PL97657B1 - Zespol mocujacy do elementu polprzewodnikowego - Google Patents
Zespol mocujacy do elementu polprzewodnikowegoInfo
- Publication number
- PL97657B1 PL97657B1 PL18699976A PL18699976A PL97657B1 PL 97657 B1 PL97657 B1 PL 97657B1 PL 18699976 A PL18699976 A PL 18699976A PL 18699976 A PL18699976 A PL 18699976A PL 97657 B1 PL97657 B1 PL 97657B1
- Authority
- PL
- Poland
- Prior art keywords
- conductor
- fastening kit
- kit
- fastening
- Prior art date
Links
- 239000004020 conductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CS119375A CS176675B1 (enrdf_load_stackoverflow) | 1975-02-24 | 1975-02-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| PL97657B1 true PL97657B1 (pl) | 1978-03-30 |
| PL97657B2 PL97657B2 (enrdf_load_stackoverflow) | 1978-03-31 |
Family
ID=5345717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL18699976A PL97657B1 (pl) | 1975-02-24 | 1976-02-03 | Zespol mocujacy do elementu polprzewodnikowego |
Country Status (6)
| Country | Link |
|---|---|
| CH (1) | CH600570A5 (enrdf_load_stackoverflow) |
| CS (1) | CS176675B1 (enrdf_load_stackoverflow) |
| DD (1) | DD123251A1 (enrdf_load_stackoverflow) |
| DE (1) | DE2604070C3 (enrdf_load_stackoverflow) |
| PL (1) | PL97657B1 (enrdf_load_stackoverflow) |
| SU (1) | SU651432A1 (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2942401C2 (de) | 1979-10-19 | 1984-09-06 | Siemens AG, 1000 Berlin und 8000 München | Halbleiterbauelement mit mehreren Halbleiterkörpern |
| FR2721438B1 (fr) * | 1994-06-21 | 1996-10-18 | Jacques Daniel Lhomme | Dispositif de serrage utilisable notamment pour les semi-conducteurs de puissance. |
-
1975
- 1975-02-24 CS CS119375A patent/CS176675B1/cs unknown
-
1976
- 1976-01-27 CH CH98976A patent/CH600570A5/xx not_active IP Right Cessation
- 1976-02-03 DE DE19762604070 patent/DE2604070C3/de not_active Expired
- 1976-02-03 PL PL18699976A patent/PL97657B1/xx unknown
- 1976-02-20 DD DD19137276A patent/DD123251A1/xx unknown
- 1976-02-24 SU SU762325411A patent/SU651432A1/ru active
Also Published As
| Publication number | Publication date |
|---|---|
| DE2604070B2 (de) | 1978-08-31 |
| DD123251A1 (enrdf_load_stackoverflow) | 1976-12-05 |
| DE2604070A1 (de) | 1976-09-09 |
| SU651432A1 (ru) | 1979-03-05 |
| CS176675B1 (enrdf_load_stackoverflow) | 1977-06-30 |
| CH600570A5 (enrdf_load_stackoverflow) | 1978-06-15 |
| DE2604070C3 (de) | 1979-05-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DK158476A (da) | Radialdek | |
| DK429376A (da) | Bladholder | |
| AT335804B (de) | Fitting | |
| SE398058B (sv) | Skruvidragare | |
| ATA273676A (de) | Ablenkjoch | |
| FI64181B (fi) | Polyvinylidenfluorid- eller vinylidenfluorid-kopolymeratblandningar med utmaerkt ljusgenomslaeppande foermaoga | |
| DK364375A (da) | Branddroj plade | |
| FR2300226A1 (fr) | Perfectionnements | |
| DK482576A (da) | Herbicid | |
| FR2317868A1 (fr) | Moissonneuse | |
| DK516176A (da) | Rormolle | |
| TR19499A (tr) | Yuezey havalandiricisi | |
| FR2299188A1 (fr) | Perfectionnements | |
| JPS5187890A (ja) | Angyuraashikisaafueisusochi | |
| DK143991C (da) | Mejetaersker | |
| BE848946A (fr) | Plugkraan | |
| BE838960A (fr) | Tris-phenols | |
| FI53155C (fi) | Foerspaent byggnadselement med en traekonstruktion | |
| BE840864A (fr) | Agents thermo-sensibilisateurs | |
| AT360216B (de) | Rostmatte | |
| JPS5187746A (ja) | Hiraiki | |
| PL97657B1 (pl) | Zespol mocujacy do elementu polprzewodnikowego | |
| DK144976A (da) | Korn-fungicid-kombination | |
| DK488776A (da) | Fungicider | |
| JPS51101025A (ja) | Yuyoseishokubutsushikisonoseizoho |