SU282879A1 - METHOD OF ELECTROLYTIC DEPOSITION OF ALLOY - ZINC - Google Patents
METHOD OF ELECTROLYTIC DEPOSITION OF ALLOY - ZINCInfo
- Publication number
- SU282879A1 SU282879A1 SU1325775A SU1325775A SU282879A1 SU 282879 A1 SU282879 A1 SU 282879A1 SU 1325775 A SU1325775 A SU 1325775A SU 1325775 A SU1325775 A SU 1325775A SU 282879 A1 SU282879 A1 SU 282879A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- zinc
- alloy
- copper
- electrolytic deposition
- electrolyte
- Prior art date
Links
- 229910052725 zinc Inorganic materials 0.000 title description 5
- 239000011701 zinc Substances 0.000 title description 5
- 239000003792 electrolyte Substances 0.000 description 8
- HWGNBUXHKFFFIH-UHFFFAOYSA-I pentasodium;[oxido(phosphonatooxy)phosphoryl] phosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])(=O)OP([O-])([O-])=O HWGNBUXHKFFFIH-UHFFFAOYSA-I 0.000 description 5
- 235000019832 sodium triphosphate Nutrition 0.000 description 5
- 230000002378 acidificating Effects 0.000 description 4
- -1 copper-zinc Chemical compound 0.000 description 4
- 239000001488 sodium phosphate Substances 0.000 description 4
- 229910000162 sodium phosphate Inorganic materials 0.000 description 4
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N zinc Chemical class [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 4
- 229910001297 Zn alloy Inorganic materials 0.000 description 3
- 239000008139 complexing agent Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical class [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000011780 sodium chloride Substances 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L Copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- FQENQNTWSFEDLI-UHFFFAOYSA-J Tetrasodium pyrophosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 229940048086 sodium pyrophosphate Drugs 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 235000019818 tetrasodium diphosphate Nutrition 0.000 description 1
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 150000003751 zinc Chemical class 0.000 description 1
Description
Изобретение относитс к способам электролитического осаждени сплавов, в частности сплава медь-цинк.The invention relates to methods for the electrolytic deposition of alloys, in particular a copper-zinc alloy.
Известен способ электроосаждени сплава медь - цинк из комплексного электролита, содержащего соли меди и цинка, кислый фосфорнокислый натрий и пирофосфат натри , в качестве комплексообразовател . Однако этот электролит недостаточно стабилен в работе и готовитс из дорогих и дефицитных солей.The known method of electrodeposition of a copper-zinc alloy from a complex electrolyte containing salts of copper and zinc, acidic sodium phosphate and sodium pyrophosphate, as a complexing agent. However, this electrolyte is not sufficiently stable in operation and is prepared from expensive and scarce salts.
Предложенный способ позвол ет получать плотные, мелкокристаллические и хорошо сцепленные с основой осадки сплава медь- цинк при достаточной стабильности электролита .The proposed method allows to obtain dense, fine-crystalline and well adhered to the base precipitates of the copper-zinc alloy with sufficient stability of the electrolyte.
Способ отличаетс от известного тем, что в качестве комплексообразовател в электролит ввод т триполифосфат натри , а также по услови м ведени процесса. Процесс ведут в электролите, содержащем, г/л;The method differs from the known one in that sodium tripolyphosphate is introduced into the electrolyte as a complexing agent, as well as according to the conditions of the process. The process is conducted in an electrolyte containing, g / l;
сернокислую медь11- 13copper sulfate 11-13
сернокислый цинк40- 46zinc sulphate40- 46
триполифосфат натри 224-230sodium tripolyphosphate 224-230
кислый фосфорнокислый натрий 18- 20 при рН 7,4-8,0; температуре 30-40°С и катодной плотности тока 0,8-1,2 а1дм.acidic sodium phosphate 18-20 at pH 7.4-8.0; temperature 30-40 ° C and a cathode current density of 0.8-1.2 a1 dm.
Аноды из латуни Л-62 перед работой рекомендуетс протравливать в концентрированной азотной кислоте.Anodes made of L-62 brass are recommended to be etched in concentrated nitric acid before operation.
Приготовление электролита. Расчетное количество солей раствор ют отдельно в половине требуемого объема воды при . Затем при перемещивании к раствору триполифосфата натри небольшими порци ми добавл ют растворы сернокислых солей цинка и меди, регулируют рН добавлением серной кислоты или едкого натра.Preparation of electrolyte. The calculated amount of salts is dissolved separately in half of the required volume of water at. Then, when transferred to a solution of sodium tripolyphosphate, solutions of sulphate salts of zinc and copper are added in small portions, and the pH is adjusted by the addition of sulfuric acid or caustic soda.
Предмет изобретени Subject invention
Способ электролитического осаждени сплаза медь-цинк из комплексного электролита, содержащего соли меди и цинка и кислый фосфорнокислый натрий, отличающийс тем, что, с целью получени плотных мелкокристаллических осадков, в качестве комплексообразовател в электролит ввод т триполифосфат натри при следующем соотношении компонентов, г/л:The method of electrolytic precipitation of copper-zinc from a complex electrolyte containing copper and zinc salts and acidic sodium phosphate, characterized in that sodium tripolyphosphate is introduced into the electrolyte in the following ratio of components, g / l, as a complexing agent :
сернокисла медь11- 13sulfate copper 11-13
сернокислый цинк40- 46zinc sulphate40- 46
триполифосфат натри 224-230sodium tripolyphosphate 224-230
кислый фосфорнокислый натрий 18- 20 и процесс ведут при рН 7,4-8,0, температуре 30-40°С и катодной плотности тока 0,8-1,2 а/Лиг.acidic sodium phosphate 18-20 and the process is carried out at a pH of 7.4-8.0, a temperature of 30-40 ° C and a cathode current density of 0.8-1.2 a / Lig.
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU282879A1 true SU282879A1 (en) |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5762778A (en) * | 1996-02-12 | 1998-06-09 | Gould Electronics Inc. | Non-cyanide brass plating bath and a method of making metallic foil having a brass layer using the non-cyanide brass plating bath |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5762778A (en) * | 1996-02-12 | 1998-06-09 | Gould Electronics Inc. | Non-cyanide brass plating bath and a method of making metallic foil having a brass layer using the non-cyanide brass plating bath |
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