SU653898A1 - Glue - Google Patents

Description

one

This invention relates to cold curing adhesives based on epoxy resins for bonding metallic and non-metallic materials.

Cold-cured adhesives based on epoxy resins are known, for example K-153 glue containing ED-20 resin, hardener and filler. Cure time at 20 ° C 18 h ij.

The closest in technical essence and the achieved result to the proposed is K-400 glue, which is a composition based on epoxy-silicone resin T-III, cured by low molecular weight polyamide L-20, and boron nitride as a filler 2. Cure time at 48 h.

These adhesives have sufficient chemical and mechanical strength, but they have a long curing time. .

The aim of the invention is to reduce the curing time of the adhesive while maintaining the original strength characteristics.

 The proposed adhesive, comprising an epoxy silicone resin, low molecular weight polyamide and fill%.

Tel, additionally contains the reaction product of cyanuric acid with melamine, polypropylene glycol and 2,4,6-tris-dimethylaminomethyl) phenolJ, in the following ratio of components, wt.%:

Epoxy organic silicon resin 38-61 Low molecular weight polyamide 15-21 Filling agent 5-12

.Product of the reaction of cyanuric acid with melamine 14-22

Polypropylene glycol3-4 2,4,6-tris. - Odimethylaminomethyl) phenol3 2-3 The reaction product of cyanuric acid with melamine, which is a white powder, is commercially available under the trademark C.

Boron nitride, Portland cement, chromium oxide, etc. are used as fillers.

2,4,6-tris- (dimethylaminomethyl) phenol is commercially available under the label U 606/2.

Polypropylene glycols are commercially available under the name laprol,

In tab. 1 shows the compositions of the proposed glue and glue, taken for

prototype in table. 2 - the properties of these compounds.

The adhesive is prepared by mixing the components until a homogeneous mixture is obtained. Curing occurs within 10 hours at 15-20s. . Table 1

ED-20 epoxy resin

Hardener L-20 Chromium oxideProduct of the reaction of cyanuric acid with melamine Polypropylene glycol

Epoxy organic silicon resin t - i i i

2,4,6-tris-Dimethylaminomethyl) phenol

Boron nitride

Gluing strength for uniform tearing off (Art. S + Art. S), kg / cm

Cure time at 20 ° C, h

Claims (1)

Claim, comprising epoxy-silica resin, low molecular weight polyamide and filler, characterized in that, in order to reduce the curing time while maintaining the original strength characteristics, it additionally contains polypropylene glycol, the product of cyanuric acid with melamine and 2, 4, 6 tris- (di --- 19,3152118,82 --- 19, 3142218.82 3.6343.53 48,2386147,07 -232.35 9.65129.41 table 2 118 115 135 124 128 54 12 ten 12 48 Methylaminomethyl) phenol in the following ratio of components, wt.% D Epoxy organic resin 38-61 Low molecular weight polyamide15-21 Filler 5-12 The reaction product of cyanuric acid with melamine14-22 5653898 Polypropylene glycol 3-41. Kardapyuv D.A. Synthetic g, 4, b-tris-Kdimetil-glues, M., Himi, 1976, p. 113. Aminomethyl) phenol 2-3 Sources of information, 2, Kardashov DA Synthetic taken into account when examiners. M., Himn, 1976, p. 124.