SU1501506A1 - Compound for sealing radio electronic devices - Google Patents
Compound for sealing radio electronic devicesInfo
- Publication number
- SU1501506A1 SU1501506A1 SU4318577/05A SU4318577A SU1501506A1 SU 1501506 A1 SU1501506 A1 SU 1501506A1 SU 4318577/05 A SU4318577/05 A SU 4318577/05A SU 4318577 A SU4318577 A SU 4318577A SU 1501506 A1 SU1501506 A1 SU 1501506A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- resin
- epoxyorganosilicon
- compound
- electronic devices
- sealing
- Prior art date
Links
Landscapes
- Joining Of Glass To Other Materials (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
FIELD: preparation of compositions used for bonding together, sealing and compacting components made of glass and metals in electronic engineering, more particularly in the manufacture of microdevices and liquid phase indicators. SUBSTANCE: the epoxy resin is an epoxydane resin or an epoxyorganosilicon resin, the organosilicon modifier is a mixture of low molecular dimethylsiloxane rubber with an epoxyorganosilicon oligomer which is a product of reaction of epychlorohydrin and oligophenylsiloxanes containing 18.4 % hydroxyl groups, 3$ phenyltriethoxysilane, 11.7-16.9 a mixed hardener based on aminoalkylimidazoline; 3.1-4.3 a filler. EFFECT: improved moisture resistance, adhesion strength and heat shock resistance.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU4318577/05A SU1501506A1 (en) | 1987-08-18 | 1987-08-18 | Compound for sealing radio electronic devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU4318577/05A SU1501506A1 (en) | 1987-08-18 | 1987-08-18 | Compound for sealing radio electronic devices |
Publications (1)
Publication Number | Publication Date |
---|---|
SU1501506A1 true SU1501506A1 (en) | 1995-11-10 |
Family
ID=60526974
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SU4318577/05A SU1501506A1 (en) | 1987-08-18 | 1987-08-18 | Compound for sealing radio electronic devices |
Country Status (1)
Country | Link |
---|---|
SU (1) | SU1501506A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2457231C1 (en) * | 2011-02-16 | 2012-07-27 | Открытое акционерное общество "Московский завод "САПФИР" | Adhesive epoxide compound |
RU2804400C1 (en) * | 2022-08-03 | 2023-09-28 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Набережночелнинский государственный педагогический университет" (ФГБОУ ВО "НГПУ") | Composition for anti-corrosion coating |
-
1987
- 1987-08-18 SU SU4318577/05A patent/SU1501506A1/en active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2457231C1 (en) * | 2011-02-16 | 2012-07-27 | Открытое акционерное общество "Московский завод "САПФИР" | Adhesive epoxide compound |
RU2804400C1 (en) * | 2022-08-03 | 2023-09-28 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Набережночелнинский государственный педагогический университет" (ФГБОУ ВО "НГПУ") | Composition for anti-corrosion coating |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0315090A3 (en) | Epoxy resin compositions for use in low temperature curing applications | |
AU627757B2 (en) | Reactive hot-melt adhesive containing a resin component and a thermally activatable, latent curing agent, a process for producing said adhesive and uses thereof | |
MX9606181A (en) | Curable compositions. | |
GB8603701D0 (en) | Epoxy resins | |
KR910016853A (en) | Modified epoxy resin | |
ES8705489A1 (en) | Partially advanced epoxy resin compositions and products resulting from reacting and curing said compositions. | |
KR870002198A (en) | Epoxy Resin Compositions for Sealing Semiconductor Devices | |
EP0351365A3 (en) | Curable epoxide resin compositions | |
ES8900124A1 (en) | Reactive composition based on polyamides, oligomers and epoxy resins. | |
US3948849A (en) | Adhesive compositions | |
PL306275A1 (en) | Epoxy resin suspension and application thereof | |
SU1501506A1 (en) | Compound for sealing radio electronic devices | |
KR850006701A (en) | Organosilicon / Oxirane Additives for Filled Condensed Polymer Composites | |
EP0388473A4 (en) | Silicone-epoxy resin composition and conductive adhesive prepared therefrom | |
NO861463L (en) | EPOXY RESINES WITH CONTROLLED CONVERSION, AND PROCEDURE FOR THE PREPARATION OF SUCH. | |
JP3196245B2 (en) | One-part type thermosetting epoxy resin composition | |
ES2130435T3 (en) | GELIFIED REACTIVE RESIN COMPOSITIONS. | |
EP0196077A3 (en) | Curing agent solution for epoxy resin compositions | |
KR910008067A (en) | Epoxy Resin Mixture | |
MY103755A (en) | Curing agent compositions, laminating varnishes containing same and laminates prepared terefrom | |
EP0458984A4 (en) | Novel resin, process for preparing the same, and composition comprising the same | |
JPS6429418A (en) | Epoxy resin composition | |
MY114142A (en) | Compositions on the basis of epoxy resins. | |
KR940014615A (en) | Thermosetting epoxy resin composition for FOCUS PACK encapsulant | |
CS264910B3 (en) | Epoxide two-component adhesive with short pot life |