SU417454A1 - - Google Patents
Info
- Publication number
- SU417454A1 SU417454A1 SU1827062A SU1827062A SU417454A1 SU 417454 A1 SU417454 A1 SU 417454A1 SU 1827062 A SU1827062 A SU 1827062A SU 1827062 A SU1827062 A SU 1827062A SU 417454 A1 SU417454 A1 SU 417454A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- resin
- polyaminoimidazoline
- thermal conductivity
- boron nitride
- epoxy
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 description 4
- 229910052582 BN Inorganic materials 0.000 description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 229910021419 crystalline silicon Inorganic materials 0.000 description 3
- YQHLDYVWEZKEOX-UHFFFAOYSA-N cumene hydroperoxide Chemical compound OOC(C)(C)C1=CC=CC=C1 YQHLDYVWEZKEOX-UHFFFAOYSA-N 0.000 description 3
- 239000012764 mineral filler Substances 0.000 description 3
- ROLAGNYPWIVYTG-UHFFFAOYSA-N 1,2-bis(4-methoxyphenyl)ethanamine;hydrochloride Chemical compound Cl.C1=CC(OC)=CC=C1CC(N)C1=CC=C(OC)C=C1 ROLAGNYPWIVYTG-UHFFFAOYSA-N 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- -1 Butylglycidyl Chemical group 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- QQVIHTHCMHWDBS-UHFFFAOYSA-L isophthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC(C([O-])=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-L 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU1827062A SU417454A1 (cg-RX-API-DMAC10.html) | 1972-09-11 | 1972-09-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU1827062A SU417454A1 (cg-RX-API-DMAC10.html) | 1972-09-11 | 1972-09-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU417454A1 true SU417454A1 (cg-RX-API-DMAC10.html) | 1974-02-28 |
Family
ID=20526613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU1827062A SU417454A1 (cg-RX-API-DMAC10.html) | 1972-09-11 | 1972-09-11 |
Country Status (1)
| Country | Link |
|---|---|
| SU (1) | SU417454A1 (cg-RX-API-DMAC10.html) |
-
1972
- 1972-09-11 SU SU1827062A patent/SU417454A1/ru active
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