SU1700109A1 - Unit for electrolytic depositing - Google Patents

Abstract

This invention relates to electroplating. The purpose of the invention is to continuously monitor the process by registering a gas release. The device comprises a bath 1, a thyristor rectifier 2 with an automatic current control system, a shunt 3, an amplifier 4, a memory element 5, a comparison element 6, a deflection amplifier 7, a time delay element 8 that turns the deviation value (signal) and a time delay. A visual information analyzer 9 is installed above the mirror of bath 1, which is compared with electronic data (with tolerance) and, after a corresponding conversion, is fed to an adjustable rectifier 2. This ensures the quality control of the electrolysis through the control and regulation of the gas release process. 2 Il.

Description

1

The invention relates to electroplating and can be applied in the processes of copper plating, zinc plating, chrome plating, iron plating, etc.

The purpose of the invention is to continuously monitor the process by registering gas evolution.

FIG. 1 shows a block diagram of the device; in fig. 2 is a block diagram (one of the variants) of the electrolysis process control algorithm.

The device comprises a bath 1, a thyristor rectifier 2. a shunt 3, an amplifier 4, a memory element 5, a comparison element b, a deviation amplifier 7, a time delay element 8, an analyzer 9 and a converter 10.

The device works as follows.

A signal proportional to the process current flowing through bath 1 (Fig. 1) from the controlled thyristor rectifier 2 is removed from shunt 3 and amplified by amplifier 4, from where the signal goes to the controlled thyristor rectifier 2 (automatic control circuit) and to the element 5 memory, storing its value at the end of the period of direct polarity. Then, in the comparison ep, the em deviates from the nominal value. The difference signal from the element b is the comparison of the difference between the amplifier and the amplifier 7 of the deviation. The amplified difference signal is supplied from the time delay element 8, which fixes the time delay inversely proportional to the deviation of the process current from the nominal value. Element 8 is connected to the reverse polarity relay of the controlled rectifier 2 and automatically corrects the reverse polarity times in inversely proportional to the current deviation at the end of the direct polarity period from the nominal value. A visual information analyzer 9 is installed above the mirror of the bath 1. The electrolit electrolyte control device is scanned by polling the video signal processor registers with moving the visual information analyzer relative to the electrolyte surface. The incoming signals are analyzed in converter 10, as a result of which the selected linear sections in which defects (gas bubbles) are detected are summed up and compared with the tolerance sum, where the signal goes to the controlled thyristor rectifier 2 (automatic control type). The main idea in the algorithm regulation is to find

differences between the input image and the template (tolerance image of the bath mirror). Such a MOXIHQ comparison is performed using the subtract operation (FIG.

2). If the number of differences exceeds the allowable, then the rectifier 2 is de-energized, since the workpiece is poorly prepared in previous operations and this is accompanied by an active outgassing. The algorithm in the flowchart provides good quality adhesion of the coating to the surface of the workpiece.

The device works as follows

5 After a short period of anodic decoupling and a short pause, the first long period of direct polarity is turned on, during all these periods there is a constant monitoring of the discharge.

0 In case of exceeding the permissible amount of emitted gas, the process is unstable and therefore stops until the cause of the instability is eliminated.

5 At the end of the first prolonged period, there is a danger of accelerated growth of chromium crystals around the formed grading process, but during a short period of reverse polarity (about 20 seconds), the surface of chromium undergoes anodic dissolution and the centers of crystallization are destroyed. After,, from here, the period of the direct polarity (p 15 p aa mich) begins with a gradual

5 current increases from 30% to the nominal value for a certain time. Then the cycles of the forward and reverse polarity are repeated a certain number of times, depending on the desired thickness of the chrome plating.

The proposed device will improve the performance and quality of coatings, as well as provide increased technological discipline and a significant measure5 but will reduce the defect in work.

Claims (1)

The invention The electroplating deposition device containing a bath, thyristor rectifier with a system 0 automatic current control, shunt, amplifier, memory element, reference element, deflection amplifier, time delay element, characterized in that, in order to continuously monitor the process by registering gas release, it contains a visual information analyzer and a converter, with the analyzer installed above the bath mirror, and the converter is connected to an adjustable rectifier. Not cooin8emcm8yem tolerance 3 Comparison with reference mark Match / admission Selecting the surface, moving to camera #, registering the surface image Years mpefft / e- my thickness required / e / b