JPS6133669B2 - - Google Patents

Description

[Detailed Description of the Invention] Conventionally used diamond saws for cutting stones, etc. include the Kimberly type, in which a layer of diamond abrasive grains is solidified in an annular shape around the entire circumference of the substrate, and the diamond saw. There is a segment type in which diamond abrasive grains called chips are sintered into pellets and fixed to the outer periphery of a substrate at equal intervals. Among these, the Kimberly type is made by continuously solidifying a diamond abrasive grain layer around the entire circumference of the substrate as described above, and its cutting method is to cut the outer peripheral surface of the diamond abrasive grain layer. The method uses a method in which the diamond abrasive grain layer is pressed against the surface of the target material and is abraded while progressing, so the cutting edge of the target material is finished neatly, the work is not accompanied by vibration or noise, and the diamond abrasive layer does not peel or break. Although it has advantages, it has the disadvantage that it is significantly inferior to the segment type in terms of machinability. On the other hand, the segment type is made by fixing a diamond chip to the outer periphery of the substrate by a method such as brazing, and the cutting method is such that the tip of the chip crashes into the surface of the mating material, breaking the part and scraping it off. Since this method simultaneously abrades the mating material using the outer peripheral surface of the chip, the cutting performance is significantly higher than that of the Kimberly type, which cuts only by abrading the mating material. However, due to the accumulation of impact during the above-mentioned cutting process, fatigue fracture is likely to occur in the part where the chip is fixed, and since the length of the part where the chip is fixed is short, it may break at the bonded part due to the bending moment caused by an unexpected lateral load during work. Often. Furthermore, the impact generated during cutting generates a large amount of noise, and these drawbacks are unavoidable in the case of the segment type.

As mentioned above, both the Kimberly type and the segment type of diamond saws for cutting stones, etc., which have been used in the past, have their own advantages but also have their disadvantages, so both types are different. As a result of our efforts to research a diamond saw that takes advantage of only the advantages and eliminates the disadvantages, we have succeeded in developing the diamond saw according to the present invention.

The details of the diamond saw of the present invention will be explained below with reference to the drawings. Fig. 1 is a partial front view of the diamond saw of the present invention, Fig. 2 is a partial plan view taken in the direction of arrow A, Fig. 3 is a sectional view of BB', Fig. 4 is a sectional view of CC',
Fig. 5 is a partial plan view when the depth of the grooves provided on both the front and rear sides of the diamond abrasive grain layer is shallow;
FIG. 6 is a partial plan view when the depth of the grooves provided on both the front and rear sides of the diamond abrasive grain layer is exactly 1/2 the thickness of the abrasive grain layer. FIG. 7 is a diagram showing the state after the outer peripheral part of the cross section of the diamond abrasive grain layer CC' has been worn to a certain extent after a certain amount of use, and similarly, FIG. FIG. 9 is a diagram showing the wear state of the outer peripheral portion of the diamond abrasive grain layer in the cross section taken along the line EE' in FIG. 6.
In FIG. 1, 1 is a substrate, and 2 is a diamond abrasive grain layer, which, like the Kimberly type, is fixed to the outer periphery of the substrate in an unbroken ring shape. 3, 3'' indicates a groove provided on the front side of the diamond abrasive layer 2. In FIG. 2, 2 indicates a diamond abrasive layer,
3, 3'' are grooves provided on the front side of the diamond abrasive layer, 3', 3 are grooves provided on the rear side of the diamond abrasive layer. 4 is a center line representing the center of the diamond abrasive layer. and the groove 3,
3', 3'', 3 reach beyond the center line 4, indicating that the depth l of the groove is more than 1/2 of the thickness t of the diamond abrasive grain layer. Fig. 3 is a cross-sectional view of BB' in Fig. 2, which shows that the depth of groove 3' is more than 1/2 of the thickness t of the diamond abrasive grain layer, and 4 is the center line. Figure CC' is a cross-sectional view of the part where there are no grooves in the diamond abrasive grain layer.
This shows that the depth of the grooves 5, 5', 5'' provided on both rear sides is shallower than 1/2 of the thickness of the diamond abrasive grain layer. The grooves indicated by 6'' reach as far as the center line 4, indicating that the depth of these grooves is exactly 1/2 the thickness of the diamond abrasive grain layer. Figures 7, 8, and 9 all show the state of wear on the outer periphery of the diamond abrasive layer after a diamond saw has been used for a certain period of time, and the depth of the grooves provided on both the front and rear sides of the diamond abrasive layer Therefore, the cross-sectional shapes of the outer periphery of the same portion are concave (FIG. 7), convex (FIG. 8, 8), and flat (FIG. 9, 9). Hereinafter, the relationship between the depth of the grooves provided on the front and rear surfaces of the diamond abrasive grain layer and the outer circumferential cross-sectional shape of the same portion after the start of use will be explained. That is, when considering the outer periphery of the diamond abrasive grain layer as divided into several annular zones, the number of grooves included in each zone varies depending on the depth of the grooves. The amount of diamond abrasive grains contained therein is also small. The degree of wear of the diamond abrasive grain layer is faster when the amount of diamond abrasive grains contained in the zone is small. Therefore, in the case of the type shown in Figure 5 where the depth of the grooves in the diamond abrasive grain layer is shallow, the outermost zone of the abrasive grain layer wears out the fastest, and the central zone that does not include the grooves wears out the most. This results in wear to a convex cross-sectional shape as shown in FIG. 8. Based on the same principle, in the case of the type shown in Fig. 2 where the groove depth is deep, the seventh
As shown in Fig. 7, in the case of the type shown in Fig. 6, where the groove is worn in a concave manner and the depth of the groove is equal to 1/2 of the thickness of the diamond abrasive layer, the wear state is flat as shown in Fig. 9. It will be shown.

