SU1621190A1 - Device for evaporative cooling of electronic devices - Google Patents

Abstract

The invention relates to electronics. The purpose of the invention is to simplify the design, increase maintainability and improve the mass and size characteristics of the device for evaporative cooling of semiconductor devices - it is achieved in that case 1 is made in the form of a closed shell of transparent dielectric film and filled with liquid heat carrier 2o On the outer surface of case 1 in the zone evaporation element is placed b stiffness with ensuring thermal contact with the wall of the housing 1. The installation sites 6 for semiconductor devices 7 are separated by the outer surface of the elements 5 of the environment, each of which is made in the form of a box or a disk. A zp f-lp, 5 ill.

Description

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The invention relates to converter technology and can be used to cool power semiconductor devices, powering down metro substations,

The purpose of the invention is to simplify the design, increase maintainability and improve weight and size characteristics.

FIG. 1 and 2 show a device for evaporative cooling of tablet-type semiconductor devices, two orthogonal projections} in FIG. 3, the same, with rigid elements in the form of boxes; in fig. 4 - the same for two semiconductor devices, cross section; in fig. 5 - the same with,

stiffeners in the form of disks.

A device for evaporative cooling of semiconductor devices comprises a body 1 with elastic walls partially filled with heat-transfer fluid 2, with condensation zones 3 and evaporation 4, stiffness elements 5 located on the walls of the housing 1 in its evaporation zone 4 ensuring thermal contact with the wall 15 of the installation platforms 6 for semiconductor devices 7 placed on the outer surface of the walls of the housing 1 in its evaporation zone 4. The housing 1 is made in the form of a closed shell of a transparent dielectric film, for example, an artificial polymer film. The stiffness element 5 is located on the outer surface of the shell of the housing 1 in its evaporation zone 4, and the mounting sites 6 for semiconductor devices 7 are mounted on the outer surface of the stiffness elements 5.

Each element 5 stiffness is made in the form of a box, and the shell of the housing 1 in its evaporation zone 4 is in the form of sleeves 8 installed in the box, with mounting pads 6 located on the walls of the box.

Sleeves 8 shell shell 1 is placed on the outer sides of the boxes

Each element 5 stiffness can be made in the form of a disk 9. The closed shell of the housing 1 has the shape of a ring. Sleeves are located inside the ring. The disks 9 are installed inside the ring in parallel with each other with the possibility of interaction with the sleeves. In the condensation zone 3 of the housing 1 a container 10 is placed of artificial polymer j 5 to

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film, filled with heat storage material 11. PET film was used as an artificial polymer film. Semiconductor devices 7 are compressed with stiffening elements 5 and conductive tires 12 by means of clamping elements 13. Stiffening elements 5 are made of heat-conducting material,

The device for evaporative cooling works as follows

When current flows through the semiconductor device 7, heat is released, which is transmitted through the wall of the stiffening element 5, the wall of the housing 1 in its evaporation zone 4 to the heat storage substance 2J, which is used as a heat transfer fluid, for example water, the heat transfer fluid boils and its vapors rise the condensation zone 3 of the housing 1, where it condenses and flows along the inner walls of the housing 1 into its evaporation zone 4, and heat is discharged into the environment through the wall of the housing 1, for example, by natural convection Air With increasing current through the semiconductor device 7, the amount of heat increases, which leads to an increase in the vapor pressure of the heat-transfer fluid in the internal cavity of the housing 1 and contributes to a better pressing of the polymer film to the walls of the power element 5 and, consequently, reducing the thermal resistance between the semiconductor the device 7 and the liquid coolant 2,

In the case of the use of container 10 of tagshokakumulyuk with material 11, part of the heat is spent on melting the hepatomogenous substance tf, for example paraffin, during periods of abrupt load on the semiconductor device 7, during periods of decrease or cessation of current through the semiconductor device 7, the heat from the accumulated the material 11 of the container 10 is transferred to the liquid coolant 2 of the housing 1, on the surface of which the container 10 floats, thus thermally stabilizing the semiconductor device 7 and lengthens his life.

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Claims (5)

Invention Formula 1, Device for evaporative cooling of semiconductor devices, comprising a housing with elastic walls, partially filled with a heat-transfer fluid, with condensation and evaporation zones, stiffening elements located on the hull walls in its evaporation zone to ensure thermal contact with the wall, mounting sites for semiconductor devices on the outer surface of the hull walls in its zone evaporation, characterized in that, in order to simplify the design, increase maintainability and improve weight and size characteristics, the casing is made in the form of a closed shell of transparent glass electric film, a stiffener disposed on the outer surface of the housing shell in its vaporization zone and mounting pad for semiconductor devices disposed on the outer surface of stiffeners 2. The device according to claim. Characterized in that each FIG. 2 0 The stiffness ment is made in the form of a box, and the shell of the case in its evaporation zone is in the form of sleeves installed in the box, with mounting pads located on the walls of the boxes. 3. The device according to paragraphs. 1 and 2, differing in that the sleeves of the shell are located on the outer sides of the boxes. 4. The device according to claim, 1, characterized in that each stiffness element is made in the form of a disk, 5 the enclosure is enclosed in the form of a ring. With sleeves inside the ring, with the disks mounted inside the ring parallel with each other with the possibility of interaction with the hands, 5. Device on the front. 1 to 4, characterized in that a polymer is used as a transparent dielectric film of the shell 5 PET film brand. / eight Fig.d w Fig -/ five 10.11 V-V / g $