SU1738626A1 - Abrasive cutting disk - Google Patents

Abstract

Use: for cutting single crystal plates. SUMMARY OF THE INVENTION: The abrasive layer 2 on the peripheral part of the circle body is symmetrically divided by a reinforcing ring 3. The wear of this ring is faster than the wear of its abrasive surroundings, during the cutting process creates a central annular groove on the front cutting part of the circle, reducing lateral leads. 1 hp f-ly, 2 ill.

Description

FIG. 2

The invention relates to the tooling industry, more specifically to diamond cutting wheels with an inner cutting edge, intended for cutting silicon single crystals and other complex semiconductor compositions into plates.

The aim of the invention is to increase the stability of the wheel during the cutting process.

The goal is achieved by the fact that in a cutting wheel, on the case of which a diamond abrasive working layer is reinforced, the latter is symmetrically divided by a disk (ring) over the entire height of the layer, and the hardness of the disk is less than the hardness of the working layer. The thickness of the annular disk is in the range (0.5-1.0) dcp, where dcp is the average size of the abrasive grain in the working layer.

The specified range of the thickness of the annular disk due to the following. The lower limit of 0.5 dcp is determined by the minimum necessary strength of the disk in order to withstand the mechanical forces that occur when diamond grains are fed into the area of their attachment - overgrowth during the formation of the working layer. The upper limit of 1.0 dcp is due to the need to ensure the destruction of the material being cut in the zone of contact between the annular disk and the material. Studies show that when cutting grains, diamond grains create microcracks in the cut single crystal, the depth of which is on average equal to half the size of the diamond grain. Therefore, to destroy the material being cut in the area of the annular disk, the distance between the diamond grains of the divided halves of the working layer should be no more than two microcrack depths, i.e. single medium diameter diamond grain.

Figure 1 shows the cutting wheel, a general view; Fig. 2 shows a circle in the process of its manufacture, a section.

The circle is made in the form of a thin-sheet metal case 1 with an inner central hole, on the surface of the edge of which a diamond-abrasive working layer 2 is galvanically deposited symmetrically divided in half by a metal partition, generally looking like an annular disk.

Example. The AKVR 546x184x0.32 mm cutting wheel (outer diameter of the circle, diameter of the internal hole and thickness of the body) was made by electroplating of a package of circle cases. Made circles and other sizes. First, on the peripheral edge of the inner hole of the body of the circle form

an annular disk 3 with a thickness of 35/50 mm (the range of variation in the package of casing circles is indicated) by injecting nickel electrolyte into the gap between insulators 4,

tightly pressed against the body of the circle (FIG. 2a). Then, by known methods of electroplating (using insulators 5), a coating of diamond grains AC6 is formed around the peripheral edge with an annular disk.

50/40 on the nickel bond (fig.2b). Upon completion of the electroplating process, the deposition by mechanical means, for example, with a grinding wheel, removes a part of the diamond layer from the peripheral side.

before opening the metal of the annular disk 3 (figv),

The circle works as follows. The circles of the claimed type cut brittle solid materials, such as silicon single crystal, into plates with a thickness of 0.3-1.0 mm. The process of cutting such materials is the formation of diamond grains of a circle in the material of microcracks and chipping the material out of the cutting strip. The claimed circle in the center of the cutting front creates microcracks propagating and intersecting in front of the annular disk, which creates normal conditions for chipping material in this zone. Due to the higher hardness of the material of the annular disk 3, the material being cut will wear out the contiguous surface of the annular disk more quickly than it wears. This causes the formation and constant maintenance in the center of the diamond abrasive working layer of the circle of the depression in the form of a central annular groove, which ensures the stability of the circle from lateral displacements during

cutting.

Improving the stability of the cutting edge of the circle provides a reduction of 2-5% of the waste material of the object being cut: the plates come out more evenly, with

smaller deviations from flatness, which allows to reduce the allowance for subsequent grinding and thereby increase the output of plates by 2-3%.

Claims (2)

1. A cutting abrasive wheel, made in the form of a disk case with an abrasive layer located at its ends and periphery, characterized by By the fact that, in order to increase the stability of the wheel during the cutting process, the abrasive layer is reinforced with a ring on the peripheral part of the body in the plane of symmetry of its ends, the hardness of which is less than the hardness of the abrasive layer. 2. A circle according to claim 1, characterized in that the thickness (H) of the reinforcing ring is selected from the condition H (0.5-1.0) dcp, where dcp is the average size of the abrasive grain of the abrasive layer. FIG.