The details of the diamond saw of the present invention will be explained below. As explained in the drawings, the diamond saw of the present invention is a Kimberley-type diamond saw in which a diamond abrasive grain layer is continuously sintered on the outer periphery of a substrate without any breaks, in front of the diamond abrasive grain layer. , a large number of grooves are arranged on both rear sides, and these grooves are characterized by being deeper than 1/2 of the thickness of the diamond abrasive grain layer. Kimberly type and segment It has a performance that takes advantage of the strengths of the mold and eliminates its defects.

The first advantage is that since the diamond abrasive layer is fixed to the substrate over the entire circumference, the accident of breakage of the diamond abrasive layer, which occurs in the case of the segment type, no longer occurs. Next, when creating grooves on both the front and rear sides of the diamond abrasive layer, the thickness of the diamond abrasive layer will remain unchanged, so the depth of this groove (Fig. 2 l) It has the same shape as if a new cutting blade with the corresponding blade width was added. Therefore, not only the cutting quality is significantly improved compared to the Kimberly type without grooves, but the diamond abrasive grains equivalent to the volume of the grooves are not used, so cutting performance is improved and costs are reduced. This can also be achieved, which is the second advantage of the diamond saw of the present invention. Next, in the segment type, there is a gap between the tips, and each time the tip cuts into the other party, the impact applied to the tip edge appears in the form of vibration, causing wear and tear on the machine, breakage of the tip, and damage to the tip. However, since the diamond saw of the present invention does not have a part that causes vibration corresponding to the gap between the tips in the segment type, the vibration is hardly felt. Next, one of the shortcomings of the Kimberly type is the problem of clogging and sharpening. When cutting with a diamond saw, the chips generated from the cutting surface adhere firmly to the outer surface of the diamond abrasive layer, causing the heads of the diamond abrasive grains exposed on the surface of the diamond abrasive layer to become It may become buried in adhering chips. In such a case, the diamond abrasive grains lose their cutting ability and a phenomenon of clogging occurs. This tendency is more likely in the case of the Kimberley type, where chips are not sufficiently discharged. In the diamond saw of the present invention, the grooves provided on the side surfaces of the diamond abrasive grain layer also have the role of discharging chips, so clogging hardly occurs. Since this clogging takes considerable time and effort to correct, the fact that clogging does not occur is very helpful in improving work efficiency. Another problem that often occurs when cutting stones, etc. is the phenomenon of deviation, where the cutting direction is not kept constant. The internal physical properties of both stone and concrete materials are not uniform and may contain pebbles and gravel. The cutting resistance of such materials often differs depending on the location, and in such cases, the board is subjected to lateral loads, or buckling occurs, causing distortion on the board surface. If the substrate axis is advanced in this state, the substrate will move in the direction of the strain that once occurred, causing a phenomenon of deviation. The occurrence of this deviation is also related to the cross-sectional shape of the diamond abrasive grain layer, and this deviation is likely to occur when