SU651432A1 - Устройство дл прижима таблеточного полупроводникового прибора к охладителю - Google Patents
Устройство дл прижима таблеточного полупроводникового прибора к охладителюInfo
- Publication number
- SU651432A1 SU651432A1 SU762325411A SU2325411A SU651432A1 SU 651432 A1 SU651432 A1 SU 651432A1 SU 762325411 A SU762325411 A SU 762325411A SU 2325411 A SU2325411 A SU 2325411A SU 651432 A1 SU651432 A1 SU 651432A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- elastic element
- semiconductor device
- elastic
- piston
- cooler
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims description 13
- 238000003825 pressing Methods 0.000 title claims description 4
- 239000004020 conductor Substances 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 3
- 239000000428 dust Substances 0.000 claims description 2
- 229920001971 elastomer Polymers 0.000 claims 7
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims 5
- 239000000806 elastomer Substances 0.000 claims 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 4
- 229910052793 cadmium Inorganic materials 0.000 claims 4
- 229910052797 bismuth Inorganic materials 0.000 claims 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 3
- 239000007788 liquid Substances 0.000 claims 3
- 229910052751 metal Inorganic materials 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- 229910045601 alloy Inorganic materials 0.000 claims 2
- 239000000956 alloy Substances 0.000 claims 2
- 238000002844 melting Methods 0.000 claims 2
- 230000008018 melting Effects 0.000 claims 2
- 229910001152 Bi alloy Inorganic materials 0.000 claims 1
- 229910000925 Cd alloy Inorganic materials 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910000978 Pb alloy Inorganic materials 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 229910001128 Sn alloy Inorganic materials 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 230000007797 corrosion Effects 0.000 claims 1
- 238000005260 corrosion Methods 0.000 claims 1
- 239000006071 cream Substances 0.000 claims 1
- 238000000354 decomposition reaction Methods 0.000 claims 1
- 230000007613 environmental effect Effects 0.000 claims 1
- 239000006023 eutectic alloy Substances 0.000 claims 1
- 230000005496 eutectics Effects 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
- 238000009434 installation Methods 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 239000012811 non-conductive material Substances 0.000 claims 1
- 239000004033 plastic Substances 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 229920002379 silicone rubber Polymers 0.000 claims 1
- 239000004945 silicone rubber Substances 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 230000007704 transition Effects 0.000 claims 1
- 238000009827 uniform distribution Methods 0.000 claims 1
- 229940099259 vaseline Drugs 0.000 claims 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CS119375A CS176675B1 (enrdf_load_stackoverflow) | 1975-02-24 | 1975-02-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU651432A1 true SU651432A1 (ru) | 1979-03-05 |
Family
ID=5345717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU762325411A SU651432A1 (ru) | 1975-02-24 | 1976-02-24 | Устройство дл прижима таблеточного полупроводникового прибора к охладителю |
Country Status (6)
| Country | Link |
|---|---|
| CH (1) | CH600570A5 (enrdf_load_stackoverflow) |
| CS (1) | CS176675B1 (enrdf_load_stackoverflow) |
| DD (1) | DD123251A1 (enrdf_load_stackoverflow) |
| DE (1) | DE2604070C3 (enrdf_load_stackoverflow) |
| PL (1) | PL97657B1 (enrdf_load_stackoverflow) |
| SU (1) | SU651432A1 (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2942401C2 (de) | 1979-10-19 | 1984-09-06 | Siemens AG, 1000 Berlin und 8000 München | Halbleiterbauelement mit mehreren Halbleiterkörpern |
| FR2721438B1 (fr) * | 1994-06-21 | 1996-10-18 | Jacques Daniel Lhomme | Dispositif de serrage utilisable notamment pour les semi-conducteurs de puissance. |
-
1975
- 1975-02-24 CS CS119375A patent/CS176675B1/cs unknown
-
1976
- 1976-01-27 CH CH98976A patent/CH600570A5/xx not_active IP Right Cessation
- 1976-02-03 PL PL18699976A patent/PL97657B1/xx unknown
- 1976-02-03 DE DE19762604070 patent/DE2604070C3/de not_active Expired
- 1976-02-20 DD DD19137276A patent/DD123251A1/xx unknown
- 1976-02-24 SU SU762325411A patent/SU651432A1/ru active
Also Published As
| Publication number | Publication date |
|---|---|
| DE2604070A1 (de) | 1976-09-09 |
| CS176675B1 (enrdf_load_stackoverflow) | 1977-06-30 |
| PL97657B1 (pl) | 1978-03-30 |
| DE2604070B2 (de) | 1978-08-31 |
| DD123251A1 (enrdf_load_stackoverflow) | 1976-12-05 |
| CH600570A5 (enrdf_load_stackoverflow) | 1978-06-15 |
| DE2604070C3 (de) | 1979-05-03 |
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