SU1440963A1 - Apparatus for monitoring etching rate - Google Patents

Abstract

The invention relates to a measurement technique, in particular for measuring the speed of dimensional chemical etching of parts. The purpose of the invention is to improve the measurement accuracy / device for monitoring

Description

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The pickling parts of the parts contain a fastener bracket 1, into which the workpiece 2 is installed, a gas collecting vessel 3 with windows 4 located along the perimeter of the lower part, a rod 6, to the lower part of which a vessel 3 is fastened with the help of the movable connection 5 in the coupling 7 and fixed to the bracket 1 with the help of a screw 8. When the part is immersed together with the device, dimensional etching begins in the solution, during which hydrogen is released. Part of the released hydrogen gradually fills vessel 3, displacing the working solution from it. As a result, the vessel 3 rises up and turns around the movable joint 5. At this point, the tension of the rod 10 weakens and the magnet 11 under the action of the load 12 moves to the contact 13, which closes the circuit, and the device 14 resets the digital time meter. After the gas has exited, the vessel 3 is returned to its original position by the action of its own weight, and the device 14 starts a new count of the time of filling the vessel. Then the cycle repeats. The rod 6 is set at an angle cc to the surface of the workpiece. Depending on the immersion depth, this angle varies. Such a design of the device allows, by appropriately changing the position of the gas-collecting vessel relative to the treatment surface, when the depth of its immersion in the solution is increased, the accuracy of the measurement is increased by approximately 8%. 3 or

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The invention relates to a measurement technique and can be used to control the speed of size (chemical etching of parts).

The purpose of the invention is to increase the measurement accuracy.

Figure 1 shows the device, a general view; Figure 2 is the same, view from above; FIG. 3 is a plot of the time it takes to fill a vessel with the angle of inclination of the side surface of the vessel.

The device contains a fastening bracket 1, by means of which it is fastened to a vertically positioned workpiece 2. The gas collecting vessel 3 is made with rectangular windows 4 cut along the perimeter of the lateral surface of the lower part of the vessel 3, and through the movable joint 5 is connected to the fastening bracket 1 through the shaft .6, having the ability to move along the length of the sleeve 7. The stem 6 is fixed in the sleeve 7 by a screw 8. The angle of inclination of the stem 6 to the surface of the workpiece 2 is established by a corresponding turning fasteners 7. Fixing the coupling 7 in a predetermined position is carried out by a screw 9. The gas collecting vessel 3 is connected by means of a flexible rod 10 to a signaling device, made in the form of a magnet 11, which can be rotated relative to the support point under the action of a load 12, Magnetic contact A 13 (reed switch) is placed above the magnet 11 and electrically connected to the device 14, which indicates the etching rate of the workpiece 2.

The device works as follows.

In the initial position, the device is placed by means of the fastening bracket 1 on the common mounting frame of the workpieces. The part, together with the device, is immersed in the etching solution and the processing of the part begins. In the process of etching, the hydrogen that settles above the boundary of the bottom of the vessel of the part, lifts, partially falls into the window 4 located opposite the etching surface, and gradually fills the gas collecting vessel 3, displacing the solution from it. When the lift force of the gas becomes greater than the weight of the vessel 3, so3U

the court, turning relative to the movable joint 5, rises and completely releases the gas through the windows 4 located along the perimeter of the vessel. At this moment, the tension of the gi 10 weakens and the magnet 11 under the action of the load 12 moves to the magnetically controlled contact 13. The magnetically controlled contact 13 triggers and the indicating device 14 resets the digital time interval meter. After the gas has exited, the vessel 3 returns to its original position under the action of its own weight, and the device 14 again starts counting the time of filling the vessel 3 with gas. Then the cycle repeats. Since during the filling of the pump

Yes, the gas from the treated part is a defrosting vessel and a detector, a previously known layer of metal is trapped, then the measured filling time of the vessel gives information about the speed of processing the part.

In the proposed device, as the depth of immersion of the vessel in the solution increases, the rectangular window approaches the etching surface and, consequently, increases the flow of gas entering the vessel. When the depth of the vessel is reduced, the window is removed from the treatment surface and the gas intake into the vessel is reduced.

From the graph shown in FIG. 3, it follows that when diving

vessel angle of inclination of the plane of the window side of the side surface must be reduced.

Thus, by appropriately changing the position of the gas collecting vessel relative to the surface of the treatment as the depth of its immersion into the solution changes, the accuracy of the measurement can be increased by approximately 8%.

Claims (1)

Invention Formula A device for controlling the etching rate of parts, containing a support bracket for vertical fixation of parts, bell-shaped gas-reinforcing so that, in order to improve measurement accuracy, it is provided with a sleeve and a stem connected to the bracket by 25 of the coupling and placed at an acute angle to the vertical plane in the direction of the part, while the gas collecting vessel is attached to the lower end of the stem and made in the form of a regular upper stigma pyramid with rectangular windows located along the perimeter of the side surface of the pyramid at the base, and the distance from the bracket to the point of its connection with the rod is equal to the radius inscribed in the hexagon 35 base of the vessel circumference. Fie.2 t.c 10 of