SU1350700A1 - Solid-state refticier - Google Patents

Abstract

The invention relates to converter equipment and is intended for use in industrial switching equipment. The purpose of the invention is to increase the cooling efficiency, reliability of operation and improvement of mass and overall performance. The device contains two disk semiconductor elements I, which are 3 5 pug through the device body 3 and the cup springs 4 are pressed against the heat-conducting unit 5, in which a hole for a round heat pipe 6 is drilled. the device, which is divided into two hermetic cavities by spring-loaded partitions I1, which fix the piston 12, made of a heat insulating material. Both cavities have bellows 13 and are filled with heat-accumulating substance. The piston has the shape of a semi-cylinder, the guides of the inner and outer surfaces of which are circles of different diameters and are made with eccentricity. The invention allows for efficient cooling of semiconductor rectifying devices. Regardless of the environmental parameters and without the use of additional injection devices, 2 sludge. 2. 7 13; . ..sh .. | L.sh. (С ё о о о. Ч;; УК ч ч 5 У - УУ yvf А I т мм I (Im I I If в; G 12 9 КА

Description

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The invention relates to converter technology and is intended for use in industrial switching equipment.

The purpose of the invention is to improve the cooling efficiency, the reliability of operation and the improvement of mass and overall performance.

Figure 1 shows a semiconductor rectifying device, a general view; figure 2 - section aa nafig.1

The device contains two disk semiconductor elements 1, which with the help of bolts 2 through the housing 3 of the device and cup springs 4 are pressed to the heat-conducting unit 5, for example, from beryllium ceramics in which a hole for a round heat pipe 6 with ribs is drilled

Condenser. The body of the electric1 zo-20 effort applied to two different

pads 7. Tires 8 connect the semiconductor elements in the downstream circuit with the midpoint terminal. A silver-plated heatpipe condenser is placed in a cooling body 9 of the device, which is divided into two hermetic chambers 10 by spring-loaded partitions 11, which fix the piston 12, made of thermally insulating material, in one of two possible positions by means of a special groove made in its shape outer surface. Both chambers are equipped with bellows 13 and are filled with a heat-accumulating substance. The rotational movement of the piston is guided by rings 14 embedded in the housing and the piston, which has the shape of a half-cylinder, the guides of the inner and outer surfaces of which are circles of different diameters, made with eccentricity.

The device works as follows.

When the semiconductor rectifying device is turned on, the heat released by the semiconductor elements 1 is transferred through the heat-conducting unit 5 to the evaporator of the heat pipe 6. The heat removal is carried out from one open half of the heat pipe's pressure sensing device by melting the heat storage substance in one of the chambers ambient temperature

The environment is solid. As the working substance melts in the liquid part, natural convection occurs, and, consequently, the heat transfer coefficient increases. Due to this, an effective heat removal from the finned teglow tube capacitor is achieved and at the same time its temperature is maintained at approximately the same level, independent of environmental parameters.

As the heat-accumulating substance melts, the sylphs 13 are compressed, compensating for the sharp increase in pressure in the chamber, due to the large coefficient of volume expansion of the melting substance. As the pressure rises, the difference

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the areas of flat porous surfaces 12, which enter the chamber where the melting takes place, at a certain moment will exceed the retaining effect of the spring partition 11 and the piston is turned under the action of the pressure force accumulated by the bellows to the second fixed position. Thus, heat transfer to the first chamber, where the solidified heat-accumulating substance now takes place, is stopped, and heat is removed from the other opened part of the heat pipe condenser to the second chamber, where the melting process begins. Upon reaching the limiting pressure in this chamber, the cycle will be repeated.

The proposed design allows for the effective cooling of semiconductor rectifying devices without the use of additional injection means, for example, fans. This increases the reliability of semiconductor devices, improves their weight and dimensions. In addition, the cooling efficiency does not depend on environmental parameters.

Claims (1)

Invention Formula A semiconductor rectifying device containing semiconductor elements, a heat pipe placed in the hole of a heat-conducting block, characterized in that, in order to increase the cooling efficiency, and improved mass-and-air indicators; a heat-conducting unit in the form of a sealed chamber divided by a partition into two cavities filled with a heat-accumulating substance; each cavity has a bellows and a heat pipe is installed The iHBHb is interchangeable around it, the piston is made in the form of a semi-cylinder, the guides of the inner and outer surfaces of which are circles of different diameters and are made with eccentricity. A-A P / G2 6 / P Compiled by Yu. Torshin Editor I. Egorov Tehred I. Veres Order 5287/50 Circulation 697. Subscription VNIIPI USSR State Committee for inventions and discoveries 113035, Moscow, Zh-35 ,. Raushsk nab. 4/5 Production and printing company, Uzhgorod, st. Project, 4 - W FIG. 2 Proofreader A. Obruchar