the diamond abrasive layer has a convex cross-section as shown in Fig. 8 or a flat cross-section as shown in Fig. 9. It was found that this is unlikely to occur in the case of the concave cross section shown in the figure. This is because when the cross section is concave, the inner surfaces of the convex parts on both sides of the concave receive pressure from both the left and right directions, exerting a self-aligning property and correcting the orientation of the board to its original orientation. This is probably because it functions like this. Since convex cross sections and flat cross sections do not have this self-centering function, it is thought that once the course goes out of order, the outage progresses at an accelerated rate and appears as a deviation phenomenon. In the diamond saw of the present invention, since the depth of the groove provided on the side surface of the diamond abrasive grain layer is deep, the cross-sectional shape of the diamond abrasive grain layer takes the concave wear shape shown in FIG. This feature has the advantage that the cutting direction is kept constant and no deviation occurs. This deflection phenomenon has the property of gradually growing due to a slight deflection of the outer circumference of the substrate, and once the deflection begins to grow, the work currently in progress will be wasted, so Extreme care must always be taken to prevent this, and it is also one of the causes of worker fatigue. In this respect, the development of the diamond saw of the present invention, in which the outer periphery of the diamond abrasive grain layer is in a concave worn state, greatly contributes to improving the efficiency of stone cutting operations and preventing defects, and also has a significant economic effect.

As explained above, the diamond saw for cutting stones, etc. of the present invention has a diamond abrasive grain layer fixed in an annular shape around the entire outer periphery of the substrate, and a large number of grooves are arranged on both the front and rear sides of the diamond layer. Because it is made up of 300-mold steel, it is as safe against breakage as the Kimberly type, has a cutting capacity comparable to the segmented type, can be manufactured at a much lower cost than the Kimberly type, has less vibration, and is less prone to clogging. Also, since there is no deviation in the cutting direction, it can be said to be an excellent diamond saw for cutting stones, etc., with high economic efficiency and safety.

[Brief explanation of the drawing]

Figure 1: Partial front view, Figure 2: Partial plan view as seen from arrow A, Figure 3: BB' sectional view, Figure 4: CC' sectional view,
Fig. 5 Partial plan view when shallow grooves are provided in the diamond abrasive layer, Fig. 6 Partial plan view when the depth of the grooves provided on the side surface of the diamond abrasive layer is equal to 1/2 of the thickness of the abrasive layer Partial plan view, Figures 7, 8, and 9 Diagrams showing the state of wear on the outer periphery of the diamond saw after it has been used for a certain period of time. 1...Substrate, 2...Diamond abrasive layer, 3,
3', 3'', 3... groove, 4... center line, 5,
5', 5''...groove, 6, 6', 6''...groove, 7, 8,
9... Indicates a worn state.

Claims (1)

[Claims] 1. A large number of grooves are alternately arranged on both front and rear sides of a diamond abrasive grain layer solidified in an annular shape around the entire outer periphery of the substrate, and the depth of the grooves is equal to the diamond abrasive grain layer. A continuous type diamond saw for cutting stone, etc., characterized by a dimension that is 1/2 or more of the thickness of the diamond saw.