SU731623A1 - Radio electronic module with removable plates - Google Patents

Radio electronic module with removable plates Download PDF

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Publication number
SU731623A1
SU731623A1 SU762402161A SU2402161A SU731623A1 SU 731623 A1 SU731623 A1 SU 731623A1 SU 762402161 A SU762402161 A SU 762402161A SU 2402161 A SU2402161 A SU 2402161A SU 731623 A1 SU731623 A1 SU 731623A1
Authority
SU
USSR - Soviet Union
Prior art keywords
electronic module
radio electronic
removable plates
radio
guides
Prior art date
Application number
SU762402161A
Other languages
Russian (ru)
Inventor
Игорь Натанович Кацнельсон
Сергей Валерьянович Васильев
Владимир Александрович Кокошинский
Александр Яковлевич Тронин
Original Assignee
Предприятие П/Я Г-4371
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Предприятие П/Я Г-4371 filed Critical Предприятие П/Я Г-4371
Priority to SU762402161A priority Critical patent/SU731623A1/en
Application granted granted Critical
Publication of SU731623A1 publication Critical patent/SU731623A1/en

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Description

1one

Изобретение относитс  к радиоэлектронике , в частности к устройству радиоэлектронных модулей, содержащих сменные платы.The invention relates to radio electronics, in particular to the device of electronic modules containing plug-in cards.

Известен радиоэлектронный модуль со сменными платами, содержащий корпус с направл ющими {1.A radio module with plug-in cards is known, comprising a housing with guides {1.

Однако в данном устройстве охлаждение плат происходит не в достаточной степени.However, in this device, the cooling of the boards is not sufficiently.

Цель изобретени  - улучщение охлаждени  плат.The purpose of the invention is to improve the cooling of the boards.

Это достигаетс  тем, что в радиоэлектронном модуле со сменными платами, содержащем корпус с направл ющими, в торцевых част х каждой платы, обхватываемых направл ющими, выполнены полостп, заполненные веществом с коэффициентом объемного расширени , больщим коэффициента объемного расширени  материала, из которого выполнен корпус.This is achieved by the fact that in a radio-electronic module with interchangeable boards, comprising a housing with guides, in the end parts of each board, grasped by the guides, a cavity is filled with a substance with a coefficient of volume expansion, greater than the coefficient of volume expansion of the material from which the body is made.

На фиг. 1 показан предлагаемый радиоэлектронный модуль со сменными платами, общий вид; на фиг. 2 - сменна  плата, разрез.FIG. 1 shows the proposed radio-electronic module with interchangeable boards, general view; in fig. 2 - replaceable board, cut.

Радиоэлектронный модуль содержит корпус 1 с направл ющими 2, сменные платы 3, в торцевых част х которых, обхватываемых направл ющими 2, выполненные полости 4, заполненные веществом с коэффициентом объемного расширени  большим,The electronic module comprises a housing 1 with guides 2, interchangeable boards 3, in the end parts of which, grasped by the guides 2, are made cavities 4 filled with a substance with a large expansion coefficient,

чем коэффициент объемного расширени than the coefficient of volume expansion

материала, из которого выполнен корпус 1.material from which the body is made 1.

Тепло от электронного элемента 5, установленного на плате 3, распростран етс  к торцам платы 3 и вызывает нагрев и расщирение вещества в полости 4. Вещество прижимает боковые поверхности 6 платы 3 к боковым поверхност м направл ющих 2Heat from the electronic element 5 mounted on the board 3 spreads to the ends of the board 3 and causes the substance to heat and expand in the cavity 4. The substance presses the side surfaces 6 of the board 3 to the side surfaces of the guides 2

10 корпуса 1, обеспечива  надежный контакт между платой и корпусом, что способствует отводу большего колпчества тепла от электронного элемента 5 к корпусу 1.10 of the housing 1, ensuring reliable contact between the board and the housing, which contributes to the diversion of a greater heat quantity from the electronic element 5 to the housing 1.

При остывании электронного элемента 5When cooling the electronic element 5

15 вещество в полости 4 занимает первоначальный объем.15 substance in cavity 4 occupies the original volume.

Claims (1)

1. Патент ФРГ № 2103923, кл. 21С 27/05, 12.12.74.1. Patent of Germany No. 2103923, cl. 21S 27/05, 12.12.74.
SU762402161A 1976-09-01 1976-09-01 Radio electronic module with removable plates SU731623A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SU762402161A SU731623A1 (en) 1976-09-01 1976-09-01 Radio electronic module with removable plates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU762402161A SU731623A1 (en) 1976-09-01 1976-09-01 Radio electronic module with removable plates

Publications (1)

Publication Number Publication Date
SU731623A1 true SU731623A1 (en) 1980-04-30

Family

ID=20676196

Family Applications (1)

Application Number Title Priority Date Filing Date
SU762402161A SU731623A1 (en) 1976-09-01 1976-09-01 Radio electronic module with removable plates

Country Status (1)

Country Link
SU (1) SU731623A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4731698A (en) * 1984-06-14 1988-03-15 Sintra Mechanical and electrical assembling device for high-density electronic cards with thermal conduction cooling
US4849858A (en) * 1986-10-20 1989-07-18 Westinghouse Electric Corp. Composite heat transfer means
DE4422114A1 (en) * 1994-06-24 1996-01-04 Wabco Gmbh Electronic module housing cap
US5482109A (en) * 1994-03-15 1996-01-09 E-Systems, Inc. Modular heat exchanger

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4731698A (en) * 1984-06-14 1988-03-15 Sintra Mechanical and electrical assembling device for high-density electronic cards with thermal conduction cooling
US4849858A (en) * 1986-10-20 1989-07-18 Westinghouse Electric Corp. Composite heat transfer means
US5482109A (en) * 1994-03-15 1996-01-09 E-Systems, Inc. Modular heat exchanger
DE4422114A1 (en) * 1994-06-24 1996-01-04 Wabco Gmbh Electronic module housing cap

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