts (12% Li F + 88% U: ce) and Ma or K salt of polyphosphoric acid (the latter is introduced when using flux in the form of powders with solder) and stirred until complete dissolution. Potassium fluoride powders, boron fluoride potassium, boric anhydride and fluorspar are mixed (the last one is added: using flux in the form of plaster), then it is poured in with the previously prepared solution. After shaking, a homogeneous, paste-like mass of light gray color is formed. In the open air, under the condition of periodic mixing, the flux remains in a pasty state for 5-8 days, depending on the initial consistency of the paste. Below are examples of the implementation of the mixture for the preparation of flux-paste, wt.%: Open air. Examples of the charge of the proposed coating, weight.

Fluoride potassium Fluoroborate calv Borne anhydrous

A mixture of salts (12% Li + 88% L, iCe)

Claims (2)

Carnallite Fluor spar or salt of half-phosphorous piHofl acid 0.5 Flux-paste has a uniform, resistant to thickening state. The use of fluxes in the form of paste improves the productivity of the process, since the process of feeding it during the soldering process is eliminated and a more uniform dosage of the flux is ensured. The solder flux during soldering provides the formation of a steam seam with a continuous nhoTHofi double-sided galggel and an optional: hermetic seal; pa se stitches. Claims 1. Flux for brazing copper and its alloys,: containing potassium fluoride, potassium fluoroborate, boric anhydride, other than rto, containing fluids of a steady, uniform and pasty state, it also contains carnallite , a mixture of lithium halide salts (12% LiF + 88% UiCC) and: water in the following ratio of components, wt.%: ly Y 5 2,: W ith mi and I pho (№ О № О 26-40 Potassium fluoride 15-40 Potassium Fluoroborate 15-35 Boric anhydride A mixture of haploid lithium salts (12% LiF + 88% biCE) Carnallite Water (by weight of dry rygta ) 30-55 2. Flux according to Clause 1, distinguished by the fact that, with the aim of possible using it as an amp on a solder rod, it contains a fluorspar 1-3.5 Bed.% Alium or sodium salt polyphosphoric acid O, 5–15 wt.%: Sources of information,.; take into account when using euspertiz 1. Author's certificate of the USSR 719839, class B 23 K 35/362, .O1.78. 2. USSR author's certificate 399333, cl. 23 K 35/362, .12.71 (jDpoToran).