SU719822A1 - Apparatus for soldering by dipping - Google Patents

Description

I.

The invention relates to soldering, in particular to devices for immersion by brazing.

The izvaytno device for soldering by immersion, containing large and movable small baths placed one inside the other, as well as a flux bath and a scraper For cleaning the surface of the solder. The oxide film from the surface of the molten solder of the large Janna removes .. from the center of the mechanical movement of the scraper of the solid surface of the solder

1. However, the presence of high temperatures instantly forms a new oxide film on the cleaned surface, which degrades the quality of the tinning of the surface of radio components.

The aim of the invention is to improve the cleaning of the surface of the solder from oxides. - The delivered zero is achieved by combining the mechanical and chemical destruction of oxides on the surface of the solder.

small baths due to the fact that the scraper is made with a longitudinal groove in the lower part filled with flux and fixed on the transport mechanism with the ability to tilt when in contact with small baths to ensure that a thin film of the flux is prevented from passing through the scraper to a clean surface preventing a certain oxidation time solder.

FIG. 1 schematically shows the proposed device; in fig. 2 AA abutting, but FIG. 1, the position of the scraper at the time of removing the oxide film from the surface of the solder bath; in fig.

3- the same position of the scraper in the process of filling its groove with a flux; in fig.

4- the same position of the scraper when approaching it to a small bath with solder.

Claims (2)

The device contains a rotary transporting mechanism 1, returned to its original position after pressing spring 2, mechanism 3 for adjusting the depth of immersion of parts in the flux And solder, bath 4 with flux, large bath 5 with solder and small movable baths 6 placed in it 6. In addition, the device , includes a mechanism for lifting small movable baths with solder, an emphasis 8, a scraper 9 with a groove 10 in the lower part, mounted on the axis 11 of the bracket 12 and can be rotated around this axis and returned to its original position (vertical Flax) by a spring 13. The device operates as follows. The product is mounted on a pivoting transport mechanism 1 which, by means of a guide groove of the fur. Nizma 3 immersion depth adjustments can be used with flux. Then, by pressing the rotary protractor, the skinny mechanism 1 is lowered until the screw is in contact with the screw of the Immersion Depth Adjustment Mechanism 3, When the output of the Product is dipped into the flux to the desired height. Scratch 9, fixed on the rotary transport mechanism 1, also on the burner, is pressed into the flux and its longitudinal groove 10 is filled with a fyus. After removing the force from the turning-transporting mechanism 1, it returns to its original position with a spring 2. By means of the mechanism 7, the small small baths 6 rise above the surface of the large bath 5 to touch the stop 8. When the transport mechanism 1 rotates, the scraper 9 abuts against the side wall of the small submersible bath 6 and under the action of continuing the rotation of the Spire tilts. This results from the longitudinal groove 10 of the scraper 9 on the surface of the soldering small mobile bath 6. When Continuing the rotation of the transport mechanism 1, the oxide of the player from the surface of the soldering small mobile baths 6 is removed as rfSepfelieWiqM mbhaneychesOPS moving the scraper 9 on the surface of the solder, and by the interaction Oxidized pulley FPUSOM, everyday life, from the longitudinal groove 1O of the scraper 9. When the scraper moves 9 ps of the solder surface of small sub 7 7, 4 floating baths, a thin flux film remains on its surface for a certain time inhibits oxidation of the cleaned surface with solder. After the scraper passes over the small baths under the Action of the spring 13, the scraper 9 returns to its original position. Above the small movable baths 6, the pivoting transport mechanism 1 is precisely exposed by means of a groove of the mechanism 3 for adjusting the depth of immersion. Under the action of the applied force, the rotary transporting mechanism 1 is lowered and the conclusions of the products are dipped into solder. After removal of the force, the rotating transporting mechanism 1 is reversed to its upper position by a spring 2. The product contacts and another is installed in its place. The design of the immersion soldering device with a scraper, made with i longitudinal groove in the lower part, filled with flux and fixed on the transport mechanism with the possibility of tilting when in contact with small baths, allows to improve the cleaning of the solder surface by combining the mechanical and chemical destruction of oxides on the surface small baths. DETAILED DESCRIPTION OF THE INVENTION Claims: A device for immersion by soldering, containing pa; large and Movable small baths, one with another, a flute with flux and a scraper for cleaning the surface of the solder, a transporting mechanism, characterized in that longitudinal groove filled with flux, and the scraper mounted on the transporting mechanism with the ability to tilt. Sources of information taken into account in the examination. 1. USSR author's certificate N9 337210, cl. B 23 K 3 / O6, O2.04.7O ..