SU1358247A1 - METHOD OF INSTALLATION OF SEMICONDUCTOR DEVICES - Google Patents

METHOD OF INSTALLATION OF SEMICONDUCTOR DEVICES

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Publication number
SU1358247A1
SU1358247A1 SU4033644/27A SU4033644A SU1358247A1 SU 1358247 A1 SU1358247 A1 SU 1358247A1 SU 4033644/27 A SU4033644/27 A SU 4033644/27A SU 4033644 A SU4033644 A SU 4033644A SU 1358247 A1 SU1358247 A1 SU 1358247A1
Authority
SU
USSR - Soviet Union
Prior art keywords
installation
tool
semiconductor devices
welding
cross
Prior art date
Application number
SU4033644/27A
Other languages
Russian (ru)
Inventor
С.Н. Нехонов
Ю.В. Бочанов
Original Assignee
С.Н. Нехонов
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by С.Н. Нехонов filed Critical С.Н. Нехонов
Priority to SU4033644/27A priority Critical patent/SU1358247A1/en
Application granted granted Critical
Publication of SU1358247A1 publication Critical patent/SU1358247A1/en

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Abstract

Способ монтажа полупроводниковых приборов, включающий установку гибких выводов на контактную площадку, прижатие выводов инструментом, их сварку и контроль качества на отрыв при отведении инструмента под углом 90° к плоскости присоединения вывода с усилием, равным эталонному усилию отрыва сварного соединения, отличающийся тем, что, с целью снижения трудоемкости и повышения точности контроля, сварку производят инструментом, на рабочем торце которого выполняют крестообразный паз с поперечным сечением в виде "ласточкина хвоста" для затекании материала вывода и обеспечения равномерного механического нагружения сварного соединения при отрыве.The method of installation of semiconductor devices, including the installation of flexible leads to the contact pad, pressing the leads with a tool, welding them, and quality control for tearing when the tool is led at an angle of 90 ° to the plane of connection of the lead with a force equal to the standard breakout force of the welded joint, characterized in that in order to reduce labor intensity and increase the accuracy of control, welding is carried out with a tool, on the working end of which a cross-shaped groove with a cross section in the form of a “dovetail” for a drip is performed uu output material and provide uniform mechanical loading at the weld joint break.

SU4033644/27A 1986-03-03 1986-03-03 METHOD OF INSTALLATION OF SEMICONDUCTOR DEVICES SU1358247A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SU4033644/27A SU1358247A1 (en) 1986-03-03 1986-03-03 METHOD OF INSTALLATION OF SEMICONDUCTOR DEVICES

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU4033644/27A SU1358247A1 (en) 1986-03-03 1986-03-03 METHOD OF INSTALLATION OF SEMICONDUCTOR DEVICES

Publications (1)

Publication Number Publication Date
SU1358247A1 true SU1358247A1 (en) 2005-12-20

Family

ID=60533756

Family Applications (1)

Application Number Title Priority Date Filing Date
SU4033644/27A SU1358247A1 (en) 1986-03-03 1986-03-03 METHOD OF INSTALLATION OF SEMICONDUCTOR DEVICES

Country Status (1)

Country Link
SU (1) SU1358247A1 (en)

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