SU1805826A1 - Method for local deposition of tin-lead alloy on copper-metallized insulating substrate - Google Patents

Method for local deposition of tin-lead alloy on copper-metallized insulating substrate

Info

Publication number
SU1805826A1
SU1805826A1 SU4868707/21A SU4868707A SU1805826A1 SU 1805826 A1 SU1805826 A1 SU 1805826A1 SU 4868707/21 A SU4868707/21 A SU 4868707/21A SU 4868707 A SU4868707 A SU 4868707A SU 1805826 A1 SU1805826 A1 SU 1805826A1
Authority
SU
USSR - Soviet Union
Prior art keywords
tin
copper
local deposition
insulating substrate
fluoboric
Prior art date
Application number
SU4868707/21A
Other languages
Russian (ru)
Inventor
Е.П. Чубаров
В.Ю. Виноградов
Original Assignee
Центральный научно-исследовательский технологический институт
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Центральный научно-исследовательский технологический институт filed Critical Центральный научно-исследовательский технологический институт
Priority to SU4868707/21A priority Critical patent/SU1805826A1/en
Application granted granted Critical
Publication of SU1805826A1 publication Critical patent/SU1805826A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder

Landscapes

  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

FIELD: microelectronics. SUBSTANCE: method for local deposition involves soldering of one or more auxiliary metal (activator) droplets onto copper-metallized substrate prior to dipping it in medium; used as medium is voltaic solution of the following composition, g/l: fluoboric tin - 15; fluoboric lead - 9; fluoboric acid - 260; boric acid - 5. EFFECT: uniform thickness of coating obtained in the process. 1 tbl
SU4868707/21A 1990-07-05 1990-07-05 Method for local deposition of tin-lead alloy on copper-metallized insulating substrate SU1805826A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SU4868707/21A SU1805826A1 (en) 1990-07-05 1990-07-05 Method for local deposition of tin-lead alloy on copper-metallized insulating substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU4868707/21A SU1805826A1 (en) 1990-07-05 1990-07-05 Method for local deposition of tin-lead alloy on copper-metallized insulating substrate

Publications (1)

Publication Number Publication Date
SU1805826A1 true SU1805826A1 (en) 1996-04-10

Family

ID=60538369

Family Applications (1)

Application Number Title Priority Date Filing Date
SU4868707/21A SU1805826A1 (en) 1990-07-05 1990-07-05 Method for local deposition of tin-lead alloy on copper-metallized insulating substrate

Country Status (1)

Country Link
SU (1) SU1805826A1 (en)

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