SU1372177A1 - Two-phase thermosiphon - Google Patents

Abstract

The invention relates to heat transfer devices and allows to improve the weight and size characteristics and increase the heat transfer capacity of a thermosyphon (TS) when cooling semiconductor devices under conditions of periodic oscillations of the TS. In the zone 2 of the heat input, the vehicle 1 is provided externally with fins 5, and inside with a transverse partition 6 with an opening 7 in the upper part. A capillary structure (CS) 8 is placed on the site of the finning on either side of the partition on the inner surface of TC 1. When the TC oscillates, the partition keeps a portion of the liquid heat carrier from draining into its lower portion, and CS 8 prevents the drainage of the inner surface of the TC in the zone 2. The presence of fins prevents the drainage of COP 8. 1 Il. i Z /

Description

 M /) 7))) f)) fZ /

with y

eleven

FIELD OF THE INVENTION The invention relates to heat engineering, namely to heat transfer devices.

The purpose of the invention is to improve the overall characteristics and increase the heat transfer capacity when cooling semiconductor devices in conditions of periodic oscillations of a thermosyphon.

The drawing shows a thermosyphon, longitudinal section.

The thermosyphon 1 contains a heat supply zone 2 and two heat removal zones 3, made in the form of branches connected to zone 2 from opposite sides and equipped with fins 4. The heat supply zone 2 also has a fins 5 (radiator) on the outside and a transverse partition inside. 6 with a hole 7 in its upper part, with a capillary structure 8 located on either side of the partition 6 in the area of the placement of the fins 5 on the inner surface of the thermosyphon. Heat source 9 is installed in the zone 2 (semiconductor device). Thermosiphon 1 is partially filled with coolant.

The thermosyphon works as follows.

When heat is emitted from source 9 through the thermosiphon, heat and mass transfer occurs with a change in the aggregate state of the heat transfer medium. In case of small heat gaps in the device, a considerable part of the heat is removed directly through the fins.

72

5, as an increase in heat flux, the coolant boils and most of the heat is removed due to phase transformations. When the thermosyphon 1 oscillates, the partition 6 keeps a portion of the liquid heat carrier from draining into its lower (sloping) portion, and the capillary structure 8 prevents the internal surface of the thermosyphon from being drained in the heat supply zone 2, and the presence of the fins 5, in turn, prevents dehumidification of the capillary structure 8. These factors contribute to the increase in the heat transfer ability of the thermosyphon under oscillation conditions.

Claims (1)

Invention Formula Two-phase thermosyphon with a zone of heat supply in the middle part and two branches of heat removal in the form of branches connected to it from opposite sides, characterized in that, in order to improve the mass-dimensional characteristics and increase the heat transfer capacity during cooling of semiconductor devices under conditions of periodic oscillations thermosyphon, the latter in the area of heat supply is provided outside with fins, and inside with a transverse partition with a hole in the upper part, and in the area of the fins on either side of the Captures on the inner surface of the thermosyphon are located a capillary structure.