SU885169A1 - Pickling solution - Google Patents

Description

one

The invention relates to the technology for the manufacture of electrovacuum devices, specifically to the surface treatment of metal-glass structures, which are components of the enclosures of the above-mentioned devices.

A pickling solution 1 is known for treating the junctions of thin glass films with metal, comprising wt.%: NHAF 0.08-0.1; H2.S04. 40-43; CHjCOONa 0.08-0.1; she is 25-29; water the rest.

The known composition is used to polish the surfaces of glass structures, but the presence of Nht} .F and CHjCOONa helps to slow down the process of polishing products, which can lead to partial dissolution of the metal-glass surface, which in turn does not clean the surface of metal-glass products from oxides but it also pollutes the solution and makes it unsuitable for work.

The purpose of the invention is to obtain a non-oxide surface of the processed products.

The goal is achieved by the fact that in the pickling solution, including, her, water, additionally

contains 1 [ShO] with the following ratio of components, wt.% H2.S0440-42; NDS 0.2-0.6; 1/52, 0, HNOj 30-34; water the rest.

The introduction of Na-281C and HNO makes it possible to optimally carry out the etching operation, while at the same time obtaining the surface of the workable knot, la, carefully removed from oxides and other contaminants. With this, the profile is not disturbed; metal-glass spa, which is an important factor for maintaining high vacuum density and its reliability.

The invention is illustrated by specific examples which are given

in the table.1. After processing in the polishing solution of the proposed composition of the product and the shot is clean, free from oxides

20 surface (see tab.2).

As can be seen from table 1, the quality of junctions processed in the proposed composition is better than the quality of junctions,

2S, which were polished in a known manner, with this eruption of metal removal is the cause of the change in the spa profile.

It should be noted that when working with the proposed composition, even with

thirty

for a long polishing time (6–8 s), there is no large metal removal, since a buffer complex is formed in the solution, which prevents a further decrease in the thickness of the products and, at the same time, the spa profile is not disturbed.

In addition, speeding up the polishing process increases productivity.

The use of the proposed invention makes it possible to improve the quality of the processed glass-metal assemblies and, thus, to increase the service life and improve the parameters of electrovacuum devices made on the basis of the indicated assemblies.

Iribor & g with the use of metal-glass junctions treated with a polishing solution, is used in medicine, electronic vacuum tubes, electronics.

Table 1

Claims (1)

Claim The etching solution, including HnSO ^, NSB, water, is also characterized in that, in order to obtain an oxide-free surface of the processed products, it additionally contains Na ^ SiC ^ and HNO ₃ with the following ratio of components, wt.%: NzBod 40-42; NA? 0.2-0.6, - Na ^ SiO ^ ed 1.5-2.0, - HNO3 30-34; water the rest. Jr-