SU529924A1 - Solder for soldering heat-resistant materials - Google Patents

Solder for soldering heat-resistant materials

Info

Publication number
SU529924A1
SU529924A1 SU2131934A SU2131934A SU529924A1 SU 529924 A1 SU529924 A1 SU 529924A1 SU 2131934 A SU2131934 A SU 2131934A SU 2131934 A SU2131934 A SU 2131934A SU 529924 A1 SU529924 A1 SU 529924A1
Authority
SU
USSR - Soviet Union
Prior art keywords
solder
resistant materials
soldering heat
heat
soldering
Prior art date
Application number
SU2131934A
Other languages
Russian (ru)
Inventor
Софья Васильевна Лашко
Николай Федорович Лашко
Аркадий Михайлович Шварцер
Александр Сергеевич Никишов
Василий Иванович Межерицкий
Виктор Андреевич Смирнов
Original Assignee
Всесоюзный Научно-Исследовательский Институт По Нормализации В Машиностроении Вниимаш
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Всесоюзный Научно-Исследовательский Институт По Нормализации В Машиностроении Вниимаш filed Critical Всесоюзный Научно-Исследовательский Институт По Нормализации В Машиностроении Вниимаш
Priority to SU2131934A priority Critical patent/SU529924A1/en
Application granted granted Critical
Publication of SU529924A1 publication Critical patent/SU529924A1/en

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Description

Изобретение относитс  к области пай- This invention relates to the field of

I ки, в частности к составу припо . I ki, in particular to the composition of the solder.

i Известен припой дп  паШсп жаропрочныi Known solder dp paShsp heat resisting

материапов, содержащий следуюшле компоЫенты , вес.%:materials containing the following components, wt.%:

Никепи и/ипи кобальт до24 .Nikepi and / ipi cobalt do24.

Хром до40Chrome do40

Железо до-.5Iron up to .5

Алюминий .5Aluminum .5

Углерод доOj3Carbon doj3

Марганец Manganese

Кремний до .:О,3Silicon up.: O, 3

Ниобий до Oj5Niobium to Oj5

Титан до .1,5Titanium to .1,5

Бор доо,Bor do

ПалладийОстальноеPalladium Else

Недостатком известного нрипо   вл е-хо то, что температура пайки этим припоем ; слишком высока, а это вызывает лерегрев и пережог структуры жаропрочных материалов , а таюке юс отпуск. сПри этом па ное соединение имеет низкую жаростойкость и жаропрочность.The disadvantage of the known nippo e-ho is that the soldering temperature of this solder; too high, and this causes leregrev and burnout of the structure of heat-resistant materials, but also leave. With this, the solder joint has a low heat resistance and heat resistance.

Дн  повынАени  жарощюHot days

аюсти и жаро-ayusti and heat

тойкости пшпгых соединеcapacity of the joint

Й ГфИПОЙ ДОПОП-THIRD FULL ADD

нитепыю содержит вопь(Ьраnitepyu contains scream

:м, мо 1Ибден, 1шролий , церий, иттрий шж с ле;зующем соот.: m, mo, 1Ibden, 1shrol, cerium, yttrium, shzh, with le;

ошении компонентов, вес, component weight, weight,

ПалладийPalladium

20-55 20-55

Хром 3,.6 о Chrome 3, .6 o

Апюмпгтй , 2,,8 i4,27-8,8 Apyumpgty, 2, 8 i4,27-8,8

ВольфрамTungsten

Марганец :О,18.0,32Manganese: Oh, 18.0,32

МолибденMolybdenum

0,54-1,90.54-1.9

0,018-0,32 0,018-0,32

ЦирконийZirconium

Уг-щюа , О, О 6-0 Д 6Ug-shchyu, O, O 6-0 D 6

КобальтCobalt

4,05-8,44.05-8.4

КремнийSilicon

0,18-0,32 0.18-0.32

Титан 10,9-2,3Titanium 10.9-2.3

О, ОО 9-0, (16.Oh, OO 9-0, (16.

НорийNoria

ЖелезоIron

0,45-0,8 0.45-0.8

Ниобий ;0,36-.О,96 Niobium; 0.36-O, 96

Иттрий 10,005-0,008 0,016-0,028 Yttrium 10.005-0.008 0.016-0.028

Бор Остальное ,Bohr Else

НикельNickel

Температура пайки предложенным припоем ниже1200 , no3TOf-.ty при пайке отсутствует The soldering temperature offered by the solder is below 1200, no3TOf-.ty during soldering is absent

SU2131934A 1975-05-07 1975-05-07 Solder for soldering heat-resistant materials SU529924A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SU2131934A SU529924A1 (en) 1975-05-07 1975-05-07 Solder for soldering heat-resistant materials

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU2131934A SU529924A1 (en) 1975-05-07 1975-05-07 Solder for soldering heat-resistant materials

Publications (1)

Publication Number Publication Date
SU529924A1 true SU529924A1 (en) 1976-09-30

Family

ID=20618696

Family Applications (1)

Application Number Title Priority Date Filing Date
SU2131934A SU529924A1 (en) 1975-05-07 1975-05-07 Solder for soldering heat-resistant materials

Country Status (1)

Country Link
SU (1) SU529924A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0534934A1 (en) * 1987-08-25 1993-04-07 Allied Signal Inc Low temperature, high strength glassy nickel-palladium based brazing alloys.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0534934A1 (en) * 1987-08-25 1993-04-07 Allied Signal Inc Low temperature, high strength glassy nickel-palladium based brazing alloys.

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