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Publication date
Application filed by Б.Г. СоколовfiledCriticalБ.Г. Соколов
Priority to SU1085102/27ApriorityCriticalpatent/SU245524A1/en
Application grantedgrantedCritical
Publication of SU245524A1publicationCriticalpatent/SU245524A1/en
Electric Connection Of Electric Components To Printed Circuits
(AREA)
Abstract
Способ пайки изделий в вакууме путем бомбардировки паяемой поверхности электрически заряженными частицами, отличающийся тем, что, с целью повышения качества паяных соединений при пайке активных тугоплавких металлов без предварительной очистки паяемой поверхности, пайку изделий осуществляют путем бомбардировки паяемой поверхности ионами газов.The method of soldering products in vacuum by bombarding the brazed surface with electrically charged particles, characterized in that, in order to improve the quality of soldered joints when soldering active refractory metals without first cleaning the soldered surface, soldering products is carried out by bombarding the brazed surface with gas ions.
SU1085102/27A1966-06-211966-06-21
Method of soldering products
SU245524A1
(en)
Transmission line connector with means including cam surfaces for altering connector element dimensions to compensate for junction gaps, and method therefor
Improvements in or relating to methods of joining ina vacuum-tight manner parts ofa vacuum vessel atleast oneof which consists atleast atthe surface of copper