SU1558590A1 - Arrangement for tinning without flux - Google Patents

Abstract

The invention relates to tinning and can be used in the assembly of microelectronic equipment in electronic engineering. The purpose of the invention is to improve the quality of the coating. The holes for soldering in the tip are made in the form of parallel grooves in two mutually perpendicular directions. The casing and the tip are attached to the head of the tinning 4 through the flat springs 8 and the circular vibrator 9. The vibrator 9 is attached to the vertical movement mechanism 14. In this way, a uniform supply of solder to the working zone is ensured. 4 il.

Description

The invention relates to tinning, in particular, to devices for fluxless tinning of boards of microstrip devices of electronic products with low-temperature solders.

The purpose of the invention is to improve the quality of the coating by ensuring uniform supply of solder to the work area.

Fig. 1 shows the device, a general view of Fig. 2-4, embodiments of a finisher with grooves in Fig. 5, section A-A in Fig. 4.

The device contains a coordinate table 1, a tile 2, and a tin board 3 is fastened on the tile. The tinning head consists of a body 4 in which the heater tube 5 is placed. In the tube is attached the tip 6, and on the body there is a cover 7. The tip together with the tube form storage tank. In the tip, narrow grooves are cut through, the channel connected to the reservoir. The head for tinning with the help of flat springs 8 is attached to the vibrator of circular movements. The vibrator 9 consists of a housing, an electric motor 10, an intermediate shaft 11, an eccentric 12 and a movable plate 13 suspended on springs 14. The springs 8 are attached to the plate 13. The housing 9 is attached to the vertical movement mechanism 15. In the tip of large sizes, narrow grooves in one direction are cut to a shallower depth. The device works as follows.

A plate 3 is fixed on the tile 2. The solder in the reservoir of the tip 6 is melted by means of the heater 5. A gas mixture is fed to the head for the tinning. Warm up

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the plate 3 on the tile is 2 to 10–20 ° C below the melting point of the solder. Turn on the vibrator, then move in one direction. Through the grooves of the tip solder continuously enters the zone of tinning. Owing to the vibrations of the tip, the oxide film is removed from the surface of the board, and the supply of the gas mixture to the tinning zone ensures the recovery of the oxide film from the surface of the solder and prevents the solder from oxidation. In this way, tinning without flux is provided.

The proposed device effectively removes oxide films and ensures the tinned surface of the boards without the use of fluxes.

Claims (1)

Invention Formula A device for fluxless tinning of boards of microstrip devices, comprising a coordinate table, a tinning head located above it, connected to a vertical movement mechanism, a tip with a cavity for molten solder connected to a channel for supplying solder to the working area, the casing coaxial to the tip, gas source connected to the casing and reservoir, characterized in that, in order to improve the quality of the coating by ensuring uniform supply of solder to the working area, the channel for supplying solder to the p bochuyu zone is in the form of parallel grooves formed in two mutually perpendicular directions, and the head for tinning mounted for rotary movement. fts.2 HE nn OBE HEJ nor willow tree Fi.by FI.3 FIG. five