SU1779198A1 - Устройство термообработки стеклокристаллических покрытий металлодиэлектрических подложек - Google Patents

Устройство термообработки стеклокристаллических покрытий металлодиэлектрических подложек

Info

Publication number
SU1779198A1
SU1779198A1 SU4858626/21A SU4858626A SU1779198A1 SU 1779198 A1 SU1779198 A1 SU 1779198A1 SU 4858626/21 A SU4858626/21 A SU 4858626/21A SU 4858626 A SU4858626 A SU 4858626A SU 1779198 A1 SU1779198 A1 SU 1779198A1
Authority
SU
USSR - Soviet Union
Prior art keywords
stops
plate
glass
metal
heat
Prior art date
Application number
SU4858626/21A
Other languages
English (en)
Inventor
С.А. Зайдман
Original Assignee
Научно-производственное объединение "Динамика"
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Научно-производственное объединение "Динамика" filed Critical Научно-производственное объединение "Динамика"
Priority to SU4858626/21A priority Critical patent/SU1779198A1/ru
Priority to PCT/SU1991/000164 priority patent/WO1992003029A1/ru
Application granted granted Critical
Publication of SU1779198A1 publication Critical patent/SU1779198A1/ru

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Tunnel Furnaces (AREA)

Abstract

Использование: изобретение относится к технологии изготовления подложек радиоэлектронной аппаратуры, в частности к технологии термообработки стеклокристаллических покрытий металлодиэлектрических подложек для изделий гибридной микроэлектроники. Сущность изобретения: цель - повышение качества покрытия. Устройство содержит камеру 1 нагрева с размещенными внутри нее конвейером, средство 2 изменения скорости перемещения и подложкодержатель 3. Подложкодержатель 3 выполнен в виде двух профилированных стержней из жаростойкой стали с упорами на их концах, скрепленных между собой в центре тяжести каждого стержня, и теплопроводящей пластины 14 с упорами, жестко соединенной со стержнями одним своим концом. Упоры пластины выполнены из материала с большей теплопроводностью и с большим поперечным сечением, чем упоры стержня. Средство 2 изменения скорости перемещения подложки выполнено в виде лебедки, барабан 11 которой закреплен перед выходным отверстием камеры нагрева, ось барабана 11 расположена перпендикулярно направлению перемещения подложки, а конец троса 13 закреплен в отверстии, выполненном на свободном конце пластины. 4 ил.
SU4858626/21A 1990-08-08 1990-08-08 Устройство термообработки стеклокристаллических покрытий металлодиэлектрических подложек SU1779198A1 (ru)

Priority Applications (2)

Application Number Priority Date Filing Date Title
SU4858626/21A SU1779198A1 (ru) 1990-08-08 1990-08-08 Устройство термообработки стеклокристаллических покрытий металлодиэлектрических подложек
PCT/SU1991/000164 WO1992003029A1 (en) 1990-08-08 1991-08-05 Device for heat treatment of substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU4858626/21A SU1779198A1 (ru) 1990-08-08 1990-08-08 Устройство термообработки стеклокристаллических покрытий металлодиэлектрических подложек

Publications (1)

Publication Number Publication Date
SU1779198A1 true SU1779198A1 (ru) 1996-03-10

Family

ID=21531789

Family Applications (1)

Application Number Title Priority Date Filing Date
SU4858626/21A SU1779198A1 (ru) 1990-08-08 1990-08-08 Устройство термообработки стеклокристаллических покрытий металлодиэлектрических подложек

Country Status (2)

Country Link
SU (1) SU1779198A1 (ru)
WO (1) WO1992003029A1 (ru)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1509312A (en) * 1974-04-01 1978-05-04 Nippon Paint Co Ltd Method and apparatus for curing photo-curable composition
SU838278A1 (ru) * 1979-07-23 1981-06-15 Предприятие П/Я А-3813 Установка дл термообработки изде-лий
US4468259A (en) * 1981-12-04 1984-08-28 Ushio Denki Kabushiki Kaisha Uniform wafer heating by controlling light source and circumferential heating of wafer
DE3305934A1 (de) * 1983-02-21 1984-08-23 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zur temperaturbehandlung von substraten, insbesondere von halbleiterkristallscheiben
SU1478007A1 (ru) * 1987-04-23 1989-05-07 Предприятие П/Я Г-4066 Установка дл тепловой обработки изделий

Also Published As

Publication number Publication date
WO1992003029A1 (en) 1992-02-20

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