SU491963A1 - Device for modeling thermal conductivity - Google Patents

Description

one

The invention relates to the field of analog computing and is intended to solve non-linear heat conduction problems.

A device for simulating thermal conductivity is known, comprising a series-connected switch, an analog-to-digital converter, a first interface block, a digital computing unit, a second interface block, and an / -net.

In order to reduce the cost and simplify the simulation, the proposed device contains a code-controlled voltage source and a code-controlled register element connected to its output, connected to an α-grid, made on variable resistors, the inputs of which are connected to the outputs of the second interface block.

The scheme of the proposed device is shown in the drawing.

The device contains a digital computing unit 1, an analog-to-digital converter 2, a switch 3 and interface blocks 4 and 5. The device also contains an / network, which is made on variable resistors 7, a code-controlled voltage source 8 and a code-controlled resistor 9, which entered through the interface unit with block 1.

The device works as follows.

The signal corresponding to the initial conditions, through the interface block 5, is applied to the code-controlled blocks 8 and 9. The current from the output of the code-controlled voltage source 8 through the code-controlled resistor element 9 is fed to the node, / -nets, where the currents from the neighboring mesh nodes. From the node of the / -net, the signal through the switch 3, the analog-digital converter 2 and the interface block 4 is transmitted as a code to the block 1, where the data for the second approximation at a given time interval is corrected using special programs. In particular, the value of the code-controlled resistance is corrected, the value of which is determined by the thermal diffusivity coefficient, which depends on the temperature (therefore, the value of the code-control resistance depends on the potential of the node in the previous approximation). In addition, the magnitude of the current or potential of the voltage setting the boundary conditions is corrected.

The iteration process continues until two successive approximations produce results that differ from each other within a predetermined accuracy. After that, a time step is taken, for which the potentials of the nodes obtained at the previous time instant are given by block 1 through block 5 on

the code-controlled PICTOMHHK voltage 8 and the solution goes in the same way as described above for the previous step in time, i.e., information is retrieved from Ksetka, transferred to the flea 1, correction of values in the code-controlled elements, etc. .

Claims (1)

Invention Formula A device for simulating thermal conductivity, containing: its series-connected switch, analog-digital converter, first interface block, digital computing unit, second interface block, and / -net connected to the first input of the switch, to the second input of which the output of the digital computing unit is connected , characterized in that, in order to reduce the cost and simplify the simulation, it contains a code-controlled voltage source and a code-mounted resistor element connected to its output, One of which is connected to the input of the R grid, which is made on variable resistors, and the inputs of the code-controlled voltage source and the code-compensated resistor element are connected to the outputs of the second interface block.  3 I. „J