SU1558950A1 - Potting compound - Google Patents

Abstract

The invention relates to electronics, in particular to casting compounds used for sealing electronic equipment and electrical products. The invention makes it possible to increase the impact strength of the compound to 18 kJ / m ² , the electric strength up to 26 mV / m, water and acid resistance due to its use in a composition that includes, in parts by weight: epoxy resin Dianova 100, monocyanylethylethylene triamine 20-23 the modifier is oligoetherepoxide 10-20, the filler is talc 10-40, additionally N is phenylneftylamine-10.1-1.0. 3 tab.

Description

The invention relates to electronics, in particular to casting compounds used for sealing electronic equipment and electrical products.

The aim of the invention is to increase the toughness, dielectric strength, water and acid resistance of the compound.

The components used have the following characteristics.

Epoxy resin of mark ED-20 with the content of epoxy groups up to 22% and viscosity at 25 ° С 12 - 18 Pa-s is used as epoxy resin. As a modifier - oligoether epoxide brand Laproxide-503 (L-503), GEPT-2 with the content of epo-. xidic groups 19%. Curing is carried out with an amine-type hardener UP-OBZZMM with a nitrogen content of 36.4% and viscosity at 25 ° C, 0.2 Pas. The additive is Sch-phenylnaphthylamine-1 (Ne-ozone-A) with a melting point of 54 ° C, and the filler is medical talc.

Experimental verification of the properties of the compound is used to prepare nine mixtures of ingredients, three of which give optimal results (Table 1), as well as a known composition.

The composition of the proposed composition is prepared as follows.

A batch of ED-20, L-503 and Neozone-A is introduced into the mixer. The components are heated to 80 ± 5 ° C for 20 minutes and mixed well. A portion of talc is added to the cooled mixture and stirred for 15 minutes at 20-30 ° C. This mixture of components is preheated before and evacuated for 1 hour. The calculated amount of hardeners is added to the cooled mixture. UH-RPMW. Curing is carried out in air for 3 hours and then at 80 ± 5 ° C for 3 hours.

(L

with

SP

cl

Additional control compositions (Table 2) are tested using similar compounds: N-phenylnaphthylamine-2 (Neozon-C), NN-di- (naphthyl-2) -phenylenediamine-1, b (Ciaphen N.N.) and H - (- hydroxyphenyl) naphthylamine-2 (P-oxineozone). The research results are presented in

From the data obtained it follows that the use of N-phenylnaphthylamine-2, N, N -di (naphthyl-2) -phenylenediamine-amine-, and L – C “-hydroxyphenyl) naphthylamine-2 epoxy compositions as additives is not gives a positive effect.

The polymers obtained are tested for resistance to the action of aqueous and acidic (10% HC1) media in accordance with the known method

one

the invention

A casting compound comprising an epoxy resin of Dianova, an amine type hardener, a modifier of the oligoester type and a filler, characterized in that, in order to increase the toughness, electrical strength, water and acid resistance, it contains monocyanylethylethylene dimethyl amine, as a modifier oligothiarepoxide, as a filler is talc and additionally contains M-phenylnaphthylamine1 in the following ratio of components, mac.ch ..:,

Epoxy Dianova; ,

resin10O4

Monocyanethyldieth

Oh,} 0, (O Ooo

150.022 0

2590

 The basis of the composition has the following composition, mac.: ED-20 100; L-503 20; talc kQ; UE-0633M 23.

table 2

Table 3

1558950

Compiled by A.Zachernyuk Editor I. Derbak Tehred A. Kravchuk

Order 818

Mintage 588

VNIIPI State Committee for Inventions and Discoveries at the State Committee on Science and Technology of the USSR 113035, Moscow, Zh-35, Raushsk nab., D.

Production and Publishing Combine Patent, Uzhgorod, st. Gagarin, 101

eight

Continuation of table 3

Proofreader L. Beskid

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Claims (1)

Casting compound comprising an epoxy diane resin, amine type hardener ^g, oligoefirnogo type modifier and a filler, characterized in that, in order to increase toughness, elekIQ the dielectric strength, water- and acid-™, it contains as hardener monotsianetildietilentriamin, as modifier oligoester epoxide, as a filler 15 talc and additionally contains N-phenylnaphthylamine-1 in the following ratio, wt.h .: Epoxy Dianova Resin one hundred twenty Monocyanethyl diethyl- lenriamine 20-23 Oligoetherpoxide 10f20 Talc 10-40 N-phenylnaphthylamine-1 0.1-1.0 Tables1 Structure Ratio Waterlogo- Coefficient Hit- Tangent Specific Specific Elek- Pace ionpo components. X , diffusion may angle dm volumetric on top of three- rvtur * eition parts by weight " h si / s L-10 ’ vae- electrm electrm nostme cheskvya glass- 24 bone, cheshoe salt other vviya. 1000 .in water a 102- kL / n ¹ of losses solro laziness nost "from no HC1 at tmvle- 10 * Hz. MV / m 10 ‘Hz when is he and 20 * C 10 ⁴ Hz and 20 * C, Ohm cm one Iaest- NEW EZK-4 - • · - - - 0.011 Yu - 16 33K-S Proposed 0.12 0.9 0.2 0.04 5 0.014 5.9-10 ” 2.1 10. 16 90 one ED-20 100 0.10 L-503 20 Tal * 40 UP-063EM 23 Neoaon-d 0.05 0.88 0.18 c, 0b) 10 0,025 4.8-10 * 3.5 yu .21 88. 2 ED-20 100 0.08 L-503 20 Talc 40 UP-0633N 23 Neoeon-A 0.1 0.55 .0.017 0.003 16 0,032 2.4 10 2.1.10 " 24 90 3 ED-20 100 0.08- L-503 20 Talc 40 UP-0633I 23 Neo "he-a 0.5 0.5 0.06 0.0056 fourteen 0.02 510 ” 2.1-10 " 26 1 ¹ 90 four / ED-20 100 0.07 L-503 20 Talc 40 UP-0633I 23 Naoaon-A 1.0 0.49 0.01 0.007 17 0.024 5,6-10 * 2.1 10 " 26 90 5 ED-20 100 0.16 L-503 20 Talc 40 UP-0633M 23 Neoaon-A 1.5 0.84 0.3 0.056 13 0.02 4.8-10 * 2.1-10 " 22 90 6 ED-20 100 0.12 L-503 20 Talc 40 UP-0633M 23 0.89 0.15 0,095 6 0,0) 2 5.9-10 ” 2.1 10 " twenty 88 7 30-20 100 0.07 L-503 10 Talc 10 UP-0633M 20 Neoaon-A 0.1 0.45 0.04 0.004 fifteen 0.02 2 10 ” 2 10 " 25 90