SU1606252A1 - Die heat insulation unit for isothermal forming - Google Patents

Abstract

The invention relates to the processing of metals by pressure, in particular to thermal insulation devices for dies for isothermal stamping. The purpose of the invention is to reduce heat loss and improve die conditions. The thermal insulation unit of the stamp for isothermal stamping contains a package of metal gaskets with regularly spaced holes in each of them. In the process of heating and stamping, the heat flux, the passage through the package of gaskets, is disturbed in the zone of their holes, located in a staggered order, replacing the transfer of heat from thermal conductivity to radiation. 2 Il.

Description

The invention relates to the processing of metals by pressure and can be used in high-temperature isothermal dies as a thermal insulating plate located in the high-temperature zone.

The purpose of the invention is to reduce heat loss and improve the working conditions of the stamp.

At firm 1, the proposed block presents a general view of figure 2 - section A-A in figure 1.

Thermal insulation unit of the stamp for isothermal punching of screws in the form of a package of metal gaskets (for example, of four) 1,2, 3 and 4, each of which has regularly arranged holes (for example, in a checkerboard pattern) holes 5 that do not cross one another in contacting the seals. Thus, the holes 5 in the gasket 2 do not overlap with the holes 5 in the gasket 1, and the same holes in the gasket 3 do not overlap with the holes in the gasket 2, etc.

The number of gaskets in the package can be different and is determined by the required value of thermal resistance of thermal insulation. Besides . in addition, the holes 5 can be located along the area of the gaskets 1-4, both uniformly and in accordance with a predetermined law.

Figure 1 also indicates the heated tool 6, for example, the die and the die plates 7. The heat insulation package, as a rule, sets

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Claims (1)

Claim The block of thermal insulation of the stamp for isothermal stamping, containing a package of metal gaskets located in the zone of support of the stamp, characterized in that ^ in order to reduce heat loss and improve the working conditions of the stamp, metal chi energy thermal conductivity on the gasket is made with holes regularly located over their area, giving radiation through a system of screens can dramatically reduce heat loss placed along the height of the package in the mine-figure 1 A ~ A Yv AG A hr y ' to - (- A /4 Sd A A A A V at —G A Λ. A V Ah A V A v L '' to hr A A γ A A \ R A > g A· A A A v Λ l y ' A V A V A at ~ i-- to Λ. A l A A A at FIG. g