SU529924A1 - Solder for soldering heat-resistant materials - Google Patents
Solder for soldering heat-resistant materialsInfo
- Publication number
- SU529924A1 SU529924A1 SU2131934A SU2131934A SU529924A1 SU 529924 A1 SU529924 A1 SU 529924A1 SU 2131934 A SU2131934 A SU 2131934A SU 2131934 A SU2131934 A SU 2131934A SU 529924 A1 SU529924 A1 SU 529924A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- solder
- resistant materials
- soldering heat
- heat
- soldering
- Prior art date
Links
Landscapes
- Ceramic Products (AREA)
Description
Изобретение относитс к области пай- This invention relates to the field of
I ки, в частности к составу припо . I ki, in particular to the composition of the solder.
i Известен припой дп паШсп жаропрочныi Known solder dp paShsp heat resisting
материапов, содержащий следуюшле компоЫенты , вес.%:materials containing the following components, wt.%:
Никепи и/ипи кобальт до24 .Nikepi and / ipi cobalt do24.
Хром до40Chrome do40
Железо до-.5Iron up to .5
Алюминий .5Aluminum .5
Углерод доOj3Carbon doj3
Марганец Manganese
Кремний до .:О,3Silicon up.: O, 3
Ниобий до Oj5Niobium to Oj5
Титан до .1,5Titanium to .1,5
Бор доо,Bor do
ПалладийОстальноеPalladium Else
Недостатком известного нрипо вл е-хо то, что температура пайки этим припоем ; слишком высока, а это вызывает лерегрев и пережог структуры жаропрочных материалов , а таюке юс отпуск. сПри этом па ное соединение имеет низкую жаростойкость и жаропрочность.The disadvantage of the known nippo e-ho is that the soldering temperature of this solder; too high, and this causes leregrev and burnout of the structure of heat-resistant materials, but also leave. With this, the solder joint has a low heat resistance and heat resistance.
Дн повынАени жарощюHot days
аюсти и жаро-ayusti and heat
тойкости пшпгых соединеcapacity of the joint
Й ГфИПОЙ ДОПОП-THIRD FULL ADD
нитепыю содержит вопь(Ьраnitepyu contains scream
:м, мо 1Ибден, 1шролий , церий, иттрий шж с ле;зующем соот.: m, mo, 1Ibden, 1shrol, cerium, yttrium, shzh, with le;
ошении компонентов, вес, component weight, weight,
ПалладийPalladium
20-55 20-55
Хром 3,.6 о Chrome 3, .6 o
Апюмпгтй , 2,,8 i4,27-8,8 Apyumpgty, 2, 8 i4,27-8,8
ВольфрамTungsten
Марганец :О,18.0,32Manganese: Oh, 18.0,32
МолибденMolybdenum
0,54-1,90.54-1.9
0,018-0,32 0,018-0,32
ЦирконийZirconium
Уг-щюа , О, О 6-0 Д 6Ug-shchyu, O, O 6-0 D 6
КобальтCobalt
4,05-8,44.05-8.4
КремнийSilicon
0,18-0,32 0.18-0.32
Титан 10,9-2,3Titanium 10.9-2.3
О, ОО 9-0, (16.Oh, OO 9-0, (16.
НорийNoria
ЖелезоIron
0,45-0,8 0.45-0.8
Ниобий ;0,36-.О,96 Niobium; 0.36-O, 96
Иттрий 10,005-0,008 0,016-0,028 Yttrium 10.005-0.008 0.016-0.028
Бор Остальное ,Bohr Else
НикельNickel
Температура пайки предложенным припоем ниже1200 , no3TOf-.ty при пайке отсутствует The soldering temperature offered by the solder is below 1200, no3TOf-.ty during soldering is absent
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU2131934A SU529924A1 (en) | 1975-05-07 | 1975-05-07 | Solder for soldering heat-resistant materials |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU2131934A SU529924A1 (en) | 1975-05-07 | 1975-05-07 | Solder for soldering heat-resistant materials |
Publications (1)
Publication Number | Publication Date |
---|---|
SU529924A1 true SU529924A1 (en) | 1976-09-30 |
Family
ID=20618696
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SU2131934A SU529924A1 (en) | 1975-05-07 | 1975-05-07 | Solder for soldering heat-resistant materials |
Country Status (1)
Country | Link |
---|---|
SU (1) | SU529924A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0534934A1 (en) * | 1987-08-25 | 1993-04-07 | Allied Signal Inc | Low temperature, high strength glassy nickel-palladium based brazing alloys. |
-
1975
- 1975-05-07 SU SU2131934A patent/SU529924A1/en active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0534934A1 (en) * | 1987-08-25 | 1993-04-07 | Allied Signal Inc | Low temperature, high strength glassy nickel-palladium based brazing alloys. |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3155491A (en) | Brazing alloy | |
JPS51133807A (en) | Turbo type impeller with high performance | |
US4255190A (en) | Essentially non-precious stainless dental alloy | |
SU529924A1 (en) | Solder for soldering heat-resistant materials | |
EP0096428A1 (en) | High temperature brazing alloys | |
US2901347A (en) | Nickel-chromium-germanium alloys for stainless steel brazing | |
JPS55103298A (en) | Gold braze alloy for dental | |
JPS5337992A (en) | Sintered diamond | |
SU144084A1 (en) | Ceramic flux | |
US4205985A (en) | Nickel base alloy | |
JPS55138040A (en) | Combined contact material | |
US2843478A (en) | High temperature brazing alloy for joining fe cr al materials and austenitic and ferritic stainless steels | |
ES444891A1 (en) | Dental solder | |
SU212539A1 (en) | Refractory nickel-base alloy | |
SU451768A1 (en) | Nickel based alloy | |
GB1489212A (en) | High temperature alloy | |
SU529031A1 (en) | Solders for brazing stainless steels | |
SU625422A1 (en) | Iron-base alloy | |
JPS5270466A (en) | Low boiling point cooling medium composition | |
KR920016601A (en) | Liquid Phase Diffusion Bonding Using Insert Materials with Higher Melting Temperature than Base Metal | |
SU436874A1 (en) | Titanium based alloy | |
JPS5732346A (en) | Mother alloy for oxidation resistant lead-tin solder | |
FR2055978A5 (en) | Zirconium alloy for brazing zirconium and other metals | |
JPS5337110A (en) | Preparation of overlays | |
Aleksandrova et al. | Effects of Overheating in the Heat Treatment of Cast Creep- and Corrosion Resistant Alloys of the EP 539 LM Type for the Blades of Gas Turbine Engines |