SU424681A1 - COMPOSITE MATERIAL FOR SOLDER CONDUCTOR SHOE-CONDUITS FUND W: SH? 10c - Google Patents
COMPOSITE MATERIAL FOR SOLDER CONDUCTOR SHOE-CONDUITS FUND W: SH? 10cInfo
- Publication number
- SU424681A1 SU424681A1 SU1761212A SU1761212A SU424681A1 SU 424681 A1 SU424681 A1 SU 424681A1 SU 1761212 A SU1761212 A SU 1761212A SU 1761212 A SU1761212 A SU 1761212A SU 424681 A1 SU424681 A1 SU 424681A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- fund
- conduits
- composite material
- conductor shoe
- solder conductor
- Prior art date
Links
Description
Изобретение касаетс пайки.The invention relates to soldering.
Известен комиозитнъш материал дл паГжи полуиро1водин1ко,в на основе свинца, в котором содержатс 11вердые частицы никел .A comitious material is known for pagzhi poluirovodin1ko, in lead-based, which contains 11 solid particles of nickel.
Дл снижени температуры пайки и повышени качества па ного соединени без предварительной металлизации поверхности содержание никел составл ет 25-75% от общего веса материала. Предлагаемым комнозиционньш материалом возможно при низкой температуре получать соединени непосредственно с кремнием без Предварительной металлизации его новерхности.To reduce the brazing temperature and improve the quality of the solder joint without prior surface metallization, the nickel content is 25-75% of the total weight of the material. The proposed material is possible at a low temperature to obtain compounds directly with silicon without preliminary metallization of its surface.
:Комиозитный материал представл ет собой матрицу из свинца с волокнами из никелевой ираволоки, соста вл ющей 25-75% от общего веса материала. Соединение получаетс также нри до,бав:ке из порошкового никел в той же проиорции. При использовании предлагаемого комнозиционного материала высокопрочные и низкоом.ные контакты готов тс при 330-370°С и выдержке нри этой температуре ,Б течение 10-20 мин под давление-м 1-5 кг/см. Соединени получают за счет поверхностных влений: фотоэлектрические преобразователи с глубиной залегани /;-п перехода около 1 мкм не измен ют своих хара1ктеристик после Принайки па их поверхности токосъемов в виде р да параллельных проволок. Пайке подвергаетс монокристаллический кремнИй р- и /г-тина проводимости с удельным электросопротивлением 1-2 ом-см с полированной поверхностью. На участках поверхности кремни , смоченных припобМ, замечаетс металлизированный подслой .A: The comosite material is a matrix of lead with nickel and ilowolk fibers, making up 25-75% of the total weight of the material. The compound is also obtained in the do, bav: ke of powdered nickel in the same production. When using the proposed composite material, high-strength and low-resistance contacts are prepared at 330-370 ° C and exposure at this temperature, B for 10-20 minutes under pressure 1-5 kg / cm. The joints are obtained by means of surface effects: photoelectric converters with a depth of f /; - n junction of about 1 micron do not change their characteristics after gaining their surface of current collectors in the form of a series of parallel wires. Single-crystal silicon of p-and / g-tin conductivity with a specific electrical resistance of 1-2 ohm-cm with a polished surface is subjected to soldering. On the surface areas of silicon moistened with the primer, a metallized sublayer is observed.
Пред м е т и з о б р е т е н и Prevention and Consideration
Композитный aтepиaл дл найки полупроводников на осноцзе свинца, содержащий твердые частицы никел , отличающийс тем, что, с целью сппженм тем1пературы пайки и повышени качества па ного соед)гпсии без предварительной металлизацпп поверхности, содержание никел составл ет 25-75% от общего веса материала.A composite atomic for semiconductors based on lead oxide containing nickel solids, characterized in that, in order to heat the solder temperature and improve the quality of the solder without a prior metal surface, the nickel content is 25-75% of the total weight of the material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU1761212A SU424681A1 (en) | 1972-03-20 | 1972-03-20 | COMPOSITE MATERIAL FOR SOLDER CONDUCTOR SHOE-CONDUITS FUND W: SH? 10c |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU1761212A SU424681A1 (en) | 1972-03-20 | 1972-03-20 | COMPOSITE MATERIAL FOR SOLDER CONDUCTOR SHOE-CONDUITS FUND W: SH? 10c |
Publications (1)
Publication Number | Publication Date |
---|---|
SU424681A1 true SU424681A1 (en) | 1974-04-25 |
Family
ID=20507128
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SU1761212A SU424681A1 (en) | 1972-03-20 | 1972-03-20 | COMPOSITE MATERIAL FOR SOLDER CONDUCTOR SHOE-CONDUITS FUND W: SH? 10c |
Country Status (1)
Country | Link |
---|---|
SU (1) | SU424681A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4706870A (en) * | 1984-12-18 | 1987-11-17 | Motorola Inc. | Controlled chemical reduction of surface film |
-
1972
- 1972-03-20 SU SU1761212A patent/SU424681A1/en active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4706870A (en) * | 1984-12-18 | 1987-11-17 | Motorola Inc. | Controlled chemical reduction of surface film |
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